JP5052091B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5052091B2 JP5052091B2 JP2006285863A JP2006285863A JP5052091B2 JP 5052091 B2 JP5052091 B2 JP 5052091B2 JP 2006285863 A JP2006285863 A JP 2006285863A JP 2006285863 A JP2006285863 A JP 2006285863A JP 5052091 B2 JP5052091 B2 JP 5052091B2
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Description
(実施の形態1)
最初に、本実施の形態の半導体装置の構成について、図1〜図4を用いて説明する。
図16および図17は、本発明の実施の形態2における半導体装置の構成を概略的に示す部分断面図および上面図である。なお図16は図17のXVI−XVI線に沿う部分断面図である。
図21は、本発明の実施の形態3における半導体装置の構成を概略的に示す部分断面図である。図21を参照して、本実施の形態の半導体装置は、正対面42Pにp型コレクタ領域14が形成されている。
Claims (4)
- 第1および第2主面を有し、第1導電型の第1不純物領域を含む半導体基板と、
前記半導体基板の前記第1主面に形成され、前記第1主面において前記第1不純物領域に取り囲まれた第2導電型の第2不純物領域と、
前記第1主面に形成され、前記第1不純物領域との間で前記第2不純物領域を挟む第1導電型の第3不純物領域と、
前記半導体基板の前記第2主面に選択的に形成され、前記第2不純物領域との間で前記第1不純物領域を挟む第2導電型の第4不純物領域と、
前記半導体基板の前記第2主面に選択的に形成され、前記第2不純物領域との間で前記第1不純物領域を挟む、前記第1不純物領域よりも不純物濃度の高い第1導電型の第5不純物領域と、
前記第1不純物領域と前記第3不純物領域とに挟まれる前記第2不純物領域に絶縁膜を介在して対向するように形成された制御電極層とを備え、
前記第1主面において前記第1不純物領域が形成されている部分と正対する前記第2主面の部分が、前記第2主面において前記第4および第5不純物領域の形成領域を取り囲み、かつ前記第1不純物領域の不純物濃度以下の濃度を有する第1導電型の領域であり、
前記第2主面において、前記第4不純物領域と前記第5不純物領域とが同じ方向に延びており前記第5不純物領域が前記第4不純物領域に挟まれている、半導体装置。 - 前記第1主面において前記第1不純物領域を介在して前記第2不純物領域を取り囲む第2導電型の第6不純物領域をさらに備えたことを特徴とする、請求項1に記載の半導体装置。
- 前記半導体基板の前記第1主面上に形成され、前記第6不純物領域と電気的に接続されたガード電極層をさらに備えたことを特徴とする、請求項2に記載の半導体装置。
- 前記第3不純物領域と正対する前記第2主面の部分には前記第4不純物領域が位置していることを特徴とする、請求項1〜3のいずれかに記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006285863A JP5052091B2 (ja) | 2006-10-20 | 2006-10-20 | 半導体装置 |
US11/617,863 US7705398B2 (en) | 2006-10-20 | 2006-12-29 | Semiconductor device preventing recovery breakdown and manufacturing method thereof |
KR1020070032753A KR100838651B1 (ko) | 2006-10-20 | 2007-04-03 | 반도체장치 및 그 제조방법 |
DE102007019561A DE102007019561B4 (de) | 2006-10-20 | 2007-04-25 | Halbleitervorrichtung und Herstellungsverfahren derselben |
CN200710102972A CN100585858C (zh) | 2006-10-20 | 2007-04-27 | 半导体装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006285863A JP5052091B2 (ja) | 2006-10-20 | 2006-10-20 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2008103590A JP2008103590A (ja) | 2008-05-01 |
JP5052091B2 true JP5052091B2 (ja) | 2012-10-17 |
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JP2006285863A Expired - Fee Related JP5052091B2 (ja) | 2006-10-20 | 2006-10-20 | 半導体装置 |
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US (1) | US7705398B2 (ja) |
JP (1) | JP5052091B2 (ja) |
KR (1) | KR100838651B1 (ja) |
CN (1) | CN100585858C (ja) |
DE (1) | DE102007019561B4 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4265684B1 (ja) * | 2007-11-07 | 2009-05-20 | トヨタ自動車株式会社 | 半導体装置 |
JP5267036B2 (ja) * | 2007-12-05 | 2013-08-21 | 株式会社デンソー | 半導体装置の製造方法 |
JP5206541B2 (ja) * | 2008-04-01 | 2013-06-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP5366297B2 (ja) * | 2009-02-10 | 2013-12-11 | 富士電機株式会社 | 半導体装置 |
EP2442355B1 (en) * | 2009-06-11 | 2014-04-23 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
JP5182766B2 (ja) * | 2009-12-16 | 2013-04-17 | 三菱電機株式会社 | 高耐圧半導体装置 |
WO2011125156A1 (ja) * | 2010-04-02 | 2011-10-13 | トヨタ自動車株式会社 | ダイオード領域とigbt領域を有する半導体基板を備える半導体装置 |
JP5321669B2 (ja) * | 2010-11-25 | 2013-10-23 | 株式会社デンソー | 半導体装置 |
US8502346B2 (en) * | 2010-12-23 | 2013-08-06 | Alpha And Omega Semiconductor Incorporated | Monolithic IGBT and diode structure for quasi-resonant converters |
JP2013247248A (ja) * | 2012-05-25 | 2013-12-09 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
KR101927410B1 (ko) | 2012-11-30 | 2018-12-10 | 삼성전자주식회사 | 고전자 이동도 트랜지스터 및 그 제조방법 |
JP6119577B2 (ja) | 2013-11-26 | 2017-04-26 | 三菱電機株式会社 | 半導体装置 |
JP6277814B2 (ja) * | 2014-03-25 | 2018-02-14 | 株式会社デンソー | 半導体装置 |
WO2016030966A1 (ja) | 2014-08-26 | 2016-03-03 | 三菱電機株式会社 | 半導体素子 |
JP6260515B2 (ja) | 2014-11-13 | 2018-01-17 | 三菱電機株式会社 | 半導体装置 |
JP6335829B2 (ja) | 2015-04-06 | 2018-05-30 | 三菱電機株式会社 | 半導体装置 |
JP6531589B2 (ja) * | 2015-09-17 | 2019-06-19 | 株式会社デンソー | 半導体装置 |
JP6565815B2 (ja) | 2016-07-21 | 2019-08-28 | 株式会社デンソー | 半導体装置 |
JP6598756B2 (ja) | 2016-11-11 | 2019-10-30 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
JP6624101B2 (ja) * | 2017-02-03 | 2019-12-25 | 株式会社デンソー | 半導体装置 |
JP6804379B2 (ja) | 2017-04-24 | 2020-12-23 | 三菱電機株式会社 | 半導体装置 |
KR102442933B1 (ko) * | 2017-08-21 | 2022-09-15 | 삼성전자주식회사 | 3차원 반도체 장치 |
JP6824135B2 (ja) * | 2017-09-29 | 2021-02-03 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP7131003B2 (ja) * | 2018-03-16 | 2022-09-06 | 富士電機株式会社 | 半導体装置 |
DE112019007210T5 (de) * | 2019-04-10 | 2021-12-30 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
JP7342742B2 (ja) | 2020-03-11 | 2023-09-12 | 三菱電機株式会社 | 半導体装置 |
JP7354897B2 (ja) | 2020-03-26 | 2023-10-03 | 三菱電機株式会社 | 半導体装置 |
JP7359053B2 (ja) | 2020-03-26 | 2023-10-11 | 三菱電機株式会社 | 半導体装置 |
JP7459666B2 (ja) | 2020-06-04 | 2024-04-02 | 三菱電機株式会社 | 半導体装置 |
JP2022085307A (ja) | 2020-11-27 | 2022-06-08 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066995A (en) | 1987-03-13 | 1991-11-19 | Harris Corporation | Double level conductor structure |
EP0409010A1 (de) * | 1989-07-19 | 1991-01-23 | Asea Brown Boveri Ag | Abschaltbares Leistungshalbleiterbauelement |
JPH03238871A (ja) * | 1990-02-15 | 1991-10-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH05152574A (ja) | 1991-11-29 | 1993-06-18 | Fuji Electric Co Ltd | 半導体装置 |
JPH0685269A (ja) | 1992-08-31 | 1994-03-25 | Fuji Electric Co Ltd | 逆導通絶縁ゲート型バイポーラトランジスタの製造方法 |
JPH07153942A (ja) | 1993-12-01 | 1995-06-16 | Matsushita Electron Corp | 絶縁ゲート型バイポーラトランジスタおよびその製造方法 |
DE69530881D1 (de) | 1994-03-18 | 2003-07-03 | Hitachi Ltd | Halbleiteranordnung mit einem lateralen Bipolartransistor |
KR970004060B1 (ko) | 1994-07-04 | 1997-03-24 | 엘지반도체 주식회사 | 전송게이트를 이용한 전치 출력 버퍼 |
JP3424635B2 (ja) * | 1994-09-20 | 2003-07-07 | 株式会社日立製作所 | 半導体装置及びそれを使った電力変換装置 |
US5969400A (en) | 1995-03-15 | 1999-10-19 | Kabushiki Kaisha Toshiba | High withstand voltage semiconductor device |
KR970004060A (ko) * | 1995-06-30 | 1997-01-29 | 김광호 | 반도체장치 및 그 제조방법 |
JP4351745B2 (ja) * | 1997-09-19 | 2009-10-28 | 株式会社東芝 | 半導体装置 |
JPH11204789A (ja) * | 1998-01-08 | 1999-07-30 | Sanken Electric Co Ltd | 絶縁ゲ−ト形トランジスタ |
JP4354069B2 (ja) * | 2000-02-08 | 2009-10-28 | 日本碍子株式会社 | 逆導通機能を有する半導体装置 |
JP4357753B2 (ja) * | 2001-01-26 | 2009-11-04 | 株式会社東芝 | 高耐圧半導体装置 |
TW594946B (en) | 2002-01-16 | 2004-06-21 | Sanken Electric Co Ltd | Manufacturing method of semiconductor device |
JP2003297957A (ja) | 2002-04-05 | 2003-10-17 | Mitsubishi Electric Corp | 半導体装置及び半導体装置の製造方法 |
US6838321B2 (en) | 2002-09-26 | 2005-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
JP4403366B2 (ja) * | 2003-06-04 | 2010-01-27 | 富士電機デバイステクノロジー株式会社 | 半導体装置およびその製造方法 |
JP2005057235A (ja) * | 2003-07-24 | 2005-03-03 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ及びその製造方法、並びに、インバータ回路 |
JP4799829B2 (ja) | 2003-08-27 | 2011-10-26 | 三菱電機株式会社 | 絶縁ゲート型トランジスタ及びインバータ回路 |
JP4791704B2 (ja) * | 2004-04-28 | 2011-10-12 | 三菱電機株式会社 | 逆導通型半導体素子とその製造方法 |
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KR20080035942A (ko) | 2008-04-24 |
US7705398B2 (en) | 2010-04-27 |
KR100838651B1 (ko) | 2008-06-16 |
CN100585858C (zh) | 2010-01-27 |
CN101165897A (zh) | 2008-04-23 |
US20080093697A1 (en) | 2008-04-24 |
JP2008103590A (ja) | 2008-05-01 |
DE102007019561B4 (de) | 2012-10-25 |
DE102007019561A1 (de) | 2008-04-24 |
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