SG11201500924PA - Polishing composition and method for producing substrate - Google Patents

Polishing composition and method for producing substrate

Info

Publication number
SG11201500924PA
SG11201500924PA SG11201500924PA SG11201500924PA SG11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA
Authority
SG
Singapore
Prior art keywords
polishing composition
producing substrate
producing
substrate
polishing
Prior art date
Application number
SG11201500924PA
Inventor
Kohsuke Tsuchiya
Shuhei Takahashi
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50183241&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201500924P(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201500924PA publication Critical patent/SG11201500924PA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08BPOLYSACCHARIDES; DERIVATIVES THEREOF
    • C08B11/00Preparation of cellulose ethers
    • C08B11/02Alkyl or cycloalkyl ethers
    • C08B11/04Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals
    • C08B11/08Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals with hydroxylated hydrocarbon radicals; Esters, ethers, or acetals thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/02Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F16/04Acyclic compounds
    • C08F16/06Polyvinyl alcohol ; Vinyl alcohol
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F26/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F26/06Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C08F26/10N-Vinyl-pyrrolidone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/06Other polishing compositions
    • C09G1/14Other polishing compositions based on non-waxy substances
    • C09G1/16Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1436Composite particles, e.g. coated particles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02024Mirror polishing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/582Recycling of unreacted starting or intermediate materials
SG11201500924PA 2012-08-31 2013-08-12 Polishing composition and method for producing substrate SG11201500924PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012191899 2012-08-31
PCT/JP2013/071813 WO2014034425A1 (en) 2012-08-31 2013-08-12 Polishing composition and method for producing substrate

Publications (1)

Publication Number Publication Date
SG11201500924PA true SG11201500924PA (en) 2015-04-29

Family

ID=50183241

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500924PA SG11201500924PA (en) 2012-08-31 2013-08-12 Polishing composition and method for producing substrate

Country Status (8)

Country Link
US (1) US9505950B2 (en)
JP (1) JP6184962B2 (en)
KR (1) KR102155205B1 (en)
CN (1) CN104603227B (en)
DE (1) DE112013004295T5 (en)
SG (1) SG11201500924PA (en)
TW (1) TWI613283B (en)
WO (1) WO2014034425A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306383B2 (en) * 2014-03-17 2018-04-04 日本キャボット・マイクロエレクトロニクス株式会社 Slurry composition and substrate polishing method
JP6389630B2 (en) * 2014-03-31 2018-09-12 ニッタ・ハース株式会社 Polishing composition
JP2015203081A (en) * 2014-04-15 2015-11-16 株式会社フジミインコーポレーテッド polishing composition
JP6185432B2 (en) 2014-06-24 2017-08-23 株式会社フジミインコーポレーテッド Silicon wafer polishing composition
CN104327741B (en) * 2014-09-28 2016-06-15 顾泉 For grinding abrasive composition and the application thereof of sapphire substrate
US10748778B2 (en) 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
US20180030313A1 (en) * 2015-02-12 2018-02-01 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
JP6489690B2 (en) * 2015-06-25 2019-03-27 花王株式会社 Polishing liquid composition for silicon wafer
JP6348927B2 (en) * 2016-04-27 2018-06-27 株式会社フジミインコーポレーテッド Silicon wafer polishing composition
JP6737124B2 (en) * 2016-10-20 2020-08-05 Agc株式会社 Method for manufacturing mask blank substrate
JP7061965B2 (en) * 2016-11-22 2022-05-02 株式会社フジミインコーポレーテッド Polishing composition
WO2018124230A1 (en) * 2016-12-28 2018-07-05 ニッタ・ハース株式会社 Polishing composition
CN107189695A (en) * 2017-04-15 2017-09-22 浙江晶圣美纳米科技有限公司 A kind of polishing fluid for being efficiently applied to stainless steel lining bottom CMP process
JP7221479B2 (en) 2018-08-31 2023-02-14 日化精工株式会社 Formulation for dicing processing and processing liquid
CN109096924B (en) * 2018-09-17 2021-07-30 宁波日晟新材料有限公司 Glass free-form surface polishing solution and preparation method and application thereof
CN109054656B (en) * 2018-09-17 2021-07-06 宁波日晟新材料有限公司 Metal free-form surface polishing solution and preparation method and application thereof
CN108822739A (en) * 2018-09-17 2018-11-16 珠海琴晟新材料有限公司 A kind of polishing fluid and preparation method thereof
CN110551453A (en) * 2018-12-25 2019-12-10 清华大学 polishing composition
CN117165263A (en) * 2019-03-28 2023-12-05 福吉米株式会社 Polishing composition
CN115662877B (en) * 2022-09-08 2023-08-04 东海县太阳光新能源有限公司 Monocrystalline silicon surface cleaning method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1566421B1 (en) 1998-12-25 2014-12-10 Hitachi Chemical Company, Ltd. CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate.
JP4604727B2 (en) 1998-12-25 2011-01-05 日立化成工業株式会社 Additive for CMP abrasives
JP4608925B2 (en) * 1998-12-25 2011-01-12 日立化成工業株式会社 Additive for CMP abrasives
JP2001240850A (en) * 2000-02-29 2001-09-04 Sanyo Chem Ind Ltd Dispersing agent for abrasive grain for polishing and slurry for polishing
US6685757B2 (en) 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
JP4076012B2 (en) * 2002-04-10 2008-04-16 株式会社日本触媒 Aqueous dispersion for chemical mechanical polishing
JP2003303792A (en) * 2002-04-10 2003-10-24 Nippon Shokubai Co Ltd Water-based dispersing element for chemical mechanical polishing and polishing method
JP4668528B2 (en) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド Polishing composition
US7435356B2 (en) 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
JP5121128B2 (en) * 2005-06-20 2013-01-16 ニッタ・ハース株式会社 Semiconductor polishing composition
US8157876B2 (en) 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
US20090032006A1 (en) 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
SG188090A1 (en) * 2008-02-01 2013-03-28 Fujimi Inc Polishing composition and polishing method using the same
JP2011171689A (en) * 2009-07-07 2011-09-01 Kao Corp Polishing liquid composition for silicon wafer
US20110073800A1 (en) 2009-09-25 2011-03-31 Hongyu Wang Abrasive-free chemical mechanical polishing compositions
JP2012079964A (en) * 2010-10-04 2012-04-19 Nissan Chem Ind Ltd Polishing liquid composition for semiconductor wafer

Also Published As

Publication number Publication date
TWI613283B (en) 2018-02-01
WO2014034425A1 (en) 2014-03-06
US20150210892A1 (en) 2015-07-30
TW201420738A (en) 2014-06-01
US9505950B2 (en) 2016-11-29
DE112013004295T5 (en) 2015-05-13
CN104603227B (en) 2017-03-08
KR102155205B1 (en) 2020-09-11
JPWO2014034425A1 (en) 2016-08-08
JP6184962B2 (en) 2017-08-23
CN104603227A (en) 2015-05-06
KR20150050572A (en) 2015-05-08

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