CN103131330B - 研磨用组合物以及使用其的研磨方法 - Google Patents
研磨用组合物以及使用其的研磨方法 Download PDFInfo
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- CN103131330B CN103131330B CN201210587010.0A CN201210587010A CN103131330B CN 103131330 B CN103131330 B CN 103131330B CN 201210587010 A CN201210587010 A CN 201210587010A CN 103131330 B CN103131330 B CN 103131330B
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- Prior art keywords
- polishing
- composition
- acid
- silicon
- grinding
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- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
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Abstract
本发明的第1方式的研磨用组合物含有含氮化合物和磨粒、pH为1～7。研磨用组合物中所含的含氮化合物优选具有通式(1)：R1-N(-R2)-R3(其中，R1、R2、R3分别表示烷基或者在烷基上附加特性基团得到的基团，R1～R3中的2个可构成杂环的一部分，R1～R3中的2个还可以相同并与剩余的1个一起构成杂环的一部分)所示的结构，或者为羧基甜菜碱型两性表面活性剂、磺基甜菜碱型两性表面活性剂、咪唑啉型两性表面活性剂、和氧化胺型两性表面活性剂中的任一种。本发明的第2方式的研磨用组合物含有水溶性高分子和磨粒，不含氧化剂，pH为1～8。
Description
本申请是申请日为2009年1月29日、申请号为200980103331.5、发明名称为“研磨用组合物以及使用其的研磨方法”的申请的分案申请。
技术领域
本发明涉及主要在对硅单晶、无定形硅、多晶硅等单体硅以及氮化硅、氧化硅等硅化合物等的硅材料进行研磨的用途中使用的研磨用组合物以及使用该研磨用组合物的研磨方法。
背景技术
例如在半导体装置的制造工序中，有时会进行用于除去硅单晶、无定形硅、多晶硅等单体硅的至少一部分的研磨。这种研磨通常使用碱性的研磨用组合物进行(例如参照专利文献1、2)。但是，以往已知的研磨用组合物的多数并不能够以使用者十分满意的高的除去速度对单体硅进行研磨。
另外，当将单体硅与氮化硅、氧化硅等硅化合物同时研磨等时，优选使用中性或酸性的研磨用组合物。但是，使用以往已知的中性或酸性研磨用组合物时，难以以使用者十分满意的高的除去速度对单体硅进行研磨。
作为本发明涉及的现有技术文献，不仅可举出上述专利文献1、2，还可举出专利文献36。
专利文献1：日本特表2002-525383号公报
专利文献2：日本特开平7-249600号公报
专利文献3：日本特开2001-031951号公报
专利文献4：日本特开2006-060205号公报
专利文献5：日本特开平11-302633号公报
专利文献6：日本特开2004-266155号公报
发明内容
因此，本发明的目的在于提供可适用于研磨单体硅以及硅化合物等硅材料的用途的研磨用组合物以及使用该研磨用组合物的研磨方法。
为了达成上述目的，本发明的第1方式提供含有含氮化合物和磨粒、pH为1～7的研磨用组合物。
第1方式所涉及的研磨用组合物中所含的含氮化合物优选具有通式(1)：R1-N(-R2)-R3(其中，R1、R2、R3分别表示烷基或者在烷基上附加特性基团得到的基团，R1～R3中的2个可以构成杂环的一部分，R1～R3中的2个还可以相同并与剩余的1个一起构成杂环的一部分)所示的结构。
具有上述通式(1)所示结构的化合物优选具有通式(2)：R1-N(-R2)-C(＝O)-R4(其中，R1、R2、R4分别表示烷基或者在烷基上附加特性基团得到的基团，R1或R2可以与R4一起构成杂环的一部分)所示的结构，或者为氨基酸型两性表面活性剂或者为胺型非离子表面活性剂。
或者第1方式的研磨用组合物中所含的含氮化合物优选为羧基甜菜碱型两性表面活性剂、磺基甜菜碱型两性表面活性剂、咪唑啉型两性表面活性剂和氧化胺型两性表面活性剂中的任一种。
本发明的第2方式提供含有水溶性高分子和磨粒、不含氧化剂、pH为1～8的研磨用组合物。
第2方式的研磨用组合物中所含的水溶性高分子优选为多糖、聚羧酸、聚羧酸酰胺、聚羧酸酯、聚羧酸盐、聚磺酸和乙烯基系聚合物中的任一种。
本发明的第3方式提供以使用上述第1或第2方式的研磨用组合物研磨硅材料为特征的研磨方法。
具体实施方式
第1实施方式
以下说明本发明的第1实施方式。
本实施方式的研磨用组合物通过将含氮化合物和磨粒与根据需要的pH调节剂以及pH缓冲剂一起混合于水中，使得pH达到1～7的范围内而制造。因此，研磨用组合物含有含氮化合物、磨粒和水，根据需要进一步含有pH调节剂和pH缓冲剂。
本实施方式的研磨用组合物在研磨硅材料、即硅单晶、无定形硅、多晶硅等单体硅和氮化硅、氧化硅等硅化合物的用途中使用，更具体地，主要在例如研磨单晶硅基板等硅基板的用途、或者研磨形成于硅基板上的无定形硅膜、多晶硅膜等单体硅膜或者氮化硅膜、氧化硅膜等硅化合物膜的用途中使用。硅化合物膜包含相对介电常数为3以下的低介电常数膜。
含氮化合物具体地可举出胺类、酰胺类、亚胺类、酰亚胺类、脲类、铵类、季铵类、氨基酸类、氨基磺酸类、氨基膦酸类。胺类和酰胺类根据氮原子上的取代基数分为伯、仲、叔级。伯胺包括甲基胺、乙基胺、丁基胺、乙二胺、甘氨酸、丙氨酸、缬氨酸等，仲胺包括哌嗪、哌啶、吗啉、N-甲基甘氨酸等，叔胺包括甲基哌啶、乙基哌啶、甲基吡咯烷、N，N-二甲基乙酰胺、N，N-二乙基乙酰胺等。
作为研磨用组合物中所含的含氮化合物优选使用的是具有通式(1)：R1-N(-R2)-R3所示结构的化合物。通式(1)中，R1、R2、R3分别表示烷基或者在烷基上附加特性基团得到的基团。R1～R3中的2个可以构成杂环的一部分，还可以是R1～R3中的2个相同并与剩余1个一起构成杂环的一部分。作为附加于烷基的特性基团，例如可举出卤素、羟基、氨基、亚氨基、N-氧化物、N-羟基、肼、硝基、亚硝基、偶氮、重氮基、叠氮、氧基、环氧基、氧代、羰基、苯基、膦基、硫代、S-氧化物、thioxy。具有通式(1)所示结构的化合物中，作为R1～R3中的2个构成杂环的一部分的化合物的具体例子，可举出甲基哌啶、乙基哌啶等哌啶类及其类似化合物、甲基吡咯烷等吡咯烷类及其类似化合物、甲基吡咯等吡咯及其类似化合物、甲基吗啉等吗啉类及其类似化合物、甲基哌嗪、二甲基哌嗪等哌嗪类及其类似化合物、六亚甲基四胺及其类似化合物。另外作为R1～R3中的2个相同并与剩余1个一起构成杂环一部分的化合物的具体例子，可举出咪唑、吡唑、三唑、四唑、噻唑、异噻唑、唑、异唑、吡啶、吡嗪、嘧啶、哒嗪以及它们的类似化合物。要说明的是，这里所说的类似化合物均包含衍生物。
具有通式(1)所示结构的化合物中，具有通式(2)：R1-N(-R2)-C(＝O)-R4所示结构的化合物特别优选用作研磨用组合物中所含的含氮化合物。通式(2)中，R1、R2、R4分别表示烷基或者在烷基上附加特性基团得到的基团。R1或R2可以与R4一起构成杂环的一部分。附加在烷基上的特性基团的具体例子如上所述。作为具有通式(2)所示结构的化合物的具体例子，可举出N，N-二甲基乙酰胺、1-甲基-2-吡咯烷酮、N，N-二甲基丙烯酰胺、1-乙烯基-2-吡咯烷酮、N，N-二甲基乙酰乙酰胺、N，N-二乙基丙烯酰胺、N-月桂酰基肌氨酸钠水合物、1-(2-羟基乙基)-2-吡咯烷酮、N-油酰肌氨酸、1-环己基-2-吡咯烷酮、N-苯基马来酰亚胺、N-乙烯基-ε-己内酰胺、N-月桂酰基肌氨酸、1-正辛基-2-吡咯烷酮、N-乙酰乙酰基吗啉、N-(2-乙基己基)-5-降冰片烯-2，3-二羧基酰亚胺、1，3，5-三丙烯酰基六氢-1，3，5-三嗪、4-丙烯酰基吗啉、N，N-二乙基乙酰乙酰胺、N-乙酰基-ε-己内酰胺、N-邻苯二甲酰基甘氨酸、4，4’-双马来酰亚胺二苯基甲烷、N，N-二甲基丙酰胺、4-乙酰基吗啉、N-羟基甲基邻苯二甲酰亚胺、N，N-二乙基十二烷酰胺、N，N’-1，3-亚苯基二马来酰亚胺、N，N-二乙基乙酰胺、N-(2-羟基乙基)邻苯二甲酰亚胺、1，3-二甲基巴比妥酸、N-乙氧羰基(carboethoxy)邻苯二甲酰亚胺、7-(2-羟基乙基)茶碱、N-甲基-ε-己内酰胺、双(3-乙基-5-甲基-4-马来酰亚胺苯基)甲烷、肌酸酐、1-乙酰基-4-(4-羟基苯基)哌嗪、N，N-二乙基氯乙酰胺、N-(2-溴乙基)邻苯二甲酰亚胺、1-乙基-2，3-二氧代哌嗪、1-乙基-2-吡咯烷酮、重氮烷基脲(diazolidinyl urea)、N-(3-溴丙基)邻苯二甲酰亚胺、双(N，N-二甲基乙酰胺)三氢溴酸盐、N-甲基马来酰亚胺、3’，6’-双(二乙基氨基)-2-(4-硝基苯基)螺[异吲哚-1，9’-呫吨]-3-酮、青霉素G钾、N，N-二乙基丙酰胺、N-月桂酰基肌氨酸钠水合物、氯美扎酮、N-甲基-4-硝基邻苯二甲酰亚胺、6-氨基青霉烷酸、邻苯二甲酰亚胺丙酮、N-乙酰基邻苯二甲酰亚胺、3-苄基绕丹酸、3-乙基绕丹酸、N，N，N’，N’-四乙酰基乙二胺、3-烯丙基绕丹酸、N-环己基马来酰亚胺、N-(2，4，6-三氯苯基)马来酰亚胺、头孢氨苄、N-甲基邻苯二甲酰亚胺、邻苯二甲酰亚胺DBU、2-邻苯二甲酰亚胺乙醛二乙基缩醛、二氯丙烯胺(dichlormid)、N-丁基邻苯二甲酰亚胺、氨苄青霉素、4-乙基-2，3-二氧代-1-哌嗪碳酰氯、绕丹酸-3-乙酸、N-乙基马来酰亚胺、N-苄基邻苯二甲酰亚胺、3，4，5，6-四氟-N-甲基邻苯二甲酰亚胺、头孢唑啉钠、1-乙酰基-4-哌啶酮、N-乙基丁二酰亚胺、阿莫西林、N-(溴甲基)邻苯二甲酰亚胺、4-硝基-N-苯基邻苯二甲酰亚胺、1-乙酰基哌啶、1-乙酰基哌嗪、7-氨基去乙酰氧基头孢烷酸、1-(3-羟基丙基)-2-吡咯烷酮、4-氨基-N-甲基邻苯二甲酰亚胺、N，N，N’，N’-四甲基丙二酰胺、1-乙酰基-2-吡咯烷酮、N-(4-溴丁基)邻苯二甲酰亚胺、1-丁基-2-吡咯烷酮、三氯乙酰异氰酸酯、头孢氨噻肟钠、头孢曲松二钠(ceftriaxone disodium)、N，N-二乙基氨基甲酰基甲基膦酸二丁基酯、邻苯二甲酰基-DL-谷氨酸、2-丁基-1，3-二氮杂螺[4.4]壬-1-烯-4-酮盐酸、头孢他啶、N，N’，N”，N”’-四乙酰基甘脲、苯唑西林钠、1-乙酰基-2-咪唑啉酮、2-氧代-1-吡咯烷乙酸甲酯、2-氰基-N，N-二甲基乙酰胺、盐酸洛哌丁胺、N-苄基马来酰亚胺、绕丹酸-3-丙酸、N-邻苯二甲酰基-DL-谷氨酸、(+)-N，N，N’，N’-四甲基-L-酒石酸二酰胺、N-(4-氯苯基)邻苯二甲酰亚胺、(邻苯二甲酰亚胺甲基)膦酸二乙基酯、(-)-N，N，N’，N’-四甲基-D-酒石酸二酰胺、7-氨基头孢烷酸(7-aminocephalosporanic acid)、N-(4-溴苯基)邻苯二甲酰亚胺、N，N-二甲基甲基丙烯酰胺、1-苄基-5-苯基巴比妥酸、胡椒碱、托品酰胺、卡托普利、N，N’-二乙酰基甘氨酸、N-乙烯基邻苯二甲酰亚胺、邻苯二甲酰亚胺丙二酸二乙酯、(R)-N-缩水甘油基邻苯二甲酰亚胺、(S)-N-缩水甘油基邻苯二甲酰亚胺、N-邻苯二甲酰基-L-苯基丙氨酸、邻苯二甲酰基-DL-丙氨酸、1，3，4，6-四-O-乙酰基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖、N，N，N’，N’-四乙基丙二酰胺、N，N，N’，N’-四丙基丙二酰胺、N，N，N’，N’-四丁基丙二酰胺、N，N，N’，N’-四戊基丙二酰胺、N-氯甲基邻苯二甲酰亚胺、氯唑西林钠、N-(4-硝基苯基)马来酰亚胺、N，N’-1，4-亚苯基二马来酰亚胺、1，5-二甲基-2-哌啶酮、L-丙氨酰-L-脯氨酸、N-癸酰基肌氨酸钠、N-邻苯二甲酰基-L-谷氨酸、1-[(2S)-3-(乙酰基硫代)-2-甲基丙酰基]-L-脯氨酸、N，N-二乙基氨基甲酰基亚甲基膦酸二己酯、(S)-(+)-2-羟基-4-邻苯二甲酰亚胺丁酸、2-溴-2-氰基-N，N-二甲基乙酰胺、1-乙酰基吡咯烷、N-甲基双(三氟乙酰胺)、青霉素G钠、格列喹酮、1，3-二甲基-2-硫代乙内酰脲、3-(N-乙酰基-N-甲基氨基)吡咯烷、赖诺普利、反式-1-甲基-4-羧基-5-(3-吡啶基)-2-吡咯烷酮、N-(3-丁烯-1-基)邻苯二甲酰亚胺、(R)-(-)-4-苄基-3-丙酰基-2-唑烷酮、(S)-(+)-4-苄基-3-丙酰基-2-唑烷酮、NAM、哌拉西林钠、N-溴甲基-2，3-二氯马来酰亚胺、4-甲氧基苯基3，4，6-三-O-乙酰基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡糖苷、1，3-二环己基巴比妥酸、甘氨酰肌氨酸、(S)-(十)-4-异丙基-3-丙酰基-2-唑烷酮、(R)-(-)-4-异丙基-3-丙酰基-2-唑烷酮、酮康唑、N-氯甲基-4-硝基邻苯二甲酰亚胺、3-(N-乙酰基-N-乙基氨基)吡咯烷、4，4’，4”-三(4，5-二氯邻苯二甲酰亚胺)三苯甲基溴、4-甲氧基苯基4，6-O-亚苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、4-甲氧基苯基3-O-烯丙基-4，6-O-亚苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、甲基3，4，6-三-O-乙酰基-2-脱氧-2-邻苯二甲酰亚胺-1-硫代-β-D-吡喃葡萄糖苷、4-甲氧基苯基3-O-苄基-4，6-O-亚苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、甘氨酰-L-脯氨酸、酒石酸麦角胺、3-丙烯酰基-2-唑烷酮、N-(8-羟基辛基)邻苯二甲酰亚胺、(R)-1-乙酰基-3-吡咯烷醇、甲磺酸二氢麦角胺、3-马来酰亚胺丙酸、N-(1-芘基)马来酰亚胺、3-马来酰亚胺苯甲酸N-丁二酰亚胺酯、酒石酸二氢麦角胺、4-马来酰亚胺丁酸N-丁二酰亚胺酯、3-马来酰亚胺丙酸N-丁二酰亚胺酯、6-马来酰亚胺己酸N-丁二酰亚胺酯、1，2-双(马来酰亚胺)乙烷、1，6-双马来酰亚胺己烷、N-(4-氨基苯基)马来酰亚胺、N-乙基-N-(4-吡啶甲基)阿托胺、N-[4-(2-苯并咪唑)苯基]马来酰亚胺、(1R，2R)-2-(蒽-2，3-二羧基酰亚胺)环己烷羧酸、(1S，2S)-2-(蒽-2，3-二羧基酰亚胺)环己烷羧酸、(1R，2R)-2-(萘-2，3-二羧基酰亚胺)环己烷羧酸、(1S，2S)-2-(萘-2，3-二羧基酰亚胺)环己烷羧酸、6，7-亚甲二氧基-4-甲基-3-马来酰亚胺香豆素、2，4，7，8，9-五-O-乙酰基-N-乙酰基神经氨酸甲酯、GlcNPhth[346Ac]β(1-3)Gal[246Bn]-β-MP、Gal[2346Ac]β(1-3)GlcNPhth[46Bzd]-β-MP、4-甲氧基苯基3-O-苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、4-甲氧基苯基-3，6-二-O-苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、4-甲氧基苯基4-O-乙酰基-3，6-二-O-苄基-2-脱氧-2-邻苯二甲酰亚胺-β-D-吡喃葡萄糖苷、1，3-二甲基-2-咪唑啉酮、1-(羟基甲基)-5，5-二甲基乙内酰脲、N-(环己基硫代)邻苯二甲酰亚胺、1，3-二甲基-3，4，5，6-四氢-2(1H)-嘧啶酮、N-羟基邻苯二甲酰亚胺、四甲基脲、N-氯邻苯二甲酰亚胺、3-(4-氯苯基)-1，1-二甲基脲、3-(3，4-二氯苯基)-1，1-二甲基脲、1，3-二甲基巴比妥酸、3-甲基-2-唑烷酮、7-(2-羟基乙基)茶碱、1-哌嗪羧酸乙酯、N-苄氧羰氧基丁二酰亚胺、1，3-二甲基-5-吡唑啉酮、重氮烷基咪唑脲、1，1-二甲基脲、1，1，3，3-四乙基脲、1-乙氧基羰基-4-哌啶酮、1-烯丙基乙内酰脲、1-苄基-5-乙氧基乙内酰脲、1-甲基乙内酰脲、N-(叔丁氧基羰基)-L-脯氨酸、N-苄氧羰基-L-脯氨酸、N-[(9H-芴-9-基甲氧基)羰基]-L-脯氨酸、1-丁基乙内酰脲、顺式-1，3-二苄基-2-氧代-4，5-咪唑烷二羧酸、N-(2-氯苄基氧基羰氧基)丁二酰亚胺、1-十二烷基乙内酰脲、4-氯-1-哌啶羧酸乙酯、1，1-二乙基脲、N，N，O-三乙酰基羟基胺、4-羟基-1-哌啶羧酸乙酯、1-苄基乙内酰脲、4-氨基-1-哌啶羧酸乙基酯、3-甲磺酰基-2-氧代-1-咪唑烷羰基氯、碳酸2-溴苄基丁二酰亚胺酯、N-溴邻苯二甲酰亚胺、碳酸9-芴甲基N-丁二酰亚胺酯、1，3，4，6-四(甲氧基甲基)甘脲、2-氧代-1-咪唑烷羰基氯、克菌丹(captan)、1-十六烷基乙内酰脲、1，1，3，3-四丁基脲、N-氨基邻苯二甲酰亚胺、N，N’-二甲氧基-N，N’-二甲基草酰胺、溴新斯的明、1-苄氧羰基哌嗪、N-烯丙氧基邻苯二甲酰亚胺、1-(叔丁氧基羰基)-4-哌啶酮、1，1-二甲基-3-[3-(三氟甲基)苯基]脲、柠檬酸二乙基乙胺嗪、N，N’，N”，N”’-四乙酰基甘脲、1-(叔丁氧基羰基)-4-羟基哌啶、1，5，5-三甲基乙内酰脲、1-乙酰基-2-咪唑烷酮、甲基硫酸新斯的明、碳酸二(N-丁二酰亚胺基)酯、N-甲氧基-N-甲基乙酰胺、1，1’-(偶氮二羰基)二哌啶、(-)-噻唑烷-3，4-二羧酸3-乙基酯、N-(叔丁氧基羰基)-L-脯氨醇、乙氧基羰基异硫氰酸酯、2-氯-N-甲氧基-N-甲基乙酰胺、N-(1，2，2，2-四氯乙氧基羰基氧基)丁二酰亚胺、N-(苯基硫代)邻苯二甲酰亚胺、溴吡斯的明(pyridostigmine bromide)、1-苄基-5-苯基巴比妥酸、N-苄氧羰基-D-脯氨酸、N-(叔丁氧基羰基)-D-脯氨酸、N-(叔丁氧基羰基)-L-4-羟基脯氨酸、2-(5-降冰片烯-2，3-二羧基酰亚胺)-1，1，3，3-四甲基脲四氟硼酸盐、1-(叔丁氧基羰基)哌嗪、(3S)-2-CBZ-1，2，3，4-四氢异喹啉-3-羧酸、N-苄氧羰基-L-脯氨酸叔丁基酯、N-羟基-4-硝基邻苯二甲酰亚胺、N-甲氧基二乙酰胺、(S)-(-)-3-叔丁氧基羰基-4-甲氧基羰基-2，2-二甲基-1，3-唑烷、N-[(9H-芴-9-基甲氧基)羰基]-D-脯氨酸、N-(叔丁氧基羰基)-O-苄基-L-丝氨酸N-丁二酰亚胺酯、1-(叔丁氧基羰基)异哌啶酸、N，N，N’，N’-四甲基-O-(N-丁二酰亚胺基)脲四氟硼酸盐、4-氨基-1-叔丁氧基羰基哌啶、碳酸叔丁基邻苯二甲酰亚胺、3-(N-叔丁氧基羰基-N-甲基氨基)吡咯烷、N-[2-(三甲基甲硅烷基)乙氧基羰基氧基]丁二酰亚胺、N-(叔丁氧基羰基)-D-脯氨醇、1-(叔丁氧基羰基)-4-哌啶甲醇、(S)-(+)-4-苄基-3-丙酰基-2-唑烷酮、(S)-1-(叔丁氧基羰基)-3-吡咯烷醇、(R)-1-(叔丁氧基羰基)-3-吡咯烷醇、1，3-二环己基巴比妥酸、(R)-(-)-4-苄基-3-丙酰基-2-唑烷酮、1，1’-偶氮双(N，N-二甲基甲酰胺)、(S)-(+)-4-异丙基-3-丙酰基-2-唑烷酮、三(苄氧羰基)-L-精氨酸、(N-甲氧基-N-甲基氨基甲酰基甲基)膦酸二乙酯、(R)-(-)-4-异丙基-3-丙酰基-2-唑烷酮、(3R)-(+)-1-(叔丁氧基羰基)-3-氨基吡咯烷、(3S)-(-)-1-(叔丁氧基羰基)-3-氨基吡咯烷、(N-甲氧基-N-甲基氨基甲酰基甲基)膦酸二苯酯、N-氨基丁二酰亚胺盐酸、4-硝基苯基乙酸N-丁二酰亚胺酯、1-(叔丁氧基羰基)-3-羟基氮杂环丁烷、(S)-(-)-3-(叔丁氧基羰基)-4-甲酰基-2，2-二甲基-1，3-唑烷、3，3’-二硫代二丙酸二(N-丁二酰亚胺基)酯、S-乙酰基巯基乙酸N-丁二酰亚胺酯、3-丙烯酰基-2-唑烷酮、N-(二乙基氨基甲酰基)-N-甲氧基甲酰胺、6-(2，4-二硝基苯胺基)己酸N-丁二酰亚胺酯、3-马来酰亚胺苯甲酸N-丁二酰亚胺酯、(2S、4R)-1-(叔丁氧基羰基)-4-氟-2-吡咯烷羧酸、(2S、4S)-1-(叔丁氧基羰基)-4-氟-2-吡咯烷羧酸、4-马来酰亚胺丁酸N-丁二酰亚胺酯、3-马来酰亚胺丙酸N-丁二酰亚胺酯、6-马来酰亚胺己酸N-丁二酰亚胺酯、D-生物素N-丁二酰亚胺酯、4-[3，5-二甲基-4-(4-硝基苄基氧基)苯基]-4-氧代丁酸丁二酰亚胺酯、(S)-1-(叔丁氧基羰基)-2-氮杂环丁烷甲醇、(R)-1-(叔丁氧基羰基)-2-氮杂环丁烷甲醇、N-叔丁氧基羰基-N-[3-(叔丁氧基羰基氨基)丙基]甘氨酸、盐酸依立替康、6-[[7-(N，N-二甲基氨基磺酰基)-2，1，3-苯并二唑-4-基]氨基]己酸丁二酰亚胺酯、(2R)-6-(四氢-2H-吡喃-2-基氧基)-2，5，7，8-四甲基色烷-2-羧酸丁二酰亚胺酯、苯基N-苄基-2-氨基-4，6-O-亚苄基-2-N，3-O-羰基-2-脱氧-1-硫代-β-D-吡喃葡萄糖苷。研磨用组合物含有具有通式(2)所示结构的化合物时，研磨用组合物中的其含量优选为0.05摩尔/L左右。
作为研磨用组合物中所含的含氮化合物，特别优选具有通式(2)所示结构的化合物的原因在于这些化合物大致为中性。当所使用的含氮化合物大致为中性时，即使不加入大量的酸，也可容易地将研磨用组合物的pH调节至7以下。与此相对，当所使用的含氮化合物为强碱性时，为了将研磨用组合物的pH调节至7以下，有时需要加入大量的酸。大量酸的使用会导致研磨用组合物中的磨粒的凝集。
在具有通式(1)所示结构的化合物中，作为研磨用组合物中所含的含氮化合物还可特别优选地使用氨基酸型两性表面活性剂和胺型非离子表面活性剂。作为氨基酸型两性表面活性剂的具体例子，例如可举出烷基氨基单丙酸、烷基氨基二丙酸、烷基酰胺肌氨酸。作为胺型非离子表面活性剂的具体例子，例如可举出聚氧乙烯烷基氨基醚、烷基二乙醇胺、聚氧乙烯烷基胺、附加了聚氧丙烯和聚氧乙烯的烷基胺、N，N’，N’-三(2-羟基乙基)-N-烷基-1，3-二氨基丙烷。当研磨用组合物含有氨基酸型两性表面活性剂时，优选研磨用组合物中的其含量为0.002～0.20g/L。当研磨用组合物含有胺型非离子表面活性剂时，优选研磨用组合物中的其含量为0.002～1g/L。
另外，除了具有上述通式(1)所示结构的化合物之外，作为研磨用组合物中所含的含氮化合物也可优选使用羧基甜菜碱型两性表面活性剂、磺基甜菜碱型两性表面活性剂、咪唑啉型两性表面活性剂、氧化胺型两性表面活性剂。作为羧基甜菜碱型两性表面活性剂的具体例子，例如可举出烷基二甲基氨基乙酸甜菜碱(别名：烷基甜菜碱)、烷基酰胺丙基二甲基氨基乙酸甜菜碱(别名：烷基酰胺丙基甜菜碱)。作为磺基甜菜碱型两性表面活性剂的具体例子，例如可举出烷基羟基磺基甜菜碱。作为咪唑啉型两性表面活性剂的具体例子，例如可举出2-烷基-N-羧基甲基-N-羟基乙基咪唑啉甜菜碱、2-高级脂肪酸-N’-羧基甲基-N’-羟基乙基乙二胺。作为氧化胺型两性表面活性剂的具体例子，例如可举出烷基二甲基氧化胺、高级脂肪酸酰胺丙基二甲基胺氧化物。当研磨用组合物含有这些两性表面活性剂的任一种时，优选研磨用组合物中的其含量为0.002～0.20g/L。
对研磨用组合物中所含的上述磨粒的种类并无特别限定，例如可使用二氧化硅、氧化铝、氧化锆、氧化铈。在研磨硅材料的用途中使用研磨用组合物时可优选使用的是二氧化硅，其中特别优选胶态二氧化硅或热解法二氧化硅。当使用二氧化硅、特别是其中的胶态二氧化硅或热解法二氧化硅作为磨粒时，利用研磨用组合物的硅材料的研磨速度大大提高。
优选研磨用组合物中所含磨粒的平均二次粒径为5nm以上、更优选为10nm以上。随着平均二次粒径增大，利用研磨用组合物的硅材料的研磨速度提高。在此方面，当磨粒的平均二次粒径为5nm以上、进一步为10nm以上时，可以容易地将利用研磨用组合物的硅材料的研磨速度提高至实用上特别优选的水平。
另外，优选研磨用组合物中所含磨粒的平均二次粒径为250nm以下、更优选为200nm以下。随着平均二次粒径减小，磨粒在研磨用组合物中的分散性提高。在此方面，当磨粒的平均二次粒径为250nm以下、进一步为200nm以下时，可以容易地将磨粒在研磨用组合物中的分散性提高至实用上特别优选的水平。
研磨用组合物中的磨粒的含量优选为1质量％以上、更优选为3质量％以上。随着磨粒的含量增多，则利用研磨用组合物的硅材料的研磨速度提高。在此方面，当研磨用组合物中的磨粒含量为1质量％以上、进一步为3质量％以上时，可以容易地将利用研磨用组合物的硅材料的研磨速度提高至实用上特别优选的水平。
另外，研磨用组合物中的磨粒的含量优选为25质量％以下、更优选为20质量％以下。随着磨粒的含量减少，磨粒在研磨用组合物中的分散性提高。在此方面，当研磨用组合物中的磨粒含量为25质量％以下、进一步为20质量％以下时，可以容易地将磨粒在研磨用组合物中的分散性提高至实用上特别优选的水平。
对研磨用组合物中根据需要含有的上述pH调节剂并无特别限定，为了使研磨用组合物的pH达到1～7之间的所需值，可以使用适当量的任一种酸或碱。同样，对研磨用组合物中根据需要含有的上述pH缓冲剂也无特别限定，为了获得所需的缓冲作用，可以使用适当量的任一种盐。作为pH调节剂或者pH缓冲剂，优选避免使用如硝酸、硝酸盐等具有氧化作用的物质、即氧化剂。不限于硝酸以及硝酸盐，当在研磨用组合物中含有过氧化氢等过氧化物、氢碘酸盐、高碘酸盐、次氯酸盐、亚氯酸盐、氯酸盐、高氯酸盐、过硫酸盐、重铬酸盐、高锰酸盐、臭氧水、二价的银盐以及三价的铁盐等氧化剂时，由于在研磨中的硅材料表面上形成氧化膜，因此利用研磨用组合物的硅材料的研磨速度有可能会降低。作为pH调节剂可优选使用的酸，例如可举出硫酸、盐酸、磷酸等无机酸，乙酸、乙醇酸、苹果酸、酒石酸、柠檬酸、乳酸、α-丙氨酸、甘氨酸等有机酸。另外，作为pH调节剂可优选使用的碱剂例如可举出氢氧化铵、氢氧化四甲基铵、氢氧化钠、氢氧化钾等。
通过本实施方式可获得以下优点。
·通过使用本实施方式的研磨用组合物，能够以高的除去速度对单体硅以及硅化合物等硅材料进行研磨。因此，本实施方式的研磨用组合物不仅可优选用于研磨硅材料的用途、具体的说单独研磨单体硅或硅化合物的用途，还可适用于同时研磨单体硅和硅化合物的用途。通过本实施方式的研磨用组合物能够以高的除去速度实现硅材料的研磨的理由还不十分清楚，但推测由于存在于研磨用组合物中所含含氮化合物的氮原子的非共有电子对具有高的供电子性，因此在中性～酸性的区域内发挥相对于硅材料的高反应性。该非共有电子对的供电子性在含氮化合物具有上述通式(1)所示结构时特别增强。
第2实施方式
以下说明本发明的第2实施方式。
第2实施方式的研磨用组合物通过将水溶性高分子和磨粒与根据需要的pH调节剂和pH缓冲剂一起混合在水中，使pH达到1～8的范围内而制造。因此，研磨用组合物含有水溶性高分子、磨粒和水，根据需要含有pH调节剂和pH缓冲剂。即，第2实施方式的研磨用组合物仅在含有水溶性高分子代替含氮化合物方面以及pH不是1～7而是1～8的范围的方面与第1实施方式的研磨用组合物不同。
作为研磨用组合物中所含的上述水溶性高分子，例如可举出藻酸、果胶酸、羧甲基纤维素、淀粉、琼脂、凝胶多糖、支链淀粉等多糖；聚天冬氨酸、聚谷氨酸、聚赖氨酸、聚苹果酸、聚甲基丙烯酸、聚甲基丙烯酸铵盐、聚甲基丙烯酸钠盐、聚马来酸、聚衣康酸、聚富马酸、聚(对苯乙烯羧酸)、聚丙烯酸、聚丙烯酰胺、氨基聚丙烯酰胺、聚丙烯酸甲酯、聚丙烯酸乙酯、聚丙烯酸铵盐、聚丙烯酸钠盐、聚酰胺酸、聚酰胺酸铵盐、聚酰胺酸钠盐、聚乙醛酸等聚羧酸、聚羧酸酰胺、聚羧酸酯或聚羧酸盐；聚苯乙烯磺酸等聚磺酸；聚乙烯醇、聚乙烯吡啶、聚乙烯吡咯烷酮、聚丙烯醛等乙烯基系聚合物。为了防止被研磨的硅材料被碱金属、碱土金属或卤化物污染，优选分子中不含碱金属、碱土金属或卤元素的水溶性高分子。研磨用组合物中的水溶性高分子的含量优选为0.1～5.0g/L。
通过第2实施方式可获得以下的优点。
·通过使用第2实施方式的研磨用组合物，能够以高的除去速度研磨单体硅。因此，第2实施方式的研磨用组合物可适用于研磨单体硅的用途。通过第2实施方式的研磨用组合物能够以高的除去速度实现硅单体的研磨的理由还不十分清楚，但推测是由于硅单体的表面被研磨用组合物中所含的水溶性高分子改性所导致的。
·与第1实施方式的研磨用组合物同样，利用第2实施方式的研磨用组合物的单体硅的研磨速度也由于氧化剂的存在有降低的可能。此点由于第2实施方式的研磨用组合物不含氧化剂，因此可以避免由于氧化剂所导致的硅材料的研磨速度降低。
上述第1和第2实施方式还可如下改变。
·第1实施方式的研磨用组合物可以含两种以上的含氮化合物。
·第2实施方式的研磨用组合物可以含两种以上的水溶性高分子。
·第1和第2实施方式的研磨用组合物可分别含有两种以上的磨粒。
·第1实施方式的研磨用组合物还可以含有含氮化合物、磨粒和水以外的成分，例如可根据需要添加螯合剂、水溶性高分子、表面活性剂、防腐剂、防霉剂、防锈剂等添加剂。
·第2实施方式的研磨用组合物还可以含有水溶性高分子、磨粒和水以外的成分，例如可根据需要添加螯合剂、表面活性剂、防腐剂、防霉剂、防锈剂等添加剂。
·第1和第2实施方式的研磨用组合物可通过分别用水稀释研磨用组合物的原液进行调制。
接着，举出实施例和比较例更具体地说明本发明。
实施例1～21和参考例1～5中，将含氮化合物和磨粒与根据需要的pH调节剂一起混合至水中，调制研磨用组合物。比较例1～5中，将磨粒与根据需要的pH调节剂一起混合至水中，调制研磨用组合物。将各例的研磨用组合物中的含氮化合物的详细情况以及测定各例研磨用组合物的pH的结果示于表1。予以说明，各例中所用的磨粒是平均二次粒径为30nm的胶态二氧化硅，研磨用组合物中的胶态二氧化硅含量均为5质量％。另外，各例所用的pH调节剂为乙酸或氢氧化钾。
使用各例的研磨用组合物，在表2所示的条件下研磨直径为200mm的带多晶硅膜的基板的表面。用使用大日本スクリ一ン制造株式会社的光干涉式膜厚测定装置“ラムダエ一スVM-2030”测定的研磨前后各基板的厚度差除以研磨时间，求得多晶硅研磨速度。使利用实施例4的研磨用组合物的多晶硅研磨速度为100，用相对值表示此时的利用各例研磨用组合物的多晶硅研磨速度，将其示于表1的“多晶硅研磨速度”栏。
使用一部分的各例的研磨用组合物，在表2所示条件下研磨直径为200mm的带氮化硅膜的基板的表面。用使用光干涉式膜厚测定装置“ラムダエ一スVM-2030”测定的研磨前后各基板的厚度差除以研磨时间，求得氮化硅研磨速度。使利用实施例4的研磨用组合物的氮化硅研磨速度为100，用相对值表示此时的利用各例研磨用组合物的氮化硅研磨速度，将其示于表1的“氮化硅研磨速度”栏。
[表1]
[表2]
由表1可知，中性～酸性区域的多晶硅研磨速度通过在研磨用组合物中添加含氮化合物而增大。该中性～酸性区域的多晶硅研磨速度的增大在使用具有上述通式(1)所示结构的化合物作为含氮化合物时特别显著(参照实施例2～11)。通过含氮化合物的添加、研磨速度增大的倾向不仅在多晶硅的研磨时发生，在硅单晶和无定形硅的研磨时也同样发生。另外，由表1还可知，氮化硅研磨速度在中性～酸性区域高，在pH5附近显示最大的峰值，该氮化硅研磨速度也通过含氮化合物的添加而增大。由上可知，本发明的研磨用组合物不仅可适用于研磨多晶硅等单体硅的用途，还可优选用于与单体硅同时研磨氮化硅等硅化合物的用途。
实施例101～123中，在磨粒中添加pH调节剂和水，进而添加两性表面活性剂调制研磨用组合物。实施例201～205中，在磨粒中添加pH调节剂和水，进而添加含氮表面活性剂调制研磨用组合物。实施例301～337中，在磨粒中添加pH调节剂和水，进而添加水溶性高分子调制研磨用组合物。比较例101～109中，在磨粒中添加pH调节剂和水调制研磨用组合物。将各例的研磨用组合物中的两性表面活性剂、含氮表面活性剂或水溶性高分子和磨粒的详细情况以及测定各例的研磨用组合物的pH的结果示于表3～表6。予以说明，各例所用的pH调节剂为乙酸。
表3～表6中，
A1a表示平均二次粒径为70nm的胶态二氧化硅、
A1b表示平均二次粒径为30nm的胶态二氧化硅、
A2表示平均二次粒径为150nm的热解法二氧化硅、
B1表示2-油基-N-羧基甲基-N-羟基乙基咪唑啉甜菜碱、
B2表示烷基(C12～C14)二甲基氨基乙酸甜菜碱、
B3表示烷基(C12～C14)酰胺丙基二甲基氨基乙酸甜菜碱、
B4表示烷基(C12～C14)二甲基氧化胺、
B5表示月桂基羟基磺基甜菜碱、
B6表示烷基(C12～C14)酰胺肌氨酸、
B7表示月桂基氨基丙酸、
C1表示POE(2)月桂基氨基醚、
C2表示POE(10)月桂基氨基醚、
C3表示POE(5)油基氨基醚、
D1a表示平均分子量为3000的聚丙烯酸、
D1b表示平均分子量为5500的聚丙烯酸、
D2表示平均分子量为200000的聚丙烯酸酰胺、
D3表示平均分子量为80000的羧甲基纤维素、
D4表示和光纯药工业株式会社制的淀粉(生化学用试剂)、
D5表示株式会社林原生物化学研究所制的淀粉(试剂)、
D6a表示平均分子量为8800的聚乙烯醇、
D6b表示平均分子量为22026的聚乙烯醇、
D6c表示平均分子量为66078的聚乙烯醇、
D6d表示平均分子量为105725的聚乙烯醇、
D6e表示平均分子量为146000的聚乙烯醇、
D7a表示平均分子量为15000的聚乙烯吡咯烷酮、
D7b表示平均分子量为29000的聚乙烯吡咯烷酮、
D7c表示平均分子量为30000的聚乙烯吡咯烷酮、
D7d表示平均分子量为40000的聚乙烯吡咯烷酮、
D7e表示平均分子量为360000的聚乙烯吡咯烷酮、
D8表示平均分子量为60000的聚乙烯吡啶、
D9表示平均分子量为18320的聚苯乙烯磺酸。
表3～表6的“多晶硅研磨速度”栏中示出使用各例的研磨用组合物。在表7所示条件下研磨直径为200mm的带多晶硅膜的基板表面时的研磨速度。研磨速度的值通过用使用大日本スクリ一ン制造株式会社的光干涉式膜厚测定装置“ラムダエ一スVM-2030”测定的研磨前后各基板厚度之差除以研磨时间而求得。
[表3]
[表4]
[表5]
[表6]
[表7]
由表3～表6可知，通过添加两性表面活性剂、含氮表面活性剂或水溶性高分子，可见利用研磨用组合物的多晶硅研磨速度增大的倾向。这种倾向不仅在多晶硅的研磨时发生，在研磨硅单晶和无定形硅时也同样发生。
Claims (1)
1.一种研磨用组合物，其是用于选自硅单晶、无定形硅和多晶硅中的单体硅的研磨的研磨用组合物，含有含氮化合物和磨粒，所述磨粒为二氧化硅，pH为1～7，上述含氮化合物为1-甲基-2-吡咯烷酮或1-乙基-2-吡咯烷酮，所述研磨用组合物不含氧化剂。
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Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8492277B2 (en) * | 2010-03-16 | 2013-07-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
| JP5795843B2 (ja) | 2010-07-26 | 2015-10-14 | 東洋鋼鈑株式会社 | ハードディスク基板の製造方法 |
| CN102533122B (zh) * | 2010-12-28 | 2016-01-20 | 安集微电子（上海）有限公司 | 一种用于抛光含钛基材的抛光浆料 |
| JP6411708B2 (ja) * | 2011-06-14 | 2018-10-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP6407503B2 (ja) * | 2011-06-14 | 2018-10-17 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US9640407B2 (en) | 2011-06-14 | 2017-05-02 | Fujimi Incorporated | Polishing composition |
| CN103890114B (zh) * | 2011-10-24 | 2015-08-26 | 福吉米株式会社 | 研磨用组合物、使用了其的研磨方法和基板的制造方法 |
| KR102155205B1 (ko) * | 2012-08-31 | 2020-09-11 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 기판의 제조 방법 |
| EP2957613B1 (en) * | 2013-02-13 | 2020-11-18 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and method for producing polished article |
| WO2014196299A1 (ja) * | 2013-06-07 | 2014-12-11 | 株式会社フジミインコーポレーテッド | シリコンウエハ研磨用組成物 |
| WO2015068672A1 (ja) * | 2013-11-08 | 2015-05-14 | 東亞合成株式会社 | 半導体用濡れ剤及び研磨用組成物 |
| JP6420260B2 (ja) * | 2014-01-31 | 2018-11-07 | Hoya株式会社 | 磁気ディスク用基板の製造方法及び磁気ディスクの製造方法 |
| JP6376599B2 (ja) * | 2014-12-26 | 2018-08-22 | 花王株式会社 | シリカ分散液 |
| WO2016132951A1 (ja) * | 2015-02-19 | 2016-08-25 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| TWI654293B (zh) | 2015-03-17 | 2019-03-21 | 德商福斯石油股份公司 | 添加劑組合物和工業處理流體 |
| JP6393228B2 (ja) * | 2015-03-31 | 2018-09-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨物の製造方法 |
| WO2017011115A1 (en) * | 2015-07-10 | 2017-01-19 | Ferro Corporation | Slurry composition and additives and method for polishing organic polymer-based ophthalmic substrates |
| KR102463863B1 (ko) * | 2015-07-20 | 2022-11-04 | 삼성전자주식회사 | 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법 |
| US9293339B1 (en) * | 2015-09-24 | 2016-03-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing semiconductor substrate |
| JP6728939B2 (ja) * | 2016-04-27 | 2020-07-22 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| WO2018055985A1 (ja) * | 2016-09-23 | 2018-03-29 | 株式会社フジミインコーポレーテッド | 研磨用組成物、ならびにこれを用いた研磨方法および半導体基板の製造方法 |
| JP7153566B2 (ja) * | 2017-01-11 | 2022-10-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7208019B2 (ja) * | 2017-02-17 | 2023-01-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法 |
| KR102649676B1 (ko) | 2017-03-14 | 2024-03-21 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 그 제조 방법, 그리고 이것을 사용한 연마 방법 및 기판의 제조 방법 |
| EP3613822A4 (en) | 2017-04-17 | 2020-12-23 | Nissan Chemical Corporation | POLISHING COMPOSITION WITH AMPHOTERIC SURFACTANT |
| CN109971356A (zh) * | 2017-12-27 | 2019-07-05 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN109971358A (zh) * | 2017-12-27 | 2019-07-05 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| JP7128005B2 (ja) * | 2018-03-26 | 2022-08-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7237933B2 (ja) * | 2018-03-28 | 2023-03-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US11111435B2 (en) * | 2018-07-31 | 2021-09-07 | Versum Materials Us, Llc | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography |
| CN111378380B (zh) * | 2018-12-29 | 2022-05-13 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及其应用 |
| CN111378377A (zh) * | 2018-12-29 | 2020-07-07 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及其应用 |
| US20230174892A1 (en) * | 2020-05-11 | 2023-06-08 | Daicel Corporation | Detergent composition and chemical-mechanical polishing composition |
| CN114591686B (zh) * | 2022-03-11 | 2023-05-26 | 万华化学集团电子材料有限公司 | 一种铜阻挡层化学机械抛光液及其应用 |
| CN115160211B (zh) * | 2022-06-23 | 2023-11-03 | 温州大学 | 一种异吲哚啉酮类化合物的绿色合成方法 |
| CN118620527A (zh) * | 2024-08-14 | 2024-09-10 | 齐芯微(绍兴)电子材料科技有限公司 | 一种化学机械抛光液及其制备方法和应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296049A (zh) * | 1999-11-12 | 2001-05-23 | 第一毛织株式会社 | 用于化学机械抛光的组合物 |
| CN1572017A (zh) * | 2001-10-26 | 2005-01-26 | 旭硝子株式会社 | 研磨剂、研磨剂的制造方法以及研磨方法 |
| CN1742066A (zh) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | 抛光含硅电介质的方法 |
| CN101040021A (zh) * | 2004-10-12 | 2007-09-19 | 卡伯特微电子公司 | 用于抛光贵金属的具有聚合物添加剂的化学机械抛光组合物 |
Family Cites Families (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4269959A (en) * | 1979-10-22 | 1981-05-26 | Whittaker Corporation | Method of preparing improved imbibitive polymer |
| US4913841A (en) * | 1985-05-09 | 1990-04-03 | Sherex Chemical Company, Inc. | Alkaline tolerant sulfobetaine amphoteric surfactants |
| DE3735158A1 (de) | 1987-10-16 | 1989-05-03 | Wacker Chemitronic | Verfahren zum schleierfreien polieren von halbleiterscheiben |
| JP2889810B2 (ja) | 1994-03-14 | 1999-05-10 | 三菱マテリアル株式会社 | ポリシリコン膜の研磨方法およびポリシリコン膜用研磨剤 |
| EP0704749B1 (en) * | 1994-09-27 | 2000-01-12 | Agfa-Gevaert N.V. | Method of preparing light-sensitive silver halide emulsions and dispersions of photographically useful compounds |
| JPH08295875A (ja) | 1995-04-25 | 1996-11-12 | Shinano Denki Seiren Kk | スライシング用研磨液組成物 |
| US5822738A (en) * | 1995-11-22 | 1998-10-13 | F.M.E. Corporation | Method and apparatus for a modular postage accounting system |
| JP3707845B2 (ja) * | 1995-12-27 | 2005-10-19 | 花王株式会社 | 磁気記録媒体基板製造用研磨材組成物及び磁気記録媒体用基板の製造方法 |
| EP0786504A3 (en) * | 1996-01-29 | 1998-05-20 | Fujimi Incorporated | Polishing composition |
| US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| JP4052607B2 (ja) | 1998-04-20 | 2008-02-27 | 株式会社東芝 | 研磨剤及び半導体基板のポリッシング方法 |
| US6533832B2 (en) | 1998-06-26 | 2003-03-18 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry and method for using same |
| JP2000144109A (ja) * | 1998-11-10 | 2000-05-26 | Okamoto Machine Tool Works Ltd | 化学機械研磨用研磨剤スラリ− |
| WO2000079577A1 (fr) * | 1999-06-18 | 2000-12-28 | Hitachi Chemical Co., Ltd. | Compose abrasif pour polissage cmp, procede de polissage d'un substrat, procede de fabrication d'un dispositif a semiconducteur utilisant ledit compose, et additif pour compose abrasif cmp |
| JP2001031951A (ja) | 1999-07-22 | 2001-02-06 | Hitachi Chem Co Ltd | 研磨剤及び基板の研磨方法 |
| JP2001185514A (ja) | 1999-12-27 | 2001-07-06 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| JP3869608B2 (ja) * | 2000-01-25 | 2007-01-17 | Ｎｅｃエレクトロニクス株式会社 | 防食剤 |
| AU2001264605C1 (en) * | 2000-05-15 | 2005-10-06 | Monsanto Technology Llc | Preparation of iminodiacetic acid compounds from monoethanolamine substrates |
| JP2002069340A (ja) * | 2000-08-28 | 2002-03-08 | Fuji Photo Film Co Ltd | インクジェット記録用インク |
| CN100496896C (zh) * | 2000-12-01 | 2009-06-10 | 东洋橡膠工业株式会社 | 研磨垫 |
| EP1356502A1 (en) * | 2001-01-16 | 2003-10-29 | Cabot Microelectronics Corporation | Ammonium oxalate-containing polishing system and method |
| WO2002067309A1 (fr) * | 2001-02-20 | 2002-08-29 | Hitachi Chemical Co., Ltd. | Pate a polir et procede de polissage d'un substrat |
| EP1444284B1 (en) * | 2001-11-07 | 2006-10-18 | Dow Global Technologies Inc. | Planarized microelectronic substrates |
| JP4003116B2 (ja) * | 2001-11-28 | 2007-11-07 | 株式会社フジミインコーポレーテッド | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
| US6719920B2 (en) * | 2001-11-30 | 2004-04-13 | Intel Corporation | Slurry for polishing a barrier layer |
| US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| US7524346B2 (en) * | 2002-01-25 | 2009-04-28 | Dupont Air Products Nanomaterials Llc | Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates |
| JP2003306669A (ja) | 2002-04-16 | 2003-10-31 | Nihon Micro Coating Co Ltd | 研磨スラリー |
| FR2843061B1 (fr) * | 2002-08-02 | 2004-09-24 | Soitec Silicon On Insulator | Procede de polissage de tranche de materiau |
| JP3926293B2 (ja) * | 2002-08-28 | 2007-06-06 | 花王株式会社 | 研磨液組成物 |
| EP1403347B1 (en) * | 2002-09-26 | 2006-11-15 | Nippon Shokubai Co., Ltd. | Thickener for water-based vibration damper |
| WO2004037943A1 (en) * | 2002-10-25 | 2004-05-06 | Showa Denko K.K. | Polishing slurry and polished substrate |
| JP2004266155A (ja) | 2003-03-03 | 2004-09-24 | Jsr Corp | 化学機械研磨用水系分散体およびこれを用いた化学機械研磨方法ならびに半導体装置の製造方法 |
| JP2004172606A (ja) * | 2002-11-08 | 2004-06-17 | Sumitomo Chem Co Ltd | 金属研磨材組成物及び研磨方法 |
| KR100516886B1 (ko) * | 2002-12-09 | 2005-09-23 | 제일모직주식회사 | 실리콘 웨이퍼의 최종 연마용 슬러리 조성물 |
| JP4202172B2 (ja) | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| TW200505975A (en) * | 2003-04-18 | 2005-02-16 | Ekc Technology Inc | Aqueous fluoride compositions for cleaning semiconductor devices |
| JP4649871B2 (ja) * | 2003-05-12 | 2011-03-16 | Ｊｓｒ株式会社 | 化学機械研磨剤キットを用いた化学機械研磨方法 |
| KR100698396B1 (ko) | 2003-05-28 | 2007-03-23 | 히다치 가세고교 가부시끼가이샤 | 연마제 및 연마 방법 |
| JP2005034986A (ja) | 2003-06-27 | 2005-02-10 | Showa Denko Kk | 研磨用組成物とそれを用いた基板研磨方法 |
| WO2005000984A1 (en) | 2003-06-27 | 2005-01-06 | Showa Denko K.K. | Polishing composition and method for polishing substrate using the composition |
| US20050014851A1 (en) * | 2003-07-18 | 2005-01-20 | Eastman Kodak Company | Colloidal core-shell assemblies and methods of preparation |
| US7381690B1 (en) * | 2003-09-25 | 2008-06-03 | Ppt Research Inc | Stable aqueous slurry suspensions |
| US20050079803A1 (en) | 2003-10-10 | 2005-04-14 | Siddiqui Junaid Ahmed | Chemical-mechanical planarization composition having PVNO and associated method for use |
| US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
| US7344988B2 (en) * | 2003-10-27 | 2008-03-18 | Dupont Air Products Nanomaterials Llc | Alumina abrasive for chemical mechanical polishing |
| DE102004009149A1 (de) * | 2004-02-23 | 2005-09-08 | Beiersdorf Ag | Stabile Kosmetika |
| KR100582771B1 (ko) * | 2004-03-29 | 2006-05-22 | 한화석유화학 주식회사 | 반도체 얕은 트렌치 소자 분리 공정용 화학적 기계적 연마슬러리 |
| US7198549B2 (en) * | 2004-06-16 | 2007-04-03 | Cabot Microelectronics Corporation | Continuous contour polishing of a multi-material surface |
| AU2005258281A1 (en) * | 2004-06-24 | 2006-01-05 | The Scripps Research Institute | Arrays with cleavable linkers |
| KR20060016498A (ko) | 2004-08-18 | 2006-02-22 | 삼성전자주식회사 | 슬러리 조성물, 이의 제조 방법 및 이를 이용한 가공물의연마방법 |
| CA2575164A1 (en) * | 2004-08-25 | 2006-03-02 | Janssen Pharmaceutica N.V. | Imazalil compositions comprising alkoxylated amines |
| KR100674927B1 (ko) * | 2004-12-09 | 2007-01-26 | 삼성전자주식회사 | Ｃｍｐ용 슬러리 조성물 및 그 제조 방법과 이들을 이용한기판 연마 방법 |
| JP2006269600A (ja) * | 2005-03-23 | 2006-10-05 | Fuji Photo Film Co Ltd | 化学的機械的研磨方法及びこれに用いる研磨液 |
| US7294044B2 (en) * | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
| JP5133874B2 (ja) * | 2005-04-28 | 2013-01-30 | テクノ セミケム シーオー．， エルティーディー． | 高段差酸化膜の平坦化のための自動研磨停止機能を有する化学機械的研磨組成物 |
| JP2007019093A (ja) | 2005-07-05 | 2007-01-25 | Nitta Haas Inc | 半導体研磨用組成物 |
| JP2007051200A (ja) | 2005-08-17 | 2007-03-01 | Tosoh Corp | シリコンエッチング用組成物 |
| US7842193B2 (en) * | 2005-09-29 | 2010-11-30 | Fujifilm Corporation | Polishing liquid |
| CN101291778B (zh) * | 2005-10-19 | 2012-06-20 | 日立化成工业株式会社 | 氧化铈浆料、氧化铈抛光浆料以及使用其抛光衬底的方法 |
| KR101243423B1 (ko) * | 2005-11-11 | 2013-03-13 | 히타치가세이가부시끼가이샤 | 산화규소용 연마제, 첨가액 및 연마 방법 |
| GB0525369D0 (en) * | 2005-12-14 | 2006-01-18 | Ineos Silicas Ltd | Silicas |
| JP2007227446A (ja) | 2006-02-21 | 2007-09-06 | Fujifilm Corp | バリア用研磨液及び研磨方法 |
| US20070209287A1 (en) * | 2006-03-13 | 2007-09-13 | Cabot Microelectronics Corporation | Composition and method to polish silicon nitride |
| JP5401766B2 (ja) | 2006-04-21 | 2014-01-29 | 日立化成株式会社 | Ｃｍｐ研磨剤及び基板の研磨方法 |
| JP2007305677A (ja) | 2006-05-09 | 2007-11-22 | Sony Corp | 洗浄方法及び半導体装置の製造方法 |
| JP2007326916A (ja) | 2006-06-06 | 2007-12-20 | Nitta Haas Inc | 研磨用組成物および研磨用組成物の製造方法 |
| JP2007335531A (ja) | 2006-06-13 | 2007-12-27 | Adeka Corp | 金属ｃｍｐ用研磨組成物 |
| KR100818996B1 (ko) * | 2006-06-19 | 2008-04-04 | 삼성전자주식회사 | 금속배선 연마용 슬러리 |
| US20080220610A1 (en) * | 2006-06-29 | 2008-09-11 | Cabot Microelectronics Corporation | Silicon oxide polishing method utilizing colloidal silica |
| US20080241081A1 (en) * | 2006-11-07 | 2008-10-02 | Hiroaki Suga | Amide compound or salt thereof, and biofilm remover containing the same |
| US7696095B2 (en) * | 2007-02-23 | 2010-04-13 | Ferro Corporation | Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide |
| WO2009058288A1 (en) * | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc. | Amidoxime compounds as chelating agents in semiconductor processes |
| AU2011249478B2 (en) * | 2010-05-06 | 2014-12-04 | Regenics As | Use of cellular extracts for skin rejuvenation |
| US8961815B2 (en) * | 2010-07-01 | 2015-02-24 | Planar Solutions, Llc | Composition for advanced node front-and back-end of line chemical mechanical polishing |
-
2009
- 2009-01-29 SG SG10201605686XA patent/SG10201605686XA/en unknown
- 2009-01-29 SG SG2013007075A patent/SG188090A1/en unknown
- 2009-01-29 JP JP2009551585A patent/JPWO2009096495A1/ja active Pending
- 2009-01-29 EP EP09705253A patent/EP2237311A4/en not_active Withdrawn
- 2009-01-29 WO PCT/JP2009/051510 patent/WO2009096495A1/ja active Application Filing
- 2009-01-29 KR KR1020147033389A patent/KR101564676B1/ko active IP Right Grant
- 2009-01-29 KR KR1020107016583A patent/KR101564673B1/ko active IP Right Grant
- 2009-01-29 US US12/864,811 patent/US10144849B2/en active Active
- 2009-01-29 CN CN201210587010.0A patent/CN103131330B/zh not_active Expired - Fee Related
- 2009-01-29 CN CN2009801033315A patent/CN102084465A/zh active Pending
- 2009-02-02 TW TW098103228A patent/TWI554600B/zh active
-
2013
- 2013-07-19 JP JP2013150331A patent/JP5695708B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1296049A (zh) * | 1999-11-12 | 2001-05-23 | 第一毛织株式会社 | 用于化学机械抛光的组合物 |
| CN1572017A (zh) * | 2001-10-26 | 2005-01-26 | 旭硝子株式会社 | 研磨剂、研磨剂的制造方法以及研磨方法 |
| CN1742066A (zh) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | 抛光含硅电介质的方法 |
| CN101040021A (zh) * | 2004-10-12 | 2007-09-19 | 卡伯特微电子公司 | 用于抛光贵金属的具有聚合物添加剂的化学机械抛光组合物 |
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| JPWO2009096495A1 (ja) | 2011-05-26 |
| US20100301014A1 (en) | 2010-12-02 |
| KR20100121469A (ko) | 2010-11-17 |
| EP2237311A4 (en) | 2011-11-30 |
| TW200946660A (en) | 2009-11-16 |
| EP2237311A1 (en) | 2010-10-06 |
| CN103131330A (zh) | 2013-06-05 |
| CN102084465A (zh) | 2011-06-01 |
| JP5695708B2 (ja) | 2015-04-08 |
| SG10201605686XA (en) | 2016-08-30 |
| US10144849B2 (en) | 2018-12-04 |
| KR101564673B1 (ko) | 2015-10-30 |
| KR20140146225A (ko) | 2014-12-24 |
| WO2009096495A1 (ja) | 2009-08-06 |
| JP2013251561A (ja) | 2013-12-12 |
| TWI554600B (zh) | 2016-10-21 |
| SG188090A1 (en) | 2013-03-28 |
| KR101564676B1 (ko) | 2015-11-02 |
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