TWI516579B - A polishing composition, and a polishing method using the same - Google Patents
A polishing composition, and a polishing method using the same Download PDFInfo
- Publication number
- TWI516579B TWI516579B TW099142609A TW99142609A TWI516579B TW I516579 B TWI516579 B TW I516579B TW 099142609 A TW099142609 A TW 099142609A TW 99142609 A TW99142609 A TW 99142609A TW I516579 B TWI516579 B TW I516579B
- Authority
- TW
- Taiwan
- Prior art keywords
- phenyl ether
- ether sulfate
- polyoxyethylene
- polyoxypropylene
- styryl
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 134
- 239000000203 mixture Substances 0.000 title claims description 92
- 238000000034 method Methods 0.000 title claims description 4
- -1 polyoxyethylene monostyrylmethyl phenyl ether sulfate Polymers 0.000 claims description 277
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims description 100
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 68
- 229920001451 polypropylene glycol Polymers 0.000 claims description 52
- 125000005504 styryl group Chemical group 0.000 claims description 52
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 50
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 37
- 239000002253 acid Substances 0.000 claims description 33
- RDOXTESZEPMUJZ-UHFFFAOYSA-N methyl phenyl ether Natural products COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 27
- 239000004094 surface-active agent Substances 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 239000007800 oxidant agent Substances 0.000 claims description 20
- FURYAADUZGZUGQ-UHFFFAOYSA-N phenoxybenzene;sulfuric acid Chemical compound OS(O)(=O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 FURYAADUZGZUGQ-UHFFFAOYSA-N 0.000 claims description 19
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- BXCPYILIGVODMY-UHFFFAOYSA-N anisole;sulfuric acid Chemical compound OS(O)(=O)=O.COC1=CC=CC=C1 BXCPYILIGVODMY-UHFFFAOYSA-N 0.000 claims description 15
- 229910052684 Cerium Inorganic materials 0.000 claims description 13
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 13
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 13
- YIWUCIQXQGITNL-UHFFFAOYSA-N S(=O)(=O)(O)O.C(CCC)OC1=CC=CC=C1 Chemical compound S(=O)(=O)(O)O.C(CCC)OC1=CC=CC=C1 YIWUCIQXQGITNL-UHFFFAOYSA-N 0.000 claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 9
- GEBGLWVJKGCPAD-UHFFFAOYSA-N S(=O)(=O)(O)O.C1(=CC=CC=C1)OCCCCCCCCCC Chemical compound S(=O)(=O)(O)O.C1(=CC=CC=C1)OCCCCCCCCCC GEBGLWVJKGCPAD-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
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- PWSZRRFDVPMZGM-UHFFFAOYSA-N 5-phenyl-1h-pyrazol-3-amine Chemical compound N1N=C(N)C=C1C1=CC=CC=C1 PWSZRRFDVPMZGM-UHFFFAOYSA-N 0.000 claims description 4
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 claims description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 4
- OZFPSOBLQZPIAV-UHFFFAOYSA-N 5-nitro-1h-indole Chemical compound [O-][N+](=O)C1=CC=C2NC=CC2=C1 OZFPSOBLQZPIAV-UHFFFAOYSA-N 0.000 claims description 3
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical compound CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 claims description 3
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- 125000001376 1,2,4-triazolyl group Chemical group N1N=C(N=C1)* 0.000 claims 1
- 206010036790 Productive cough Diseases 0.000 claims 1
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- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 claims 1
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- 230000009471 action Effects 0.000 description 9
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- RCWQAJNBLHCHEU-UHFFFAOYSA-N anisole;phosphoric acid Chemical compound OP(O)(O)=O.COC1=CC=CC=C1 RCWQAJNBLHCHEU-UHFFFAOYSA-N 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
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- 230000004888 barrier function Effects 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 5
- 239000011164 primary particle Substances 0.000 description 5
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- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
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- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
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- 229960003330 pentetic acid Drugs 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
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- 108010064470 polyaspartate Proteins 0.000 description 1
- 239000010318 polygalacturonic acid Substances 0.000 description 1
- 108010040003 polyglutamine Proteins 0.000 description 1
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- 108010050934 polyleucine Proteins 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
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- 239000005017 polysaccharide Substances 0.000 description 1
- 150000004804 polysaccharides Chemical class 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- CPNGPNLZQNNVQM-UHFFFAOYSA-N pteridine Chemical compound N1=CN=CC2=NC=CN=C21 CPNGPNLZQNNVQM-UHFFFAOYSA-N 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 229960001153 serine Drugs 0.000 description 1
- IFGCUJZIWBUILZ-UHFFFAOYSA-N sodium 2-[[2-[[hydroxy-(3,4,5-trihydroxy-6-methyloxan-2-yl)oxyphosphoryl]amino]-4-methylpentanoyl]amino]-3-(1H-indol-3-yl)propanoic acid Chemical compound [Na+].C=1NC2=CC=CC=C2C=1CC(C(O)=O)NC(=O)C(CC(C)C)NP(O)(=O)OC1OC(C)C(O)C(O)C1O IFGCUJZIWBUILZ-UHFFFAOYSA-N 0.000 description 1
- 229940029258 sodium glycinate Drugs 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- KKDONKAYVYTWGY-UHFFFAOYSA-M sodium;2-(methylamino)ethanesulfonate Chemical compound [Na+].CNCCS([O-])(=O)=O KKDONKAYVYTWGY-UHFFFAOYSA-M 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- NFOSJIUDGCORCI-UHFFFAOYSA-M sodium;methoxymethanesulfonate Chemical compound [Na+].COCS([O-])(=O)=O NFOSJIUDGCORCI-UHFFFAOYSA-M 0.000 description 1
- DZXBHDRHRFLQCJ-UHFFFAOYSA-M sodium;methyl sulfate Chemical compound [Na+].COS([O-])(=O)=O DZXBHDRHRFLQCJ-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- WPLOVIFNBMNBPD-ATHMIXSHSA-N subtilin Chemical compound CC1SCC(NC2=O)C(=O)NC(CC(N)=O)C(=O)NC(C(=O)NC(CCCCN)C(=O)NC(C(C)CC)C(=O)NC(=C)C(=O)NC(CCCCN)C(O)=O)CSC(C)C2NC(=O)C(CC(C)C)NC(=O)C1NC(=O)C(CCC(N)=O)NC(=O)C(CC(C)C)NC(=O)C(NC(=O)C1NC(=O)C(=C/C)/NC(=O)C(CCC(N)=O)NC(=O)C(CC(C)C)NC(=O)C(C)NC(=O)CNC(=O)C(NC(=O)C(NC(=O)C2NC(=O)CNC(=O)C3CCCN3C(=O)C(NC(=O)C3NC(=O)C(CC(C)C)NC(=O)C(=C)NC(=O)C(CCC(O)=O)NC(=O)C(NC(=O)C(CCCCN)NC(=O)C(N)CC=4C5=CC=CC=C5NC=4)CSC3)C(C)SC2)C(C)C)C(C)SC1)CC1=CC=CC=C1 WPLOVIFNBMNBPD-ATHMIXSHSA-N 0.000 description 1
- 229960003080 taurine Drugs 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229960002898 threonine Drugs 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 229960004441 tyrosine Drugs 0.000 description 1
- 229960004295 valine Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本發明係提供一種例如為形成半導體裝置之配線時之研磨處理所使用的研磨用組成物。
形成半導體裝置之配線時,係先在具有凹溝(trench)之絕緣體層上順序形成阻障層及導體層。然後,藉由化學機械研磨處理,除去至少位於凹溝外之導體層的部分(導體層之外側部分)及位於凹溝外之阻障層的部分(阻障層之外側部分)。為除去該至少導體層之外側部分及阻障層之外側部分時的研磨處理,通常分為第1研磨步驟與第2研磨步驟進行。第1研磨步驟係使阻障層之上面露出,除去部分導體層之外側部分。然後,第2研磨步驟係使絕緣體層露出,同時得到平坦的表面,至少除去導體層之外側部分的殘份及阻障層之外側部分。
為形成該半導體裝置之配線時的研磨,特別是第2研磨步驟之研磨處理時使用的研磨用組成物,為改善研磨後之研磨對象物的平坦性時,提案使用含有界面活性劑者。例如專利文獻1中揭示,含有聚氧化乙烯月桂醚硫酸銨等之陰離子界面活性劑、苯并三唑等之防腐蝕劑,及聚氧化乙烯烷醚等之非離子界面活性劑的研磨用組成物。於專利文獻2中揭示,使用組合聚氧化乙烯烷醚醋酸或聚氧化乙烯烷醚磷酸等之界面活性劑與選自苯并三唑及苯并三唑衍生物中至少一種之化合物。而且,於專利文獻3中揭示,含有各種界面活性劑之研磨用組成物。
然而,上述之習知研磨用組成物,主要是特別著重於改善研磨後之研磨對象物的平坦性者,惟就減低藉由研磨之研磨對象物的表面上所產生的表面缺陷而言不充分。
[習知技術文獻]
[專利文獻]
[專利文獻1]日本特開2008-41781號公報
[專利文獻2]國際公開第2007/026862號
[專利文獻3]日本特開2005-109256號公報
因此,本發明係提供一種除可改善研磨後之研磨對象物的平坦性外,且可減低藉由研磨之研磨對象物所產生的表面缺陷之研磨用組成物,以及使用該研磨用組成物以研磨研磨對象物之方法。
為達成上述目的時,本發明一形態係提供含有氧化劑、防腐蝕劑及界面活性劑之研磨用組成物。界面活性劑係以化學式1:
所示之化合物(R1~R5中之1~3個為烷基、烯基、炔基、芳基或芳基伸烷基,1個為氫原子或碳數1~9個之烷基,其餘為氫原子,O-R6為氧化乙烯、氧化丙烯,或氧化乙烯與氧化丙烯之無規或嵌段鍵結物,n為1以上之整數,X為OSO3 -基、OPO3 2-基或OH基)。
化學式1之R1~R5中之1~3個以化學式2:
所示之官能基(R7~R13中為氫原子或甲基)較佳。
化學式1之X以OSO3 -基、OPO3 2-基較佳。
本發明之另一形態,係提供一種使用上述一形態之研磨用組成物,以使研磨對象物之含銅表面進行研磨的研磨方法。
[發明效果]
藉由本發明,除可改善研磨後之研磨對象物的平坦性外,且可減低藉由研磨之研磨對象物所產生的表面缺陷之研磨用組成物,以及使用該研磨用組成物以研磨研磨對象物的方法。
[為實施發明之形態]
於下述中,說明本發明之一實施形態。
本實施形態之研磨用組成物,係使氧化劑、防腐蝕劑及界面活性劑,較佳者同時使砥粒及酸於水等之溶劑中混合予以調製。因此,研磨用組成物含有氧化劑、防腐蝕劑及界面活性劑,較佳者尚含有砥粒及酸。該研磨用組成物係主要使用於為形成半導體裝置之配線時的研磨,特別是使研磨對象物之含銅的表面進行研磨之用途。
(氧化劑)
研磨用組成物中所含的氧化劑,具有使研磨對象物之表面氧化的作用。該氧化劑之作用,係藉由研磨用組成物以提高研磨對象物之研磨速度。
可使用的氧化劑,沒有特別的限制,具體例如過氧化氫等之過氧化物、硝酸鹽、碘酸鹽、過碘酸鹽、次氯酸鹽、亞氯酸鹽、氯酸鹽、過氯酸鹽、過硫酸鹽、重鉻酸鹽、過錳酸鹽、臭氧水、銀(II)鹽及鐵(III)鹽,較佳者為過氧化氫。
研磨用組成物中氧化劑之含量,以0.1g/L以上較佳,更佳者為0.5g/L以上,最佳者為1g/L以上。伴隨氧化劑之含量變多時,可更為提高藉由研磨用組成物之研磨對象物的研磨速度。
另外,研磨用組成物中氧化劑之含量,以30g/L以下較佳,更佳者為25g/L以下,最佳者為20g/L以下。伴隨氧化劑之含量變少時,除可更為抑制研磨用組成物之材料成本外,且可更為減輕研磨使用後之研磨用組成物處理、即廢液處理的負荷。
(防腐蝕劑)
研磨用組成物中所含的防腐蝕劑,可緩和藉由氧化劑之研磨對象物表面的氧化情形,同時可與因藉由氧化劑之研磨對象物表面之金屬氧化而產生的金屬離子反應,生成不溶性之複合物。該防腐蝕劑之作用,可提高使用研磨組成物進行研磨後之研磨對象物表面的平坦性。
可使用的防腐蝕劑,沒有特別的限制,較佳者有雜環式化合物。雜環式化合物中雜環之碳數,沒有特別的限制。而且,雜環式化合物可為單環化合物,亦可為具有縮合環之多環化合物。雜環化合物之具體例,如吡咯、吡唑、咪唑、三唑、四唑、吡啶、吡嗪、噠嗪、4-氮茚(pyrindine)、吲哚嗪、吲哚、異吲哚、吲唑、卜啉、喹嗪、喹啉、異喹啉、萘錠、酞嗪、喹喔啉、喹唑啉、噌啉、蝶啶、噻唑、異噻唑、噁唑、異噁唑、呋咱等之含氮雜環化合物。
吡唑之例,如包含1H-吡唑、4-硝基-3-吡唑羧酸、3,5-吡唑羧酸、3-胺基-5-苯基吡唑、5-胺基-3-苯基吡唑、3,4,5-三溴吡唑、3-胺基吡唑、3,5-二甲基吡唑、3,5-二甲基-1-羥基甲基吡唑、3-甲基吡唑、1-甲基吡唑、3-胺基-5-甲基吡唑、4-胺基-吡唑并[3,4-d]嘧啶、別嘌呤醇、4-氯-1H-吡唑并[3,4-D]嘧啶、3,4-二羥基-6-甲基吡唑并-[3,4-B]吡啶、6-甲基-1H-吡唑并[3,4-b]吡啶-3-胺等。
咪唑之例,如包含咪唑、1-甲基咪唑、2-甲基咪唑、4-甲基咪唑、1,2-二甲基吡唑、2-乙基-4-甲基咪唑、2-異丙基咪唑、苯并咪唑、5,6-二甲基苯并咪唑、2-胺基苯并咪唑、2-氯化苯并咪唑、2-甲基苯并咪唑、2-(1-羥基乙基)苯并咪唑、2-羥基苯并咪唑、2-苯基苯并咪唑、2,5-二甲基苯并咪唑、5-甲基苯并咪唑、5-硝基苯并咪唑、1H-卜啉。
三唑之例,如包含1,2,3-三唑、1,2,4-三唑、1-甲基-1,2,4-三唑、甲基-1H-1,2,4-三唑-3-羧酸酯、1,2,4-三唑-3-羧酸、1,2,4-三唑-3-羧酸甲酯、1H-1,2,4-三唑-3-硫醇、3,5-二胺基-1H-1,2,4-三唑、3-胺基-1,2,4-三唑-5-硫醇、3-胺基-1,2,4-三唑、3-胺基-5-苯甲基-4H-1,2,4-三唑、3-胺基-5-甲基-4H-1,2,4-三唑、3-硝基-1,2,4-三唑、3-溴-5-硝基-1,2,4-三唑、4-(1,2,4-三唑-1-基)苯酚、4-胺基-1,2,4-三唑、4-胺基-3,5-二丙基-4H-1,2,4-三唑、4-胺基-3,5-二甲基-4H-1,2,4-三唑、4-胺基-3,5-二庚基-4H-1,2,4-三唑、5-甲基-1,2,4-三唑-3,4-二胺、1H-苯并三唑、1-羥基苯并三唑、1-胺基苯并三唑、1-羧基苯并三唑、5-氯-1H-苯并三唑、5-硝基-1H-苯并三唑、5-羧基-1H-苯并三唑、5-甲基-1H-苯并三唑、5,6-二甲基-1H-苯并三唑、1-(1’,2’-二羧基乙基)苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]苯并三唑及1-[N,N-雙(羥基乙基)胺基甲基]-5-甲基苯并三唑等。
四唑之例,如包含1H-四唑、5-甲基四唑、5-胺基四唑、5-苯基四唑等。
吲唑之例,如包含1H-吲唑、5-胺基-1H-吲唑、5-硝基-1H-吲唑、5-羥基-1H-吲唑、6-胺基-1H-吲唑、6-硝基-1H-吲唑、6-羥基-1H-吲唑、3-羧基-5-甲基-1H-吲唑等。
吲哚之例,如1H-吲哚、1-甲基-1H-吲哚、2-甲基-1H-吲哚、3-甲基-1H-吲哚、4-甲基-1H-吲哚、5-甲基-1H-吲哚、6-甲基-1H-吲哚、7-甲基-1H-吲哚、4-胺基-1H-吲哚、5-胺基-1H-吲哚、6-胺基-1H-吲哚、7-胺基-1H-吲哚、4-羥基-1H-吲哚、5-羥基-1H-吲哚、6-羥基-1H-吲哚、7-羥基-1H-吲哚、4-甲氧基-1H-吲哚、5-甲氧基-1H-吲哚、6-甲氧基-1H-吲哚、7-甲氧基-1H-吲哚、4-氯-1H-吲哚、5-氯-1H-吲哚、6-氯-1H-吲哚、7-氯-1H-吲哚、4-羧基-1H-吲哚、5-羧基-1H-吲哚、6-羧基-1H-吲哚、7-羧基-1H-吲哚、4-硝基-1H-吲哚、5-硝基-1H-吲哚、6-硝基-1H-吲哚、7-硝基-1H-吲哚、4-硝醯-1H-吲哚、5-硝醯-1H-吲哚、6-硝醯-1H-吲哚、7-硝醯-1H-吲哚、2,5-二甲基-1H-吲哚、1,2-二甲基-1H-吲哚、1,3-二甲基-1H-吲哚、2,3-二甲基-1H-吲哚、5-胺基-2,3-二甲基-1H-吲哚、7-乙基-1H-吲哚、5-(胺基甲基)吲哚、2-甲基-5-胺基-1H-吲哚、3-羥基甲基-1H-吲哚、6-異丙基-1H-吲哚、5-氯-2-甲基-1H-吲哚等。
其中,較佳的防腐蝕劑有3-胺基-5-苯基吡唑、1H-苯并三唑、5-甲基-1H-苯并三唑、5,6-二甲基-1H-苯并三唑、1-[N,N-雙(羥基乙基)胺基甲基]-5-甲基苯并三唑、
1,2,4-三唑,及5-硝基-1H-吲哚。
研磨用組成物中防腐蝕劑之含量,以0.001g/L以上較佳,更佳者為0.01g/L以上,最佳者為0.1g/L以上。伴隨防腐蝕劑之含量變多時,可更為提高使用研磨用組成物,於研磨後之研磨對象物的表面平坦性。
研磨用組成物中防腐蝕劑之含量,以5g/L以下較佳,更佳者為2g/L以下,最佳者為1g/L以下。伴隨防腐蝕劑之含量變少時,可更為提高藉由研磨用組成物之研磨對象物的研磨速度。
(界面活性劑)
研磨用組成物中所含的界面活性劑的作用,如下所述。藉由氧化劑之研磨對象物表面的金屬被氧化所產生的金屬離子,與防腐蝕劑反應而生成不溶性錯合物。藉由研磨而在研磨對象物表面上產生的表面缺陷之原因之一係因此不溶性錯合物附著於研磨對象物表面上。界面活性劑會吸附於此不溶性錯合物之表面,且使不溶性錯合物之疏水性表面親水化,不溶性錯合物不易吸附於研磨對象物之表面。因此,使不溶性錯合物之疏水性表面親水化的界面活性劑之作用係減低使用研磨用組成物,經研磨之研磨對象物上產生的表面缺陷。
可使用的界面活性劑,係以化學式1:
所示之化合物。化學式1之R1~R5中之1~3個為烷基、烯基、炔基、芳基或芳基伸烷基,1個為氫原子或碳數1~9個之烷基,其餘為氫原子。O-R6為氧化乙烯、氧化丙烯,或氧化乙烯與氧化丙烯之無規或嵌段鍵結物,n為1以上之整數,X為OSO3 -基、OPO3 2-基或OH基。
X為OSO3 -基或OPO3 2-基時,以化學式1所示之化合物為陰離子型界面活性劑。陰離子型界面活性劑,具有提高研磨用組成物中隨意含有的砥粒之分散性的作用為強烈的優點。
化學式1之R1~R5中1~3個以化學式2:
所示之官能基(芳基伸烷基)較佳。化學式2之R7~R13為氫原子或甲基。此時,可更為提高藉由界面活性劑而減低表面缺陷的效果。
以化學式1所示之化合物的具體例,如由乙二醇單苯醚、二乙二醇單苯醚、聚氧化乙烯單苯醚、聚氧化乙烯單
甲基苯醚、聚氧化乙烯丁基苯醚、聚氧化乙烯壬基苯醚、丙二醇單苯醚、二丙二醇單苯醚、聚氧化丙烯單苯醚、聚氧化丙烯單甲基苯醚、聚氧化丙烯丁基苯醚、聚氧化丙烯壬基苯醚、聚氧化乙烯聚氧化丙烯單苯醚、聚氧化乙烯聚氧化丙烯單甲基苯醚、聚氧化乙烯聚氧化丙烯丁基苯醚、聚氧化乙烯聚氧化丙烯壬基苯醚、乙二醇單苯醚硫酸酯、二乙二醇單苯醚硫酸酯、聚氧化乙烯單苯醚硫酸酯、聚氧化乙烯單甲基苯醚硫酸酯、聚氧化乙烯丁基苯醚硫酸酯、聚氧化乙烯壬基苯醚硫酸酯、丙二醇單苯醚硫酸酯、二丙二醇單苯醚硫酸酯、聚氧化丙烯單苯醚硫酸酯、聚氧化丙烯單甲基苯醚硫酸酯、聚氧化丙烯丁基苯醚硫酸酯、聚氧化丙烯壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙基單苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯壬基苯醚硫酸酯、乙二醇單苯醚磷酸酯、二乙二醇單苯醚磷酸酯、聚氧化乙烯單苯醚磷酸酯、聚氧化乙烯單甲基苯醚磷酸酯、聚氧化乙烯丁基苯醚磷酸酯、聚氧化乙烯壬基苯醚磷酸酯、丙二醇單苯醚磷酸酯、二丙二醇單苯醚磷酸酯、聚氧化丙烯單苯醚磷酸酯、聚氧化丙烯單甲基苯醚磷酸酯、聚氧化丙烯丁基苯醚磷酸酯、聚氧化丙烯壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯丁基苯醚磷酸酯,及聚氧化乙烯聚氧化丙烯壬基苯醚磷酸酯所成的第1化合物群,由聚氧化乙烯單苯乙烯基苯醚、聚氧化乙烯單苯乙烯基甲基苯醚、聚氧化乙烯單苯乙烯基丁基苯醚、聚氧化乙烯單苯乙烯基壬基苯醚、聚氧化乙烯單甲基苯乙烯基苯醚、聚氧化乙烯單甲基苯乙烯基甲基苯醚、聚氧化乙烯單甲基苯乙烯基丁基苯醚、聚氧化乙烯單甲基苯乙烯基壬基苯醚、聚氧化乙烯二苯乙烯基苯醚、聚氧化乙烯二苯乙烯基甲基苯醚、聚氧化乙烯二苯乙烯基丁基苯醚、聚氧化乙烯二苯乙烯基壬基苯醚、聚氧化乙烯二甲基苯乙烯基苯醚、聚氧化乙烯二甲基苯乙烯基甲基苯醚、聚氧化乙烯二甲基苯乙烯基苯醚、聚氧化乙烯二甲基苯乙烯基壬基苯醚、聚氧化乙烯三苯乙烯基苯醚、聚氧化乙烯三苯乙烯基甲基苯醚、聚氧化乙烯三苯乙烯基丁基苯醚、聚氧化乙烯三苯乙烯基壬基苯醚、聚氧化乙烯三甲基苯乙烯基苯醚、聚氧化乙烯三甲基苯乙烯基甲基苯醚、聚氧化乙烯三甲基苯乙烯基丁基苯醚、聚氧化乙烯三甲基苯乙烯基壬基苯醚、聚氧化乙烯枯烯基苯醚、聚氧化丙烯單苯乙烯基苯醚、聚氧化丙烯單苯乙烯基甲基苯醚、聚氧化丙烯單苯乙烯基丁基苯醚、聚氧化丙烯單苯乙烯基壬基苯醚、聚氧化丙烯單甲基苯乙烯基苯醚、聚氧化丙烯單甲基苯乙烯基甲基苯醚、聚氧化丙烯單甲基苯乙烯基丁基苯醚、聚氧化丙烯單甲基苯乙烯基壬基苯醚、聚氧化丙烯二苯乙烯基苯醚、聚氧化丙烯二苯乙烯基甲基苯醚、聚氧化丙烯二苯乙烯基丁基苯醚、聚氧化丙烯二苯乙烯基壬基苯醚、聚氧化丙烯二甲基苯乙烯基苯醚、聚氧化丙烯二甲基苯乙烯基甲基苯醚、聚氧化丙烯二甲基苯乙烯基丁基苯醚、聚氧化丙烯二甲基苯乙烯基壬基苯醚、聚氧化丙烯三苯乙烯基苯醚、聚氧化丙烯三苯乙烯基甲基苯醚、聚氧化丙烯三苯乙烯基丁基苯醚、聚氧化丙烯三苯乙烯基壬基苯醚、聚氧化丙烯三甲基苯乙烯基苯醚、聚氧化丙烯三甲基苯乙烯基甲基苯醚、聚氧化丙烯三甲基苯乙烯基丁基苯醚、聚氧化丙烯三甲基苯乙烯基壬基苯醚、聚氧化丙烯枯烯基苯醚、聚氧化乙烯聚氧化丙烯單苯乙烯基苯醚、聚氧化乙烯聚氧化丙烯單苯乙烯基甲基苯醚、聚氧化乙烯聚氧化丙烯單苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯單苯乙烯基壬基苯醚、聚氧化乙烯聚氧化丙烯單甲基苯乙烯苯醚、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基甲基苯醚、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基壬基苯醚、聚氧化乙烯聚氧化丙烯二苯乙烯基苯醚、聚氧化乙烯聚氧化丙烯二苯乙烯基甲基苯醚、聚氧化乙烯聚氧化丙烯二苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯二苯乙烯基壬基苯醚、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基苯醚、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基甲基苯醚、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基壬基苯醚、聚氧化乙烯聚氧化丙烯三苯乙烯基苯醚、聚氧化乙烯聚氧化丙烯三苯乙烯基甲基苯醚、聚氧化乙烯聚氧化丙烯三苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯三苯乙烯基壬基苯醚、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基苯醚、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基甲基苯醚、聚氧聚氧化乙烯聚氧化丙烯三甲基苯乙烯基丁基苯醚、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基壬基苯醚,及聚氧化乙烯聚氧化丙烯枯烯基苯醚所成的第2化合物群,以及由聚氧化乙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯枯烯基苯醚硫酸酯、聚氧化乙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯
單甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯枯烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯枯烯基苯醚硫酸酯、聚氧化乙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯單苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯單苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯單甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯單甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯單甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯單甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯枯烯基苯醚磷酸酯、聚氧化乙烯二苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯二苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯二苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯二甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯二甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯二甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯二甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯三苯乙烯甲基苯醚磷酸酯、聚氧化乙烯三苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯三苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯三甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯三甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯三甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯三甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯單苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯單苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯單苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯單甲基苯乙烯基苯醚磷酸酯、聚氧化丙烯單甲基苯乙烯基甲基苯醚磷酸酯、聚氧化丙烯單甲基苯乙烯基丁基苯醚磷酸酯、聚氧化丙烯單甲基苯乙烯基壬基苯醚磷酸酯、聚氧化丙烯單二苯乙烯基甲基苯醚磷酸酯、聚氧化丙烯二苯乙烯基丁基苯醚磷酸酯、聚氧化丙烯二苯乙烯基壬基苯醚磷酸酯、聚氧化丙烯二甲基苯乙烯基苯醚磷酸酯、聚氧化丙烯二甲基苯乙烯基甲基苯醚磷酸酯、聚氧化丙烯二甲基苯乙烯基丁基苯醚磷酸酯、聚氧化丙烯二甲基苯乙烯基壬基苯醚磷酸酯、聚氧化丙烯三苯乙烯基苯醚磷酸酯、聚氧化丙烯三苯乙烯基丁基苯醚磷酸酯、聚氧化丙烯三苯乙烯基壬基苯醚磷酸酯、聚氧化丙烯三甲基苯乙烯基苯醚磷酸酯、聚氧化丙烯三甲基苯乙烯基甲基苯醚磷酸酯、聚氧化丙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基壬基苯醚磷酸酯、聚氧化丙烯枯烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單二苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基甲基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基丁基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基壬基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯枯烯基苯醚磷酸酯、聚氧化乙烯單苯乙烯基苯醚硫酸酯、聚氧化乙烯二苯乙烯基苯醚硫酸酯、聚氧化乙烯三苯乙烯基苯醚硫酸酯、聚氧化丙烯單苯乙烯基苯醚硫酸酯、聚氧化丙烯二苯乙烯基苯醚硫酸酯、聚氧化丙烯三苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基苯醚硫酸酯、聚氧化乙烯單苯乙烯基苯醚磷酸酯、聚氧化乙烯二苯乙烯基苯醚磷酸酯、聚氧化乙烯三苯乙烯基苯醚磷酸酯、聚氧化丙烯單苯乙烯基苯醚磷酸酯、聚氧化丙烯二苯乙烯基苯醚磷酸酯、聚氧化丙烯三苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基苯醚磷酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基苯醚磷酸酯,及聚氧化乙烯聚氧化丙烯三苯乙烯基苯醚磷酸酯所成的第3化合物群。
其中,較佳的界面活性劑有以化學式1之R1~R5中1~3個為以化學式2所示之官能基的化合物、即第2及第3之化合物群。此時,可得高的表面缺陷的減低效果。化學式1之R1~R5中1~3個為以化學式2所示之官能基,且化學式1之X為OSO3 -基或OPO3 2-基之化合物時、即第3化合物群時,可得更強的砥粒之分散效果。第3化合物群可為任何一個之苯乙烯基化聚氧化伸烷基苯醚硫酸酯或苯乙烯基化聚氧化伸烷基苯醚磷酸酯。
研磨用組成物中界面活性劑之含量,以0.0001g/L以上較佳,更佳者為0.001g/L以上,最佳者為0.01g/L以上。伴隨界面活性劑之含量增多,可更為減低使用研磨用組成物進行研磨之研磨對象物所產生的表面缺陷現象。
研磨用組成物中界面活性劑之含量,以10g/L以下較佳,更佳者為5g/L以下,最佳者為1g/L以下。伴隨界面活性劑之含量減少,可更為提高藉由研磨用組成物之研磨對象物的研磨速度。
(砥粒)
研磨用組成物中隨意所含有的砥粒,具有使研磨對象物之表面進行機械性研磨的作用。該砥粒之作用,可藉由研磨用組成物以提高研磨對象物之研磨速度。
可使用的砥粒,沒有特別的限制,以二氧化矽、特別是膠體二氧化矽較佳。
研磨用組成物中砥粒之含量,以1質量%以上較佳,更佳者為3質量%以上,最佳者為5質量%以上。伴隨砥粒之含量增多,可藉由研磨用組成物更為提高研磨對象物的研磨速度。
另外,研磨用組成物中砥粒之含量,以20質量%以下較佳,更佳者為15質量%以下,最佳者為10質量%以下。伴隨砥粒之含量減少,可更為抑制研磨用組成物之材料成本。
砥粒之平均一次粒徑,以5nm以上較佳,更佳者為10nm以上,尤佳者為15nm以上,最佳者為20nm以上。伴隨砥粒之平均一次粒徑增大,可藉由研磨用組成物更為提高研磨對象物的研磨速度。
此外,砥粒之平均一次粒徑,以100nm以下較佳,更佳者為80nm以下,尤佳者為65nm以下,最佳者為50nm以下。伴隨砥粒之平均一次粒徑變小,使用研磨用組成物進行研磨後,研磨對象物之含微小扭轉的表面之品質更佳。
(酸)
研磨用組成物中隨意含有的酸,具有使研磨對象物之表面進行蝕刻的作用、藉由氧化劑促進研磨對象物表面氧化的作用、PH緩衝能力等。該酸之作用,可藉由研磨用組成物提高研磨對象物之研磨速度。
可使用的酸,亦可使用無機酸及有機酸中任何一種。
無機酸之具體例,如硫酸、硝酸、硼酸、碳酸、次亞磷酸、亞磷酸及磷酸。
除胺基酸以外之有機酸的具體例,如甲酸、乙酸、丙酸、丁酸、戊酸、2-甲基丁酸、正己酸、3,3-二甲基丁酸、2-乙基丁酸、4-甲基戊酸、正庚酸、2-甲基己酸、正辛酸、2-乙基己酸、苯甲酸、乙醇酸、水楊酸、丙三醇酸、草酸、丙二酸、琥珀酸、三甲酸乙酸、己二酸、庚二酸、馬來酸、苯二甲酸、蘋果酸、酒石酸、檸檬酸、乳酸,以及甲烷磺酸、乙烷磺酸或羥乙磺酸等之有機硫酸。亦可使用組合此等酸之銨鹽或鹼金屬鹽等之鹽與酸以取代酸。
胺基酸之具體例,如甘胺酸(glycine)、N-甲基甘胺酸、N,N-二甲基甘胺酸、L-丙胺酸(alanine)、β-丙胺酸、L-2-胺基丁酸、L-戊胺酸(norvaline)、L-擷胺酸(valine)、L-亮胺酸(leucine)、L-己胺酸(norleucine)、L-異亮胺酸、L-另己胺酸、L-苯基丙胺酸、L-脯胺酸(proline)、肌胺酸(sarcosine)、L-鳥胺酸(ornithin)、L-賴胺酸(lysine)、L-牛磺酸(taurine)、L-絲胺酸(serine)、L-蘇胺酸(threonine)、L-高絲胺酸(homoserine)、L-酪胺酸(tyrosine)、3,5-二碘-L-酪胺酸、β-(3,4-二羥基苯基)-L-丙胺酸、L-甲狀腺素(thyroxine)、4-羥基-L-脯胺酸、L-半胱胺酸(cysteine)、L-蛋胺酸(methionine)、L-乙硫胺酸(ethionine)、L-羊毛硫胺酸(lanthionine)、L-磺基丙胺酸(cysteic acid)、L-胱胺酸、L-磺基丙胺酸、L-天冬胺酸(aspartic acid)、L-谷胺酸(glutamic acid)、S-(羧基甲基)-L-胱硫醚(cystathionine)、4-胺基丁酸、L-天冬醯胺(asparagine)、L-谷胺醯胺(glutamine)、氮絲胺酸(azaserine)、L-精胺酸(arginine)、L-刀豆胺酸(canavanine)、L-瓜胺酸(citrullin)、δ-羥基-L-賴胺酸、肌酸(creatine)、L-犬尿素(kynurenine)、L-組胺酸(histidine)、1-甲基-L-組胺酸、3-甲基-L-組胺酸、硫組胺酸甲基內鹽(ergotinine)、L-色胺酸、放線菌素(actinomycin)C1、蜂毒明肽(apamin)、高血壓蛋白寧I(angiotonin)、高血壓蛋白寧II,及抗木瓜酶。
其中,較佳的酸有蘋果酸、酒石酸、檸檬酸、乙醇酸、羥乙磺酸(isethionic)。
研磨用組成物中酸之含量,以0.001g/L以上較佳,更佳者為0.01g/L以上,最佳者為0.1g/L以上。伴隨酸之含量增多,可更為提高藉由研磨用組成物之研磨對象物的研磨速度。
另外,研磨用組成物中酸之含量,以50g/L以下較佳,更佳者為20g/L以下,最佳者為10g/L以下。伴隨酸之含量減少,可藉由酸更為控制研磨對象物表面引起過剩的蝕刻情形。
(研磨用組成物之pH值)
研磨用組成物之pH值,以4以上較佳,更佳者為7以上。伴隨研磨用組成物之pH值增大,可更為提高藉由研磨用組成物的研磨對象物之研磨速度。為得到企求的pH值時,亦可使用任意的鹼、酸及緩衝劑。
藉由本實施形態,可得下述之優點。
本實施形態之研磨用組成物,含有由以化學式1所示之化合物所構成的界面活性劑。因此,藉由該界面活性劑之作用,使用研磨用組成物,減少經研磨的研磨對象物所產生的表面缺陷情形。因此,本實施形態之研磨用組成物,可適合使用於為形成半導體裝置之配線時之研磨、特別是使研磨對象物之含銅表面進行研磨的用途。
前述實施形態亦可如下述所示進行改變。
‧ 前述實施形態之研磨用組成物,亦可含有二種以上之氧化劑。
‧ 前述實施形態之研磨用組成物。亦可含有二種以上之防腐蝕劑。
‧ 前述實施形態之研磨用組成物,亦可含有二種以上之界面活性劑。
‧ 前述實施形態之研磨用組成物,亦可含有二種以上之砥粒。
‧ 前述實施形態之研磨用組成物,亦可含有二種以上之酸。
‧ 前述實施形態之研磨用組成物,亦可含有螯合劑。螯合劑不僅可有效地減低研磨用組成物中所混入的多價金屬離子等之不良影響,且可有效地減低因研磨中產生的金屬離子,在研磨對象物之表面上產生的擦傷情形。可使用的螯合劑,沒有特別的限制,具體例如硝醯基三醋酸、二乙三胺五醋酸、乙二胺四醋酸、N,N,N-三亞甲基磷酸、乙二胺-N,N,N,’,N’-四亞甲基磺酸、反式環己烷二胺四醋酸、1,2-二胺基丙烷四醋酸、乙醇醚二胺四醋酸、乙二胺-o-羥基苯基醋酸、乙二胺二琥珀酸(SS體)、N-(2-羧化乙基)-L-天冬胺酸、β-丙胺酸二醋酸、2-磷化丁烷-1,2,4-三羧酸、1-羥基次乙基-1,1-二磷酸、N,N’-雙(2-羥基苯甲基)乙二胺-N,N’-二醋酸,及1,2-二羥基苯-4,6-二磺酸。
‧ 前述實施形態之研磨用組成物,尚可含有水溶性高分子。水溶性高分子具有不僅可吸附於砥粒之表面或研磨對象物之表面上,可更為控制藉由研磨用組成物之研磨對象物的研磨速度,且具有使研磨中所產生的不溶性成分在研磨用組成物中安定化的作用。可使用的水溶性高分子,沒有特別的限制,具體例如褐藻酸、果膠酸、羧基甲基纖維素、卡特蘭多醣、支鏈澱粉等之多糖類;甘胺酸銨鹽、甘胺酸鈉鹽等之胺基酸鹽;聚天胺冬酸、聚谷胺酸、聚亮胺酸、聚蘋果酸、聚甲基丙烯酸、聚甲基丙烯酸銨鹽、聚甲基丙烯酸鈉鹽、聚醯胺酸、聚馬來酸、聚衣康酸、聚富馬酸、聚(p-苯乙烯羧酸)、聚丙烯酸、聚丙烯醯胺、胺基聚丙烯醯胺、聚丙烯酸銨鹽、聚丙烯酸鈉鹽、聚醯胺酸、聚醯胺酸銨鹽、聚醯胺酸鈉鹽、聚乙醛酸等之聚羧酸及其鹽;聚乙烯醇、聚乙烯基吡咯烷酮、聚丙烯醛等之乙烯基系聚合物;甲基牛磺膽酸銨鹽、甲基牛磺酸鈉鹽、硫酸甲基鈉鹽、硫酸乙銨鹽、硫酸丁銨鹽、乙烯基磺酸鈉鹽、1-烯丙基磺酸鈉鹽、2-烯丙基磺酸鈉鹽、甲氧基甲基磺酸鈉鹽、乙氧基甲基磺酸銨鹽、3-乙氧基丙基磺酸鈉鹽、甲氧基甲基磺酸鈉鹽、乙氧基甲基磺酸銨鹽、3-乙氧基丙基磺酸鈉鹽、磺基琥珀酸鈉鹽等之磺酸及其鹽;丙醯胺、丙烯醯胺、甲基尿素、煙鹼醯胺、琥珀酸醯胺、磺醯基醯胺等之醯胺;聚丙三醇、聚丙三醇酯等。其中,較佳的水溶性高分子,有支鏈澱粉、羧基甲基纖維素、聚甲基丙烯酸、聚丙烯酸、聚丙烯醯胺、聚乙烯醇及聚乙烯基吡咯烷酮,以及此等之酯及銨鹽。
‧ 前述實施形態之研磨用組成物,視其所需尚可添加防腐蝕劑、防霉劑及防銹劑之習知添加劑。
‧ 前述實施形態之研磨用組成物,可以為一液型,亦可為以二液型為始的多液型。
‧ 前述實施形態之研磨用組成物,亦可藉由以水稀釋研磨用組成物之原液予以調製。
‧ 前述實施形態之研磨用組成物,亦可被使用於除為形成半導體裝置之配線時的研磨處理外之用途。
其次,說明本發明之實施例及比較例。
[實施例]
使氧化劑、防腐蝕劑、界面活性劑、砥粒及酸與水混合,調製實施例1~40及比較例1~20之研磨用組成物。實施例1~40及比較例1~20之研磨用組成物中之界面活性劑及防腐蝕劑之詳細如表1所示。而且,表1中雖沒有表示,實施例1~40及比較例1~20之研磨用組成物中,皆含有3g/L之作為氧化劑的過氧化氫、7質量%作為砥粒之平均一次粒徑為30nm之膠體二氧化矽、11g/L(0.09mol/L)作為酸之明膠酸。
使用實施例1~40及比較例1~20之各研磨用組成物,使銅套晶圓表面以表2記載之條件進行研磨60秒,再予以洗淨。經研磨及洗淨後之各晶圓表面上存在的0.2μm以上之大小的缺陷數,使用表面缺陷裝置(SP-1、KLA-Tencor公司製)計算。另外,由該缺陷中有關各晶圓係無規選擇100個,以掃描電子顯微鏡(RS-4000、日立Hitech公司製)觀察。然後,由第1(a)圖及第1(b)圖之掃描電子顯微鏡照片可知,不定形凸狀之二次電子像與晶圓表面相比時,計算黑暗中可見的特定缺陷數。有關各晶圓,藉由以掃描電子顯微鏡觀察的100個缺陷中所佔的特定缺陷之比例乘以該晶圓之總缺陷數,推測各晶圓之特定缺陷數。該推定的特定缺陷數為100個以下時評估為5(特優),101個以上、500個以下時評估為4(優),501個以上、1000個以下時評估為3(佳),1001個以上、2000個以下時評估為2(可),2001個以上時評估為1(不佳)。該評估結果如表1之"缺陷"欄所示。而且,第1(a)圖及第1(b)圖之各照片的一邊長度約為2.5μm。
使用粒度分布測定裝置(UPA-UT151、日機裝公司製),測定於調製後直接或調製後、在40℃下保管1周後之實施例1~40及比較例1~20之各研磨用組成物中,膠體二氧化矽之D90值(90%粒徑)。D90值係相等於直至各研磨用組成物中之膠體二氧化矽的全部粒子之累計體積的90%以上為止,粒徑小的順序累計粒子之體積時,相當於最後所累計的粒子之粒徑。以於保管1周後之研磨用組成物所測定的D90值除以相同的研磨用組成物於調製後直接測定的D90值,為1.05以下時評估為5(特優),1.06以上、1.10以下時評估為4(優),1.11以上、1.20以下時評估為3(佳),1.21以上、1.50以下時評估為2(可),1.51以上時評估為1(不佳)。該評估結果如表1之"分散性"欄所示。
[第1圖]第1(a)圖及第1(b)圖係表示在使用本發明之實施例及比較例的研磨用組成物,於研磨後之銅套晶圓的表面上所觀察的缺陷例之掃描電子顯微鏡照片。
Claims (11)
- 一種研磨用組成物,其特徵為含有氧化劑、防腐蝕劑及界面活性劑,且前述界面活性劑為聚氧化乙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯單甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯枯烯基苯醚硫酸酯、聚氧化乙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯單甲基 苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化丙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化丙烯枯烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯二甲基苯乙烯基丁基苯醚硫酸酯、 聚氧化乙烯聚氧化丙烯二甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基甲基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基丁基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯三甲基苯乙烯基壬基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯枯烯基苯醚硫酸酯、聚氧化乙烯單苯乙烯基苯醚硫酸酯、聚氧化乙烯二苯乙烯基苯醚硫酸酯、聚氧化丙烯單苯乙烯基苯醚硫酸酯、聚氧化丙烯二苯乙烯基苯醚硫酸酯、聚氧化乙烯聚氧化丙烯單苯乙烯基苯醚硫酸酯、或聚氧化乙烯聚氧化丙烯二苯乙烯基苯醚硫酸酯。
- 如申請專利範圍第1項之研磨用組成物,其中界面活性劑為由聚氧化乙烯單苯乙烯基苯醚硫酸酯、聚氧化乙烯二苯乙烯基苯醚硫酸酯、聚氧化乙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化丙烯二甲基苯乙烯基苯醚硫酸酯、聚氧化乙烯枯烯基苯醚硫酸酯、及聚氧化丙烯枯烯基苯醚硫酸酯所選出之至少一種。
- 如申請專利範圍第1或2項之研磨用組成物,其中前述界面活性劑之含量為0.0001g/L以上10g/L以下。
- 如申請專利範圍第1項之研磨用組成物,其中前述防腐蝕劑為含氮雜環化合物。
- 如申請專利範圍第4項之研磨用組成物,其中前述防 腐蝕劑為由1,2,4-三唑、苯并咪唑、吲唑、吲哚、5-硝基-1H-吲哚、別嘌呤醇(allopurinol)、3-胺基-5-苯基吡唑及苯并三唑所選出之至少一種。
- 如申請專利範圍第4或5項之研磨用組成物,其中前述防腐蝕劑之含量為0.001g/L以上5g/L以下。
- 如申請專利範圍第1、2、5項中任一項之研磨用組成物,其中前述氧化劑為過氧化物。
- 如申請專利範圍第1、2、5項中任一項之研磨用組成物,其中再含有氧下矽作為砥粒。
- 如申請專利範圍第1、2、5項中任一項之研磨用組成物,其中再含有酸。
- 如申請專利範圍第1、2、5項中任一項之研磨用組成物,其中pH為7以上。
- 一種研磨方法,其特徵為使用如申請專利範圍第1~10項中任一項之研磨用組成物,對研磨對象物之含銅表面進行研磨。
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EP2348080A1 (en) | 2011-07-27 |
TW201137096A (en) | 2011-11-01 |
KR20110087227A (ko) | 2011-08-02 |
US20110180511A1 (en) | 2011-07-28 |
JP5587620B2 (ja) | 2014-09-10 |
JP2011151324A (ja) | 2011-08-04 |
CN102161879A (zh) | 2011-08-24 |
US8703007B2 (en) | 2014-04-22 |
KR101732191B1 (ko) | 2017-05-02 |
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