CN103493194B - 静电夹盘的氮化铝电介质修复 - Google Patents
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Abstract
本发明一般涉及一种刷新的静电夹盘与一种用于刷新已使用的静电夹盘的方法。一开始,从已使用的静电夹盘移除预定量的电介质材料,以留下基部表面。接着,粗糙化所述基部表面,以提高新的电介质材料对基部表面的粘着性。接着,在粗糙化表面上喷洒新的电介质材料,然后在新的电介质材料上方放置掩模,以助于形成台面,其中在处理期间基板将座落在所述台面上。接着移除一部分新的电介质层,以形成新的台面。在移除掩模之后,台面的边缘变得平滑,且经刷新的静电夹盘可在清洁之后准备返回作业。
Description
发明背景
发明领域
本发明的实施例一般涉及一种刷新的静电夹盘及一种用于刷新静电夹盘的方法。
相关技术的描述
静电夹盘用于半导体装置制造中。通过使基板静电夹置于夹盘,静电夹盘可使基板在处理期间保持在静电夹盘上的固定位置。
静电夹盘一般具有嵌入在电介质材料中的电极。静电夹盘的最上方表面具有多个台面,其中基板将于处理期间座落在这些台面上。随着时间过去,这些台面会磨损,且静电夹盘将变得无法作用。此外,静电夹盘的电气特性会因电介质材料中的裂痕而受波及,或是因化学或等离子体侵袭而危及电介质材料,导致电介质材料损坏。
当台面磨损时,在电介质材料中即会形成裂痕,或是电介质材料会损坏,静电夹盘即无法使用,且一般会被丢弃。能刷新所述静电夹盘以避免购买新的静电夹盘的花费便是有帮助的。
发明内容
本发明一般涉及一种刷新的静电夹盘与一种用于刷新已使用的静电夹盘的方法。一开始,从已使用的静电夹盘移除预定量的电介质材料,以留下基部表面。接着,粗糙化所述基部表面,以提高新的电介质材料对基部表面的粘着性。接着,在粗糙化表面上喷洒新的电介质材料,然后在新的电介质材料上方放置掩模,以助于形成台面,其中在处理期间基板将座落在所述台面上。接着移除一部分新的电介质层,以形成新的台面。在移除掩模之后,台面的边缘可变得平滑,且经刷新的静电夹盘在清洁之后准备返回作业。
在一个实施例中,一种用于刷新静电夹盘的方法包含以下步骤:测量在静电夹盘的上表面下方的电极的深度;回应于测量的所述深度,确定所述静电夹盘的待移除部分的厚度;以及移除所述静电夹盘的所述部分,以暴露基部表面。所述方法也包含以下步骤:粗糙化所述基部表面;在粗糙化基部表面上等离子体喷洒电介质材料,以于所述基部表面上形成喷洒材料的电介质层;以及压缩所述喷洒材料的电介质层。所述方法另外包含以下步骤:选择性移除压缩的所述喷洒材料的电介质层中的材料,以建立新的上表面,并研磨所述新的上表面。
在另一实施例中,公开了一种用于刷新静电夹盘的方法。所述方法包含以下步骤:测量在静电夹盘主体的上表面下方的电极的深度;回应于测量的所述深度,确定所述静电夹盘主体的待移除部分的厚度;移除所述静电夹盘主体的所述部分,以暴露出基部表面;粗糙化所述基部表面;以及在粗糙化基部表面上配置电介质材料,以于所述基部表面上形成电介质层。
在另一实施例中,一种刷新的静电夹盘包含:夹盘主体,所述夹盘主体具有一或多个电极及配置在所述夹盘主体上方的一或多层第一电介质层以及配置在所述一或多层第一电介质层上方的第二电介质层。所述第二电介质层具有上表面,所述上表面具有以远离所述一或多层第一电介质层的方向而自所述上表面延伸的多个台面。所述第二电介质层与所述一或多层第一电介质层是不同的层。
在另一实施例中,一种刷新的静电夹盘包含多层式静电夹盘主体,其中所述多层式静电夹盘主体的第一层上嵌入有一或多个电极,其中所述多层式静电夹盘主体的第二层选自由烧结电介质层以及以粘着剂接合至所述第一层的电介质层所组成的组,其中所述第二层具有上表面,所述上表面具有以远离所述第一层的方向而自所述上表面延伸的多个台面,且其中所述第二层与所述第一层是不同的层。
附图简要说明
为可详细理解本发明的上述特征,如上简述的本发明的更具体说明可参阅上述实施例而得知,其中部分实施例图示于附图中。然而,应注意附图仅图示本发明的典型实施例,且因此不应被视为限制发明的范围,因为本发明可允许其它等效实施例。
图1A是已使用的静电夹盘在刷新之前的示意上视图。
图1B是图1A的已使用的静电夹盘的截面图。
图2至图7是图1A与图1B的静电夹盘在根据一个实施例的各个刷新阶段的截面图。
图8是图1A与图1B的静电夹盘在根据另一实施例的各个刷新阶段的截面图。
为帮助理解,在图中已尽可能地使用了相同的元件符号来代表图中相同的元件。应知在一个实施例中所公开的元件可有利地用于其它实施例,无须特别叙述。
具体描述
本发明一般涉及一种刷新的静电夹盘与一种用于刷新已使用的静电夹盘的方法。可依本文所述的实施例来进行刷新的适当静电夹盘包含由美国加州圣克拉拉的应用材料公司所供应的琼森-拉贝克(Johnson-Rahbeck)静电夹盘。应理解本文所讨论的实施例可等效地应用于其它类型的静电夹盘,包含其它制造商所供应的静电夹盘。
图1A是已使用的琼森-拉贝克型静电夹盘100在刷新之前的示意上视图。图1B是图1A的已使用静电夹盘的截面图。静电夹盘100具有夹盘主体108,夹盘主体108包含上表面112与下表面114。上表面112包含从静电夹盘100的夹盘主体108延伸的多个台面102。夹盘主体108具有一或多层电介质层。在图1A与图1B所示实施例中,夹盘主体108包含单一电介质层。夹盘主体108包含陶瓷材料,例如氮化铝,然而,应理解本文所讨论的刷新方法也可应用于包含其它电介质材料的静电夹盘。气体保持环104从上表面112延伸,并且围绕设置台面102所在区域。台面102与气体保持环104都包含与夹盘主体108相同的电介质材料。在夹盘主体108内嵌入有电极106,电极106经由杆部110而耦接至电源,杆部110耦接至静电夹盘100的下表面114。
如图1B所示,台面102各于夹盘主体108上方延伸不同高度。因此,置于静电夹盘100上的任何基板可因台面102的不均高度而无法被实质平坦地固定。此外,不平坦的台面102会使置于静电夹盘100上的基板无法被均匀夹紧,这可影响对基板所进行处理的均匀性。
为了刷新静电夹盘100,需要确定欲移除的材料量。电极106与台面102的最高点或气体保持环104之间的距离(如箭头“B”所示)是通过测量静电夹盘100的电容而加以确定。在移除材料后,需要在电极106上方留下预定材料量(如箭头“D”所示),以避免电极106的意外暴露。因此,欲移除的材料量(如箭头“C”所示)确定为距离“B”减去距离“D”。
一旦确定欲移除的材料量,接着即抛光及研磨静电夹盘100,以移除台面102、气体保持环104与夹盘主体108的额外材料,留下在电极106上方距离“D”处的基部表面202,如图2所示。距离“D”可介于离电极106约20微米至约25微米之间。抛光会移除材料块材,而研磨使表面202平滑。在一个实施例中,抛光根据浆体内的钻石大小而以介于约每分钟1微米至约每分钟150微米之间的速率移除材料。在一个实施例中,浆体钻石大小介于约0.05微米至约100微米之间。应理解可调整浆体钻石大小以符合所需的移除速率。抛光有利于移除材料,因为抛光可被控制在1微米内,且尽可能平滑均匀地产生基部表面202。其它的移除技术(例如珠击或蚀刻)可能较不合适,因为珠击与蚀刻无法如同抛光般受控制。
为助于新的电介质材料粘着至平滑的基部表面202,基部表面202可经粗糙化。举例而言,基部表面202可经粗糙化至介于约50微英寸至约300微英寸之间的表面粗糙度,产生如图3所示的粗糙化表面302。在一个实施例中,通过珠击来粗糙化基部表面202。
在形成粗糙化表面302之后,即沉积新的电介质材料402,如图4所示。在一个实施例中,新的电介质材料402以热等离子体喷洒涂覆于粗糙化表面302上。大部分的沉积工艺都是一致性沉积工艺,所述一致性沉积工艺会复制发生沉积的表面。热等离子体喷洒工艺是一种可达到非一致性涂覆的工艺(即,新涂层的上表面并不复制粗糙化表面302)。因为热等离子体喷洒工艺,后续欲形成的台面与气体保持环可具有所需的隆起轮廓,所述隆起轮廓减少基板或硅损害与背侧颗粒。为了确定喷洒涂覆的适当材料,测量原始电介质材料的电阻率,然后选择可喷洒且尽可能接近原始电介质材料电阻率的适当材料。可使用的适当电介质材料包含氮化铝粉末。电介质材料可与掺杂剂混合,掺杂剂例如氧化钇、氧化铝、氧化钛、氧化钐与上述物质的组合。一旦选择琼森-拉贝克静电夹盘的适当材料,即于粗糙化表面302上喷洒涂覆新的电介质材料402。
因为喷洒涂覆了新的电介质材料402,晶粒松散堆积。因此,静电夹盘100被置于高压、惰性气体环境中,以压缩晶粒,使得在晶粒之间的空间较少。压缩的适当压力是在高于约1托的压力环境。
接着,形成台面与气体保持环。为了形成台面与气体保持环,选择性移除部分新的电介质材料402。为了选择性移除部分新的电介质材料402,在新的电介质材料402上方放置掩模502,如图5所示。在形成台面604与气体保持环602的工艺中,可视需要而形成气体沟槽、隆起与其它几何形状。掩模502具有开口504,开口504对应于将形成台面与气体保持环的位置的相邻区域。接着通过穿过掩模502所形成的开口504对暴露的新的电介质材料402进行珠击。移除掩模502以留下新形成的台面604与气体保持环602,如图6所示。
台面604与气体保持环602可具有尖锐边缘或毛边,尖锐边缘或毛边会在处理期间刮伤基板背部,并产生不希望的颗粒。因此,可在最小力量下以软质研磨垫研磨台面604与气体保持环602,以磨圆尖锐角部、移除毛边,留下如图7所示的完成台面704与保持环702。因此,刷新的静电夹盘700再次准备操作。
图8是图1A与图1B的静电夹盘在根据另一实施例的各个刷新阶段的截面图。不同于在粗糙化表面302上喷洒涂覆电介质层,电介质材料定位盘802可通过粘着层804而接合于粗糙化表面302上。如上所述,可使用的适当电介质材料包含氮化铝粉末。电介质材料可与掺杂剂混合,掺杂剂例如氧化钇、氧化铝、氧化钛、氧化钐与上述物质的组合。粘着层的适当材料包含真空环氧树脂,所述真空环氧树脂具有添加物以控制电阻率及衰减性或放电性,添加物例如氧化铝、氧化钛、氧化钽、氧化钐与上述物质的组合。一旦定位盘802粘着至粗糙化表面302,即如上述关于图5至图7的说明形成台面。定位盘802不需经烧结,因为定位盘的晶粒已紧密堆积。
经刷新的静电夹盘700包含嵌有电极106的原始夹盘主体108与配置在上方的新的电介质材料402,所述新的电介质材料402具有上表面,上表面具有以远离原始夹盘主体108的方向延伸的多个台面704。因此,经刷新的静电夹盘700包含多层电介质层。经刷新的静电夹盘700因此具有不同的部分,即原始夹盘主体108与新的电介质材料402。原始夹盘主体108与新的电介质材料402都可包含相同的材料(例如氮化铝)。此外,新的电介质材料402可具有掺杂剂,例如氧化钇、氧化铝、氧化钛、氧化钐或上述物质的组合。
通过刷新静电夹盘,即无须购买全新的静电夹盘。刷新的静电夹盘比新的静电夹盘成本低,但仍具有基本上相同的电阻率,且功能与新的静电夹盘实质相同。
虽然前述说明针对本发明的实施例,但可设计本发明的其它与进一步的实施例而不背离本发明的基本范围,本发明的范围由所附的权利要求书所确定。
Claims (11)
1.一种用于刷新静电夹盘的方法,所述方法包含以下步骤:
测量在静电夹盘主体的上表面下方的电极的深度;
回应于测量的所述深度,确定所述静电夹盘主体的待移除部分的厚度;
移除所述静电夹盘主体的所述部分,以暴露基部表面;
粗糙化所述基部表面;
在粗糙化基部表面上等离子体喷洒电介质材料,以于所述基部表面上形成喷洒材料的电介质层;
压缩所述喷洒材料的电介质层;以及
选择性移除压缩的所述喷洒材料的电介质层中的材料,以建立新的上表面。
2.如权利要求1所述的方法,其中移除所述静电夹盘主体的所述部分以暴露所述基部表面包含于所述上表面上执行抛光工艺。
3.如权利要求2所述的方法,其中粗糙化所述基部表面包含珠击所述基部表面。
4.如权利要求3所述的方法,其中所述粗糙化基部表面具有介于50微英寸与300微英寸之间的表面粗糙度。
5.如权利要求4所述的方法,其中移除所述静电夹盘主体的所述部分以暴露所述基部表面包含在所述基部表面与所述电极之间留下20微米至25微米的静电夹盘主体。
6.如权利要求5所述的方法,其中压缩所述喷洒材料的电介质层包含使所述喷洒材料的电介质层暴露于高于1托的压力中。
7.如权利要求6所述的方法,其中选择性移除压缩的所述喷洒材料的电介质层中的材料以建立所述新的上表面包含以下步骤:
于压缩的所述喷洒材料的电介质层上方形成掩模;以及
珠击经由所述掩模而暴露的压缩的所述喷洒材料的电介质层,以形成台面。
8.如权利要求7所述的方法,所述方法还包含研磨所述新的上表面,其中研磨所述新的上表面包含移除所述台面的毛边。
9.如权利要求1所述的方法,其中所述喷洒材料的电介质层包含氮化铝。
10.如权利要求9所述的方法,其中所述喷洒材料的电介质层另包含氧化钇、氧化铝、氧化钛、氧化钐或上述物质的组合。
11.如权利要求1所述的方法,其中测量在所述静电夹盘的所述上表面下方的所述电极的深度包含测量所述静电夹盘主体在所述电极与所述上表面之间的电容。
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JP2017055126A (ja) | 2017-03-16 |
US9001489B2 (en) | 2015-04-07 |
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