JP2006173986A - 電子回路 - Google Patents
電子回路 Download PDFInfo
- Publication number
- JP2006173986A JP2006173986A JP2004362460A JP2004362460A JP2006173986A JP 2006173986 A JP2006173986 A JP 2006173986A JP 2004362460 A JP2004362460 A JP 2004362460A JP 2004362460 A JP2004362460 A JP 2004362460A JP 2006173986 A JP2006173986 A JP 2006173986A
- Authority
- JP
- Japan
- Prior art keywords
- transmission
- coil
- receiving
- substrate
- coils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 78
- 238000004891 communication Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 230000003321 amplification Effects 0.000 abstract description 8
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 8
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000001939 inductive effect Effects 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H04B5/48—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
- H04W52/04—TPC
- H04W52/18—TPC being performed according to specific parameters
- H04W52/28—TPC being performed according to specific parameters using user profile, e.g. mobile speed, priority or network state, e.g. standby, idle or non transmission
- H04W52/283—Power depending on the position of the mobile
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
【解決手段】増幅器10aの増幅率が1であるのに対して、増幅器10b〜dのそれはそれぞれ2、4、8であり、これらを組み合わせて全体として1〜15(=1+2+4+8)の増幅率で増幅する。送信電力制御レジスタ21は、送信先である受信コイルを有する基板までの距離(すなわち、送信コイルと受信コイル間の距離)に応じた送信電力となるように、より具体的にはその距離に比例した送信電力にする増幅率となるように、各増幅器10a〜10dにオン・オフ信号を出力して、増幅器10a〜10dの組合せを選択する。
【選択図】図1
Description
11 NOT
12 NOT
13 NAND
14 NOR
21 送信電力制御レジスタ
22 送信コイル
23 コンデンサ
31 LSIチップ
32 送信回路
33 送信コイル
34 受信回路
35 受信コイル
T1、T2 トランジスタ
Txdata 送信データ
Claims (3)
- 基板上の配線により形成され信号を受信する第1受信コイルと、該第1受信コイルから信号を入力する第1受信回路とを有する第1基板と、
基板上の配線により形成され信号を受信する第2受信コイルと、該第2受信コイルから信号を入力する第2受信回路とを有する第2基板と、
基板上の配線により前記第1及び第2受信コイルと対応する位置に形成され第1及び第2受信コイルと誘導結合して通信チャネルを構成し信号を送信する送信コイルと、第1受信コイルに送信する場合には第1送信電力で、第2受信コイルに送信する場合には第1送信電力と異なる第2送信電力で該送信コイルに信号を出力する送信回路とを有する第3基板と
を備えることを特徴とする電子回路。 - 前記第1基板は、複数の第1受信コイルを有し、
前記第2基板は、複数の第2受信コイルを有し、
前記第3基板は、それぞれ前記第1及び第2受信コイルと対応する位置に形成され第1及び第2受信コイルと誘導結合して通信チャネルを構成し信号を送信する複数の送信コイルを有する
ことを特徴とする請求項1記載の電子回路。 - 前記送信回路は、前記送信コイルと送信先である前記第1又は第2受信コイルとの距離に比例する送信電力で前記送信コイルに信号を出力することを特徴とする請求項1又は2記載の電子回路。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004362460A JP2006173986A (ja) | 2004-12-15 | 2004-12-15 | 電子回路 |
US11/302,501 US7546106B2 (en) | 2004-12-15 | 2005-12-14 | Electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004362460A JP2006173986A (ja) | 2004-12-15 | 2004-12-15 | 電子回路 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006173986A true JP2006173986A (ja) | 2006-06-29 |
Family
ID=36674272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004362460A Pending JP2006173986A (ja) | 2004-12-15 | 2004-12-15 | 電子回路 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7546106B2 (ja) |
JP (1) | JP2006173986A (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009148007A1 (ja) * | 2008-06-03 | 2009-12-10 | 学校法人慶應義塾 | 電子回路 |
US8054871B2 (en) | 2008-03-27 | 2011-11-08 | Renesas Electronics Corporation | Semiconductor device and semiconductor integrated circuit |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
US8467256B2 (en) | 2008-12-26 | 2013-06-18 | Keio University | Electronic circuit |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
JP5491868B2 (ja) * | 2007-11-26 | 2014-05-14 | 学校法人慶應義塾 | 電子回路 |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9130602B2 (en) | 2006-01-18 | 2015-09-08 | Qualcomm Incorporated | Method and apparatus for delivering energy to an electrical or electronic device via a wireless link |
US20070246805A1 (en) * | 2006-04-25 | 2007-10-25 | Ligang Zhang | Multi-die inductor |
US9774086B2 (en) | 2007-03-02 | 2017-09-26 | Qualcomm Incorporated | Wireless power apparatus and methods |
US9124120B2 (en) | 2007-06-11 | 2015-09-01 | Qualcomm Incorporated | Wireless power system and proximity effects |
JP2009032857A (ja) * | 2007-07-26 | 2009-02-12 | Hitachi Ltd | 半導体集積回路および半導体装置 |
JP5600237B2 (ja) * | 2008-02-02 | 2014-10-01 | 学校法人慶應義塾 | 集積回路 |
US7750435B2 (en) * | 2008-02-27 | 2010-07-06 | Broadcom Corporation | Inductively coupled integrated circuit and methods for use therewith |
JP5475962B2 (ja) * | 2008-04-28 | 2014-04-16 | 学校法人慶應義塾 | 電子回路 |
US20090273242A1 (en) * | 2008-05-05 | 2009-11-05 | Nigelpower, Llc | Wireless Delivery of power to a Fixed-Geometry power part |
JP4698702B2 (ja) * | 2008-05-22 | 2011-06-08 | 三菱電機株式会社 | 電子機器 |
US9177715B2 (en) | 2010-11-23 | 2015-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for inductive wireless signaling |
US9740342B2 (en) * | 2011-12-23 | 2017-08-22 | Cirque Corporation | Method for preventing interference of contactless card reader and touch functions when they are physically and logically bound together for improved authentication security |
US10958154B2 (en) * | 2017-07-06 | 2021-03-23 | Integrated Device Technology, Inc. | Wireless receiver rectifier low side current limited operation |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6000128A (en) * | 1994-06-21 | 1999-12-14 | Sumitomo Special Metals Co., Ltd. | Process of producing a multi-layered printed-coil substrate |
JP2002057350A (ja) | 1994-08-30 | 2002-02-22 | Seiko Instruments Inc | 半導体装置 |
EP0704928A3 (en) * | 1994-09-30 | 1998-08-05 | HID Corporation | RF transponder system with parallel resonant interrogation and series resonant response |
US5701037A (en) | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
JPH10255003A (ja) | 1997-03-13 | 1998-09-25 | Omron Corp | リーダライタ |
US20030042571A1 (en) * | 1997-10-23 | 2003-03-06 | Baoxing Chen | Chip-scale coils and isolators based thereon |
JP2003008481A (ja) | 2001-06-27 | 2003-01-10 | Denso Corp | Idタグシステム,idタグリーダ及びidタグ |
US6958531B2 (en) * | 2003-11-14 | 2005-10-25 | The Regents Of The University Of Michigan | Multi-substrate package and method for assembling same |
JP4131544B2 (ja) | 2004-02-13 | 2008-08-13 | 学校法人慶應義塾 | 電子回路 |
JP4193060B2 (ja) | 2004-06-04 | 2008-12-10 | 学校法人慶應義塾 | 電子回路 |
JP4677598B2 (ja) | 2004-08-05 | 2011-04-27 | 学校法人慶應義塾 | 電子回路 |
JP4124365B2 (ja) * | 2004-08-24 | 2008-07-23 | 学校法人慶應義塾 | 電子回路 |
-
2004
- 2004-12-15 JP JP2004362460A patent/JP2006173986A/ja active Pending
-
2005
- 2005-12-14 US US11/302,501 patent/US7546106B2/en active Active
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5491868B2 (ja) * | 2007-11-26 | 2014-05-14 | 学校法人慶應義塾 | 電子回路 |
US9053950B2 (en) | 2007-11-26 | 2015-06-09 | Keio University | Electronic circuit |
US8054871B2 (en) | 2008-03-27 | 2011-11-08 | Renesas Electronics Corporation | Semiconductor device and semiconductor integrated circuit |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
JP2009295699A (ja) * | 2008-06-03 | 2009-12-17 | Keio Gijuku | 電子回路 |
US9979441B2 (en) | 2008-06-03 | 2018-05-22 | Thruchip Japan Inc. | Inductive relayed coupling circuit between substrates |
WO2009148007A1 (ja) * | 2008-06-03 | 2009-12-10 | 学校法人慶應義塾 | 電子回路 |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
US8467256B2 (en) | 2008-12-26 | 2013-06-18 | Keio University | Electronic circuit |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
US8872609B2 (en) | 2009-02-25 | 2014-10-28 | Keio University | Inductor element and integrated circuit device |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
Also Published As
Publication number | Publication date |
---|---|
US20060176676A1 (en) | 2006-08-10 |
US7546106B2 (en) | 2009-06-09 |
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