JP2012119648A5 - - Google Patents

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Publication number
JP2012119648A5
JP2012119648A5 JP2011010288A JP2011010288A JP2012119648A5 JP 2012119648 A5 JP2012119648 A5 JP 2012119648A5 JP 2011010288 A JP2011010288 A JP 2011010288A JP 2011010288 A JP2011010288 A JP 2011010288A JP 2012119648 A5 JP2012119648 A5 JP 2012119648A5
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JP
Japan
Prior art keywords
semiconductor die
substrate
pad
power
pads
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Pending
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JP2011010288A
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English (en)
Japanese (ja)
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JP2012119648A (ja
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Priority claimed from US12/959,709 external-priority patent/US8853001B2/en
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Publication of JP2012119648A publication Critical patent/JP2012119648A/ja
Publication of JP2012119648A5 publication Critical patent/JP2012119648A5/ja
Pending legal-status Critical Current

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JP2011010288A 2010-12-03 2011-01-20 フリップチップ半導体ダイのパッドレイアウトを形成する半導体素子および方法 Pending JP2012119648A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/959,709 US8853001B2 (en) 2003-11-08 2010-12-03 Semiconductor device and method of forming pad layout for flipchip semiconductor die
US12/959,709 2010-12-03

Publications (2)

Publication Number Publication Date
JP2012119648A JP2012119648A (ja) 2012-06-21
JP2012119648A5 true JP2012119648A5 (https=) 2014-01-16

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Application Number Title Priority Date Filing Date
JP2011010288A Pending JP2012119648A (ja) 2010-12-03 2011-01-20 フリップチップ半導体ダイのパッドレイアウトを形成する半導体素子および方法

Country Status (6)

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US (2) US8853001B2 (https=)
JP (1) JP2012119648A (https=)
KR (1) KR101798657B1 (https=)
CN (1) CN102487021B (https=)
SG (2) SG10201402301RA (https=)
TW (2) TWI528515B (https=)

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