JP4072176B2 - 多層配線基板の製造方法 - Google Patents
多層配線基板の製造方法 Download PDFInfo
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Description
樹脂を用いて絶縁層を形成する工程と、配線を形成する工程とを支持基板上で繰り返し実施し、その後に前記支持基板を除去する工程を実施する多層配線基板の製造方法において、
前記絶縁層の形成工程では、積層の中央に位置する絶縁層を補強材を含む樹脂により形成し、当該積層の中央に位置する絶縁層の上部及び下部に、補強材を含まない絶縁層を対称に配置することを特徴とするものである。また、前記絶縁層の形成工程では、前記積層の中央に位置する絶縁層の上部及び下部に対称に配置する絶縁層を、更に、補強材を含む樹脂により形成してもよい。また、前記絶縁層の形成工程では、前記上部及び下部に対称に配置する、補強材を含む樹脂により形成される絶縁層は、多層配線基板の上下両面に配置されてもよい。また、上記の課題を解決するために本発明では、樹脂を用いて絶縁層を形成する工程と、配線を形成する工程とを支持基板上で繰り返し実施し、その後に前記支持基板を除去する工程を実施する多層配線基板の製造方法において、前記絶縁層の形成工程では、積層の中央に位置する絶縁層を補強材を含まない絶縁層とし、当該中央に位置する絶縁層の上部及び下部でバランスする絶縁層を、補強材を含む樹脂により形成することを特徴とする。また、前記中央に位置する絶縁層の上部及び下部でバランスする、樹脂により形成される絶縁層は、多層配線基板の上下両面に配置されることを特徴とする。
2枚の前記支持基板を貼り合わせる工程と、
前記絶縁層と前記配線がそれぞれ形成された当該2枚の支持基板を分離する工程とをさらに有するようにすると、多層配線基板を製造する効率が良好となる。
2枚の前記支持基板を、当該2枚の支持基板を保持する保持基板の第1の面と第2の面にそれぞれ貼りつける工程と、
前記絶縁層と前記配線がそれぞれ形成された当該2枚の支持基板を前記保持基板から分離する工程とをさらに有すると、多層配線基板を製造する効率が良好となる。
前記多層配線基板に半導体チップを実装する工程をさらに有するようにしてもよい。
101 支持基板
102,109 ソルダーレジスト
102A,106A,109A 開口部
103 電極
104 第1の絶縁層
105,108,110 配線
105a,108a,110a ビアプラグ部
105b,108b パターン配線部
106 第2の絶縁層
107 第3の絶縁層
110b 電極部
111 絶縁層
201 半導体チップ
202 半田接続部
203 アンダーフィル樹脂
Claims (10)
- 樹脂を用いて絶縁層を形成する工程と、配線を形成する工程とを支持基板上で繰り返し実施し、その後に前記支持基板を除去する工程を実施する多層配線基板の製造方法において、
前記絶縁層の形成工程では、積層の中央に位置する絶縁層を補強材を含む樹脂により形成し、
当該積層の中央に位置する絶縁層の上部及び下部に、補強材を含まない絶縁層を対称に配置することを特徴とする多層配線基板の製造方法。 - 前記絶縁層の形成工程では、前記積層の中央に位置する絶縁層の上部及び下部に対称に配置する絶縁層を、更に、補強材を含む樹脂により形成することを特徴とする請求項1記載の多層配線基板の製造方法。
- 前記絶縁層の形成工程では、前記上部及び下部に対称に配置する、補強材を含む樹脂により形成される絶縁層は、多層配線基板の上下両面に配置されることを特徴とする請求項2記載の多層配線基板の製造方法。
- 樹脂を用いて絶縁層を形成する工程と、配線を形成する工程とを支持基板上で繰り返し実施し、その後に前記支持基板を除去する工程を実施する多層配線基板の製造方法において、
前記絶縁層の形成工程では、積層の中央に位置する絶縁層を補強材を含まない絶縁層とし、当該中央に位置する絶縁層の上部及び下部でバランスする絶縁層を、補強材を含む樹脂により形成することを特徴とする多層配線基板の製造方法。 - 前記中央に位置する絶縁層の上部及び下部でバランスする、補強材を含む樹脂により形成される絶縁層は、多層配線基板の上下両面に配置されることを特徴とする請求項4記載の多層配線基板の製造方法。
- 前記絶縁層は、ビルドアップ樹脂であることを特徴とする請求項1乃至5のいずれか1項に記載の多層配線基板の製造方法。
- 2枚の前記支持基板を貼り合わせる工程と、
前記絶縁層と前記配線がそれぞれ形成された当該2枚の支持基板を分離する工程とをさらに有することを特徴とする請求項1乃至6のいずれか1項に記載の多層配線基板の製造方法。 - 2枚の前記支持基板を、当該2枚の支持基板を保持する保持基板の第1の面と第2の面にそれぞれ貼りつける工程と、
前記絶縁層と前記配線がそれぞれ形成された当該2枚の支持基板を前記保持基板から分離する工程とをさらに有することを特徴とする請求項1乃至6のいずれか1項に記載の多層配線基板の製造方法。 - 前記多層配線基板に半導体チップを実装する工程をさらに有することを特徴とする請求項1乃至8のいずれか1項に記載の多層配線基板の製造方法。
- 前記支持基板を除去する工程は、前記半導体チップを実装する工程の後に行われることを特徴とする請求項9記載の多層配線基板の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006122115A JP4072176B2 (ja) | 2005-08-29 | 2006-04-26 | 多層配線基板の製造方法 |
KR1020060079186A KR101342031B1 (ko) | 2005-08-29 | 2006-08-22 | 다층 배선 기판 및 그 제조 방법 |
US11/509,723 US8222527B2 (en) | 2005-08-29 | 2006-08-25 | Multilayered wiring board and method for fabricating the same |
TW095131551A TWI381785B (zh) | 2005-08-29 | 2006-08-28 | 佈線板及其製造方法,暨半導體封裝及其製造方法 |
US13/482,784 US9040836B2 (en) | 2005-08-29 | 2012-05-29 | Multilayered wiring board and method for fabricating the same |
KR1020120155916A KR101319358B1 (ko) | 2005-08-29 | 2012-12-28 | 다층 배선 기판 및 그 제조 방법 |
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Application Number | Priority Date | Filing Date | Title |
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JP2005247862 | 2005-08-29 | ||
JP2006122115A JP4072176B2 (ja) | 2005-08-29 | 2006-04-26 | 多層配線基板の製造方法 |
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US20120293973A1 (en) | 2012-11-22 |
TWI381785B (zh) | 2013-01-01 |
KR20130018215A (ko) | 2013-02-20 |
KR101319358B1 (ko) | 2013-10-16 |
US9040836B2 (en) | 2015-05-26 |
JP2007096260A (ja) | 2007-04-12 |
TW200735742A (en) | 2007-09-16 |
US8222527B2 (en) | 2012-07-17 |
KR101342031B1 (ko) | 2013-12-16 |
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US20070119619A1 (en) | 2007-05-31 |
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