JP4013386B2 - 半導体製造用保持体およびその製造方法 - Google Patents

半導体製造用保持体およびその製造方法 Download PDF

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JP4013386B2
JP4013386B2 JP04454499A JP4454499A JP4013386B2 JP 4013386 B2 JP4013386 B2 JP 4013386B2 JP 04454499 A JP04454499 A JP 04454499A JP 4454499 A JP4454499 A JP 4454499A JP 4013386 B2 JP4013386 B2 JP 4013386B2
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semiconductor
holding body
manufacturing
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base material
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JP04454499A
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JP2000058631A (ja
JP2000058631A5 (enExample
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泰久 湯塩
博彦 仲田
益宏 夏原
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to JP04454499A priority Critical patent/JP4013386B2/ja
Priority to TW088103074A priority patent/TW412823B/zh
Priority to US09/260,003 priority patent/US6423400B1/en
Priority to CNB991024710A priority patent/CN1163955C/zh
Priority to KR1019990006817A priority patent/KR100554044B1/ko
Priority to CA002264317A priority patent/CA2264317C/en
Priority to EP99301559A priority patent/EP0940845A3/en
Publication of JP2000058631A publication Critical patent/JP2000058631A/ja
Priority to US10/166,778 priority patent/US6770379B2/en
Publication of JP2000058631A5 publication Critical patent/JP2000058631A5/ja
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

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US20030066587A1 (en) 2003-04-10
US6770379B2 (en) 2004-08-03
CA2264317C (en) 2003-04-08
KR19990077529A (ko) 1999-10-25
US6423400B1 (en) 2002-07-23
JP2000058631A (ja) 2000-02-25
CN1227968A (zh) 1999-09-08
CN1163955C (zh) 2004-08-25
KR100554044B1 (ko) 2006-02-22
CA2264317A1 (en) 1999-09-02
EP0940845A3 (en) 2000-12-13
TW412823B (en) 2000-11-21

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