JP2013251561A - 研磨用組成物及びそれを用いた研磨方法 - Google Patents
研磨用組成物及びそれを用いた研磨方法 Download PDFInfo
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- JP2013251561A JP2013251561A JP2013150331A JP2013150331A JP2013251561A JP 2013251561 A JP2013251561 A JP 2013251561A JP 2013150331 A JP2013150331 A JP 2013150331A JP 2013150331 A JP2013150331 A JP 2013150331A JP 2013251561 A JP2013251561 A JP 2013251561A
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- Prior art keywords
- acid
- polishing
- polishing composition
- silicon
- water
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- 239000000203 mixture Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 7
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- 239000010703 silicon Substances 0.000 abstract description 27
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- 235000019100 piperine Nutrition 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 108010064470 polyaspartate Proteins 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 239000010318 polygalacturonic acid Substances 0.000 description 1
- 229920002643 polyglutamic acid Polymers 0.000 description 1
- 229920000656 polylysine Polymers 0.000 description 1
- 229920001444 polymaleic acid Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229960002429 proline Drugs 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229960002151 pyridostigmine bromide Drugs 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- VDUVBBMAXXHEQP-ZTRPPZFVSA-M sodium;(2s,6r)-3,3-dimethyl-6-[(5-methyl-3-phenyl-1,2-oxazole-4-carbonyl)amino]-7-oxo-4-thia-1-azabicyclo[3.2.0]heptane-2-carboxylate Chemical compound [Na+].N([C@@H]1C(N2[C@H](C(C)(C)SC21)C([O-])=O)=O)C(=O)C1=C(C)ON=C1C1=CC=CC=C1 VDUVBBMAXXHEQP-ZTRPPZFVSA-M 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical class NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 229960001367 tartaric acid Drugs 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- XIRUXUKRGUFEKC-SSDOTTSWSA-N tert-butyl (2r)-2-(hydroxymethyl)azetidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CC[C@@H]1CO XIRUXUKRGUFEKC-SSDOTTSWSA-N 0.000 description 1
- BFFLLBPMZCIGRM-MRVPVSSYSA-N tert-butyl (2r)-2-(hydroxymethyl)pyrrolidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC[C@@H]1CO BFFLLBPMZCIGRM-MRVPVSSYSA-N 0.000 description 1
- BFFLLBPMZCIGRM-QMMMGPOBSA-N tert-butyl (2s)-2-(hydroxymethyl)pyrrolidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC[C@H]1CO BFFLLBPMZCIGRM-QMMMGPOBSA-N 0.000 description 1
- CMIBWIAICVBURI-SSDOTTSWSA-N tert-butyl (3r)-3-aminopyrrolidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CC[C@@H](N)C1 CMIBWIAICVBURI-SSDOTTSWSA-N 0.000 description 1
- APCBTRDHCDOPNY-SSDOTTSWSA-N tert-butyl (3r)-3-hydroxypyrrolidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CC[C@@H](O)C1 APCBTRDHCDOPNY-SSDOTTSWSA-N 0.000 description 1
- CMIBWIAICVBURI-ZETCQYMHSA-N tert-butyl (3s)-3-aminopyrrolidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CC[C@H](N)C1 CMIBWIAICVBURI-ZETCQYMHSA-N 0.000 description 1
- XRRXRQJQQKMFBC-UHFFFAOYSA-N tert-butyl 3-hydroxyazetidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CC(O)C1 XRRXRQJQQKMFBC-UHFFFAOYSA-N 0.000 description 1
- CTEDVGRUGMPBHE-UHFFFAOYSA-N tert-butyl 4-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC(CO)CC1 CTEDVGRUGMPBHE-UHFFFAOYSA-N 0.000 description 1
- LZRDHSFPLUWYAX-UHFFFAOYSA-N tert-butyl 4-aminopiperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC(N)CC1 LZRDHSFPLUWYAX-UHFFFAOYSA-N 0.000 description 1
- PWQLFIKTGRINFF-UHFFFAOYSA-N tert-butyl 4-hydroxypiperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC(O)CC1 PWQLFIKTGRINFF-UHFFFAOYSA-N 0.000 description 1
- ROUYFJUVMYHXFJ-UHFFFAOYSA-N tert-butyl 4-oxopiperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC(=O)CC1 ROUYFJUVMYHXFJ-UHFFFAOYSA-N 0.000 description 1
- CWXPZXBSDSIRCS-UHFFFAOYSA-N tert-butyl piperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCNCC1 CWXPZXBSDSIRCS-UHFFFAOYSA-N 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 229960004791 tropicamide Drugs 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 125000005500 uronium group Chemical group 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Abstract
【解決手段】本発明の第1の態様では、水溶性高分子、並びに、コロイダルシリカ及びフュームドシリカから選ばれる少なくとも一種の砥粒を含有し、酸化剤を含有せず、pHが1〜8である研磨用組成物が提供される。本発明の第2の態様では、上記第1の態様に係る研磨用組成物を用いて、シリコン材料を研磨することを特徴とする研磨方法が提供される。
【選択図】なし
Description
以下、本発明の第1実施形態を説明する。
本実施形態の研磨用組成物は、窒素含有化合物及び砥粒を、必要に応じてpH調整剤及びpH緩衝剤とともに、水に混合することにより、pHが1〜7の範囲内になるようにして製造される。従って、研磨用組成物は、窒素含有化合物、砥粒及び水を含有し、必要に応じてpH調整剤及びpH緩衝剤をさらに含有する。
キサデシルヒダントイン、1,1,3,3−テトラブチル尿素、N−アミノフタルイミド、N,N’−ジメトキシ−N,N’−ジメチルオキサミド、ネオスチグミンブロミド、1−カルボベンゾキシピペラジン、N−アリルオキシフタルイミド、1−(tert−ブトキシカルボニル)−4−ピペリドン、1,1−ジメチル−3−[3−(トリフルオロメチル)フェニル]尿素、クエン酸ジエチルカルバマジン、N,N’,N’’,N’’’−テトラアセチルグリコールウリル、1−(tert−ブトキシカルボニル)−4−ヒドロキシピペリジン、1,5,5−トリメチルヒダントイン、1−アセチル−2−イミダゾリジノン、メチル硫酸ネオスチグミン、炭酸ジ(N−スクシンイミジル)、N−メトキシ−N−メチルアセトアミド、1,1’−(アゾジカルボニル)ジピペリジン、(−)−チアゾリジン−3,4−ジカルボン酸3−エチル、N−(tert−ブトキシカルボニル)−L−プロリノール、エトキシカルボニルイソチオシアナート、2−クロロ−N−メトキシ−N−メチルアセトアミド、N−(1,2,2,2−テトラクロロエトキシカルボニルオキシ)こはく酸イミド、N−(フェニルチオ)フタルイミド、ピリドスチグミンブロミド、1−ベンジル−5−フェニルバルビツル酸、N−カルボベンゾキシ−D−プロリン、N−(tert−ブトキシカルボニル)−D−プロリン、N−(tert−ブトキシカルボニル)−L−4−ヒドロキシプロリン、2−(5−ノルボルネン−2,3−ジカルボキシイミド)−1,1,3,3−テトラメチルウロニウムテトラフルオロボラート、1−(tert−ブトキシカルボニル)ピペラジン、(3S)−2−CBZ−1,2,3,4−テトラヒドロイソキノリン−3−カルボン酸、N−カルボベンゾキシ−L−プロリンtert−ブチル、N−ヒドロキシ−4−ニトロフタルイミド、N−メトキシジアセトアミド、(S)−(−)−3−tert−ブトキシカルボニル−4−メトキシカルボニル−2,2−ジメチル−1,3−オキサゾリジン、N−[(9H−フルオレン−9−イルメトキシ)カルボニル]−D−プロリン、N−(tert−ブトキシカルボニル)−O−ベンジル−L−セリンN−スクシンイミジル、1−(tert−ブトキシカルボニル)イソニペコチン酸、N,N,N’,N’−テトラメチル−O−(N−スクシンイミジル)ウロニウムテトラフルオロボラート、4−アミノ−1−tert−ブトキシカルボニルピペリジン、炭酸tert−ブチルフタルイミド、3−(N−tert−ブトキシカルボニル−N−メチルアミノ)ピロリジン、N−[2−(トリメチルシリル)エトキシカルボニルオキシ]こはく酸イミド、N−(tert−ブトキシカルボニル)−D−プロリノール、1−(tert−ブトキシカルボニル)−4−ピペリジンメタノール、(S)−(+)−4−ベンジル−3−プロピオニル−2−オキサゾリジノン、(S)−1−(tert−ブトキシカルボニル)−3−ピロリジノール、(R)−1−(tert−ブトキシカルボニル)−3−ピロリジノール、1,3−ジシクロヘキシルバルビツル酸、(R)−(−)−4−ベンジル−3−プロピオニル−2−オキサゾリジノン、1,1’−アゾビス(N,N−ジメチルホルムアミド)、(S)−(+)−4−イソプロピル−3−プロピオニル−2−オキサゾリジノン、トリス(カルボベンゾキシ)−L−アルギニン、(N−メトキシ−N−メチルカルバモイルメチル)ホスホン酸ジエチル、(R)−(−)−4−イソプロピル−3−プロピオニル−2−オキサゾリジノン、(3R)−(+)−1−(tert−ブトキシカルボニル)−3−アミノピロリジン、(3S)−(−)−1−(tert−ブトキシカルボニル)−3−アミノピロリジン、(N−メトキシ−N−メチルカルバモイルメチル)ホスホン酸ジフェニル、N−アミノこはく酸イミド塩酸、4−ニトロフェニル酢酸N−スクシンイミジル、1−(tert−ブトキシカルボニル)−3−ヒドロキシアゼチジン、(S)−(−)−3−(tert−ブトキシカルボニル)−4−ホルミル−2,2−ジメチル−1,3−オキサゾリジン、3,3’−ジチオジプロピオン酸ジ(N−スクシンイミジル)、S−アセチルチオグリコール酸N−スクシンイミジル、3−アクリロイル−2−オキサゾリジノン、N−(ジエチルカルバモイル)−N−メトキシホルムアミド、6−(2,4−ジニトロアニリノ)ヘキサン酸N−スクシンイミジル、3−マレイミド安息香酸N−スクシンイミジル、(2S,4R)−1−(tert−ブトキシカルボニル)−4−フルオロ−2−ピロリジンカルボン酸、(2S,4S)−1−(tert−ブトキシカルボニル)−4−フルオロ−2−ピロリジンカルボン酸、4−マレイミド酪酸N−スクシンイミジル、3−マレイミドプロピオン酸N−スクシンイミジル、6−マレイミドヘキサン酸N−スクシンイミジル、D−ビオチンN−スクシンイミジル、4−[3,5−ジメチル−4−(4−ニトロベンジルオキシ)フェニル]−4−オキソ酪酸スクシンイミジル、(S)−1−(tert−ブトキシカルボニル)−2−アゼチジンメタノール、(R)−1−(tert−ブトキシカルボニル)−2−アゼチジンメタノール、N−tert−ブトキシカルボニル−N−[3−(tert−ブトキシカルボニルアミノ)プロピル]グリシン、塩酸イリノテカン、6−[[7−(N,N−ジメチルアミノスルホニル)−2,1,3−ベンゾオキサジアゾール−4−イル]アミノ]ヘキサン酸スクシンイミジル、(2R)−6−(テトラヒドロ−2H−ピラン−2−イルオキシ)−2,5,7,8−テトラメチルクロマン−2−カルボン酸スクシンイミジル、フェニルN−ベンジル−2−アミノ−4,6−O−ベンジリデン−2−N,3−O−カルボニル−2−デオキシ−1−チオ−β−D−グルコピラノシドが挙げられる。研磨用組成物が一般式(2)で表される構造を有する化合物を含有する場合には、研磨用組成物中のその含有量は0.05モル/L前後であることが好ましい。
・本実施形態の研磨用組成物を用いることにより、単体シリコン及びシリコン化合物のようなシリコン材料を高い除去速度で研磨することが可能である。従って、本実施形態の研磨用組成物は、シリコン材料を研磨する用途、具体的には、単体シリコン又はシリコン化合物を単独で研磨する用途だけでなく単体シリコンとシリコン化合物を同時に研磨する用途でも好適に使用することができる。本実施形態の研磨用組成物によりシリコン材料の研磨を高い除去速度で実現できる理由は詳細不明であるが、研磨用組成物中に含まれる窒素含有化合物の窒素原子に存在する非共有電子対が高い電子供与性を有しているために、中性から酸性の領域においてもシリコン材料に対する高い反応性が発揮されるものと推察される。この非共有電子対の電子供与性は、窒素含有化合物が上記の一般式(1)で表される構造を有する場合に、特に強まると考えられる。
以下、本発明の第2実施形態を説明する。
第2実施形態の研磨用組成物は、水溶性高分子及び砥粒を、必要に応じてpH調整剤及びpH緩衝剤とともに、水に混合することにより、pHが1〜8の範囲内になるようにして製造される。従って、研磨用組成物は、水溶性高分子、砥粒及び水を含有し、必要に応じてpH調整剤及びpH緩衝剤をさらに含有する。すなわち、第2実施形態の研磨用組成物は、窒素含有化合物の代わりに水溶性高分子を含有している点及びpHが1〜7ではなく1〜8の範囲である点でのみ第1実施形態の研磨用組成物とは異なっている。
・第2実施形態の研磨用組成物を用いることにより、単体シリコンを高い除去速度で研磨することが可能である。従って、第2実施形態の研磨用組成物は、単体シリコンを研磨する用途で好適に使用することができる。第2実施形態の研磨用組成物によりシリコン単体の研磨を高い除去速度で実現できる理由は詳細不明であるが、研磨用組成物中に含まれる水溶性高分子によってシリコン単体の表面が改質されることによりもたらされるものであると推察される。
・第1実施形態の研磨用組成物の場合と同様、第2実施形態の研磨用組成物による単体シリコンの研磨速度も酸化剤の存在によって低下するおそれがある。この点、第2実施形態の研磨用組成物は酸化剤を含有していないため、酸化剤に原因するシリコン材料の研磨速度の低下を回避することができる。
・第1実施形態の研磨用組成物は二種類以上の窒素含有化合物を含有してもよい。
・第2実施形態の研磨用組成物は二種類以上の水溶性高分子を含有してもよい。
・第1及び第2実施形態の研磨用組成物はそれぞれ二種類以上の砥粒を含有してもよい。
・第1実施形態の研磨用組成物は、窒素含有化合物、砥粒及び水以外の成分を含有してもよく、例えば、必要に応じて、キレート剤や水溶性高分子、界面活性剤、防腐剤、防黴剤、防錆剤などの添加剤が添加されてもよい。
・第2実施形態の研磨用組成物は、水溶性高分子、砥粒及び水以外の成分を含有してもよく、例えば、必要に応じて、キレート剤や界面活性剤、防腐剤、防黴剤、防錆剤などの添加剤が添加されてもよい。
・第1及び第2実施形態の研磨用組成物はそれぞれ研磨用組成物の原液を水で希釈することによって調製されてもよい。
参考例1〜21及び参考例22〜26では、窒素含有化合物及び砥粒を、必要に応じてpH調整剤とともに水に混合して研磨用組成物を調製した。比較例1〜5では、砥粒を必要に応じてpH調整剤とともに水に混合して研磨用組成物を調整した。各例の研磨用組成物中の窒素含有化合物の詳細、並びに各例の研磨用組成物のpHを測定した結果を表1に示す。なお、各例において使用した砥粒は、平均二次粒子径が30nmのコロイダルシリカであり、研磨用組成物中のコロイダルシリカの含有量はいずれも5質量%である。また、各例において使用したpH調整剤は酢酸又は水酸化カリウムである。
A1aは、平均二次粒子径が70nmであるコロイダルシリカ、
A1bは、平均二次粒子径が30nmであるコロイダルシリカ、
A2は、平均二次粒子径が150nmであるフュームドシリカ、
B1は、2−オレイル−N−カルボキシメチル−N−ヒドロキシエチルイミダゾリニウムベタイン、
B2は、アルキル(C12〜C14)ジメチルアミノ酢酸ベタイン、
B3は、アルキル(C12〜C14)アミドプロピルジメチルアミノ酢酸ベタイン、
B4は、アルキル(C12〜C14)ジメチルアミンオキサイド、
B5は、ラウリルヒドロキシスルホベタイン、
B6は、アルキル(C12〜C14)アミドサルコシン、
B7は、ラウリルアミノプロピオン酸、
C1は、POE(2)ラウリルアミノエーテル、
C2は、POE(10)ラウリルアミノエーテル、
C3は、POE(5)オレイルアミノエーテル、
D1aは、平均分子量が3000のポリアクリル酸、
D1bは、平均分子量が5500のポリアクリル酸、
D2は、平均分子量が200000のポリアクリル酸アミド、
D3は、平均分子量が80000のカルボキシメチルセルロース、
D4は、和光純薬工業株式会社製のデンプン(生化学用試薬)、
D5は、株式会社林原生物化学研究所製のプルラン(試薬)、
D6aは、平均分子量が8800のポリビニルアルコール、
D6bは、平均分子量が22026のポリビニルアルコール、
D6cは、平均分子量が66078のポリビニルアルコール、
D6dは、平均分子量が105725のポリビニルアルコール、
D6eは、平均分子量が146000のポリビニルアルコール、
D7aは、平均分子量が15000のポリビニルピロリドン、
D7bは、平均分子量が29000のポリビニルピロリドン、
D7cは、平均分子量が30000のポリビニルピロリドン、
D7dは、平均分子量が40000のポリビニルピロリドン、
D7eは、平均分子量が360000のポリビニルピロリドン、
D8は、平均分子量が60000のポリビニルピリジン、
D9は、平均分子量が18320のポリスチレンスルホン酸を表す。
Claims (3)
- 水溶性高分子、並びに、コロイダルシリカ及びフュームドシリカから選ばれる少なくとも一種の砥粒を含有し、酸化剤を含有せず、pHが1〜8であることを特徴とする研磨用組成物。
- 前記水溶性高分子は、多糖、ポリカルボン酸、ポリカルボン酸アミド、ポリカルボン酸エステル、ポリカルボン酸塩、ポリスルホン酸及びビニル系ポリマーのいずれかである請求項1に記載の研磨用組成物。
- 請求項1又は請求項2に記載の研磨用組成物を用いて、シリコン材料を研磨することを特徴とする研磨方法。
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Also Published As
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US20100301014A1 (en) | 2010-12-02 |
CN103131330A (zh) | 2013-06-05 |
CN103131330B (zh) | 2015-09-23 |
KR20100121469A (ko) | 2010-11-17 |
KR101564676B1 (ko) | 2015-11-02 |
US10144849B2 (en) | 2018-12-04 |
JP5695708B2 (ja) | 2015-04-08 |
WO2009096495A1 (ja) | 2009-08-06 |
SG10201605686XA (en) | 2016-08-30 |
JPWO2009096495A1 (ja) | 2011-05-26 |
TW200946660A (en) | 2009-11-16 |
SG188090A1 (en) | 2013-03-28 |
TWI554600B (zh) | 2016-10-21 |
EP2237311A4 (en) | 2011-11-30 |
KR20140146225A (ko) | 2014-12-24 |
KR101564673B1 (ko) | 2015-10-30 |
EP2237311A1 (en) | 2010-10-06 |
CN102084465A (zh) | 2011-06-01 |
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