TWI634632B - 嵌入式半導體裝置封裝及其製造方法 - Google Patents

嵌入式半導體裝置封裝及其製造方法 Download PDF

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Publication number
TWI634632B
TWI634632B TW103131743A TW103131743A TWI634632B TW I634632 B TWI634632 B TW I634632B TW 103131743 A TW103131743 A TW 103131743A TW 103131743 A TW103131743 A TW 103131743A TW I634632 B TWI634632 B TW I634632B
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Taiwan
Prior art keywords
semiconductor device
dielectric
layer
dielectric layer
package structure
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TW103131743A
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English (en)
Chinese (zh)
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TW201523821A (zh
Inventor
Shakti Singh Chauhan
夏可堤 喬漢
Paul Alan Mcconnelee
保羅 麥可隆尼
Arun Virupaksha Gowda
艾倫 格達
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General Electric Company
通用電機股份有限公司
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Publication of TW201523821A publication Critical patent/TW201523821A/zh
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Publication of TWI634632B publication Critical patent/TWI634632B/zh

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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
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