JPWO2018088202A1 - 洗浄液及び基板を洗浄する方法 - Google Patents
洗浄液及び基板を洗浄する方法 Download PDFInfo
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- JPWO2018088202A1 JPWO2018088202A1 JP2018550120A JP2018550120A JPWO2018088202A1 JP WO2018088202 A1 JPWO2018088202 A1 JP WO2018088202A1 JP 2018550120 A JP2018550120 A JP 2018550120A JP 2018550120 A JP2018550120 A JP 2018550120A JP WO2018088202 A1 JPWO2018088202 A1 JP WO2018088202A1
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- cleaning liquid
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- cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 98
- 239000007788 liquid Substances 0.000 title claims abstract description 72
- 239000000758 substrate Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 33
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 11
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- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 37
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 22
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 238000005406 washing Methods 0.000 claims description 10
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- 125000002768 hydroxyalkyl group Chemical group 0.000 description 4
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- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
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- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical group O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 4
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- 229920002554 vinyl polymer Polymers 0.000 description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- TZCGFFXOEGSJCV-UHFFFAOYSA-N 2-hydroxy-n,n,2-trimethylpropanamide Chemical compound CN(C)C(=O)C(C)(C)O TZCGFFXOEGSJCV-UHFFFAOYSA-N 0.000 description 3
- 0 CCC(C)N(*)C(*)=O Chemical compound CCC(C)N(*)C(*)=O 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
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- 125000004183 alkoxy alkyl group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- 150000001565 benzotriazoles Chemical class 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
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- 125000004122 cyclic group Chemical group 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 3
- ZUHDIDYOAZNPBV-UHFFFAOYSA-N 2-[2-hydroxyethyl-[(4-methylbenzotriazol-1-yl)methyl]amino]ethanol Chemical compound CC1=CC=CC2=C1N=NN2CN(CCO)CCO ZUHDIDYOAZNPBV-UHFFFAOYSA-N 0.000 description 2
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- WVIXTJQLKOLKTQ-UHFFFAOYSA-N 3-(benzotriazol-1-yl)propane-1,2-diol Chemical compound C1=CC=C2N(CC(O)CO)N=NC2=C1 WVIXTJQLKOLKTQ-UHFFFAOYSA-N 0.000 description 2
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
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- 125000003118 aryl group Chemical group 0.000 description 2
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- 125000000392 cycloalkenyl group Chemical group 0.000 description 2
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- MPOGZNTVZCEKSW-UHFFFAOYSA-N ethenyl 2-hydroxypropanoate Chemical compound CC(O)C(=O)OC=C MPOGZNTVZCEKSW-UHFFFAOYSA-N 0.000 description 1
- AFIQVBFAKUPHOA-UHFFFAOYSA-N ethenyl 2-methoxyacetate Chemical compound COCC(=O)OC=C AFIQVBFAKUPHOA-UHFFFAOYSA-N 0.000 description 1
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- ZEYMDLYHRCTNEE-UHFFFAOYSA-N ethenyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OC=C ZEYMDLYHRCTNEE-UHFFFAOYSA-N 0.000 description 1
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- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
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- BGVWGPMAGMJLBU-UHFFFAOYSA-N ethenyl naphthalene-1-carboxylate Chemical compound C1=CC=C2C(C(=O)OC=C)=CC=CC2=C1 BGVWGPMAGMJLBU-UHFFFAOYSA-N 0.000 description 1
- BLZSRIYYOIZLJL-UHFFFAOYSA-N ethenyl pentanoate Chemical compound CCCCC(=O)OC=C BLZSRIYYOIZLJL-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- QSCNLGHKALSYKF-UHFFFAOYSA-N ethoxymethanamine Chemical compound CCOCN QSCNLGHKALSYKF-UHFFFAOYSA-N 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
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- DLEZVOPJBSAAGW-UHFFFAOYSA-N methyl benzotriazole-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OC)N=NC2=C1 DLEZVOPJBSAAGW-UHFFFAOYSA-N 0.000 description 1
- KTDMLSMSWDJKGA-UHFFFAOYSA-M methyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCC[N+](C)(CCC)CCC KTDMLSMSWDJKGA-UHFFFAOYSA-M 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
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- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- HVBXZPOGJMBMLN-UHFFFAOYSA-N n,n,n',n'-tetrapropylethane-1,2-diamine Chemical compound CCCN(CCC)CCN(CCC)CCC HVBXZPOGJMBMLN-UHFFFAOYSA-N 0.000 description 1
- NCIVMPNELJTZFT-UHFFFAOYSA-N n,n-diethyl-2-hydroxy-2-methylpropanamide Chemical compound CCN(CC)C(=O)C(C)(C)O NCIVMPNELJTZFT-UHFFFAOYSA-N 0.000 description 1
- CLJWSVLSCYWCMP-UHFFFAOYSA-N n,n-diethyl-2-methylpropanamide Chemical compound CCN(CC)C(=O)C(C)C CLJWSVLSCYWCMP-UHFFFAOYSA-N 0.000 description 1
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- KRKPYFLIYNGWTE-UHFFFAOYSA-N n,o-dimethylhydroxylamine Chemical compound CNOC KRKPYFLIYNGWTE-UHFFFAOYSA-N 0.000 description 1
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- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- XVHLHUNZWRKZPF-UHFFFAOYSA-N n-[(4-methylbenzotriazol-1-yl)methyl]-n-propan-2-ylpropan-2-amine Chemical compound C1=CC=C2N(CN(C(C)C)C(C)C)N=NC2=C1C XVHLHUNZWRKZPF-UHFFFAOYSA-N 0.000 description 1
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- KAHVZNKZQFSBFW-UHFFFAOYSA-N n-methyl-n-trimethylsilylmethanamine Chemical compound CN(C)[Si](C)(C)C KAHVZNKZQFSBFW-UHFFFAOYSA-N 0.000 description 1
- RCALDWJXTVCBAZ-UHFFFAOYSA-N oct-1-enylbenzene Chemical compound CCCCCCC=CC1=CC=CC=C1 RCALDWJXTVCBAZ-UHFFFAOYSA-N 0.000 description 1
- YNOGYQAEJGADFJ-UHFFFAOYSA-N oxolan-2-ylmethanamine Chemical compound NCC1CCCO1 YNOGYQAEJGADFJ-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
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- 229920002939 poly(N,N-dimethylacrylamides) Polymers 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- CYFIHPJVHCCGTF-UHFFFAOYSA-N prop-2-enyl 2-hydroxypropanoate Chemical compound CC(O)C(=O)OCC=C CYFIHPJVHCCGTF-UHFFFAOYSA-N 0.000 description 1
- AXLMPTNTPOWPLT-UHFFFAOYSA-N prop-2-enyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCC=C AXLMPTNTPOWPLT-UHFFFAOYSA-N 0.000 description 1
- ZQMAPKVSTSACQB-UHFFFAOYSA-N prop-2-enyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCC=C ZQMAPKVSTSACQB-UHFFFAOYSA-N 0.000 description 1
- HAFZJTKIBGEQKT-UHFFFAOYSA-N prop-2-enyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCC=C HAFZJTKIBGEQKT-UHFFFAOYSA-N 0.000 description 1
- HPCIWDZYMSZAEZ-UHFFFAOYSA-N prop-2-enyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC=C HPCIWDZYMSZAEZ-UHFFFAOYSA-N 0.000 description 1
- QLGGKSSLRJWNNV-UHFFFAOYSA-N propoxymethanamine Chemical compound CCCOCN QLGGKSSLRJWNNV-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000004963 sulfonylalkyl group Chemical group 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- HJHUXWBTVVFLQI-UHFFFAOYSA-N tributyl(methyl)azanium Chemical compound CCCC[N+](C)(CCCC)CCCC HJHUXWBTVVFLQI-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3769—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines
- C11D3/3773—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3769—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines
- C11D3/3776—Heterocyclic compounds, e.g. lactam
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/52—Amides or imides
- C08F120/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/52—Amides or imides
- C08F120/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F120/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-acryloyl morpholine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F126/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F126/06—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
- C08F126/10—N-Vinyl-pyrrolidone
-
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Abstract
Description
このため、特許文献1〜4に記載の洗浄液による洗浄対象となる基板の表面は、窒化ケイ素からなる表面を含むことが多い。
防食剤が、下記式(b1)又は式(b2):
式(b2)中、Rb3は水素原子又はメチル基であり、Rb4及びRb5は、それぞれ独立に、水素原子、又は1以上の水酸基で置換されていてもよい炭素原子数1以上6以下の炭化水素基であり、Rb4とRb5とが互いに結合して環を形成してもよい。)
で表される1種以上の単位を含む重合体を含有する、洗浄液である。
洗浄液は、フッ化水素酸(A)と、防食剤(B)と、溶媒(S)とを含有する。
洗浄液は、防食剤(B)として、下記式(b1)又は式(b2):
式(b2)中、Rb3は水素原子又はメチル基であり、Rb4及びRb5は、それぞれ独立に、水素原子、又は1以上の水酸基で置換されていてもよい炭素原子数1以上6以下の炭化水素基であり、Rb4とRb5とが互いに結合して環を形成してもよい。)
で表される1種以上の単位を含む重合体を含有する。
洗浄液は、上記重合体を含有するため、窒化ケイ素に対する優れた防食性を備える。
以下、洗浄液に含まれる必須又は任意の成分について詳細に説明する。
洗浄液は、フッ化水素酸を必須に含有する。
フッ化水素酸の含有量は、洗浄液中、0.001質量%以上0.5質量%以下が好ましく、0.08質量%以上0.32質量%以下がより好ましい。フッ化水素酸の含有量がこのような範囲内である場合、フォトレジストパターンの残渣物やエッチング残渣物の洗浄除去性と、窒化ケイ素に対する防食性とのバランスをより効果的にとることができる。
洗浄液は、防食剤(B)として、下記式(b1)又は式(b2):
式(b2)中、Rb3は水素原子又はメチル基であり、Rb4及びRb5は、それぞれ独立に、水素原子、又は1以上の水酸基で置換されていてもよい炭素原子数1以上6以下の炭化水素基であり、Rb4とRb5とが互いに結合して環を形成してもよい。)
で表される1種以上の単位を含む重合体を必須に含有する。洗浄液が、防食剤(B)を含むことによって、洗浄液の窒化ケイ素に対する防食性が顕著に高められる。
上記重合体の質量平均分子量は、1000以上2000000以下が好ましく、5000以上500000以下がより好ましく、10000以上300000以下がさらに好ましく、40000以上200000以下がさらにより好ましく、80000以上1800000以下が特に好ましく、100000以上160000以下が最も好ましい。
なお、重合体の質量平均分子量が2000000超である場合、洗浄液の調製が可能である一方で、重合体を後述する溶媒(S)に溶解させる際に、長時間や加熱が必要であったりする場合がある。
このように、上記の範囲内の質量平均分子量を有する重合体を用いる場合、防食剤(B)である重合体を洗浄液に均一に溶解させやすく、且つ、窒化ケイ素に対する所望する防食効果を得やすい。
重合体における、その他の単位の含有量は、30質量%以下が好ましく、20質量%以下がより好ましく、10質量%以下がさらに好ましい。
重合体は、式(b1)で表される単位、及び/又は式(b2)で表される単位のみからなるのが最も好ましい。
アルキル基の好適な具体例としては、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、n−ペンチル基、イソペンチル基、tert−ペンチル基、及びn−ヘキシル基等が挙げられる。アルケニル基の好適な具体例としては、ビニル基、アリル基、3−ブテニル基、2−ブテニル基、1−ブテニル基、4−ペンテニル基、5−ヘキセニル基等が挙げられる。
Rb1及び/又はRb2が炭シクロアルケニル基である場合の好適な例としては、シクロアルキル基について例示した好ましい基に対応するシクロアルケニル基が挙げられる。
Rb4及びRb5が1以上の水酸基で置換された炭素原子数1以上6以下の炭化水素基である場合、水酸基の置換数は1が好ましい。
水酸基で置換された炭素原子数1以上6以下の炭化水素基の好適な例としては、メチロール基、2−ヒドロキシエチル基、3−ヒドロキシプロピル基、4−ヒドロキシブチル基、5−ヒドロキシペンチル基、6−ヒドロキシヘキシル基、4−ヒドロキシシクロペンチル基、4−ヒドロキシフェニル基、3−ヒドロキシフェニル基、及び2−ヒドロキシフェニル基が挙げられる。これらの中では、メチロール基、2−ヒドロキシエチル基、3−ヒドロキシエチル基が好ましく、2−ヒドロキシエチル基がより好ましい。
Rb1とRb2とが互いに結合して形成してもよい環構造としては、ピロリジン環構造、ピペリジン環構造、及びヘキサメチレンイミン環構造が挙げられる。
式(b1−1):
で表される単位である重合体が好ましい。
かかる範囲内の量の防食剤(B)を用いると、種々の残渣物に対する優れた洗浄効果と、窒化ケイ素対する優れた防食効果とを兼ね備える洗浄液を得やすい。
洗浄液は、溶媒(S)を必須に含有する。溶媒(S)は典型的には主に水からなる溶媒であるが、水のみからなる溶媒であっても、水と水溶性有機溶剤の混合溶媒であっても、水溶性有機溶剤のみからなる溶媒であってもよい。
水の含有量は、洗浄液中、1.0質量%以上99.9質量%以下が好ましい。溶媒(S)が水を主体とする場合、洗浄液中の水の含有量は、80質量%以上99.9質量%以下がより好ましく、90質量%以上99.9質量%以下が特に好ましく、95質量%以上99.9質量%以下がさらに好ましく、98質量%以上99.9質量%以下が最も好ましい。溶媒(S)が水と水溶性有機溶剤とを含む場合、洗浄液中の水の含有量は、例えば、15質量%以上40質量%以下であってよい。
また、溶媒(S)が、水と水溶性有機溶剤の混合溶媒の場合、洗浄液中の水溶性有機溶剤の含有量は、1.0質量%以上90質量%以下が好ましく、10質量%以上80質量%以下がより好ましく、20質量%以上50質量%以下が特に好ましい。
洗浄液は、水溶性有機溶剤として、2種以上のN,N−ジアルキル脂肪酸アミドを組み合わせて含んでいてもよい。
式(s−2)で表される3−アルコキシ−3−メチル−1−ブタノールとしては、3−メトキシ−3−メチル−1−ブタノール(MMB)が特に好ましい。
洗浄液は、前述の防食剤(B)以外の塩基性化合物(C)を含有していてもよい。
塩基性化合物(C)の種類は特に限定されず、従来より、フォトレジスト等の残渣物の洗浄に用いられる洗浄液に配合される、無機又は有機塩基性化合物から適宜選択される。
塩基性化合物(C)としては、含窒素塩基性化合物が好ましい。
また、以下の有機アミン類も塩基性化合物(C)として好適である。有機アミン類の具体例としては、メトキシメチルアミン、メトキシエチルアミン、メトキシプロピルアミン、メトキシブチルアミン、エトキシメチルアミン、エトキシエチルアミン、エトキシプロピルアミン、エトキシブチルアミン、プロポキシメチルアミン、プロポキシエチルアミン、プロポキシプロピルアミン、プロポキシブチルアミン、ブトキシメチルアミン、ブトキシエチルアミン、ブトキシプロピルアミン、ブトキシブチルアミン、メチルアミン、エチルアミン、プロピルアミン、ブチルアミン、N,N−ジメチルアミン、N,N−ジエチルアミン、N,N−ジプロピルアミン、N,N−ジブチルアミン、トリメチルアミン、トリエチルアミン、トリプロピルアミン、トリブチルアミン、ジメチルアミノプロピルアミン、2−エチルヘキシルアミン、テトラヒドロフルフリルアミン、テトラメチルエチレンジアミン、テトラエチルエチレンジアミン、テトラプロピルエチレンジアミン、及びテトラブチルエチレンジアミン、メチルアミノブチルアミン、エチルアミノブチルアミン、プロピルアミノブチルアミン、ブチルアミノブチルアミン、ピリジン、ピロール、ピペラジン、ピロリジン、ピペリジン、ピコリン、モルホリン、メチルモルホリン、ジアザビシクロオクタン、ジアザビシクロノナン、及びジアザビシクロウンデセン等である。
このアルキル基は、水酸基、カルボキシル基、アミノ基、又はホスホン酸基を有していてもよい。そのような具体例としては、2−ヒドロキシエチル基、2−カルボキシエチル基、2−アミノエチル基、2−ホスホン酸エチル基等が挙げられる。
なお、洗浄液のpHは、25℃で測定された値である。
洗浄液は、さらに、上記の防食剤(B)以外に、従来より洗浄液に配合されている防食剤を含有していてもよい。
この防食剤としては、特に限定されず、従来公知の防食剤を用いることができるが、ベンゾトリアゾール系化合物やメルカプト基含有化合物が好ましい。
これらの中でも、1−(2,3−ジヒドロキシプロピル)−ベンゾトリアゾール、2,2’−{[(4−メチル−1H−ベンゾトリアゾール−1−イル)メチル]イミノ}ビスエタノール、2,2’−{[(5−メチル−1H−ベンゾトリアゾール−1−イル)メチル]イミノ}ビスエタノール等が好ましい。
これらのベンゾトリアゾール化合物は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
これらのメルカプト基含有化合物は、単独で用いてもよく、2種以上を組み合わせて用いてもよい。
この界面活性剤としては、特に限定されず、従来公知の界面活性剤を用いることができるが、アセチレンアルコール系界面活性剤が好ましい。
このため、以上説明した洗浄液は、基板の表面の少なくとも一部が窒化ケイ素からなる場合の基板の洗浄に好適に使用される。
以上説明した洗浄液は、特に、窒化ケイ素からなる層を、例えば、ストッパー層として含む基板を用いて化学的研磨(CMP)を行う際に使用される洗浄液として、好適に使用される。
洗浄液による洗浄の後、純水や低級アルコール等を用いたリンス処理、及び乾燥処理を施してもよい。
(洗浄液の調製)
フッ化水素酸0.1質量%と、表1に記載の種類の防食剤0.1質量%と、残部の水とを均一に混合して、実施例1〜6、及び比較例2〜7の洗浄液を調製した。
比較例1の洗浄液については、防食剤を用いないことの他は、実施例の洗浄液と同様に調製した。
各実施例、及び比較例の洗浄液の25℃で測定したpHの値を表1に記す。
B1:ポリビニルピロリドン(質量平均分子量9,000)
B2:ポリビニルピロリドン(質量平均分子量40,000)
B3:ポリビニルピロリドン(質量平均分子量45,000)
B4:ポリビニルピロリドン(質量平均分子量80,000)
B5:ポリビニルピロリドン(質量平均分子量140,000)
B6:ポリビニルピロリドン(質量平均分子量1,200,000)
B7:N−ビニルピロリドン
B8:ピラゾール
B9:ピロール
B10:イミダゾール
B11:1,2,4−トリアゾール
B12:5−アミノテトラゾール
最外層として厚さ100nmの窒化ケイ素層を備える基板を防食性の評価に用いた。各実施例及び比較例の洗浄液に、50℃で30分間、基板を浸漬させた。浸漬後、基板表面を水にてリンスし、次いで、基板を窒素ブローにより乾燥させた。
乾燥後の基板の、窒化ケイ素層の膜厚(Å)をエリプソメータにて測定して、浸漬後の窒化ケイ素層の膜厚(Å)を測定した。
浸漬前後の窒化ケイ素層の膜厚の変化から、窒化ケイ素層の膜べり量を求めた。
膜べり量(Å/30分)の測定結果を表1に示す。
フッ化水素酸0.1質量%と、防食剤であるポリ(N−(2−ヒドロキシエチル)アクリルアミド)0.5質量%と、残部の水とを混合して、実施例7の洗浄液を得た。
実施例7の洗浄液を用いて、窒化ケイ素防食性評価を行ったところ、窒化ケイ素の膜べり量は、防食剤を含まない比較例1の洗浄液の膜べり量の50%以下であった。
フッ化水素酸0.1質量%と、防食剤であるポリ(N,N−ジメチルアクリルアミド)0.5質量%と、残部の水とを混合して、実施例8の洗浄液を得た。
実施例8の洗浄液を用いて、窒化ケイ素防食性評価を行ったところ、窒化ケイ素の膜べり量は、防食剤を含まない比較例1の洗浄液の膜べり量の50%以下であった。
Claims (9)
- 前記pが1である、請求項2に記載の洗浄液。
- 前記重合体がポリビニルピロリドンである、請求項1〜3のいずれか1項に記載の洗浄液。
- 前記重合体の質量平均分子量が1000以上2000000以下である、請求項1〜4のいずれか1項に記載の洗浄液。
- 前記溶媒(S)が、水を含む、請求項1〜5のいずれか1項に記載の洗浄液。
- 窒化ケイ素からなる層を含む基板の洗浄に用いられる、請求項1〜6のいずれか1項に記載の洗浄液。
- 請求項1〜7のいずれか1項に記載の洗浄液を用いて基板を洗浄する方法。
- 前記基板が窒化ケイ素からなる層を含む、請求項8に記載の方法。
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KR102626655B1 (ko) * | 2017-02-08 | 2024-01-17 | 제이에스알 가부시끼가이샤 | 반도체 처리용 조성물 및 처리 방법 |
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