JP2015070269A5 - - Google Patents

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JP2015070269A5
JP2015070269A5 JP2014192072A JP2014192072A JP2015070269A5 JP 2015070269 A5 JP2015070269 A5 JP 2015070269A5 JP 2014192072 A JP2014192072 A JP 2014192072A JP 2014192072 A JP2014192072 A JP 2014192072A JP 2015070269 A5 JP2015070269 A5 JP 2015070269A5
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Japan
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dielectric
semiconductor device
dielectric layer
package structure
vias
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JP2014192072A
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JP6587792B2 (ja
JP2015070269A (ja
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JP2014192072A 2013-09-26 2014-09-22 埋め込み型半導体デバイスパッケージおよびその製造方法 Active JP6587792B2 (ja)

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Application Number Priority Date Filing Date Title
US14/037,728 US9209151B2 (en) 2013-09-26 2013-09-26 Embedded semiconductor device package and method of manufacturing thereof
US14/037,728 2013-09-26

Publications (3)

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JP2015070269A JP2015070269A (ja) 2015-04-13
JP2015070269A5 true JP2015070269A5 (https=) 2017-10-19
JP6587792B2 JP6587792B2 (ja) 2019-10-09

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US (2) US9209151B2 (https=)
EP (1) EP2854168A3 (https=)
JP (1) JP6587792B2 (https=)
KR (1) KR102295990B1 (https=)
CN (1) CN104681520A (https=)
TW (2) TWI634632B (https=)

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