SG11201500924PA - Polishing composition and method for producing substrate - Google Patents
Polishing composition and method for producing substrateInfo
- Publication number
- SG11201500924PA SG11201500924PA SG11201500924PA SG11201500924PA SG11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- producing substrate
- producing
- substrate
- polishing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08B—POLYSACCHARIDES; DERIVATIVES THEREOF
- C08B11/00—Preparation of cellulose ethers
- C08B11/02—Alkyl or cycloalkyl ethers
- C08B11/04—Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals
- C08B11/08—Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals with hydroxylated hydrocarbon radicals; Esters, ethers, or acetals thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F16/04—Acyclic compounds
- C08F16/06—Polyvinyl alcohol ; Vinyl alcohol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F26/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F26/06—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
- C08F26/10—N-Vinyl-pyrrolidone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012191899 | 2012-08-31 | ||
PCT/JP2013/071813 WO2014034425A1 (en) | 2012-08-31 | 2013-08-12 | Polishing composition and method for producing substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201500924PA true SG11201500924PA (en) | 2015-04-29 |
Family
ID=50183241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201500924PA SG11201500924PA (en) | 2012-08-31 | 2013-08-12 | Polishing composition and method for producing substrate |
Country Status (8)
Country | Link |
---|---|
US (1) | US9505950B2 (en) |
JP (1) | JP6184962B2 (en) |
KR (1) | KR102155205B1 (en) |
CN (1) | CN104603227B (en) |
DE (1) | DE112013004295T5 (en) |
SG (1) | SG11201500924PA (en) |
TW (1) | TWI613283B (en) |
WO (1) | WO2014034425A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6306383B2 (en) * | 2014-03-17 | 2018-04-04 | 日本キャボット・マイクロエレクトロニクス株式会社 | Slurry composition and substrate polishing method |
JP6389630B2 (en) * | 2014-03-31 | 2018-09-12 | ニッタ・ハース株式会社 | Polishing composition |
JP2015203081A (en) * | 2014-04-15 | 2015-11-16 | 株式会社フジミインコーポレーテッド | polishing composition |
JP6185432B2 (en) | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | Silicon wafer polishing composition |
CN104327741B (en) * | 2014-09-28 | 2016-06-15 | 顾泉 | For grinding abrasive composition and the application thereof of sapphire substrate |
US10748778B2 (en) | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
US20180030313A1 (en) * | 2015-02-12 | 2018-02-01 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
JP6489690B2 (en) * | 2015-06-25 | 2019-03-27 | 花王株式会社 | Polishing liquid composition for silicon wafer |
JP6348927B2 (en) * | 2016-04-27 | 2018-06-27 | 株式会社フジミインコーポレーテッド | Silicon wafer polishing composition |
JP6737124B2 (en) * | 2016-10-20 | 2020-08-05 | Agc株式会社 | Method for manufacturing mask blank substrate |
JP7061965B2 (en) * | 2016-11-22 | 2022-05-02 | 株式会社フジミインコーポレーテッド | Polishing composition |
WO2018124230A1 (en) * | 2016-12-28 | 2018-07-05 | ニッタ・ハース株式会社 | Polishing composition |
CN107189695A (en) * | 2017-04-15 | 2017-09-22 | 浙江晶圣美纳米科技有限公司 | A kind of polishing fluid for being efficiently applied to stainless steel lining bottom CMP process |
JP7221479B2 (en) | 2018-08-31 | 2023-02-14 | 日化精工株式会社 | Formulation for dicing processing and processing liquid |
CN109096924B (en) * | 2018-09-17 | 2021-07-30 | 宁波日晟新材料有限公司 | Glass free-form surface polishing solution and preparation method and application thereof |
CN109054656B (en) * | 2018-09-17 | 2021-07-06 | 宁波日晟新材料有限公司 | Metal free-form surface polishing solution and preparation method and application thereof |
CN108822739A (en) * | 2018-09-17 | 2018-11-16 | 珠海琴晟新材料有限公司 | A kind of polishing fluid and preparation method thereof |
CN110551453A (en) * | 2018-12-25 | 2019-12-10 | 清华大学 | polishing composition |
CN117165263A (en) * | 2019-03-28 | 2023-12-05 | 福吉米株式会社 | Polishing composition |
CN115662877B (en) * | 2022-09-08 | 2023-08-04 | 东海县太阳光新能源有限公司 | Monocrystalline silicon surface cleaning method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1566421B1 (en) | 1998-12-25 | 2014-12-10 | Hitachi Chemical Company, Ltd. | CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate. |
JP4604727B2 (en) | 1998-12-25 | 2011-01-05 | 日立化成工業株式会社 | Additive for CMP abrasives |
JP4608925B2 (en) * | 1998-12-25 | 2011-01-12 | 日立化成工業株式会社 | Additive for CMP abrasives |
JP2001240850A (en) * | 2000-02-29 | 2001-09-04 | Sanyo Chem Ind Ltd | Dispersing agent for abrasive grain for polishing and slurry for polishing |
US6685757B2 (en) | 2002-02-21 | 2004-02-03 | Rodel Holdings, Inc. | Polishing composition |
JP4076012B2 (en) * | 2002-04-10 | 2008-04-16 | 株式会社日本触媒 | Aqueous dispersion for chemical mechanical polishing |
JP2003303792A (en) * | 2002-04-10 | 2003-10-24 | Nippon Shokubai Co Ltd | Water-based dispersing element for chemical mechanical polishing and polishing method |
JP4668528B2 (en) * | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | Polishing composition |
US7435356B2 (en) | 2004-11-24 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Abrasive-free chemical mechanical polishing compositions and methods relating thereto |
JP5121128B2 (en) * | 2005-06-20 | 2013-01-16 | ニッタ・ハース株式会社 | Semiconductor polishing composition |
US8157876B2 (en) | 2007-07-31 | 2012-04-17 | Cabot Microelectronics Corporation | Slurry composition containing non-ionic polymer and method for use |
US20090032006A1 (en) | 2007-07-31 | 2009-02-05 | Chul Woo Nam | Wire saw process |
SG188090A1 (en) * | 2008-02-01 | 2013-03-28 | Fujimi Inc | Polishing composition and polishing method using the same |
JP2011171689A (en) * | 2009-07-07 | 2011-09-01 | Kao Corp | Polishing liquid composition for silicon wafer |
US20110073800A1 (en) | 2009-09-25 | 2011-03-31 | Hongyu Wang | Abrasive-free chemical mechanical polishing compositions |
JP2012079964A (en) * | 2010-10-04 | 2012-04-19 | Nissan Chem Ind Ltd | Polishing liquid composition for semiconductor wafer |
-
2013
- 2013-08-12 KR KR1020157007531A patent/KR102155205B1/en active IP Right Grant
- 2013-08-12 SG SG11201500924PA patent/SG11201500924PA/en unknown
- 2013-08-12 CN CN201380045596.0A patent/CN104603227B/en active Active
- 2013-08-12 JP JP2014532916A patent/JP6184962B2/en active Active
- 2013-08-12 WO PCT/JP2013/071813 patent/WO2014034425A1/en active Application Filing
- 2013-08-12 DE DE112013004295.9T patent/DE112013004295T5/en active Pending
- 2013-08-12 US US14/423,945 patent/US9505950B2/en active Active
- 2013-08-27 TW TW102130604A patent/TWI613283B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI613283B (en) | 2018-02-01 |
WO2014034425A1 (en) | 2014-03-06 |
US20150210892A1 (en) | 2015-07-30 |
TW201420738A (en) | 2014-06-01 |
US9505950B2 (en) | 2016-11-29 |
DE112013004295T5 (en) | 2015-05-13 |
CN104603227B (en) | 2017-03-08 |
KR102155205B1 (en) | 2020-09-11 |
JPWO2014034425A1 (en) | 2016-08-08 |
JP6184962B2 (en) | 2017-08-23 |
CN104603227A (en) | 2015-05-06 |
KR20150050572A (en) | 2015-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201500924PA (en) | Polishing composition and method for producing substrate | |
EP2851937A4 (en) | Polishing composition, polishing method using same, and method for producing substrate | |
SG11201401309PA (en) | Composition for polishing purposes, polishing method using same, and method for producing substrate | |
EP2859059A4 (en) | Composition and method for polishing molybdenum | |
IL231935A0 (en) | Polishing pad and method for producing same | |
EP2727649A4 (en) | Copper-and-titanium-containing composition and production method therefor | |
SG11201405091TA (en) | Polishing agent, polishing agent set, and substrate polishing method | |
SG11201404587TA (en) | Polishing composition and method for producing semiconductor substrate | |
SG11201405381WA (en) | Abrasive composition and method for producing semiconductor substrate | |
EP2922090A4 (en) | Metal-ceramic bonded substrate and method for producing same | |
SG11201405708VA (en) | Polishing method | |
GB201408236D0 (en) | Composition and method | |
GB201122195D0 (en) | Composition and method | |
EP2840072A4 (en) | Method for producing semiconductor ceramic composition | |
SG11201406031YA (en) | Polishing pad and method for producing polishing pad | |
EP2774895A4 (en) | Glass substrate and method for producing same | |
EP2781164A4 (en) | Rice-protein composition and method for manufacturing same | |
EP2693459A4 (en) | Polishing composition and polishing method | |
SG11201601292RA (en) | Polishing composition and method for producing same | |
SG11201403505UA (en) | Method for manufacturing cmp composition and application thereof | |
EP2730613A4 (en) | Resin composition and method for producing same | |
EP2821433A4 (en) | Rubber composition and method for producing rubber composition | |
SG11201601265YA (en) | Polishing Composition and Method for Producing Same | |
SG11201400909WA (en) | Composition and method for producing same | |
EP2779216A4 (en) | Polishing composition and polishing method using same, and substrate manufacturing method |