SG11201401309PA - Composition for polishing purposes, polishing method using same, and method for producing substrate - Google Patents
Composition for polishing purposes, polishing method using same, and method for producing substrateInfo
- Publication number
- SG11201401309PA SG11201401309PA SG11201401309PA SG11201401309PA SG11201401309PA SG 11201401309P A SG11201401309P A SG 11201401309PA SG 11201401309P A SG11201401309P A SG 11201401309PA SG 11201401309P A SG11201401309P A SG 11201401309PA SG 11201401309P A SG11201401309P A SG 11201401309PA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- composition
- same
- purposes
- producing substrate
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011233208 | 2011-10-24 | ||
PCT/JP2012/076125 WO2013061771A1 (en) | 2011-10-24 | 2012-10-09 | Composition for polishing purposes, polishing method using same, and method for producing substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201401309PA true SG11201401309PA (en) | 2014-06-27 |
Family
ID=48167605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201401309PA SG11201401309PA (en) | 2011-10-24 | 2012-10-09 | Composition for polishing purposes, polishing method using same, and method for producing substrate |
Country Status (9)
Country | Link |
---|---|
US (1) | US9579769B2 (en) |
JP (1) | JP5860057B2 (en) |
KR (1) | KR101983868B1 (en) |
CN (1) | CN103890114B (en) |
DE (1) | DE112012004431T5 (en) |
MY (1) | MY171840A (en) |
SG (1) | SG11201401309PA (en) |
TW (1) | TWI547531B (en) |
WO (1) | WO2013061771A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6751015B2 (en) * | 2013-03-15 | 2020-09-02 | キャボット マイクロエレクトロニクス コーポレイション | Aqueous cleaning composition for post-chemical mechanical planarization of copper |
JP6360311B2 (en) * | 2014-01-21 | 2018-07-18 | 株式会社フジミインコーポレーテッド | Polishing composition and method for producing the same |
JP6389629B2 (en) * | 2014-03-31 | 2018-09-12 | ニッタ・ハース株式会社 | Polishing composition |
JP6389630B2 (en) * | 2014-03-31 | 2018-09-12 | ニッタ・ハース株式会社 | Polishing composition |
JP6185432B2 (en) * | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | Silicon wafer polishing composition |
JP6435689B2 (en) * | 2014-07-25 | 2018-12-12 | Agc株式会社 | Abrasive, polishing method, and additive liquid for polishing |
CN104130717B (en) * | 2014-08-07 | 2016-06-08 | 佳明新材料科技有限公司 | A kind of solar silicon wafers lapping liquid formula |
EP3261114B1 (en) * | 2015-02-19 | 2021-01-13 | Fujimi Incorporated | Composition for silicon wafer polishing and polishing method |
CN107735478A (en) * | 2015-06-26 | 2018-02-23 | 福吉米株式会社 | Composition for polishing |
JP6960336B2 (en) * | 2015-10-23 | 2021-11-05 | ニッタ・デュポン株式会社 | Polishing composition |
SG11201803362VA (en) * | 2015-10-23 | 2018-05-30 | Nitta Haas Inc | Polishing composition |
JP6348927B2 (en) * | 2016-04-27 | 2018-06-27 | 株式会社フジミインコーポレーテッド | Silicon wafer polishing composition |
JP6678076B2 (en) * | 2016-06-30 | 2020-04-08 | 花王株式会社 | Polishing liquid composition for silicon wafer |
KR102515815B1 (en) * | 2016-11-09 | 2023-03-30 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing composition and silicon wafer polishing method |
US20200010727A1 (en) * | 2017-02-20 | 2020-01-09 | Fujimi Incorporated | Intermediate polishing composition for silicon substrate and polishing composition set for silicon substrate |
US10961487B2 (en) | 2017-11-30 | 2021-03-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device cleaning solution, method of use, and method of manufacture |
KR102544607B1 (en) * | 2017-11-30 | 2023-06-19 | 솔브레인 주식회사 | Chemical-mechanical polishing slurry composition and method for manufacturing semiconductor by using the same |
JP7138432B2 (en) * | 2017-12-26 | 2022-09-16 | 花王株式会社 | Silicon wafer manufacturing method |
JP7141837B2 (en) * | 2018-03-23 | 2022-09-26 | 株式会社フジミインコーポレーテッド | Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate |
CN113195657A (en) * | 2018-12-12 | 2021-07-30 | 巴斯夫欧洲公司 | Chemical mechanical polishing of copper and ruthenium containing substrates |
CN110054995A (en) * | 2019-06-05 | 2019-07-26 | 连云港众成磨料有限公司 | A kind of grinding-material handling semiconductor element electronic chip surface removal amount |
JP7477964B2 (en) * | 2019-12-13 | 2024-05-02 | インテグリス・インコーポレーテッド | Chemical mechanical polishing composition and chemical mechanical polishing method using the same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001015461A (en) | 1999-06-29 | 2001-01-19 | Toshiba Corp | Polishing solution and polishing method |
US6685757B2 (en) | 2002-02-21 | 2004-02-03 | Rodel Holdings, Inc. | Polishing composition |
JP2004128069A (en) | 2002-09-30 | 2004-04-22 | Fujimi Inc | Grinder composition and grinding method using it |
JP4212861B2 (en) | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon wafer polishing method using the same, and rinsing composition and silicon wafer rinsing method using the same |
JP4593064B2 (en) * | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
JP2005158867A (en) | 2003-11-21 | 2005-06-16 | Jsr Corp | Set for adjusting water-based dispersing element for chemical-mechanical polishing |
WO2006009160A1 (en) * | 2004-07-23 | 2006-01-26 | Hitachi Chemical Co., Ltd. | Cmp polishing agent and method for polishing substrate |
JP4808394B2 (en) * | 2004-10-29 | 2011-11-02 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP2007103515A (en) * | 2005-09-30 | 2007-04-19 | Fujimi Inc | Polishing method |
CN101291778B (en) * | 2005-10-19 | 2012-06-20 | 日立化成工业株式会社 | Cerium oxide slurry, cerium oxide polishing slurry and method for polishing substrate using the same |
JP5204960B2 (en) | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
KR100725803B1 (en) * | 2006-12-05 | 2007-06-08 | 제일모직주식회사 | Slurry compositions for polishing silicone wafer finally and methods for polishing silicone wafer finally by using the same |
US20100112728A1 (en) * | 2007-03-31 | 2010-05-06 | Advanced Technology Materials, Inc. | Methods for stripping material for wafer reclamation |
EP2237311A4 (en) | 2008-02-01 | 2011-11-30 | Fujimi Inc | Polishing composition and polishing method using the same |
JP5297695B2 (en) * | 2008-05-30 | 2013-09-25 | Sumco Techxiv株式会社 | Slurry supply device and semiconductor wafer polishing method using the same |
WO2009154164A1 (en) | 2008-06-18 | 2009-12-23 | 株式会社 フジミインコーポレーテッド | Polishing composition and polishing method using the same |
JP5255343B2 (en) * | 2008-06-27 | 2013-08-07 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
JP5474400B2 (en) * | 2008-07-03 | 2014-04-16 | 株式会社フジミインコーポレーテッド | Semiconductor wetting agent, polishing composition and polishing method using the same |
JP5362319B2 (en) | 2008-10-21 | 2013-12-11 | 花王株式会社 | Polishing liquid composition |
JP5413456B2 (en) | 2009-04-20 | 2014-02-12 | 日立化成株式会社 | Polishing liquid for semiconductor substrate and method for polishing semiconductor substrate |
-
2012
- 2012-10-09 KR KR1020147013217A patent/KR101983868B1/en active IP Right Grant
- 2012-10-09 MY MYPI2014000981A patent/MY171840A/en unknown
- 2012-10-09 SG SG11201401309PA patent/SG11201401309PA/en unknown
- 2012-10-09 CN CN201280051935.1A patent/CN103890114B/en active Active
- 2012-10-09 DE DE112012004431.2T patent/DE112012004431T5/en active Pending
- 2012-10-09 JP JP2013540715A patent/JP5860057B2/en active Active
- 2012-10-09 US US14/352,393 patent/US9579769B2/en active Active
- 2012-10-09 WO PCT/JP2012/076125 patent/WO2013061771A1/en active Application Filing
- 2012-10-19 TW TW101138653A patent/TWI547531B/en active
Also Published As
Publication number | Publication date |
---|---|
MY171840A (en) | 2019-11-04 |
US20140302752A1 (en) | 2014-10-09 |
KR101983868B1 (en) | 2019-05-29 |
CN103890114A (en) | 2014-06-25 |
US9579769B2 (en) | 2017-02-28 |
WO2013061771A1 (en) | 2013-05-02 |
DE112012004431T5 (en) | 2014-07-10 |
TWI547531B (en) | 2016-09-01 |
CN103890114B (en) | 2015-08-26 |
JP5860057B2 (en) | 2016-02-16 |
JPWO2013061771A1 (en) | 2015-04-02 |
KR20140080543A (en) | 2014-06-30 |
TW201333131A (en) | 2013-08-16 |
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