JP2016096222A - 半導体装置 - Google Patents
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- 238000009792 diffusion process Methods 0.000 description 8
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Abstract
【解決手段】第1トレンチゲートとエミッタ層が基板の表面側に形成されコレクタ層が該基板の裏面側に形成されたIGBTと、該第1トレンチゲートと絶縁された第2トレンチゲートとアノード層が該基板の表面側に形成されカソード層が該基板の裏面側に形成されたダイオードとを備え、該第1トレンチゲートは複数の第1ストライプ部と該ダイオードを囲む第1環状部を備え、該第2トレンチゲートは複数の第2ストライプ部と該第1環状部と対向し該複数の第2ストライプ部を囲む第2環状部を備え、該第1環状部と該第2環状部の距離は一定であり該第1環状部と該第2環状部の距離は該複数の第1ストライプ部のストライプ間距離と該複数の第2ストライプ部のストライプ間距離のうち大きい方の距離以下である。
【選択図】図2
Description
図1は、本発明の実施の形態1に係る半導体装置10の平面図である。半導体装置10はIGBT12とダイオード14を備えたRC−IGBTで構成されている。ダイオード14は島状に4つ形成されている。ダイオード14を囲むようにIGBT12が形成されている。IGBT12の一部にはゲートパッド12aが設けられている。半導体装置10の最外周にはn+型のエミッタ層16がある。
図7は、本発明の実施の形態2に係る半導体装置の平面図である。図8は、図7の破線部分102の拡大図である。第1トレンチゲート20は平行に設けられた第1ストライプ部20d、20e、20f、20gを備えている。第2トレンチゲート30は平行に設けられた第2ストライプ部30d、30e、30f、30gを備えている。第2トレンチゲート30は、第1トレンチゲート20と離れることで第1トレンチゲート20と絶縁されている。なお、第2トレンチゲート30はエミッタ電極に接続されている。
図9は、本発明の実施の形態3に係る半導体装置のIGBTとダイオードの境界部分の平面図である。実施の形態3に係る半導体装置は、IGBTとダイオードの境界構造に特徴がある。第2トレンチゲート30は、第1トレンチゲート20と離れて設けられることで、第1トレンチゲート20と絶縁されている。第2トレンチゲート30はエミッタ電極に接続されている。第1ストライプ部20h、20i、20j、20kの伸長方向にそれぞれ第2ストライプ部30h、30i、30j、30kがある。
図12は、本発明の実施の形態4に係る半導体装置300の平面図である。半導体装置300はストライプ状のIGBT302A、302Bと、ストライプ状のダイオード304A、304B、304Cを備えている。IGBT302Aはダイオード304Aとダイオード304Bに挟まれている。IGBT302Bはダイオード304Bとダイオード304Cに挟まれている。このように、横長に形成されたIGBTとダイオードが交互に設けられている。なお、IGBT302A、302Bのゲート電流はゲートパッド302aから供給される。
Claims (10)
- 第1トレンチゲートとエミッタ層が基板の表面側に形成され、コレクタ層が前記基板の裏面側に形成されたIGBTと、
第2トレンチゲートとアノード層が前記基板の表面側に形成され、カソード層が前記基板の裏面側に形成されたダイオードと、を備え、
前記第2トレンチゲートは前記第1トレンチゲートと絶縁され、
前記第1トレンチゲートは、複数の第1ストライプ部と、平面視で前記ダイオードを囲む第1環状部を備え、
前記第2トレンチゲートは、複数の第2ストライプ部と、平面視で前記第1環状部と対向し前記複数の第2ストライプ部を囲む第2環状部を備え、
前記第1環状部と前記第2環状部の距離は一定であり、
前記第1環状部と前記第2環状部の距離は、前記複数の第1ストライプ部のストライプ間距離と前記複数の第2ストライプ部のストライプ間距離のうち大きい方の距離以下であることを特徴とする半導体装置。 - 前記第1環状部と前記第2環状部の距離と、前記複数の第1ストライプ部のストライプ間距離と、前記複数の第2ストライプ部のストライプ間距離は等しいことを特徴とする請求項1に記載の半導体装置。
- 第1トレンチゲートとエミッタ層が基板の表面側に形成され、コレクタ層が前記基板の裏面側に形成されたIGBTと、
第2トレンチゲートとアノード層が前記基板の表面側に形成され、カソード層が前記基板の裏面側に形成されたダイオードと、を備え、
前記第2トレンチゲートは前記第1トレンチゲートと絶縁され、
前記第1トレンチゲートは複数の第1ストライプ部を備え、
前記第2トレンチゲートは複数の第2ストライプ部を備え、
前記第2トレンチゲートは、前記第1トレンチゲートの伸長方向に、前記第1トレンチゲートとギャップを設けて配置され、
前記ギャップは平面視で千鳥形となることを特徴とする半導体装置。 - 前記ギャップの長さは、前記複数の第1ストライプ部のストライプ間距離と前記複数の第2ストライプ部のストライプ間距離のうち大きい方の距離以下であることを特徴とする請求項3に記載の半導体装置。
- 前記ギャップは、ギャップ間の最短距離が、前記複数の第1ストライプ部のストライプ間距離と前記複数の第2ストライプ部のストライプ間距離のうち大きい方の距離以上となるように設けられたことを特徴とする請求項3又は4に記載の半導体装置。
- 第1トレンチゲートとエミッタ層がn型のドリフト層を有する基板の表面側に形成され、コレクタ層が前記基板の裏面側に形成されたIGBTと、
第2トレンチゲートとアノード層が前記基板の表面側に形成され、カソード層が前記基板の裏面側に形成されたダイオードと、を備え、
前記第2トレンチゲートは、前記第1トレンチゲートと離れて設けられることで、前記第1トレンチゲートと絶縁され、
前記第2トレンチゲートの端部を覆い、前記第1トレンチゲートと前記第2トレンチゲートの端部の間の領域を覆う、前記第1トレンチゲートと前記第2トレンチゲートよりも深く形成された、前記ドリフト層と接するpウェル層を備えたことを特徴とする半導体装置。 - 前記pウェル層の不純物濃度は、前記IGBTのベース層の不純物濃度より高いことを特徴とする請求項6に記載の半導体装置。
- 前記エミッタ層に接続されたエミッタ電極を備え、
前記第2トレンチゲートは前記エミッタ電極と電気的に接続されたことを特徴とする請求項1〜7のいずれか1項に記載の半導体装置。 - 前記第2トレンチゲートはフローティングとなっていることを特徴とする請求項1〜7のいずれか1項に記載の半導体装置。
- 前記第2トレンチゲートは、埋め込み酸化膜で形成されたことを特徴とする請求項1〜7のいずれか1項に記載の半導体装置。
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JP2014230928A JP6260515B2 (ja) | 2014-11-13 | 2014-11-13 | 半導体装置 |
US14/848,314 US9478647B2 (en) | 2014-11-13 | 2015-09-08 | Semiconductor device |
DE102015221061.8A DE102015221061B4 (de) | 2014-11-13 | 2015-10-28 | Halbleitervorrichtung |
CN201510779277.3A CN105609545B (zh) | 2014-11-13 | 2015-11-13 | 半导体装置 |
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018156996A (ja) * | 2017-03-15 | 2018-10-04 | 富士電機株式会社 | 半導体装置 |
US10128230B2 (en) | 2016-09-15 | 2018-11-13 | Fuji Electric Co., Ltd. | Semiconductor device |
WO2019017104A1 (ja) * | 2017-07-18 | 2019-01-24 | 富士電機株式会社 | 半導体装置 |
JP2019087623A (ja) * | 2017-11-06 | 2019-06-06 | 富士電機株式会社 | 半導体装置 |
US10559663B2 (en) | 2016-10-14 | 2020-02-11 | Fuji Electric Co., Ltd. | Semiconductor device with improved current flow distribution |
US10643992B2 (en) | 2018-02-19 | 2020-05-05 | Fuji Electric Co., Ltd. | Semiconductor device |
JPWO2019078131A1 (ja) * | 2017-10-18 | 2020-05-28 | 富士電機株式会社 | 半導体装置 |
WO2020121371A1 (ja) * | 2018-12-10 | 2020-06-18 | 三菱電機株式会社 | 炭化珪素半導体装置およびその製造方法 |
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US9478647B2 (en) | 2016-10-25 |
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JP6260515B2 (ja) | 2018-01-17 |
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