JP2013538445A - 埋め込み構造およびその製造方法 - Google Patents
埋め込み構造およびその製造方法 Download PDFInfo
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- JP2013538445A JP2013538445A JP2013520779A JP2013520779A JP2013538445A JP 2013538445 A JP2013538445 A JP 2013538445A JP 2013520779 A JP2013520779 A JP 2013520779A JP 2013520779 A JP2013520779 A JP 2013520779A JP 2013538445 A JP2013538445 A JP 2013538445A
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Abstract
【選択図】図1A
Description
本開示は、2010年7月20日に出願された米国仮特許出願第61/366,136号および2010年7月28日に出願された米国仮特許出願第61/368,555号の優先権を主張し、当該出願の明細書の全体を、本明細書と一貫しない項目を除いて、本明細書にあらゆる目的において参照として組み込む。本願は、2011年3月16日に出願された米国特許出願第13/049,550号に関連し、当該出願の明細書の全体を、本明細書と一貫しない項目を除いて、本明細書にあらゆる目的において参照として組み込む。
Claims (16)
- 第1ダイを用意する段階と、
前記第1ダイを基板の層に取り付ける段階と、
前記基板の1つ以上の更なる層を形成して、前記第1ダイを前記基板に埋め込む段階と、
第2ダイを前記1つ以上の更なる層に結合する段階と
を備え、
前記第1ダイは、前記第1ダイの電気信号をルーティングするボンドパッドを有する面を持ち、
前記第2ダイは、前記第2ダイの電気信号をルーティングするボンドパッドを有する面を持ち、
前記第2ダイは、電気信号が前記第1ダイと前記第2ダイとの間でルーティングされるように、前記1つ以上の更なる層に結合される
方法。 - ヒートシンクを前記第2ダイに結合する段階をさらに備え、
前記第2ダイは、前記第2ダイの第1面で前記1つ以上の更なる層に結合され、
前記ヒートシンクは、前記第2ダイの前記第1面とは反対側の前記第2ダイの第2面に結合される
請求項1に記載の方法。 - 第2ダイを前記1つ以上の更なる層に結合する段階は、はんだボールを用いて前記第2ダイを前記1つ以上の更なる層に結合する段階を有する請求項1または2に記載の方法。
- 前記第2ダイと前記1つ以上の更なる層との間にアンダーフィル材を設ける段階をさらに備える請求項3に記載の方法。
- 第3ダイを用意する段階と、
第3ダイを前記基板の層に取り付ける段階と
をさらに備え、
前記第3ダイは、前記第3ダイの電気信号をルーティングするボンドパッドを有する面を持ち、
前記基板の1つ以上の更なる層を形成して、前記第1ダイを前記基板に埋め込む段階は、前記基板の1つ以上の更なる層を形成して、前記第3ダイを前記基板に埋め込む段階を有し、
前記第2ダイは、前記第3ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記1つ以上の更なる層に結合される
請求項1または2に記載の方法。 - 第3ダイを用意する段階は、前記第3ダイを、前記第1ダイの横に、実質的に隣り合わせ配列で設ける段階を有する請求項5に記載の方法。
- 第3ダイを用意する段階は、前記第3ダイを、前記第1ダイの上に、前記第3ダイおよび前記第1ダイが実質的に積み重ね配列となるように設ける段階を有する請求項5に記載の方法。
- 第4ダイを用意する段階と、
第5ダイを用意する段階と
をさらに備え、
前記第4ダイは、前記第4ダイの電気信号をルーティングするボンドパッドを有する面を持ち、
前記第5ダイは、前記第5ダイの電気信号をルーティングするボンドパッドを有する面を持ち、
前記第3ダイは、前記第1ダイの上に、前記第3ダイおよび前記第1ダイが実質的に積み重ね配列となるように設けられ、
前記第5ダイは、前記第4ダイの上に、前記第5ダイおよび前記第4ダイが実質的に積み重ね配列となるように設けられ、
前記第1ダイおよび前記第3ダイと、前記第4ダイおよび前記第5ダイとは、実質的に隣り合わせ配列に配置され、
前記基板の1つ以上の更なる層を形成して前記第1ダイを前記基板に埋め込む段階は、前記基板の1つ以上の更なる層を形成して前記第4ダイおよび前記第5ダイを前記基板に埋め込む段階を有し、
前記第2ダイは、前記第4ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記1つ以上の更なる層に結合され、
前記第2ダイは、前記第5ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記1つ以上の更なる層に結合される
請求項7に記載の方法。 - (i)第1ラミネート層、(ii)第2ラミネート層、および(iii)前記第1ラミネート層と前記第2ラミネート層との間に配置されたコア材を有する基板と、
前記第1ラミネート層に結合された第1ダイであって、前記第1ダイの電気信号をルーティングするボンドパッドを有する面を持ち、前記基板の前記コア材に埋め込まれた第1ダイと、
前記第2ラミネート層に結合された第2ダイであって、前記第2ダイの電気信号をルーティングするボンドパッドを有する面を持つ第2ダイと、
を備え、
前記第2ダイが、前記第1ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記第2ラミネート層に結合されている
装置。 - 前記第2ダイに結合されたヒートシンクをさらに備え、
前記第2ダイが、前記第2ダイの第1面で前記第2ラミネート層に結合され、
前記ヒートシンクが、前記第2ダイの前記第1面とは反対側の前記第2ダイの第2面で、前記第2ダイに結合されている
請求項9に記載の装置。 - 前記第2ダイが、はんだボールを介して前記第2ラミネート層に結合されている請求項9または10に記載の装置。
- 前記第2ダイと前記第2ラミネート層との間にアンダーフィル材をさらに備える請求項11に記載の装置。
- 前記第1ラミネート層に結合された第3ダイであって、前記第3ダイの電気信号をルーティングするボンドパッドを有する面を持つ第3ダイをさらに備え、
前記第3ダイが、前記基板の前記コア材に埋め込まれ、
前記第2ダイが、前記第3ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記第2ラミネート層に結合されている
請求項9または10に記載の装置。 - 前記第3ダイが、(i)前記第1ダイに対して実質的に隣り合わせ配列、または、(ii)前記第1ダイに対して実質的に積み重ね配列、のいずれかに配置されている請求項13に記載の装置。
- 前記第1ラミネート層に結合された第4ダイであって、前記第4ダイの電気信号をルーティングするボンドパッドを有する面を持ち、前記基板の前記コア材に埋め込まれた第4ダイと、
前記第1ラミネート層に結合された第5ダイであって、前記第5ダイの電気信号をルーティングするボンドパッドを有する面を持ち、前記基板の前記コア材に埋め込まれた第5ダイと
をさらに備え、
前記第3ダイが、前記第1ダイの上に、前記第3ダイおよび前記第1ダイが、実質的に積み重ね配列となるように配置され、
前記第5ダイが、前記第4ダイの上に、前記第5ダイおよび前記第4ダイが、実質的に積み重ね配列となるように配置され、
前記第1ダイおよび前記第3ダイと、前記第4ダイおよび前記第5ダイとが、実質的に隣り合わせ配列に配置され、
前記第2ダイが、前記第4ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記第2ラミネート層に結合され、
前記第2ダイが、前記第5ダイと前記第2ダイとの間で電気信号がルーティングされるように、前記第2ラミネート層に結合されている
請求項13に記載の装置。 - 前記第1ダイがメモリ装置であり、前記第2ダイが、1つ以上のシステム・オン・チップ(SoCs)を有する集積回路である請求項9から15のいずれか1項に記載の装置。
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JP7282794B2 (ja) | 2018-06-14 | 2023-05-29 | インテル コーポレイション | 小型電子アセンブリ |
Also Published As
Publication number | Publication date |
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US9087835B2 (en) | 2015-07-21 |
KR20130133166A (ko) | 2013-12-06 |
EP2596531A1 (en) | 2013-05-29 |
CN103168358B (zh) | 2016-05-25 |
WO2012012338A8 (en) | 2013-02-14 |
EP2596531B1 (en) | 2018-10-03 |
TWI527187B (zh) | 2016-03-21 |
US8618654B2 (en) | 2013-12-31 |
US20120049364A1 (en) | 2012-03-01 |
JP6198322B2 (ja) | 2017-09-20 |
WO2012012338A1 (en) | 2012-01-26 |
CN103168358A (zh) | 2013-06-19 |
US20140106508A1 (en) | 2014-04-17 |
TW201214658A (en) | 2012-04-01 |
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