JP2023145534A5 - - Google Patents

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JP2023145534A5
JP2023145534A5 JP2023115633A JP2023115633A JP2023145534A5 JP 2023145534 A5 JP2023145534 A5 JP 2023145534A5 JP 2023115633 A JP2023115633 A JP 2023115633A JP 2023115633 A JP2023115633 A JP 2023115633A JP 2023145534 A5 JP2023145534 A5 JP 2023145534A5
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chamber
protective layers
chamber component
component
protective
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JP2023115633A
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JP2023145534A (ja
JP7691453B2 (ja
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JP2023115633A 2013-06-20 2023-07-14 プラズマ耐食性希土類酸化物系薄膜コーティング Active JP7691453B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361837595P 2013-06-20 2013-06-20
US61/837,595 2013-06-20
US14/306,583 US9850568B2 (en) 2013-06-20 2014-06-17 Plasma erosion resistant rare-earth oxide based thin film coatings
US14/306,583 2014-06-17
JP2021000036A JP7368398B2 (ja) 2013-06-20 2021-01-04 プラズマ耐食性希土類酸化物系薄膜コーティング

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JP2021000036A Division JP7368398B2 (ja) 2013-06-20 2021-01-04 プラズマ耐食性希土類酸化物系薄膜コーティング

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JP2023145534A JP2023145534A (ja) 2023-10-11
JP2023145534A5 true JP2023145534A5 (enExample) 2023-10-19
JP7691453B2 JP7691453B2 (ja) 2025-06-11

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JP2016521573A Active JP6496308B2 (ja) 2013-06-20 2014-06-19 プラズマ耐食性希土類酸化物系薄膜コーティング
JP2019003509A Active JP6820359B2 (ja) 2013-06-20 2019-01-11 プラズマ耐食性希土類酸化物系薄膜コーティング
JP2021000036A Active JP7368398B2 (ja) 2013-06-20 2021-01-04 プラズマ耐食性希土類酸化物系薄膜コーティング
JP2023115633A Active JP7691453B2 (ja) 2013-06-20 2023-07-14 プラズマ耐食性希土類酸化物系薄膜コーティング

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JP2016521573A Active JP6496308B2 (ja) 2013-06-20 2014-06-19 プラズマ耐食性希土類酸化物系薄膜コーティング
JP2019003509A Active JP6820359B2 (ja) 2013-06-20 2019-01-11 プラズマ耐食性希土類酸化物系薄膜コーティング
JP2021000036A Active JP7368398B2 (ja) 2013-06-20 2021-01-04 プラズマ耐食性希土類酸化物系薄膜コーティング

Country Status (6)

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US (5) US9850568B2 (enExample)
JP (4) JP6496308B2 (enExample)
KR (3) KR102586972B1 (enExample)
CN (2) CN111900084B (enExample)
TW (5) TW202325541A (enExample)
WO (1) WO2014205212A1 (enExample)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) * 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
US9343289B2 (en) 2012-07-27 2016-05-17 Applied Materials, Inc. Chemistry compatible coating material for advanced device on-wafer particle performance
US9708713B2 (en) 2013-05-24 2017-07-18 Applied Materials, Inc. Aerosol deposition coating for semiconductor chamber components
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
US9711334B2 (en) 2013-07-19 2017-07-18 Applied Materials, Inc. Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
US9583369B2 (en) 2013-07-20 2017-02-28 Applied Materials, Inc. Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles
US20150079370A1 (en) 2013-09-18 2015-03-19 Applied Materials, Inc. Coating architecture for plasma sprayed chamber components
US9440886B2 (en) 2013-11-12 2016-09-13 Applied Materials, Inc. Rare-earth oxide based monolithic chamber material
US9725799B2 (en) 2013-12-06 2017-08-08 Applied Materials, Inc. Ion beam sputtering with ion assisted deposition for coatings on chamber components
US9976211B2 (en) 2014-04-25 2018-05-22 Applied Materials, Inc. Plasma erosion resistant thin film coating for high temperature application
US9869013B2 (en) 2014-04-25 2018-01-16 Applied Materials, Inc. Ion assisted deposition top coat of rare-earth oxide
US10730798B2 (en) 2014-05-07 2020-08-04 Applied Materials, Inc. Slurry plasma spray of plasma resistant ceramic coating
US9460898B2 (en) 2014-08-08 2016-10-04 Applied Materials, Inc. Plasma generation chamber with smooth plasma resistant coating
CN105428195B (zh) * 2014-09-17 2018-07-17 东京毅力科创株式会社 等离子体处理装置用的部件和部件的制造方法
KR20210111885A (ko) * 2015-02-13 2021-09-13 엔테그리스, 아이엔씨. 기판 제품 및 장치의 특성 및 성능을 향상시키기 위한 코팅
CN105986245A (zh) * 2015-02-16 2016-10-05 中微半导体设备(上海)有限公司 改善mocvd反应工艺的部件及改善方法
US9790582B2 (en) * 2015-04-27 2017-10-17 Lam Research Corporation Long lifetime thermal spray coating for etching or deposition chamber application
US20160358749A1 (en) * 2015-06-04 2016-12-08 Lam Research Corporation Plasma etching device with plasma etch resistant coating
US20170040146A1 (en) * 2015-08-03 2017-02-09 Lam Research Corporation Plasma etching device with plasma etch resistant coating
US10020218B2 (en) * 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
EP3423610B1 (en) * 2016-03-04 2022-05-04 Beneq OY A plasma etch-resistant film and a method for its fabrication
US11326253B2 (en) * 2016-04-27 2022-05-10 Applied Materials, Inc. Atomic layer deposition of protective coatings for semiconductor process chamber components
US9850573B1 (en) * 2016-06-23 2017-12-26 Applied Materials, Inc. Non-line of sight deposition of erbium based plasma resistant ceramic coating
US20180016678A1 (en) 2016-07-15 2018-01-18 Applied Materials, Inc. Multi-layer coating with diffusion barrier layer and erosion resistant layer
US9773665B1 (en) * 2016-12-06 2017-09-26 Applied Materials, Inc. Particle reduction in a physical vapor deposition chamber
US10186400B2 (en) 2017-01-20 2019-01-22 Applied Materials, Inc. Multi-layer plasma resistant coating by atomic layer deposition
US20180251406A1 (en) * 2017-03-06 2018-09-06 Applied Materials, Inc. Sintered ceramic protective layer formed by hot pressing
US10975469B2 (en) 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
JP2020514237A (ja) * 2017-03-21 2020-05-21 コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド 高い腐食性又は浸食性産業用途に使用するためのセラミック材料アセンブリ
US20190078200A1 (en) * 2017-09-08 2019-03-14 Applied Materials, Inc. Fluorinated rare earth oxide ald coating for chamber productivity enhancement
KR102016615B1 (ko) * 2017-09-14 2019-08-30 (주)코미코 내플라즈마 특성이 향상된 플라즈마 에칭 장치용 부재 및 그 제조 방법
US11401611B2 (en) * 2017-11-09 2022-08-02 Solution Spray Technologies, LLC Thermal barrier coatings with CMAS resistance
KR102040910B1 (ko) 2018-02-05 2019-11-27 충북대학교 산학협력단 탈부착형 모듈을 이용한 IoT 환경 구축 방법
TWI709653B (zh) 2018-02-15 2020-11-11 日商京瓷股份有限公司 電漿處理裝置用構件及具備其之電漿處理裝置
US11047035B2 (en) 2018-02-23 2021-06-29 Applied Materials, Inc. Protective yttria coating for semiconductor equipment parts
US10443126B1 (en) 2018-04-06 2019-10-15 Applied Materials, Inc. Zone-controlled rare-earth oxide ALD and CVD coatings
JP7319425B2 (ja) * 2018-05-15 2023-08-01 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置用部品
JP7068921B2 (ja) 2018-05-15 2022-05-17 東京エレクトロン株式会社 部品の形成方法及びプラズマ処理装置
US11667575B2 (en) * 2018-07-18 2023-06-06 Applied Materials, Inc. Erosion resistant metal oxide coatings
WO2020116384A1 (ja) * 2018-12-05 2020-06-11 京セラ株式会社 プラズマ処理装置用部材およびこれを備えるプラズマ処理装置
US10920319B2 (en) 2019-01-11 2021-02-16 Applied Materials, Inc. Ceramic showerheads with conductive electrodes
KR20240093720A (ko) * 2019-05-13 2024-06-24 어플라이드 머티어리얼스, 인코포레이티드 금속 오염을 감소시키기 위한 티타늄 라이너
US11289357B2 (en) * 2019-06-27 2022-03-29 Applied Materials, Inc. Methods and apparatus for high voltage electrostatic chuck protection
WO2021002339A1 (ja) * 2019-07-03 2021-01-07 時田シーブイディーシステムズ株式会社 複合膜、部品及び製造方法
TWI768256B (zh) * 2019-10-29 2022-06-21 行政院原子能委員會核能研究所 摻雜型金屬氧化物薄膜的製作方法
US20210183620A1 (en) * 2019-12-13 2021-06-17 Applied Materials, Inc. Chamber with inductive power source
US11661650B2 (en) * 2020-04-10 2023-05-30 Applied Materials, Inc. Yttrium oxide based coating composition
CN113539771B (zh) * 2020-04-16 2024-04-12 中微半导体设备(上海)股份有限公司 零部件、其表面形成涂层的方法和等离子体反应装置
JP7140222B2 (ja) * 2020-04-30 2022-09-21 Toto株式会社 複合構造物および複合構造物を備えた半導体製造装置
JP7115582B2 (ja) * 2020-04-30 2022-08-09 Toto株式会社 複合構造物および複合構造物を備えた半導体製造装置
TWI777504B (zh) * 2020-04-30 2022-09-11 日商Toto股份有限公司 複合結構物及具備複合結構物之半導體製造裝置
TWI778587B (zh) 2020-04-30 2022-09-21 日商Toto股份有限公司 複合結構物及具備複合結構物之半導體製造裝置
CN113707526B (zh) * 2020-05-20 2024-05-24 中微半导体设备(上海)股份有限公司 零部件、形成耐等离子体涂层的方法和等离子体反应装置
US20210403337A1 (en) * 2020-06-30 2021-12-30 Applied Materials, Inc. Yttrium oxide based coating and bulk compositions
US20220037126A1 (en) * 2020-08-03 2022-02-03 Applied Materials, Inc. Fluoride coating to improve chamber performance
JP7476039B2 (ja) 2020-09-02 2024-04-30 キオクシア株式会社 半導体装置の検査装置、及び、半導体装置の検査方法
US11699611B2 (en) 2021-02-23 2023-07-11 Applied Materials, Inc. Forming mesas on an electrostatic chuck
TW202237397A (zh) 2021-03-29 2022-10-01 日商Toto股份有限公司 複合結構物及具備複合結構物之半導體製造裝置
TW202238998A (zh) 2021-03-29 2022-10-01 日商Toto股份有限公司 複合結構物及具備複合結構物之半導體製造裝置
TWI781593B (zh) * 2021-04-21 2022-10-21 翔名科技股份有限公司 耐電漿腐蝕的保護層與其形成方法
JP7668168B2 (ja) * 2021-06-22 2025-04-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ内の部品を再生する方法
WO2023018218A1 (ko) 2021-08-13 2023-02-16 주식회사 엘지에너지솔루션 음극 활물질, 음극 슬러리, 음극 및 이차 전지
WO2023033067A1 (ja) * 2021-08-31 2023-03-09 京セラ株式会社 耐プラズマ積層体、その製造方法、ならびにプラズマ処理装置
KR102810078B1 (ko) * 2021-12-22 2025-05-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치의 메인터넌스 방법 및 기판 처리 장치
KR102535560B1 (ko) * 2022-10-14 2023-05-26 주식회사 코미코 내플라즈마성 코팅막의 제조방법
CN118073157A (zh) * 2022-11-11 2024-05-24 江苏鲁汶仪器股份有限公司 一种离子源装置、离子源系统及其调试方法
TWI863057B (zh) * 2022-12-12 2024-11-21 翔名科技股份有限公司 耐電漿侵蝕的光學結構
WO2025074857A1 (ja) * 2023-10-05 2025-04-10 株式会社クリエイティブテクノロジー 静電チャック装置及びその製造方法並びに静電チャック装置の再生方法
KR102674395B1 (ko) 2023-12-04 2024-06-12 주식회사 디에프텍 이온빔 소스를 이용하여 내플라즈마 특성 향상을 위한 코팅 방법
WO2025170700A1 (en) * 2024-02-06 2025-08-14 Lam Research Corporation Yttrium aluminum oxide ceramic plate for an electrostatic chuck
WO2025207269A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Chamber lid for dissipating charges
WO2025206394A1 (ja) * 2024-03-29 2025-10-02 日本碍子株式会社 半導体製造装置用部材及びその再生方法
CN118516652B (zh) * 2024-07-24 2024-11-26 武汉工程大学 一种具有致密性和耐刻蚀性y2o3薄膜的制备方法及其应用

Family Cites Families (247)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796182A (en) 1971-12-16 1974-03-12 Applied Materials Tech Susceptor structure for chemical vapor deposition reactor
SE8000480L (sv) 1979-02-01 1980-08-02 Johnson Matthey Co Ltd Artikel lemplig for anvendning vid hoga temperaturer
US4439248A (en) 1982-02-02 1984-03-27 Cabot Corporation Method of heat treating NICRALY alloys for use as ceramic kiln and furnace hardware
US4642440A (en) 1984-11-13 1987-02-10 Schnackel Jay F Semi-transferred arc in a liquid stabilized plasma generator and method for utilizing the same
US4704299A (en) 1985-11-06 1987-11-03 Battelle Memorial Institute Process for low temperature curing of sol-gel thin films
US4695439A (en) 1986-09-25 1987-09-22 Gte Products Corporation Yttrium oxide stabilized zirconium oxide
US4773928A (en) 1987-08-03 1988-09-27 Gte Products Corporation Plasma spray powders and process for producing same
CN1036286A (zh) 1988-02-24 1989-10-11 珀金·埃莱姆公司 超导陶瓷的次大气压等离子体喷涂
US4880614A (en) 1988-11-03 1989-11-14 Allied-Signal Inc. Ceramic thermal barrier coating with alumina interlayer
JPH0775893A (ja) 1993-09-03 1995-03-20 Hitachi Ltd 構造物の補修方法および予防保全方法
US5381944A (en) 1993-11-04 1995-01-17 The Regents Of The University Of California Low temperature reactive bonding
US5631803A (en) 1995-01-06 1997-05-20 Applied Materials, Inc. Erosion resistant electrostatic chuck with improved cooling system
US5415756A (en) 1994-03-28 1995-05-16 University Of Houston Ion assisted deposition process including reactive source gassification
US5679167A (en) 1994-08-18 1997-10-21 Sulzer Metco Ag Plasma gun apparatus for forming dense, uniform coatings on large substrates
WO1996011288A1 (en) 1994-10-05 1996-04-18 United Technologies Corporation Multiple nanolayer coating system
US5792562A (en) 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
US5626923A (en) 1995-09-19 1997-05-06 Mcdonnell Douglas Corporation Method of applying ceramic coating compositions to ceramic or metallic substrate
US5766693A (en) 1995-10-06 1998-06-16 Ford Global Technologies, Inc. Method of depositing composite metal coatings containing low friction oxides
KR100471728B1 (ko) 1996-04-12 2005-03-14 가부시끼가이샤 히다치 세이사꾸쇼 플라즈마 처리장치
JP3426845B2 (ja) * 1996-04-26 2003-07-14 京セラ株式会社 静電チャック
US6500314B1 (en) 1996-07-03 2002-12-31 Tegal Corporation Plasma etch reactor and method
US5837058A (en) * 1996-07-12 1998-11-17 Applied Materials, Inc. High temperature susceptor
JP3619330B2 (ja) * 1996-07-31 2005-02-09 京セラ株式会社 プラズマプロセス装置用部材
US6217662B1 (en) 1997-03-24 2001-04-17 Cree, Inc. Susceptor designs for silicon carbide thin films
US6194083B1 (en) 1997-07-28 2001-02-27 Kabushiki Kaisha Toshiba Ceramic composite material and its manufacturing method, and heat resistant member using thereof
US6106959A (en) 1998-08-11 2000-08-22 Siemens Westinghouse Power Corporation Multilayer thermal barrier coating systems
US6361645B1 (en) 1998-10-08 2002-03-26 Lam Research Corporation Method and device for compensating wafer bias in a plasma processing chamber
DE69920152T2 (de) 1998-12-21 2005-09-22 Shin-Etsu Chemical Co., Ltd. Korrosionbeständiges Mischoxidmaterial
KR100722057B1 (ko) 1999-09-29 2007-05-25 동경 엘렉트론 주식회사 멀티존 저항가열기
KR20010062209A (ko) 1999-12-10 2001-07-07 히가시 데쓰로 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치
US6949203B2 (en) 1999-12-28 2005-09-27 Applied Materials, Inc. System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
JP4272786B2 (ja) 2000-01-21 2009-06-03 トーカロ株式会社 静電チャック部材およびその製造方法
US6891263B2 (en) 2000-02-07 2005-05-10 Ibiden Co., Ltd. Ceramic substrate for a semiconductor production/inspection device
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
FI117979B (fi) 2000-04-14 2007-05-15 Asm Int Menetelmä oksidiohutkalvojen valmistamiseksi
TW503449B (en) 2000-04-18 2002-09-21 Ngk Insulators Ltd Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members
CA2306941A1 (en) 2000-04-27 2001-10-27 Standard Aero Ltd. Multilayer thermal barrier coatings
US7441688B2 (en) 2003-11-04 2008-10-28 Reactive Nanotechnologies Methods and device for controlling pressure in reactive multilayer joining and resulting product
EP1299324A4 (en) 2000-05-02 2006-08-16 Univ Johns Hopkins FREE-STANDING REACTIVE MULTILAYER FILMS
NL1015550C2 (nl) 2000-06-28 2002-01-02 Xycarb Ceramics B V Werkwijze voor het vervaardigen van een uit een kern opgebouwde susceptor, aldus verkregen susceptor en een werkwijze voor het aanbrengen van actieve lagen op een halfgeleidersubstraat onder toepassing van een dergelijke susceptor.
EP1167565B1 (en) 2000-06-29 2007-03-07 Shin-Etsu Chemical Co., Ltd. Method for thermal spray coating and rare earth oxide powder used therefor
JP4651166B2 (ja) * 2000-06-30 2011-03-16 京セラ株式会社 耐食性部材
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
JP4688307B2 (ja) 2000-07-11 2011-05-25 コバレントマテリアル株式会社 半導体製造装置用耐プラズマ性部材
AU2001280609A1 (en) 2000-07-20 2002-02-05 North Carolina State University High dielectric constant metal silicates formed by controlled metal-surface reactions
WO2002040732A1 (en) 2000-11-15 2002-05-23 G.T. Equipment Technologies Inc. A protective layer for quartz crucibles used for silicon crystallization
US6805952B2 (en) 2000-12-29 2004-10-19 Lam Research Corporation Low contamination plasma chamber components and methods for making the same
US6620520B2 (en) 2000-12-29 2003-09-16 Lam Research Corporation Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
US6746539B2 (en) 2001-01-30 2004-06-08 Msp Corporation Scanning deposition head for depositing particles on a wafer
EP1239055B1 (en) 2001-03-08 2017-03-01 Shin-Etsu Chemical Co., Ltd. Thermal spray spherical particles, and sprayed components
US6723209B2 (en) 2001-03-16 2004-04-20 4-Wave, Inc. System and method for performing thin film deposition or chemical treatment using an energetic flux of neutral reactive molecular fragments, atoms or radicals
JP2002356387A (ja) 2001-03-30 2002-12-13 Toshiba Ceramics Co Ltd 耐プラズマ性部材
US6915964B2 (en) 2001-04-24 2005-07-12 Innovative Technology, Inc. System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US7670688B2 (en) 2001-06-25 2010-03-02 Applied Materials, Inc. Erosion-resistant components for plasma process chambers
TWI246873B (en) 2001-07-10 2006-01-01 Tokyo Electron Ltd Plasma processing device
US6616031B2 (en) 2001-07-17 2003-09-09 Asm Assembly Automation Limited Apparatus and method for bond force control
US20030047464A1 (en) 2001-07-27 2003-03-13 Applied Materials, Inc. Electrochemically roughened aluminum semiconductor processing apparatus surfaces
EP1432660A1 (en) 2001-08-02 2004-06-30 3M Innovative Properties Company Alumina-yttria-zirconium oxide/hafnium oxide materials, and methods of making and using the same
JP4921652B2 (ja) 2001-08-03 2012-04-25 エイエスエム インターナショナル エヌ.ヴェー. イットリウム酸化物およびランタン酸化物薄膜を堆積する方法
US20030029563A1 (en) 2001-08-10 2003-02-13 Applied Materials, Inc. Corrosion resistant coating for semiconductor processing chamber
JP5132859B2 (ja) 2001-08-24 2013-01-30 ステラケミファ株式会社 多成分を有するガラス基板用の微細加工表面処理液
JP4663927B2 (ja) 2001-08-29 2011-04-06 信越化学工業株式会社 希土類含有酸化物部材
KR20030025007A (ko) 2001-09-19 2003-03-28 삼성전자주식회사 쉴드링을 가지는 식각장비
JP2003146751A (ja) 2001-11-20 2003-05-21 Toshiba Ceramics Co Ltd 耐プラズマ性部材及びその製造方法
JP4493251B2 (ja) 2001-12-04 2010-06-30 Toto株式会社 静電チャックモジュールおよび基板処理装置
US7371467B2 (en) 2002-01-08 2008-05-13 Applied Materials, Inc. Process chamber component having electroplated yttrium containing coating
US6942929B2 (en) 2002-01-08 2005-09-13 Nianci Han Process chamber having component with yttrium-aluminum coating
US6592948B1 (en) 2002-01-11 2003-07-15 General Electric Company Method for masking selected regions of a substrate
US6884514B2 (en) * 2002-01-11 2005-04-26 Saint-Gobain Ceramics & Plastics, Inc. Method for forming ceramic layer having garnet crystal structure phase and article made thereby
US20080264564A1 (en) 2007-04-27 2008-10-30 Applied Materials, Inc. Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas
US8067067B2 (en) 2002-02-14 2011-11-29 Applied Materials, Inc. Clean, dense yttrium oxide coating protecting semiconductor processing apparatus
US20080213496A1 (en) 2002-02-14 2008-09-04 Applied Materials, Inc. Method of coating semiconductor processing apparatus with protective yttrium-containing coatings
US6789498B2 (en) 2002-02-27 2004-09-14 Applied Materials, Inc. Elements having erosion resistance
JP4153708B2 (ja) 2002-03-12 2008-09-24 東京エレクトロン株式会社 エッチング方法
US20030175142A1 (en) 2002-03-16 2003-09-18 Vassiliki Milonopoulou Rare-earth pre-alloyed PVD targets for dielectric planar applications
JP2003277051A (ja) 2002-03-22 2003-10-02 Ngk Insulators Ltd イットリア−アルミナ複合酸化物膜を有する積層体、イットリア−アルミナ複合酸化物膜、耐蝕性部材、耐蝕性膜およびイットリア−アルミナ複合酸化物膜の製造方法
US7026009B2 (en) 2002-03-27 2006-04-11 Applied Materials, Inc. Evaluation of chamber components having textured coatings
DE10224137A1 (de) 2002-05-24 2003-12-04 Infineon Technologies Ag Ätzgas und Verfahren zum Trockenätzen
TWI241284B (en) 2002-06-06 2005-10-11 Ngk Insulators Ltd A method of producing sintered bodies, a method of producing shaped bodies, shaped bodies, corrosion resistant members and a method of producing ceramic member
US20030232139A1 (en) 2002-06-13 2003-12-18 Detura Frank Anthony Shield and method for spraying coating on a surface
US7311797B2 (en) 2002-06-27 2007-12-25 Lam Research Corporation Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
US6784096B2 (en) 2002-09-11 2004-08-31 Applied Materials, Inc. Methods and apparatus for forming barrier layers in high aspect ratio vias
JP2004107718A (ja) * 2002-09-18 2004-04-08 Ngk Insulators Ltd 積層体、溶射膜および積層体の製造方法
US6798519B2 (en) 2002-09-30 2004-09-28 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7507481B2 (en) 2002-11-20 2009-03-24 Shin-Etsu Chemical Co., Ltd. Heat resistant coated member, making method, and treatment using the same
US7780786B2 (en) * 2002-11-28 2010-08-24 Tokyo Electron Limited Internal member of a plasma processing vessel
FR2850790B1 (fr) 2003-02-05 2005-04-08 Semco Engineering Sa Semelle de collage electrostatique avec electrode radiofrequence et moyens thermostatiques integres
CN100401478C (zh) 2003-02-12 2008-07-09 松下电器产业株式会社 半导体器件的制造方法
JP4045990B2 (ja) * 2003-03-26 2008-02-13 株式会社デンソー コーティング方法及びコーティング用治具
US6753269B1 (en) 2003-05-08 2004-06-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method for low k dielectric deposition
JP2004332081A (ja) 2003-05-12 2004-11-25 Shin Etsu Chem Co Ltd 耐プラズマ部材及びその製造方法
US7510641B2 (en) 2003-07-21 2009-03-31 Los Alamos National Security, Llc High current density electropolishing in the preparation of highly smooth substrate tapes for coated conductors
US7658816B2 (en) 2003-09-05 2010-02-09 Tokyo Electron Limited Focus ring and plasma processing apparatus
EP1589567B1 (en) 2003-09-16 2007-04-04 Shin-Etsu Quartz Products Co., Ltd. Member for plasma etching device and method for manufacture thereof
US20050056056A1 (en) 2003-09-16 2005-03-17 Wong Marvin Glenn Healing micro cracks in a substrate
EP1524682B1 (en) 2003-10-17 2011-10-05 Tosoh Corporation Component for vacuum apparatus, production method thereof and apparatus using the same
JP4189373B2 (ja) 2003-10-31 2008-12-03 株式会社トクヤマ 窒化アルミニウム接合体及びその製造方法
US7220497B2 (en) 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
US20050142393A1 (en) 2003-12-30 2005-06-30 Boutwell Brett A. Ceramic compositions for thermal barrier coatings stabilized in the cubic crystalline phase
JP4606121B2 (ja) 2004-01-29 2011-01-05 京セラ株式会社 耐食膜積層耐食性部材およびその製造方法
JP2005260040A (ja) 2004-02-12 2005-09-22 Sony Corp ドーピング方法、半導体装置の製造方法および電子応用装置の製造方法
US20050230350A1 (en) 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
JP2007531289A (ja) 2004-03-24 2007-11-01 マサチューセッツ インスティテュート オブ テクノロジー 表面堆積物を除去するための遠隔チャンバ方法
JP4443976B2 (ja) 2004-03-30 2010-03-31 忠弘 大見 セラミックスの洗浄方法および高清浄性セラミックス
WO2006005067A2 (en) 2004-07-07 2006-01-12 General Electric Company Protective coating on a substrate and method of making thereof
JP2006108602A (ja) 2004-09-10 2006-04-20 Toshiba Corp 半導体装置及びその製造方法
US20060068189A1 (en) 2004-09-27 2006-03-30 Derek Raybould Method of forming stabilized plasma-sprayed thermal barrier coatings
EP1805817B1 (en) 2004-10-01 2016-11-16 American Superconductor Corporation Thick superconductor films with improved performance
JP2006128000A (ja) 2004-10-29 2006-05-18 Advanced Lcd Technologies Development Center Co Ltd プラズマ処理装置
KR20060041497A (ko) 2004-11-09 2006-05-12 동부일렉트로닉스 주식회사 건식 식각장치
US8058186B2 (en) 2004-11-10 2011-11-15 Tokyo Electron Limited Components for substrate processing apparatus and manufacturing method thereof
JP2006207012A (ja) 2004-12-28 2006-08-10 Toshiba Ceramics Co Ltd イットリウム系セラミックス被覆材およびその製造方法
US7838083B1 (en) * 2005-01-28 2010-11-23 Sandia Corporation Ion beam assisted deposition of thermal barrier coatings
US7354659B2 (en) 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining
US20060222777A1 (en) 2005-04-05 2006-10-05 General Electric Company Method for applying a plasma sprayed coating using liquid injection
US7790216B2 (en) * 2005-04-19 2010-09-07 Zimmer Technology, Inc. Method for producing a zirconia-layered orthopedic implant component
JP2008545612A (ja) 2005-05-31 2008-12-18 コーニング インコーポレイテッド 細孔形成剤の組合せを含有するチタン酸アルミニウムセラミック形成バッチ混合物および未焼成体、および同混合物および未焼成体の製造および焼成方法
WO2006135043A1 (ja) 2005-06-17 2006-12-21 Tohoku University 金属部材の保護膜構造及び保護膜構造を用いた金属部品並びに保護膜構造を用いた半導体又は平板ディスプレイ製造装置
JP4813115B2 (ja) 2005-07-14 2011-11-09 国立大学法人東北大学 半導体製造装置用部材及びその洗浄方法
KR20070013118A (ko) 2005-07-25 2007-01-30 삼성전자주식회사 플라즈마 식각 장치
US7672110B2 (en) 2005-08-29 2010-03-02 Applied Materials, Inc. Electrostatic chuck having textured contact surface
JP4571561B2 (ja) 2005-09-08 2010-10-27 トーカロ株式会社 耐プラズマエロージョン性に優れる溶射皮膜被覆部材およびその製造方法
US7968205B2 (en) * 2005-10-21 2011-06-28 Shin-Etsu Chemical Co., Ltd. Corrosion resistant multilayer member
JP4985928B2 (ja) 2005-10-21 2012-07-25 信越化学工業株式会社 多層コート耐食性部材
JP2007126712A (ja) 2005-11-02 2007-05-24 Fujimi Inc 溶射用粉末及び溶射皮膜の形成方法
KR101019293B1 (ko) 2005-11-04 2011-03-07 어플라이드 머티어리얼스, 인코포레이티드 플라즈마-강화 원자층 증착 장치 및 방법
US20070113783A1 (en) 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7622195B2 (en) 2006-01-10 2009-11-24 United Technologies Corporation Thermal barrier coating compositions, processes for applying same and articles coated with same
US7736759B2 (en) 2006-01-20 2010-06-15 United Technologies Corporation Yttria-stabilized zirconia coating with a molten silicate resistant outer layer
US7648782B2 (en) 2006-03-20 2010-01-19 Tokyo Electron Limited Ceramic coating member for semiconductor processing apparatus
US7655328B2 (en) 2006-04-20 2010-02-02 Shin-Etsu Chemical Co., Ltd. Conductive, plasma-resistant member
US20070264155A1 (en) 2006-05-09 2007-11-15 Brady Michael D Aerosol jet deposition method and system for creating a reference region/sample region on a biosensor
ATE518016T1 (de) 2006-05-12 2011-08-15 Fundacion Inasmet Verfahren zum erhalt von keramikbeschichtungen und erhaltene keramikbeschichtungen
US20070274837A1 (en) 2006-05-26 2007-11-29 Thomas Alan Taylor Blade tip coatings
US20080009417A1 (en) 2006-07-05 2008-01-10 General Electric Company Coating composition, article, and associated method
US20080016684A1 (en) 2006-07-06 2008-01-24 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
US20080029032A1 (en) 2006-08-01 2008-02-07 Sun Jennifer Y Substrate support with protective layer for plasma resistance
US7722959B2 (en) * 2006-09-06 2010-05-25 United Technologies Corporation Silicate resistant thermal barrier coating with alternating layers
US7701693B2 (en) 2006-09-13 2010-04-20 Ngk Insulators, Ltd. Electrostatic chuck with heater and manufacturing method thereof
US20080090034A1 (en) 2006-09-18 2008-04-17 Harrison Daniel J Colored glass frit
US7469640B2 (en) 2006-09-28 2008-12-30 Alliant Techsystems Inc. Flares including reactive foil for igniting a combustible grain thereof and methods of fabricating and igniting such flares
WO2008044555A1 (en) 2006-10-06 2008-04-17 Asahi Tech Co., Ltd. Corrosion-resistant member and method for producing the same
US7479464B2 (en) 2006-10-23 2009-01-20 Applied Materials, Inc. Low temperature aerosol deposition of a plasma resistive layer
US7919722B2 (en) 2006-10-30 2011-04-05 Applied Materials, Inc. Method for fabricating plasma reactor parts
US20080176149A1 (en) * 2006-10-30 2008-07-24 Applied Materials, Inc. Endpoint detection for photomask etching
US20080142755A1 (en) 2006-12-13 2008-06-19 General Electric Company Heater apparatus and associated method
US8097105B2 (en) 2007-01-11 2012-01-17 Lam Research Corporation Extending lifetime of yttrium oxide as a plasma chamber material
KR20090101245A (ko) 2007-01-17 2009-09-24 토토 가부시키가이샤 세라믹 부재 및 내식성 부재
US7976949B2 (en) 2007-03-12 2011-07-12 Saint-Gobain Ceramics & Plastics, Inc. High strength ceramic elements and methods for making and using the same
US7659204B2 (en) 2007-03-26 2010-02-09 Applied Materials, Inc. Oxidized barrier layer
US7718559B2 (en) 2007-04-20 2010-05-18 Applied Materials, Inc. Erosion resistance enhanced quartz used in plasma etch chamber
US7696117B2 (en) 2007-04-27 2010-04-13 Applied Materials, Inc. Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
US7848076B2 (en) 2007-07-31 2010-12-07 Applied Materials, Inc. Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
US8108981B2 (en) 2007-07-31 2012-02-07 Applied Materials, Inc. Method of making an electrostatic chuck with reduced plasma penetration and arcing
US9202736B2 (en) 2007-07-31 2015-12-01 Applied Materials, Inc. Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
US8367227B2 (en) 2007-08-02 2013-02-05 Applied Materials, Inc. Plasma-resistant ceramics with controlled electrical resistivity
US7649729B2 (en) 2007-10-12 2010-01-19 Applied Materials, Inc. Electrostatic chuck assembly
US8129029B2 (en) 2007-12-21 2012-03-06 Applied Materials, Inc. Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating
US8062759B2 (en) * 2007-12-27 2011-11-22 General Electric Company Thermal barrier coating systems including a rare earth aluminate layer for improved resistance to CMAS infiltration and coated articles
US20090214825A1 (en) 2008-02-26 2009-08-27 Applied Materials, Inc. Ceramic coating comprising yttrium which is resistant to a reducing plasma
CA2658210A1 (en) 2008-04-04 2009-10-04 Sulzer Metco Ag Method and apparatus for the coating and for the surface treatment of substrates by means of a plasma beam
DE102008021167B3 (de) 2008-04-28 2010-01-21 Siemens Aktiengesellschaft Verfahren zur Erzeugung einer hermetisch dichten, elektrischen Durchführung mittels exothermer Nanofolie und damit hergestellte Vorrichtung
JP5466831B2 (ja) 2008-04-28 2014-04-09 株式会社フェローテックセラミックス イットリア焼結体およびプラズマプロセス装置用部材
US8546284B2 (en) 2008-05-07 2013-10-01 Council Of Scientific & Industrial Research Process for the production of plasma sprayable yttria stabilized zirconia (YSZ) and plasma sprayable YSZ powder produced thereby
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US20090297718A1 (en) 2008-05-29 2009-12-03 General Electric Company Methods of fabricating environmental barrier coatings for silicon based substrates
JP2010006641A (ja) * 2008-06-27 2010-01-14 Kyocera Corp 耐食性部材およびこれを用いた処理装置
KR100969248B1 (ko) 2008-08-04 2010-07-14 한국해양연구원 해양 생물표본 촬영장치 및 방법
WO2010019430A2 (en) * 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
JP5537001B2 (ja) 2008-08-20 2014-07-02 株式会社アルバック 表面処理セラミックス部材、その製造方法および真空処理装置
US7929269B2 (en) * 2008-09-04 2011-04-19 Momentive Performance Materials Inc. Wafer processing apparatus having a tunable electrical resistivity
US8667583B2 (en) 2008-09-22 2014-03-04 Microsoft Corporation Collecting and analyzing malware data
JP5357486B2 (ja) 2008-09-30 2013-12-04 東京エレクトロン株式会社 プラズマ処理装置
JP5545792B2 (ja) 2008-10-31 2014-07-09 株式会社日本セラテック 耐食性部材
CN102272344A (zh) 2008-11-04 2011-12-07 普莱克斯技术有限公司 用于半导体应用的热喷涂层
US8206829B2 (en) 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
US8858745B2 (en) 2008-11-12 2014-10-14 Applied Materials, Inc. Corrosion-resistant bonding agents for bonding ceramic components which are exposed to plasmas
US9017765B2 (en) 2008-11-12 2015-04-28 Applied Materials, Inc. Protective coatings resistant to reactive plasma processing
JP5407324B2 (ja) 2008-12-24 2014-02-05 堺化学工業株式会社 酸化ジルコニウム分散液の製造方法
FR2940278B1 (fr) 2008-12-24 2011-05-06 Snecma Propulsion Solide Barriere environnementale pour substrat refractaire contenant du silicium
US20100177454A1 (en) 2009-01-09 2010-07-15 Component Re-Engineering Company, Inc. Electrostatic chuck with dielectric inserts
US7964517B2 (en) 2009-01-29 2011-06-21 Texas Instruments Incorporated Use of a biased precoat for reduced first wafer defects in high-density plasma process
BRPI1007908A2 (pt) 2009-02-05 2016-02-16 Sulzer Metco Ag instalação de revestimento por plasma e método para revestir ou tratar a superfície de um substrato
US8404572B2 (en) 2009-02-13 2013-03-26 Taiwan Semiconductor Manufacturing Co., Ltd Multi-zone temperature control for semiconductor wafer
US8444737B2 (en) 2009-02-27 2013-05-21 Corning Incorporated Ceramic structures and methods of making ceramic structures
JP5001323B2 (ja) 2009-03-27 2012-08-15 トーカロ株式会社 白色酸化イットリウム溶射皮膜表面の改質方法および酸化イットリウム溶射皮膜被覆部材
US8137743B2 (en) 2009-05-08 2012-03-20 Fuchita Nanotechnology Ltd. Method for forming zirconia film
JP5595795B2 (ja) 2009-06-12 2014-09-24 東京エレクトロン株式会社 プラズマ処理装置用の消耗部品の再利用方法
DE112010003392B4 (de) 2009-08-26 2024-08-14 Toyota Jidosha Kabushiki Kaisha Brennstoffzellensystem und Verfahren zum Betreiben eines Brennstoffzellensystems
US20110086178A1 (en) 2009-10-14 2011-04-14 General Electric Company Ceramic coatings and methods of making the same
WO2011066314A1 (en) * 2009-11-25 2011-06-03 Green, Tweed Of Delaware, Inc. Methods of coating substrate with plasma resistant coatings and related coated substrates
JP5604888B2 (ja) 2009-12-21 2014-10-15 住友大阪セメント株式会社 静電チャックの製造方法
JP5423632B2 (ja) 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
US20110198034A1 (en) 2010-02-11 2011-08-18 Jennifer Sun Gas distribution showerhead with coating material for semiconductor processing
FR2957358B1 (fr) 2010-03-12 2012-04-13 Snecma Methode de fabrication d'une protection de barriere thermique et revetement multicouche apte a former une barriere thermique
JP5267603B2 (ja) 2010-03-24 2013-08-21 Toto株式会社 静電チャック
JP5819816B2 (ja) 2010-03-30 2015-11-24 日本碍子株式会社 半導体製造装置用耐食性部材及びその製法
KR101221925B1 (ko) 2010-04-22 2013-01-14 한국세라믹기술원 플라즈마 저항성 세라믹 피막 및 그 제조 방법
WO2011150311A1 (en) 2010-05-28 2011-12-01 Praxair Technology, Inc. Substrate supports for semiconductor applications
US20110315081A1 (en) 2010-06-25 2011-12-29 Law Kam S Susceptor for plasma processing chamber
WO2012005977A1 (en) 2010-06-29 2012-01-12 Los Alamos National Security, Llc Solution deposition planarization method
US20120183790A1 (en) 2010-07-14 2012-07-19 Christopher Petorak Thermal spray composite coatings for semiconductor applications
KR101108692B1 (ko) 2010-09-06 2012-01-25 한국기계연구원 다공성 세라믹 표면을 밀봉하는 치밀한 희토류 금속 산화물 코팅막 및 이의 제조방법
US10720350B2 (en) 2010-09-28 2020-07-21 Kla-Tencore Corporation Etch-resistant coating on sensor wafers for in-situ measurement
US9969022B2 (en) 2010-09-28 2018-05-15 Applied Materials, Inc. Vacuum process chamber component and methods of making
US20120100299A1 (en) 2010-10-25 2012-04-26 United Technologies Corporation Thermal spray coating process for compressor shafts
US8916021B2 (en) 2010-10-27 2014-12-23 Applied Materials, Inc. Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof
CN103493194B (zh) 2011-06-02 2016-05-18 应用材料公司 静电夹盘的氮化铝电介质修复
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
US20130048606A1 (en) 2011-08-31 2013-02-28 Zhigang Mao Methods for in-situ chamber dry clean in photomask plasma etching processing chamber
US20130115418A1 (en) 2011-11-03 2013-05-09 Coorstek, Inc. Multilayer rare-earth oxide coatings and methods of making
JP5496992B2 (ja) 2011-12-13 2014-05-21 中国電力株式会社 プラズマ溶射装置及びその制御方法
JP6082755B2 (ja) 2011-12-19 2017-02-15 プラックセアー エス.ティ.テクノロジー、 インコーポレイテッド 遮熱及び耐環境コーティングを生成するための水性スラリー並びにこれを作製及び適用するための方法
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
KR20130098707A (ko) 2012-02-28 2013-09-05 삼성전자주식회사 정전 척 장치 및 그 제어방법
US20150064406A1 (en) 2012-03-22 2015-03-05 Tocalo Co., Ltd. Method for forming fluoride spray coating, and fluoride spray coating covered member
US20130273313A1 (en) 2012-04-13 2013-10-17 Applied Materials, Inc. Ceramic coated ring and process for applying ceramic coating
US9090046B2 (en) 2012-04-16 2015-07-28 Applied Materials, Inc. Ceramic coated article and process for applying ceramic coating
US20130288037A1 (en) 2012-04-27 2013-10-31 Applied Materials, Inc. Plasma spray coating process enhancement for critical chamber components
US9394615B2 (en) 2012-04-27 2016-07-19 Applied Materials, Inc. Plasma resistant ceramic coated conductive article
US9150602B2 (en) 2012-07-24 2015-10-06 Atomic Energy Council, Institute Of Nuclear Energy Research Precursor used for labeling hepatorcyte receptor and containing trisaccharide and diamide demercaptide ligand, method for preparing the same, radiotracer and pharmaceutical composition of the same
US9604249B2 (en) 2012-07-26 2017-03-28 Applied Materials, Inc. Innovative top-coat approach for advanced device on-wafer particle performance
US9343289B2 (en) 2012-07-27 2016-05-17 Applied Materials, Inc. Chemistry compatible coating material for advanced device on-wafer particle performance
US20140037969A1 (en) 2012-08-03 2014-02-06 General Electric Company Hybrid Air Plasma Spray and Slurry Method of Environmental Barrier Deposition
JP5934069B2 (ja) 2012-09-14 2016-06-15 日本碍子株式会社 積層構造体、半導体製造装置用部材及び積層構造体の製造方法
US9916998B2 (en) 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9685356B2 (en) 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US8941969B2 (en) 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
US9708713B2 (en) 2013-05-24 2017-07-18 Applied Materials, Inc. Aerosol deposition coating for semiconductor chamber components
US9865434B2 (en) 2013-06-05 2018-01-09 Applied Materials, Inc. Rare-earth oxide based erosion resistant coatings for semiconductor application
US9850568B2 (en) * 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
US9711334B2 (en) 2013-07-19 2017-07-18 Applied Materials, Inc. Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
US9583369B2 (en) 2013-07-20 2017-02-28 Applied Materials, Inc. Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles
US20150079370A1 (en) 2013-09-18 2015-03-19 Applied Materials, Inc. Coating architecture for plasma sprayed chamber components
US9440886B2 (en) 2013-11-12 2016-09-13 Applied Materials, Inc. Rare-earth oxide based monolithic chamber material
US9725799B2 (en) 2013-12-06 2017-08-08 Applied Materials, Inc. Ion beam sputtering with ion assisted deposition for coatings on chamber components
US9903020B2 (en) 2014-03-31 2018-02-27 Applied Materials, Inc. Generation of compact alumina passivation layers on aluminum plasma equipment components
US9869013B2 (en) * 2014-04-25 2018-01-16 Applied Materials, Inc. Ion assisted deposition top coat of rare-earth oxide
US20150311043A1 (en) 2014-04-25 2015-10-29 Applied Materials, Inc. Chamber component with fluorinated thin film coating
US9976211B2 (en) 2014-04-25 2018-05-22 Applied Materials, Inc. Plasma erosion resistant thin film coating for high temperature application
US10730798B2 (en) 2014-05-07 2020-08-04 Applied Materials, Inc. Slurry plasma spray of plasma resistant ceramic coating
US10196728B2 (en) 2014-05-16 2019-02-05 Applied Materials, Inc. Plasma spray coating design using phase and stress control
US10385459B2 (en) 2014-05-16 2019-08-20 Applied Materials, Inc. Advanced layered bulk ceramics via field assisted sintering technology
US9460898B2 (en) 2014-08-08 2016-10-04 Applied Materials, Inc. Plasma generation chamber with smooth plasma resistant coating
KR20160030812A (ko) 2014-09-11 2016-03-21 삼성전자주식회사 플라즈마 처리 장치

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