JP2012054242A - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- JP2012054242A JP2012054242A JP2011229011A JP2011229011A JP2012054242A JP 2012054242 A JP2012054242 A JP 2012054242A JP 2011229011 A JP2011229011 A JP 2011229011A JP 2011229011 A JP2011229011 A JP 2011229011A JP 2012054242 A JP2012054242 A JP 2012054242A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- luminescent
- solid state
- light
- state light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
- F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
本発明は、照明装置、特に、１つ、あるいはそれ以上の固体発光素子、および１つ、あるいはそれ以上のルミネッセント材料（たとえば、１つ、またはそれ以上のリン発光体）を含む装置に関係する。特定の側面において、本発明は、１つ、またはそれ以上の発光ダイオード、および１つ、あるいはそれ以上のルミネッセント材料を含む照明装置に関係する。
なお、本出願は、その全体が参照によりここに組み入れられる２００５年１２月２２日に出願された、米国仮特許出願第６０／７５３，１３８号の優先権の利益を主張する。また、本出願は、その全体が参照によりここに組み入れられる２００６年７月１９日に出願された、米国仮特許出願第６０／８３１，７７５号の優先権の利益を主張する。
The present invention relates to lighting devices, particularly devices that include one or more solid state light emitters and one or more luminescent materials (eg, one or more phosphor emitters). . In certain aspects, the present invention relates to an illumination device that includes one or more light emitting diodes and one or more luminescent materials.
This application claims the benefit of priority of US Provisional Patent Application No. 60 / 753,138, filed Dec. 22, 2005, which is hereby incorporated by reference in its entirety. This application also claims the benefit of priority of US Provisional Patent Application No. 60 / 831,775, filed July 19, 2006, which is incorporated herein by reference in its entirety.
毎年、米国において生成される電気の多くの部分（いくつかの見積りは、２５％と高い）は、照明に行っている。したがって、よりエネルギー効率の高い照明を与える、進行中の必要がある。白熱電球は、エネルギー効率のよくない光源であることはよく知られている − それらが消費する電気の約９０％は、光よりむしろ熱として開放される。蛍光灯バルブは、白熱電球より、（約１０倍だけ）より効率的であるが、しかし、発光ダイオード等の、固体発光素子に比較すると、まだ、きわめて非効率である。 Each year, much of the electricity generated in the United States (some estimates are as high as 25%) goes to lighting. There is therefore an ongoing need to provide more energy efficient lighting. It is well known that incandescent bulbs are inefficient energy sources—about 90% of the electricity they consume is released as heat rather than light. Fluorescent bulbs are more efficient (about 10 times) than incandescent bulbs, but are still very inefficient when compared to solid state light emitting devices such as light emitting diodes.
さらに、固体発光素子の通常の寿命に比較すると、白熱電球は、相対的に短い寿命、たとえば、代表的に約７５０−１０００時間を持つ。比較するに、発光ダイオードの寿命は、たとえば、一般に、数十年単位で、測定することができる。蛍光灯は、白熱灯より、より長い寿命（たとえば、１０，０００−２０，０００時間）を持つが、しかし、色再現の好ましさは低い。色再現は、代表的に、特定のランプにより点灯されるときの、対象物の表面カラーのシフトの相対的な示しである演色評価数（ＣＥＩ）を用いて測定される。昼光色は、もっとも高いＣＲＩ（１００の）を持ち、白熱電球は、比較的近い（約９５）ものであり、蛍光照明は、より正確さが低い（７０−８７）。あるタイプの特定化された照明は、相対的に低いＣＲＩを持つ（たとえば、水銀蒸気またはナトリウムでは、ともに、約４０、あるいは、さらにより低い、のように低い）。 Furthermore, incandescent bulbs have a relatively short life, for example typically about 750-1000 hours, compared to the normal life of a solid state light emitting device. In comparison, the lifetime of a light emitting diode can be measured, for example, generally in units of decades. Fluorescent lamps have a longer life than incandescent lamps (eg, 10,000-20,000 hours), but color reproduction is less preferred. Color reproduction is typically measured using a color rendering index (CEI), which is a relative indication of the surface color shift of an object when illuminated by a particular lamp. Daylight colors have the highest CRI (100), incandescent bulbs are relatively close (about 95), and fluorescent lighting is less accurate (70-87). One type of specialized illumination has a relatively low CRI (eg, as low as about 40 or even lower for both mercury vapor or sodium).
従来の電灯設備により直面される問題は、照明装置（たとえば、電灯バルブ等）を、周期的に置き換える必要である。このよう問題は、特に、アクセスが困難である（たとえば、丸天井、ブリッジ、高いビル、交通トンネル）ところで、および／または、交換コストが極端に高いところで照明されている。従来の電灯設備の代表的な寿命は、少なくとも約４４，０００時間の光発生装置の使用（２０年間にわたる１日６時間の使用に基づく）に対応する、約２０年である。光発生装置の寿命は、代表的にもっと小さく、これにより、周期的な交換の必要を生じる。 A problem faced by conventional lighting installations is the need to periodically replace lighting devices (eg, light bulbs, etc.). Such problems are particularly illuminated where access is difficult (eg vaults, bridges, high buildings, traffic tunnels) and / or where replacement costs are extremely high. The typical lifetime of a conventional light fixture is about 20 years, corresponding to at least about 44,000 hours of light generator use (based on 6 hours of use per day over 20 years). The lifetime of the light generator is typically much smaller, which creates the need for periodic replacement.
したがって、これらの、および他の理由により、努力は、固体発光素子を、白熱電球、蛍光灯、および他の光発生装置の代わりに、広い領域の応用において用いることのできる方法を、開発するために続けられてきた。さらに、発光ダイオード（または、他の固体光発光素子）が、すでに使われ続けているところでは、努力は、たとえば、エネルギー効率、演色評価数（ＣＲＩ）、コントラスト、有効性（ｌｍ／Ｗ）、および／または、サービス期間、に関して、改善された発光ダイオードを与えるよう、行われ続けている。 Thus, for these and other reasons, efforts have been made to develop methods in which solid state light emitters can be used in wide area applications in place of incandescent bulbs, fluorescent lamps, and other light generating devices. Has been continued. Furthermore, where light emitting diodes (or other solid state light emitting devices) continue to be used, efforts include, for example, energy efficiency, color rendering index (CRI), contrast, effectiveness (lm / W), And / or continues to be done to provide improved light emitting diodes with respect to service periods.
種々の固体発光素子は、よく知られている。たとえば、１つのタイプの固体発光素子は、発光ダイオードである。発光ダイオードは、電流を光に変換するよく知られた半導体装置である。広い範囲の発光ダイオードが、今も広がる目的の範囲のための、ますます広い分野において使用されている。 Various solid state light emitting devices are well known. For example, one type of solid state light emitting device is a light emitting diode. Light emitting diodes are well known semiconductor devices that convert current to light. A wide range of light emitting diodes is still being used in an increasingly wider field for a wide range of purposes.
より特定的には、発光ダイオードは、電位差が、ｐｎ接合構造に対して印加されたとき、光（紫外線、可視光、または赤外線）を、発する半導体装置である。発光ダイオード、および、多くの関連する構造を作る多くの公知の方法があり、本発明は、任意のこのような装置を用いることができる。たとえば、Ｓｚｅの半導体装置の物理学（１９８１年、第２版）の第１２−１４章、および、Ｓｚｅの現代半導体装置物理学（１９９８）の第７章は、発光ダイオードを含む、広い範囲の発光装置を記述している。 More specifically, a light emitting diode is a semiconductor device that emits light (ultraviolet light, visible light, or infrared light) when a potential difference is applied to a pn junction structure. There are many known ways of making light emitting diodes and many related structures, and the invention can use any such device. For example, chapters 12-14 of Sze semiconductor device physics (1981, 2nd edition) and Sze modern semiconductor device physics (1998) include a wide range of light emitting diodes. A light emitting device is described.
ここで使用される表現“発光ダイオード”は、基本的な半導体ダイオード構造（すなわち、“チップ”）を意味するものとして用いられる。共通に認識され、商業的に入手可能な“ＬＥＤ”であって、（たとえば、）電子ショップにおいて売られているものは、多くの部品から作られている“パッケージされた”デバイスを表す。これらのパッケージされたデバイスは、代表的に、米国特許第４，９１８，４８７、５，６３１，１９０、および５，９１２，４７７号明細書に記述されたような（しかしそれらに限定されない）半導体ベースの発光ダイオード、種々のワイヤ接続、および、発光ダイオードを収容するパッケージを含む。 As used herein, the expression “light emitting diode” is used to refer to a basic semiconductor diode structure (ie, “chip”). Commonly recognized and commercially available “LEDs” that are sold in an electronic shop (for example) represent “packaged” devices made from many parts. These packaged devices are typically semiconductors as described in (but not limited to) US Pat. Nos. 4,918,487, 5,631,190, and 5,912,477. Includes a base light emitting diode, various wire connections, and a package containing the light emitting diode.
よく知られているように、発光ダイオードは、半導体活性（発光）層の導電帯と価電子帯との間のバンドギャップを横切って電子を励起することにより、光を生成する。電子遷移は、エネルギーギャップに依存する波長で、光を発生する。このように、発光ダイオードにより発光された光の色（波長）は、発光ダイオードの活性層の半導体材料に依存する。 As is well known, light emitting diodes produce light by exciting electrons across the band gap between the conduction band and valence band of a semiconductor active (light emitting) layer. Electronic transitions generate light at wavelengths that depend on the energy gap. Thus, the color (wavelength) of the light emitted by the light emitting diode depends on the semiconductor material of the active layer of the light emitting diode.
発光ダイオードの発展は、多くの態様で、照明産業を改革してきたが、発光ダイオードの特徴のいくつかは、多くの挑戦を提示してきており、そのいくつかはまだ十分に満たされていない。たとえば、任意の特定の発光ダイオードの発光スペクトルは、代表的に（発光ダイオードの組成、および構造により予言されるように）単一波長の周りに集中しており、これは、いくらかの応用には好ましいが、他のもののためには、好ましくないものである（たとえば、照明を与えるためには、このような発光スペクトルは、大変低いＣＲＩを与える）。 While the development of light emitting diodes has reformed the lighting industry in many ways, some of the features of light emitting diodes have presented many challenges, some of which are not yet fully met. For example, the emission spectrum of any particular light-emitting diode is typically concentrated around a single wavelength (as predicted by the composition and structure of the light-emitting diode), which may be useful for some applications. Preferred but not preferred for others (eg, to provide illumination, such an emission spectrum gives a very low CRI).
白と感じられる光は、必然的に、２つ、またはそれ以上の色の（または、波長の）ブレンドであるので、単一の発光ダイオードは、白色を生ずることはできない。“白色”発光ダイオードは、各赤、緑、および青の発光ダイオードにより形成される発光ダイオードピクセルを持って製造されてきた。他の、“白色”発光ダイオードは、(1) 青色光を発生する発光ダイオード、および、(2) 前記発光ダイオード により発光された光による励起に応答して黄色光を発するルミネッセント材料（たとえば、リン発光体）を含んで生成され、これにより、該青色光、および黄色光は、混合されたとき、白色光と感知される光を生成する。 Since light perceived as white is necessarily a blend of two or more colors (or wavelengths), a single light emitting diode cannot produce white. “White” light emitting diodes have been fabricated with light emitting diode pixels formed by each red, green, and blue light emitting diode. Other “white” light emitting diodes include (1) a light emitting diode that generates blue light, and (2) a luminescent material that emits yellow light in response to excitation by light emitted by the light emitting diode (eg, phosphorescent material). The blue light and yellow light, when mixed, produce light that is perceived as white light.
さらに、非主要色の結合を生成する主要色の混合は、一般に、この、および他の技術において、よく理解されている。一般に、１９３１年のＣＩＥ色度図（１９３１年に設けられた主要色の国際標準）、および１９７６年のＣＩＥ色度図（１９３１年の色度図に類似しているが、該図上の同様の距離は、同様の認知される色の差異を表現するよう修整されている）は、色を、主要色の重み付け加算として定義するための有用な参照を与える。 Furthermore, the mixing of primary colors that produce a combination of non-primary colors is generally well understood in this and other techniques. In general, the 1931 CIE chromaticity diagram (international standard for major colors established in 1931) and the 1976 CIE chromaticity diagram (similar to the 1931 chromaticity diagram, but similar on the diagram) Are adjusted to represent similar perceived color differences), providing a useful reference for defining a color as a weighted addition of the primary colors.
発光ダイオードは、このように、個々に、または、任意の結合において、任意に、１つ、またはそれ以上のルミネッセント材料（リン発光体、またはシンチレータ）、および／または、フィルターとともに使用されて、任意の所望の感受される色（白を含む）を生成することができる。したがって、現存する光源を、発光ダイオード光源により、たとえば、エネルギー効率、演色評価数（ＣＲＩ）、有効性（ｌｍ／Ｗ）、および／または、サービス期間、に関して改善するために置き換えるよう、努力がなされつづけている領域は、任意の特定の色の光、あるいは色のブレンドの光に、限定されるものではない。 The light emitting diodes can thus be used individually, or in any combination, optionally with one or more luminescent materials (phosphor emitters or scintillators) and / or filters. Desired perceived colors (including white) can be generated. Thus, efforts are made to replace existing light sources with light emitting diode light sources to improve, for example, energy efficiency, color rendering index (CRI), effectiveness (lm / W), and / or service duration. The continuing region is not limited to any particular color light or color blend light.
広い多種多様性のルミネッセント材料（たとえば、その全体が参照によりここに組み入れられる、米国特許第６，６００，１７５号明細書に開示されているように、ルミファー、あるいはルミノフォリック材料としても知られている）は、公知であり、当業者にとって入手可能である。例えば、リン発光体は、たとえば、励起放射源により励起されたとき、反応性の放射（例えば、可視光線）を発するルミネッセント材料である。多くの場合、応答する放射は、励起する放射の波長と異なる波長を持つ。ルミネッセント材料の他の例は、紫外線を照射されると、可視スペクトル内において輝くシンチレーター、昼日グローテープ、およびインクを含む。 A wide variety of luminescent materials (e.g., also known as lumiphors or luminophoric materials as disclosed in U.S. Patent 6,600,175, which is hereby incorporated by reference in its entirety). Are known and available to those skilled in the art. For example, a phosphor emitter is a luminescent material that emits reactive radiation (eg, visible light) when excited by an excitation radiation source, for example. In many cases, the responsive radiation has a wavelength that is different from the wavelength of the exciting radiation. Other examples of luminescent materials include scintillators, daylight glow tapes, and inks that shine in the visible spectrum when irradiated with ultraviolet light.
ルミネッセント材料は、ダウンコンバートするもの、すなわち、フォトンをより低いエネルギーレベル（より長い波長）に変換する材料である、あるいは、アップコンバートするもの、すなわち、フォトンをより高いエネルギーレベル（より短い波長）に変換する材料である、ものとして分類されることができる。 Luminescent materials are those that down-convert, i.e., materials that convert photons to lower energy levels (longer wavelengths), or those that up-convert, i.e., photons to higher energy levels (shorter wavelengths). It can be classified as being a material to convert.
ルミネッセント材料を、ＬＥＤ装置内に含むことは、上記したように、ルミネッセント材料を、清浄な収容材料（たとえば、エポキシ系、またはシリコーン系材料）に、たとえば、ブレンディングまたはコーティングプロセスにより、付加することにより遂行されてきた。 Inclusion of the luminescent material in the LED device is as described above by adding the luminescent material to a clean containment material (eg, epoxy-based or silicone-based material), eg, by a blending or coating process. Has been carried out.
たとえば、米国特許第６，９６３，１６６号明細書（Ｙａｎｏ‘１６６）は、従来の発光ダイオードランプが、発光ダイオードチップ、発光ダイオードチップを覆うための弾丸形状透明ハウジング、電流を発光ダイオードチップに供給する導線、および、発光ダイオードチップの放射を一定の方向に反射するためのチップ反射器、そこにおいては、発光ダイオードチップは、第１の樹脂部分により収容されており、これは、さらに第２の樹脂部分により収容されている、を含むことを開示している。Ｙａｎｏ‘１６６によれば、第１の樹脂部分は、カップリフレクタを樹脂材料で満たし、それを、発光ダイオードチップが、カップリフレクタの底上にマウントされ、そののち、そのカソード、およびアノード電極が、ワイヤによりリードに電気的に接続された後に、キュアすることにより得られる。Ｙａｎｏ‘１６６によれば、リン発光体は、発光ダイオードチップから出射された光Ａにより励起されるよう、第１の樹脂部分において分散され、該励起されたリン発光体は、光Ａより長い波長を持つ蛍光発光（“光Ｂ”）を生成し、該光Ａの一部は、リン発光体を含む第１の樹脂部分を通って送信され、結果として、光Ａと光Ｂの混合物である光Ｃが、照明として用いられる。 For example, US Pat. No. 6,963,166 (Yano'166) discloses that a conventional light-emitting diode lamp is a light-emitting diode chip, a bullet-shaped transparent housing for covering the light-emitting diode chip, and supplying current to the light-emitting diode chip. And a chip reflector for reflecting the radiation of the light-emitting diode chip in a certain direction, wherein the light-emitting diode chip is accommodated by a first resin portion, which further comprises a second It is disclosed that it is contained by the resin portion. According to Yano '166, the first resin portion fills the cup reflector with resin material, and the light emitting diode chip is mounted on the bottom of the cup reflector, after which its cathode and anode electrodes are It is obtained by curing after being electrically connected to the lead by a wire. According to Yano'166, the phosphor phosphor is dispersed in the first resin portion so as to be excited by the light A emitted from the light emitting diode chip, and the excited phosphor phosphor has a longer wavelength than the light A. And a portion of the light A is transmitted through a first resin portion that includes a phosphor emitter, resulting in a mixture of light A and light B. Light C is used as illumination.
上記したように、“白ＬＥＤ光”（すなわち、白、または、白に近いと感受される光）は、白い白熱電球に対する可能な置き替えとして研究されて来た。白色ＬＥＤランプの代表的な例は、ガリウム窒化物から作られる青色発光ダイオードチップのパッケージ、これは、ＹＡＧ等のリン発光体によりコートされる、を含む。このようなＬＥＤランプにおいて、青色発光ダイオードチップは、約４５０ｎｍの波長を持つ放射を生成し、リン発光体は、その放射を受信したとき、約５５０ｎｍのピーク波長を持つ黄色の蛍光を生成する。たとえば、ある設計においては、白色発光ダイオードは、青色発光半導体発光ダイオードの外部表面上に、セラミックリン発光体層を形成することにより、製造される。発光ダイオードチップより出射される青色光の一部は、リン発光体を通過し、一方、該発光ダイオードチップより出射される青色光の一部は、リン発光体により吸収され、これは、励起され、黄色光を発する。発光ダイオードチップより出射され、リン発光体を通過した青色光の一部は、リン発光体により発射された黄色光と混合される。観察者は、青、および黄色の光の混合物を、白色光として感受する。 As noted above, “white LED light” (ie, light perceived as white or close to white) has been studied as a possible replacement for white incandescent bulbs. A typical example of a white LED lamp includes a blue light emitting diode chip package made from gallium nitride, which is coated with a phosphor phosphor such as YAG. In such an LED lamp, the blue light emitting diode chip produces radiation having a wavelength of about 450 nm, and the phosphor emitter produces yellow fluorescence having a peak wavelength of about 550 nm when receiving the radiation. For example, in one design, white light emitting diodes are manufactured by forming a ceramic phosphor phosphor layer on the outer surface of a blue light emitting semiconductor light emitting diode. Part of the blue light emitted from the light emitting diode chip passes through the phosphor light emitter, while part of the blue light emitted from the light emitting diode chip is absorbed by the phosphor light emitter, which is excited. Emits yellow light. Part of the blue light emitted from the light emitting diode chip and passed through the phosphor emitter is mixed with the yellow light emitted by the phosphor emitter. The observer perceives a mixture of blue and yellow light as white light.
また上記したように、もう１つのタイプのＬＥＤランプにおいては、紫外光を発射する発光ダイオードチップは、赤（Ｒ）、緑（Ｇ）、青（Ｂ）光光線を生成するリン発光体材料と結合される。このようなＬＥＤランプにおいては、発光ダイオードチップから放射された紫外線は、リン発光体を励起し、該リン発光体をして、赤、緑、青の光線を発射せしめ、これらは混合されて、人の目により白色光として感受される。その結果、白色光はまた、これらの光線の混合物としても、得られる。 As described above, in another type of LED lamp, the light emitting diode chip that emits ultraviolet light includes a phosphor phosphor material that generates red (R), green (G), and blue (B) light rays. Combined. In such LED lamps, the ultraviolet light emitted from the light emitting diode chip excites the phosphor emitter, causing the phosphor emitter to emit red, green and blue light, which are mixed together, Perceived as white light by human eyes. As a result, white light is also obtained as a mixture of these rays.
既存のＬＥＤ構成要素パッケージ、および他の電子回路が、１つの電気設備内にアセンブルされる設計が与えられてきた。このような設計において、パッケージ化されたＬＥＤは回路基板にマウントされ、該回路基板はヒートシンクにマウントされ、かつ、該ヒートシンクは、所望の駆動電子回路とともに、固定ハウジングにマウントされる。多くの場合において、追加的な光学部品（パッケージ部品に対して２次的な）が、また必要である。 Existing LED component packages and other electronic circuits have been given designs that are assembled into one electrical installation. In such a design, the packaged LED is mounted on a circuit board, the circuit board is mounted on a heat sink, and the heat sink is mounted on a fixed housing along with the desired drive electronics. In many cases, additional optical components (secondary to package components) are also required.
発光ダイオードを、他の光源、例えば、白熱電球、に置き換えて用いるにおいては、パッケージされたＬＥＤは、従来の電灯設備、たとえば、中空レンズ、および該レンズに取り付けられたベースプレートを含む、電灯設備とともに使用されてきており、該ベースプレートは、電気的に電源に結合された１つ、またはそれ以上のコンタクトを持つ従来のソケットハウジングを持っている。例えば、ＬＥＤ光バルブは、電気回路基板、該回路基板上にマウントされた複数のパッケージ化されたＬＥＤ、および、該回路基板に取り付けられ、かつ、電灯設備のソケットハウジングに接続されるよう適合された接続ポストよりなって、構成されており、これにより、該複数のＬＥＤは、電源により、照明されることができる。 In using light emitting diodes in place of other light sources, such as incandescent light bulbs, the packaged LED can be used with conventional lighting equipment, for example, lighting equipment, including a hollow lens and a base plate attached to the lens. In use, the base plate has a conventional socket housing with one or more contacts that are electrically coupled to a power source. For example, an LED light bulb is adapted to be connected to an electrical circuit board, a plurality of packaged LEDs mounted on the circuit board, and a socket housing of a light fixture attached to the circuit board. The plurality of LEDs can be illuminated by a power source.
固体発光素子、たとえば、発光ダイオードを、より広い多様性のある応用において、白色光を含む、すべての可能な光の色について、改善されたエネルギー効率をもって、改善されたＣＲＩを持って、改善された有効性（ｌｍ／Ｗ）を持って、および／または、より長いサービス期間をもって、与える方法についての、継続的な要求がある。 Solid state light emitting devices, such as light emitting diodes, are improved with improved CRI with improved energy efficiency for all possible light colors, including white light, in a wider variety of applications. There is an ongoing need for a method of providing with a high effectiveness (lm / W) and / or with a longer service period.
上記したように、ルミネッセント材料を用いる従来のＬＥＤパッケージにおいては、1つ、またはそれ以上の特定の色の色合いを持つ光を生成するために、ＬＥＤは、代表的にたとえば、キュアーされたポリマー樹脂のような、その中では、ルミネッセント材料、たとえば、リン発光体は、分散されている収容体によりカバーされている。 As noted above, in conventional LED packages that use luminescent materials, to produce light having one or more specific color shades, LEDs are typically, for example, cured polymer resins. In such a case, a luminescent material, such as a phosphor emitter, is covered by a dispersed receptacle.
さらに、２００５年１２月２１日に出願された、その全体が参照によりここに組み入れられる、名称、「照明装置」（発明者：ジェラルド・Ｈ・ネグレイ、アントニー・ポール フェン・ドゥ・フェン、およびニール・ハンター）の、米国特許出願第６０／７５２，７５３号において記述されているように、照明装置は、固体発光素子（例えば、発光ダイオードチップ）、およびルミネッセント材料を用いた、それにおいては、固体発光素子（例えば、チップ）がハウジング上にマウントされているものが、開発されてきた。 Furthermore, the name “lighting device”, filed on Dec. 21, 2005, which is incorporated herein by reference in its entirety (inventors: Gerald H. Negrey, Antony Paul Fen de Fen, and Neil) Hunter), as described in U.S. Patent Application No. 60 / 752,753, the lighting device uses a solid state light emitting device (e.g., a light emitting diode chip), and a luminescent material in which the solid state A light emitting device (for example, a chip) mounted on a housing has been developed.
本発明の一般的目的は、このようなデバイスにおける、固体発光素子（たとえば、発光ダイオードチップ）、または、パッケージ（たとえば、ＬＥＤパッケージ）からの光の抽出を、最大化することである。 The general objective of the present invention is to maximize the extraction of light from a solid state light emitting device (eg, a light emitting diode chip) or package (eg, an LED package) in such a device.
リン発光体を含む従来のＬＥＤパッケージの場合には、励起光（たとえば、ＬＥＤからの光）の重要な部分（たとえば、多くの場合において、最大２０から２５％程度）は、リン発光体から発光ダイオードチップ／パッケージ内へ、反射（後方散乱）される。発光ダイオードチップ自体内に後方散乱された後方散乱光は、チップの外へ出る大変低い確率を持ち、それゆえ、このような後方散乱は、エネルギーのシステムロスを生じる。 In the case of a conventional LED package that includes a phosphor emitter, a significant portion of the excitation light (eg, light from the LED) (eg, often up to about 20-25%) is emitted from the phosphor emitter. Reflected (backscattered) into the diode chip / package. Backscattered light that is backscattered within the light emitting diode chip itself has a very low probability of going out of the chip, and therefore such backscattering results in a system loss of energy.
さらに、リン発光体により変換された光は、全方位的であり、したがって、一般に、該光の５０％は、直接、ＬＥＤ源に戻るように向かう。
さらに、もしルミネッセント要素があまりにも厚く、かつ／または、ルミネッセント要素におけるルミネッセント材料（例えば、リン発光体）含有量が、あまりにも大きければ、“自己吸収”が起こることとなる。自己吸収は、パッケージ層内の発光が、パッケージ層内に留まって他のリン発光体粒子を励起し、かつ、実際には吸収され、あるいは、そうでなければ、デバイスを励起することを妨げられるときに起こり、これにより、性能（強度）、および効率を、低減させる。さらに、もしルミネッセント材料（例えば、リン発光体）の粒子サイズがあまりに大きければ、ルミネッセント材料の粒子は、励起源（ＬＥＤチップ）の光、およびリン発光体により生成される光の、両方の望ましくない散乱を生じ得る原因となる。
Furthermore, the light converted by the phosphor emitter is omnidirectional, so in general 50% of the light is directed directly back to the LED source.
Furthermore, if the luminescent element is too thick and / or the content of the luminescent material (eg, phosphor emitter) in the luminescent element is too high, “self-absorption” will occur. Self-absorption prevents light emission in the package layer from remaining in the package layer to excite other phosphor phosphor particles and is actually absorbed or otherwise prevented from exciting the device. Occasionally, this reduces performance (strength) and efficiency. Furthermore, if the particle size of the luminescent material (eg, phosphor emitter) is too large, the particles of the luminescent material are undesirable for both the light of the excitation source (LED chip) and the light generated by the phosphor emitter. This can cause scattering.
本発明の１つの側面によれば、固体発光素子を、ルミネッセント素子から空間的に分離することにより、この抽出効率は、改善することができる。さらに、ルミネッセント要素に直面する固体発光素子の照明面積の表面領域を、固体発光素子に直面するルミネッセント要素の表面領域より、より小さくすることで、任意の励起源からの後方散乱光、あるいは、任意のルミネッセント要素からの出射光は、該固体発光素子における再吸収の、より低い確率を持つ。 According to one aspect of the present invention, this extraction efficiency can be improved by spatially separating the solid state light emitting device from the luminescent device. Furthermore, by making the surface area of the illumination area of the solid state light emitting element facing the luminescent element smaller than the surface area of the luminescent element facing the solid state light emitting element, backscattered light from any excitation source or any The emitted light from the luminescent elements has a lower probability of reabsorption in the solid state light emitting device.
本発明の第１の側面によれば、少なくとも１つの固体発光素子、および、少なくとも１つのルミネッセント要素よりなり、前記ルミネッセント要素は、少なくとも１つのルミネッセント材料よりなり、かつ前記固体発光素子より間隔をあけて設けられている、照明装置が、与えられる。本発明のこの側面において、前記ルミネッセント要素のルミネッセント要素表面は、前記固体発光素子の照明表面の少なくとも２倍の（いくつかの実施形態においては、少なくとも５倍の、かつ、いくつかの実施形態においては、少なくとも１０倍の）表面領域を持つ。 According to a first aspect of the present invention, it comprises at least one solid state light emitting element and at least one luminescent element, the luminescent element comprising at least one luminescent material and spaced from the solid state light emitting element. A lighting device is provided. In this aspect of the invention, the luminescent element surface of the luminescent element is at least twice the illumination surface of the solid state light emitter (in some embodiments at least 5 times and in some embodiments). Have at least 10 times the surface area.
この側面による特定の実施形態においては、ルミネッセント要素は、固体発光素子から、前記照明表面の最大である寸法に少なくとも等しい距離だけ、間隔を置いて配置されている。
この側面による特定の特徴においては、ルミネッセント要素は、固体発光素子から、約１００μｍから約７５０μｍの範囲（たとえば、約５００μｍから約７５０μｍの範囲、たとえば、約７５０μｍ）内の距離だけ、間隔を置いて配置されている。
In a particular embodiment according to this aspect, the luminescent elements are spaced from the solid state light emitter by a distance that is at least equal to the largest dimension of the illumination surface.
In particular features according to this aspect, the luminescent element is spaced from the solid state light emitter by a distance in the range of about 100 μm to about 750 μm (eg, in the range of about 500 μm to about 750 μm, eg, about 750 μm). Has been placed.
本発明の第２の側面によれば、少なくとも１つの固体発光素子、および、少なくとも１つのルミネッセント要素よりなり、前記ルミネッセント要素は、少なくとも１つのルミネッセント材料よりなり、固体発光素子より間隔をあけて設けられている照明装置が、与えられる。本発明のこの側面においては、該固体発光素子は、前記ルミネッセント材料と直面する照明表面を有し、前記ルミネッセント要素は、前記固体発光素子と直面するルミネッセント要素表面を持つ。さらに、本発明のこの側面において、該ルミネッセント要素表面は、実質的に前記照明表面に平行であり、かつ前記ルミネッセント要素表面は、前記照明表面の表面領域の少なくとも２倍の（いくつかの実施形態においては、少なくとも５倍の、かつ、いくつかの実施形態においては、少なくとも１０倍の）表面領域を持つ。 According to a second aspect of the present invention, it comprises at least one solid state light emitting element and at least one luminescent element, wherein the luminescent element is composed of at least one luminescent material and is spaced from the solid state light emitting element. A lighting device is provided. In this aspect of the invention, the solid state light emitting device has an illumination surface that faces the luminescent material, and the luminescent element has a surface of the luminescent element that faces the solid state light emitting device. Furthermore, in this aspect of the invention, the luminescent element surface is substantially parallel to the illumination surface, and the luminescent element surface is at least twice the surface area of the illumination surface (some embodiments). The surface area at least 5 times and in some embodiments at least 10 times).
この側面による特定の特徴においては、ルミネッセント要素は、固体発光素子から、前記照明表面の最大である寸法に少なくとも等しい距離だけ、間隔を置いて配置されている。 In a particular feature according to this aspect, the luminescent elements are spaced from the solid state light emitting element by a distance that is at least equal to the largest dimension of the illumination surface.
本発明の第３の側面によれば、少なくとも１つの固体発光素子、および少なくとも１つのルミネッセント要素よりなり、前記ルミネッセント要素は、少なくとも１つのルミネッセント材料よりなり、前記ルミネッセント要素は、前記固体発光素子より間隔をあけて設けられている、照明装置が、与えられる。 According to a third aspect of the present invention, the luminescent element comprises at least one solid state light emitting element and at least one luminescent element, the luminescent element comprises at least one luminescent material, and the luminescent element comprises: A lighting device is provided, which is provided at intervals.
この側面において、想像上の第１の平坦形状は、１組のルミネッセント要素点により定義され、該ルミネッセント要素点のおのおのは、固体発光素子の中心、および、ルミネッセント要素の中心を通るｚ軸に対して方位付けられたx−y面内に位置しており、かつ、ｚ軸に対する各半径方向位置に関して、このような半径方向位置にてｚ軸から最も離れたルミネッセント要素上の点のx−y座標に対応するx−y座標をもつものであり、すなわち、該第１の平坦形状は、前記ルミネッセント要素の、前記ルミネッセント要素および固体発光素子の各中心を接続するｚ軸に垂直な平面上への射影である。想像上の第２の平坦形状は、１組の発光素子点により定義され、該発光素子点のおのおのは、ｚ軸に対して方位付けられたx−y平面内に位置しており、かつ、ｚ軸に対する各半径方向位置について、このような半径方向位置にてｚ軸からもっとも離れた固体発光素子上の点のx−y座標に対応するx−y座標をもつものであり、すなわち、該第２の平坦形状は、前記固体発光素子の、前記ｚ軸に垂直な平面上への射影である。この側面において、前記第１の平坦形状の領域は、前記第２の平坦形状の領域の少なくとも２倍の大きさ（いくつかの実施形態においては、少なくとも５倍の大きさ、かつ、いくつかの実施形態においては、少なくとも１０倍の大きさ）である（ここで、１以上の固体発光素子が、照明装置内に存在しており、上記比較における固体発光素子は、前記照明装置における任意の固体発光素子の最大の第２の平坦形状を持つもの、となっている）。
この側面による特定の特徴においては、前記ルミネッセント要素は、前記固体発光素子から、前記第２の平坦形状の最大の寸法に少なくとも等しい距離だけ、間隔を置いて配置されている。
In this aspect, the imaginary first flat shape is defined by a set of luminescent element points, each of the luminescent element points relative to the center of the solid state light emitter and the z-axis passing through the center of the luminescent element. For each radial position relative to the z-axis, and the x-y of the point on the luminescent element furthest away from the z-axis at such radial position The first flat shape of the luminescent element is on a plane perpendicular to the z-axis connecting the centers of the luminescent element and the solid state light emitting device. Is a projection of The imaginary second flat shape is defined by a set of light emitting element points, each of the light emitting element points being located in an xy plane oriented with respect to the z axis, and For each radial position relative to the z-axis, it has an x-y coordinate corresponding to the x-y coordinate of the point on the solid state light emitting element furthest away from the z-axis at such radial position, The second flat shape is a projection of the solid state light emitting device onto a plane perpendicular to the z axis. In this aspect, the first flat-shaped region is at least twice as large as the second flat-shaped region (in some embodiments, at least five times larger, and several In the embodiment, at least 10 times the size) (here, one or more solid state light emitting elements are present in the lighting device, and the solid state light emitting element in the comparison is an arbitrary solid state in the lighting device). The light emitting element has the largest second flat shape).
In a particular feature according to this aspect, the luminescent element is spaced from the solid state light emitting element by a distance that is at least equal to a maximum dimension of the second flat shape.
本発明によるさらなる特定の特徴においては、前記固体発光素子は、発光ダイオードチップである。
本発明によるさらなる特定の特徴においては、前記固体発光素子は、実質的にプレーナーである照明表面を持つ。
In a further particular feature according to the present invention, the solid state light emitting device is a light emitting diode chip.
In a further particular feature according to the invention, the solid state light emitting device has an illumination surface that is substantially planar.
本発明によるさらなる特定の特徴においては、前記ルミネッセント要素は、実質的にプレーナーであるルミネッセント表面を持つ。
本発明によるさらなる特定の特徴においては、前記ルミネッセント要素は、その中に、ルミネッセント材料が含まれているマトリックス（たとえば、それは、ポリマー材料であってもよく、それは、キュアーされていてもよい）であってよい。
In a further particular feature according to the invention, said luminescent element has a luminescent surface which is substantially planar.
In a further particular feature according to the invention, said luminescent element is in a matrix (for example it may be a polymer material, which may be cured) in which a luminescent material is contained. It may be.
本発明によるさらなる特定の特徴においては、ルミネッセント材料が、体積で約１５％より大きくない量分だけ、前記ルミネッセント要素内に含まれている。 In a further particular feature according to the invention, the luminescent material is contained in said luminescent element in an amount not greater than about 15% by volume.
本発明によるさらなる特定の特徴においては、前記ルミネッセント要素は、少なくとも１つのリン発光体よりなる。
本発明によるさらなる特定の特徴においては、前記ルミネッセント要素は、５０μｍより大きくない平均粒子サイズを持つルミネッセント材料の粒子よりなる。
In a further particular feature according to the present invention, said luminescent element consists of at least one phosphor emitter.
In a further particular feature according to the present invention, said luminescent element consists of particles of luminescent material having an average particle size not greater than 50 μm.
本発明によるさらなる特定の特徴においては、前記ルミネッセント要素の厚さは、１ｃｍより大きくない。
特定の側面において、前記照明装置は、“白”と感受される光を、生成することができる。
本発明は、添付図面、および以下の発明の詳細な記述を参照して、より十分に理解されるであろう。
In a further particular feature according to the invention, the thickness of said luminescent element is not greater than 1 cm.
In certain aspects, the lighting device can generate light that is perceived as “white”.
The invention will be more fully understood with reference to the accompanying drawings and the following detailed description of the invention.
上記したように、本発明の種々の側面によれば、少なくとも１つの固体発光素子、および、少なくとも１つのルミネッセント要素よりなり、前記ルミネッセント要素は、少なくとも１つのルミネッセント材料よりなる、照明装置が、与えられる。 As described above, according to various aspects of the present invention, there is provided a lighting device comprising: at least one solid state light emitting device and at least one luminescent element, wherein the luminescent element comprises at least one luminescent material. It is done.
任意の所望の固体撮像素子が、本発明に従って使用することができる。当業者は、広い範囲のこのような発光素子を知っており、容易に、アクセスすることができる。このような発光素子は、無機、および有機の発光素子を含む。このような発光素子のタイプの例は、発光ダイオード（無機、または有機）、レーザダイオードおよび薄膜ルミネッセント装置を含み、そのおのおのの種々のものは、技術において知られている。上記したように、広い範囲のルミネッセント材料（たとえば、その全体が参照によりここに組み入れられる、米国特許第６，６００，１７５号明細書に開示されているように、ルミファー、あるいはルミノフォリック材料としても知られている）は、公知であり、当業者にとって入手可能であり、任意のこのような材料は、本発明にしたがって使用されることができる。 Any desired solid state imaging device can be used in accordance with the present invention. A person skilled in the art knows a wide range of such light emitting elements and is easily accessible. Such light emitting elements include inorganic and organic light emitting elements. Examples of such types of light emitting elements include light emitting diodes (inorganic or organic), laser diodes and thin film luminescent devices, each of which is known in the art. As noted above, a wide range of luminescent materials (eg, as Lumiphor or luminophoric materials as disclosed in US Pat. No. 6,600,175, which is hereby incorporated by reference in its entirety). Are also known and available to those skilled in the art, and any such material can be used in accordance with the present invention.
本発明の１つの側面において、少なくとも第１、および、第２の固体発光素子よりなる装置が与えられ、前記第１の固体発光素子は、第１の波長の光を発し、前記第２の固体発光素子は、第２の波長の光を発するものであり、前記第２の波長は、前記第１の波長と異なる。このようなデバイスにおいて、固体発光素子は、たとえば、(1) 可視スペクトラム内の異なる波長範囲内の光を発する２つ、またはそれ以上の発光ダイオード、(2) 赤外スペクトラム内の異なる波長範囲内の光を発する２つ、またはそれ以上の発光ダイオード、(3) 紫外スペクトラム内の異なる波長範囲内の光を発する２つ、またはそれ以上の発光ダイオード、(4) 可視スペクトラム内の光を発する１つ、またはそれ以上の発光ダイオード、および、赤外スペクトラム内の光を発する１つ、またはそれ以上の発光ダイオード、(5) 可視スペクトラム内の光を発する１つ、またはそれ以上の発光ダイオード、および、紫外スペクトラム内の光を発する１つ、またはそれ以上の発光ダイオード、等を含む、赤外線、可視光、および紫外線の範囲内の、任意の所望の波長（または波長範囲）の光を発することができる。 In one aspect of the present invention, an apparatus comprising at least first and second solid state light emitting elements is provided, wherein the first solid state light emitting element emits light of a first wavelength, and the second solid state element is provided. The light emitting element emits light having a second wavelength, and the second wavelength is different from the first wavelength. In such a device, the solid state light emitting device can, for example, (1) two or more light emitting diodes that emit light in different wavelength ranges in the visible spectrum, and (2) in different wavelength ranges in the infrared spectrum. Two or more light-emitting diodes that emit light of (3) two or more light-emitting diodes that emit light in different wavelength ranges in the ultraviolet spectrum, (4) light that emits light in the visible spectrum 1 One or more light emitting diodes and one or more light emitting diodes emitting light in the infrared spectrum; (5) one or more light emitting diodes emitting light in the visible spectrum; and In the infrared, visible, and ultraviolet ranges, including one or more light emitting diodes that emit light in the ultraviolet spectrum, etc. Capable of emitting light of desired wavelengths (or wavelength ranges).
上記したように、当業者は、広い範囲の発光ダイオード、広い範囲のレーザダイオード、および、広い範囲の薄膜エレクトロルミネッセントデバイスを含む、広い範囲の発光素子をよく知っており、それゆえ、このようなデバイスを、および／または、それからこのようなデバイスが作られる材料を、詳細に記述する必要はない。 As noted above, those skilled in the art are familiar with a wide range of light-emitting elements, including a wide range of light-emitting diodes, a wide range of laser diodes, and a wide range of thin-film electroluminescent devices. Such devices and / or the materials from which such devices are made need not be described in detail.
上記したように、本発明による発光装置は、任意の所望の個数の発光素子よりなることができる。たとえば、本発明による照明装置は、５０またはそれ以上の発光ダイオードを含むことができ、または、１００またはそれ以上の発光ダイオード、等を含むことができる。一般に、現在の発光ダイオードにより、より大きい効率を、より大きい数の、より小さい発光ダイオード（たとえば、おのおのが０．１ｍｍ2 の表面領域を持つ、１００個の発光ダイオード、対、おのおのが０．４ｍｍ2 の表面領域を持つ、２５個の発光ダイオード、しかし、その他は同一である）を用いて、達成することができる。 As described above, the light emitting device according to the present invention can be composed of any desired number of light emitting elements. For example, a lighting device according to the present invention may include 50 or more light emitting diodes, or may include 100 or more light emitting diodes, and the like. In general, with current light emitting diodes, greater efficiency is achieved with a larger number of smaller light emitting diodes (eg, 100 light emitting diodes, each having a surface area of 0.1 mm 2 ), each 0.4 mm. Can be achieved using 25 light emitting diodes with 2 surface areas, but the others are identical).
同様に、より低い電流密度で動作する発光ダイオードは、一般に、より効率が高い。任意の特定の電流を引き出す発光ダイオードは、本発明にしたがって使用することができる。本発明の１つの側面においては、おのおの５０ミリアンペアより多くない電流を引きだす発光ダイオードが、使用される。 Similarly, light emitting diodes operating at lower current densities are generally more efficient. Light emitting diodes that draw any specific current can be used in accordance with the present invention. In one aspect of the invention, light emitting diodes that draw no more than 50 milliamperes each are used.
本発明の照明装置における固体発光素子、およびルミネッセント要素は、任意の望ましい態様で、配列され、マウントされ、かつ、電気を供給され、かつ、任意の所望のハウジング、または電気設備に、マウントされることができ、かつ、該固体発光素子は、任意の所望の態様で、電気を供給されることができる。当業者は、広い範囲の配列、マウントするスキーム、電源供給装置、ハウジングおよび電気設備をよく知っており、任意のこのような配列、スキーム、装置、ハウジングおよび電気設備は、本発明と関連して使用することができる。本発明の照明装置は、任意の所望の電源に、電気的に接続される（あるいは、選択的に電気的に接続される）ことができ、当業者は、広い範囲のこのような電源をよく知っている。 The solid state light emitting elements and the luminescent elements in the lighting device of the present invention are arranged, mounted, and supplied with electricity in any desired manner, and mounted in any desired housing or electrical installation. The solid state light emitting device can be supplied with electricity in any desired manner. Those skilled in the art are familiar with a wide range of arrangements, mounting schemes, power supplies, housings and electrical installations, and any such arrangements, schemes, apparatus, housings and electrical installations are relevant to the present invention. Can be used. The lighting device of the present invention can be electrically connected (or selectively electrically connected) to any desired power source, and those skilled in the art often use a wide range of such power sources. know.
固体発光素子およびルミネッセント要素の配列、固体発光素子およびルミネッセント要素をマウントするためのスキーム、固体発光素子に電源を供給するための装置、固体発光素子およびルミネッセント要素のためのハウジング、固体発光素子およびルミネッセント要素のための取り付け体、および固体発光素子のための電源、の代表的な例であって、それらのすべてが、本発明の照明装置に適したものは、本出願と同時に提出された、その全体が参照によってここに組み入れられる、名称が、「照明装置」（発明者：ジェラルド・Ｈ・ネグレイ、アントニー・ポールフェン・ドゥ・フェン、およびニール・ハンター）である、米国特許出願第６０／７５２，７５３号に記述されている。このような取り付け体はまた、優れた熱放散を、光取り付け体自身と統合することを可能にする。 Arrangement of solid state light emitting elements and luminescent elements, scheme for mounting solid state light emitting elements and luminescent elements, apparatus for supplying power to solid state light emitting elements, housing for solid state light emitting elements and luminescent elements, solid state light emitting elements and luminescent elements Representative examples of attachments for elements and power supplies for solid state light emitters, all of which are suitable for the lighting device of the present invention, were filed at the same time as this application, US patent application Ser. No. 60/752, whose name is “lighting device” (inventors: Gerald H. Negrey, Antony Paul Fen Du Fen, and Neil Hunter), incorporated herein by reference in its entirety. 753. Such a mounting also makes it possible to integrate excellent heat dissipation with the light mounting itself.
本発明による照明装置のいくつかの実施形態においては、照明装置は、テーパー壁を有する、高反射要素を持つハウジングよりなる、たとえば、該デバイスは、先端を切り取った円錐形状（フラストコニカル形状）を定義する反射性の壁よりなる。本発明によれば、全体の抽出効率（光学を通しての）は、テーパー壁を有するこのような反射性要素を含むことにより、改善することができる。 In some embodiments of a lighting device according to the present invention, the lighting device comprises a housing with a tapered wall and a highly reflective element, for example, the device has a truncated conical shape (a frustoconical shape). It consists of a reflective wall to define. According to the present invention, the overall extraction efficiency (through optics) can be improved by including such reflective elements with tapered walls.
本発明による照明装置のいくつかの実施形態においては、照明装置は、実質的に直線の壁を持つ高反射性要素を持つハウジングよりなる、たとえば、該デバイスは、シリンダーを定義する反射性の壁よりなる。 In some embodiments of a lighting device according to the present invention, the lighting device comprises a housing with a highly reflective element having a substantially straight wall, for example, the device is a reflective wall defining a cylinder. It becomes more.
たとえば、表現“mounted on”において上記で使われているように、表現“on ”は、第２の構造“上”にある第１の構造が、第２の構造と接触することができる、あるいは、第２の構造から、１つ、またはそれ以上の中間構造により分離されることができることを、意味する。 For example, as used above in the expression “mounted on”, the expression “on” allows the first structure on the second structure “on” to contact the second structure, or , Means that it can be separated from the second structure by one or more intermediate structures.
項目が“電気的に接続されている”、というここでの文章は、該項目間には、電気的には、構成要素がないことを意味し、それの挿入は、実質的に、該デバイスによって与えられる機能に、影響を与える。たとえば、２つの項目は、たとえ、それらが、それらの間に、該デバイスにより与えられる機能に実質的に影響を与えることのない、小さい抵抗をもつ（実際、２つの項目を接続するワイヤは、小さい抵抗と考えることができる。）としても、電気的に接続されている、と言うことができる；同様に、２つの項目は、たとえ、それらが、それらの間に、該デバイスをして、付加的な機能を遂行することを許すが、該付加的な項目を含まないことを除いて、同一であるデバイスにより与えられる機能に実質的に影響を及ぼさない、付加的な電気的な項目を、それらの間に持っていたとしても、電気的に接続されている、と言うことができる；同様に、相互に直接接続されている、あるいは、回路基板、または他の媒体上のワイヤまたはトレースの両端に直接接続されている、２つの項目は、電気的に接続されている。 The sentence herein that an item is “electrically connected” means that there is no electrical component between the items, the insertion of which is substantially the device Affects the functionality given by For example, two items have a small resistance, even if they do not substantially affect the function provided by the device between them (in fact, the wire connecting the two items is Can be thought of as a small resistance.) Can also be said to be electrically connected; similarly, the two items can be said to be the device between them, Additional electrical items that allow additional functions to be performed but do not substantially affect the functions provided by the same device, except that the additional items are not included. Can be said to be electrically connected, even if between them; likewise, connected directly to each other, or wires or traces on a circuit board or other medium Is directly connected to both ends, the two items are electrically connected.
上記１つ、またはそれ以上のルミネッセント材料は、任意の所望のルミネッセント材料であることができる。上記したように、当業者は、広い多様性のルミネッセント材料を、よく知っており、容易にアクセスすることができる。上記１つ、またはそれ以上のルミネッセント材料は、ダウンコンバートするもの、あるいは、アップコンバートするものでよく、あるいは、両タイプの結合を含むことができる。 The one or more luminescent materials can be any desired luminescent material. As noted above, those skilled in the art are familiar with a wide variety of luminescent materials and are readily accessible. The one or more luminescent materials may be downconverting, upconverting, or may include both types of bonds.
たとえば、上記１つ、またはそれ以上のルミネッセント材料は、リン発光体、シンチレーター、昼日グローテープ、インクであって、紫外線等を照射されたとき、可視スペクトルにおいて輝くもの、の中から選択することができる。 For example, the one or more luminescent materials are selected from phosphors, scintillators, daylight glow tapes, inks that shine in the visible spectrum when irradiated with ultraviolet light, etc. Can do.
上記１つ、またはそれ以上のルミネッセント材料は、含まれるときは、任意の所望の形態において、与えられることができる。たとえば、１つの側面において、本発明による照明装置は、少なくとも１つのルミネッセント要素よりなり、これは、第１のルミネッセント材料よりなり、該ルミネッセント要素は、ハウジングに取り付けられており、該ルミネッセント要素、およびハウジングは、内部空間を定義し、前記固体発光素子のうちの少なくとも１つは、前記内部空間内に位置している、ものとすることができる。 The one or more luminescent materials, when included, can be provided in any desired form. For example, in one aspect, a lighting device according to the invention consists of at least one luminescent element, which consists of a first luminescent material, the luminescent element being attached to a housing, the luminescent element, and The housing may define an internal space, and at least one of the solid state light emitting devices may be located in the internal space.
前記ルミネッセント要素は、もし望まれれば、前記第１のルミネッセント材料が埋め込まれている材料とすることができる。たとえば、当業者は、ルミネッセント材料、たとえば、シリコーン材料、または、エポキシ樹脂等の、樹脂内に埋め込まれたリン発光体（すなわち、ポリマーマトリックス）、よりなるルミネッセント要素を大変よく知っている。 The luminescent element can be a material in which the first luminescent material is embedded, if desired. For example, those skilled in the art are very familiar with luminescent elements consisting of a luminescent material, eg, a silicone material, or a phosphor emitter (ie, a polymer matrix) embedded in a resin, such as an epoxy resin.
本発明の好ましい側面において、照明装置は、少なくとも第１のルミネッセント要素領域、および第２のルミネッセント要素領域よりなる、少なくとも１つのルミネッセント要素よりなり、該第１のルミネッセント要素領域は、第１のルミネッセント材料よりなり、該第２のルミネッセント要素領域は、第２のルミネッセント材料よりなり、前記第１のルミネッセント材料は、励起されたとき、第１の波長（または波長範囲）の光を発するものであり、該第２のルミネッセント材料は、励起されたとき、第２の波長（または波長範囲）の光を発するものであり、前記第２の波長（または波長範囲）は、前記第１の波長（または波長範囲）と異なるものである。 In a preferred aspect of the invention, the lighting device comprises at least one luminescent element comprising at least a first luminescent element region and a second luminescent element region, wherein the first luminescent element region comprises the first luminescent element region. The second luminescent element region is made of a second luminescent material, and the first luminescent material emits light of a first wavelength (or wavelength range) when excited. The second luminescent material emits light of a second wavelength (or wavelength range) when excited, and the second wavelength (or wavelength range) is the first wavelength (or wavelength range). Wavelength range).
本発明のもう１つの好ましい側面によれば、照明装置は、複数のルミネッセント要素よりなることができ、各ルミネッセント要素は、少なくとも１つのルミネッセント材料よりなり、各ルミネッセント要素は、内部空間を形成するようハウジングに取り付けられており、少なくとも１つの固体発光素子は、各内部空間内に位置している。 According to another preferred aspect of the invention, the lighting device can consist of a plurality of luminescent elements, each luminescent element consisting of at least one luminescent material, each luminescent element forming an interior space. The at least one solid state light emitting device attached to the housing is located in each internal space.
複数の固体発光素子が、ハウジング上にマウントされている本発明の実施形態においては、前記固体発光素子により生成された熱負荷は、該ハウジングの表面上に分布される。固体発光素子が、ハウジングの表面領域上により均一に分布されればされるほど、熱負荷は、より均一に分布される。結果として、ハウジングは、より有効な熱放散を、与えることができ、ハウジングが、もし望まれれば、そうでない場合にとるであろうより、より小さくされることができる。 In an embodiment of the present invention in which a plurality of solid state light emitting devices are mounted on a housing, the thermal load generated by the solid state light emitting device is distributed on the surface of the housing. The more uniformly the solid light emitting elements are distributed over the surface area of the housing, the more uniformly the heat load is distributed. As a result, the housing can provide more effective heat dissipation, and the housing can be made smaller than would otherwise be taken.
さらに、（単一点光源の場合に比べて）多数の固体発光素子を持つことにより、該光源は、陰に入ることがあってもその影響は少ない、− すなわち、もし発光領域より小さい対象物が発光領域の前に置かれれば、光線の一部のみがブロックされるであろう。光源は、ホイヘンスの原理に従う（各ソースが球面波フロントとして作用する）ので、陰の観察は見られず、かつ、照明されたソースのわずかな調光が、見られる（単一のフィラメントが使用される場合であって、そこでは光が実質的に調光され、陰が観察されるであろう場合、に比較して）。 In addition, by having a large number of solid state light emitting elements (compared to the case of a single point light source), the light source is less affected even if it enters the shadows--that is, if an object smaller than the light emitting area If placed in front of the light emitting area, only a part of the light beam will be blocked. The light source follows Huygens principle (each source acts as a spherical wave front), so no shadowing is seen and a slight dimming of the illuminated source is seen (using a single filament) Where the light is substantially dimmed and shadows will be observed).
本発明によるデバイスは、さらに、１つ、またはそれ以上の長寿命冷却装置（たとえば、極端に高い寿命を持つファン）を、備えることができる。このような長寿命冷却装置は、“中国ファン”として空気を移動させる、ピエゾ電気、または磁気抵抗材料（たとえば、ＭＲ，ＧＭＲ，及び／またはＨＭＲ材料）よりなることができる。本発明による装置を冷却するにおいて、代表的に、境界層を破壊するに十分な空気のみが、１０から１５℃の温度低下を引き起こすのに必要とされる。ここで、このような場合において、強い“そよ風”または、大きな流体フローレート（大きいＣＦＭ）は、代表的に、必要ではない（これにより、従来のファンの必要を避ける）。 The device according to the invention can further comprise one or more long-life coolers (eg fans with extremely high lifetimes). Such a long-life cooling device can be made of a piezoelectric or magnetoresistive material (eg, MR, GMR, and / or HMR material) that moves air as a “Chinese fan”. In cooling an apparatus according to the present invention, typically only enough air to break the boundary layer is required to cause a temperature drop of 10 to 15 ° C. Here, in such cases, a strong “breeze” or large fluid flow rate (large CFM) is typically not needed (thus avoiding the need for conventional fans).
本発明によるデバイスは、さらに、出射された光の投射された性質をさらに変えるよう、２次的な光学素子よりなる。このような２次的な光学素子は、当業者によく知られており、そのため、ここで詳細に述べられる必要はなく、− 任意のこのような２次的な光学素子は、もし望まれれば、使用することができる。 The device according to the invention further comprises secondary optical elements so as to further change the projected nature of the emitted light. Such secondary optical elements are well known to those skilled in the art, and therefore need not be described in detail here-any such secondary optical elements are desired if desired Can be used.
本発明による装置はさらに、センサー、または充電デバイス、またはカメラ、等よりなる。たとえば、当業者は、１つ、またはそれ以上の生起を検出する装置（たとえば、対象物、または人の動きを検出する動き検出器）であって、かつ、このような検出に応答して、光の照射、および安全カメラの活性化を起こすもの、等、をよく知っており、これにアクセスすることができる。代表的な例として、本発明によるデバイスは、本発明による照明装置および動きセンサーを含むことができ、かつ、(1) 光が照射される間、もし動きセンサーが動きを検出すれば、安全カメラが活性化されて、ビジュアルデータを、検出された動きの位置に、あるいはその周りに記録する、あるいは、(2) もし、動きセンサーが動きを検出すれば、光が、該検出された動きの位置の近くの領域を照射するよう照射され、安全カメラが活性化されて、ビジュアルデータを、検出された動きの位置に、あるいはその周りに記録する、等のように、構成されることができる。 The apparatus according to the present invention further comprises a sensor, a charging device, a camera, or the like. For example, those skilled in the art are devices that detect one or more occurrences (eg, motion detectors that detect movement of an object or a person) and are responsive to such detection, You know and have access to things like light irradiance and safety camera activation. As a representative example, a device according to the present invention can include a lighting device and a motion sensor according to the present invention, and (1) a safety camera if the motion sensor detects motion while being illuminated. Is activated to record visual data at or around the position of the detected motion, or (2) if the motion sensor detects motion, the light will be recorded in the detected motion. Illuminated to illuminate an area near the location, the safety camera is activated, and visual data can be configured to record at or around the position of the detected motion, etc. .
図１は、本発明による照明装置１０の一実施形態を描く摸式図である。
図１に描かれる照明装置は、青い光源（１つ、またはそれ以上の発光ダイオード）および高度に反射性の表面を基礎とした取り付け体１１（模式的に示される）、発光ダイオードより大きい表面領域を持つリン発光体および散乱層１２（該リン発光体は、発光ダイオードよりの光により励起されたとき、黄色光を生成する）、および一対の輝度向上膜１３および１４を持ち、均一の白色光１５が、照明装置１０から出射するものである。
FIG. 1 is a schematic diagram depicting one embodiment of a
The lighting device depicted in FIG. 1 comprises a blue light source (one or more light-emitting diodes) and a highly reflective surface-based mounting body 11 (shown schematically), a surface area larger than the light-emitting diodes. And a phosphor layer and a scattering layer 12 (which emits yellow light when excited by light from a light emitting diode), and a pair of
輝度向上膜は、技術においてよく知られており、かつ、容易に入手可能である。輝度向上膜（たとえば、３Ｍから商業的に入手可能なＢＥＦ膜）は、任意である − 用いられるとき、それらは、受け入れ角を制限することにより、より指向性の高い光源を、与える。“受け入れ”られない光は、反射性の高い光源容器により、リサイクルされる。 Brightness enhancement films are well known in the art and are readily available. Brightness enhancement films (eg, BEF films commercially available from 3M) are optional—when used, they provide a more directional light source by limiting the acceptance angle. Light that is not “accepted” is recycled by a highly reflective light source container.
散乱層は、また、任意である。該散乱層は、リン発光体層内に設けられることができ、および／または、分離した散乱層が、設けられることができる。広い多様性の分離した散乱層、および、結合したルミネッセント層および散乱層は、当業者によく知られており、かつ、任意のこのような層は、本発明の照明装置において、用いることができる。 The scattering layer is also optional. The scattering layer can be provided in the phosphor layer and / or a separate scattering layer can be provided. A wide variety of separate scattering layers and combined luminescent and scattering layers are well known to those skilled in the art, and any such layers can be used in the lighting device of the present invention. .
輝度向上膜（ＷＦＴ等、１つ、またはそれ以上の抽出膜により、任意に置き換えることのできる）が含まれているいくつかの実施形態において、該輝度向上膜は、出射された源の観察角を制限するよう、かつ、該第１の（または、もっとも早い可能な）パス上に光を抽出する可能性を増大させるよう、最適化される。 In some embodiments that include a brightness enhancement film (such as WFT, which can optionally be replaced by one or more extraction films), the brightness enhancement film is the viewing angle of the emitted source. And to increase the likelihood of extracting light on the first (or earliest possible) path.
本発明による照明装置のいくつかの実施形態において、該照明装置は、特定の抽出角度内での光のリサイクリングを与える拡散器を、ＢＥＦ膜に代表的に関連するものより小さい損失をもって、備える。いくらかのこのような拡散器は、光を拡散し、散乱する。このような光リサイクル拡散器の例は、ＲＰＣフォトニクスより入手可能な“エンジニアード拡散器”（商標）である。
好ましくは、該取り付け体（たとえば、ハウジング）の１つ、またはそれ以上の表面は、反射性であり、固体発光素子、たとえば、発光ダイオード、のいくつか、またはすべてよりの光は、このような反射性表面により反射される。
In some embodiments of an illuminating device according to the present invention, the illuminating device comprises a diffuser that provides light recycling within a particular extraction angle, with less loss than typically associated with BEF membranes. . Some such diffusers diffuse and scatter light. An example of such a light recycling diffuser is the “Engineered Diffuser” ™ available from RPC Photonics.
Preferably, one or more surfaces of the attachment (eg, housing) are reflective, and light from some or all of the solid state light emitting devices, eg, light emitting diodes, is Reflected by a reflective surface.
図２は、本発明の第３の側面に関して上記で述べられた用語をさらに説明するために、それぞれが、相互に対して対面する各面を持たないように、互いに対して、方位付けられた、発光ダイオード２０、およびルミエッセント要素２１を、描く。
FIG. 2 is oriented relative to each other such that each does not have faces facing each other to further illustrate the terminology described above with respect to the third aspect of the present invention. , The
上記たように、本発明の第３の側面においては、第１の（想像上の）平坦形状２２は、１組のルミネッセント要素点により定義され、該ルミネッセント要素点のおのおのは、発光ダイオードの中心２５およびルミネッセント要素の中心２６を通るｚ軸２４に対して方位付けられたx-y 平面２３内に位置しており、かつ、ｚ軸に対する各半径方向位置について、このような半径方向位置にてｚ軸から最も遠い前記ルミネッセント要素上の点のｘ,ｙ座標に対応するｘ,ｙ座標を有するものであり、すなわち、前記第１の平坦形状は、前記ルミネッセント要素の、前記ルミネッセント要素と前記固体発光素子の各中心を接続する、前記ｚ軸に垂直な平面上への射影である。第２の（想像上の）平坦形状２７は、１組の発光素子点で定義され、該発光素子点のおのおのは、ｚ軸に対して方位付けられたｘ−ｙ平面内に位置しており、かつ、ｚ軸に対する各半径方向位置について、このような半径方向位置にてｚ軸から最も遠い固体発光素子上の点のｘ,ｙ座標に対応するｘ,ｙ座標を有するものであり、すなわち、前記第２の平坦形状は、前記固体発光素子の、前記ｚ軸に垂直な平面上への射影である。本発明の第３の側面において、前記第１の平坦形状２２の領域は、前記第２の平坦形状２７の領域の大きさの少なくとも２倍である。
As noted above, in the third aspect of the invention, the first (imaginary)
ここで記述された照明装置の任意の２つ、またはそれ以上の構造的部分は、集積することができる。ここで記述された照明装置の任意の構造的部分は、２つ、またはそれ以上の部分（必要であれば、一緒に保持することのできる）に、設けることができる。 Any two or more structural parts of the lighting devices described herein can be integrated. Any structural part of the lighting device described herein can be provided in two or more parts (which can be held together if necessary).
Claims (13)
少なくとも１つの固体発光素子と、
少なくとも１つのルミネッセント材料よりなり、固体発光素子より間隔をあけて設けられている少なくとも１つのルミネッセント要素と
からなり、
ルミネッセント要素は、第１のルミネッセント材料からなる第１のルミネッセント要素領域と第２のルミネッセント材料からなる第２のルミネッセント要素領域とを有しており、第１のルミネッセント材料は、励起されたときに、第１の波長又は第１の波長帯の光を発生する材料であり、第２のルミネッセント材料は、励起されたときに、第１の波長又は第１の波長帯とは相違する第２の波長又は第２の波長帯の光を発生する材料である
ことを特徴とする照明装置。 A lighting device,
At least one solid state light emitting device;
Comprising at least one luminescent material, and comprising at least one luminescent element spaced from the solid state light emitting device,
The luminescent element has a first luminescent element region made of a first luminescent material and a second luminescent element region made of a second luminescent material, the first luminescent material being excited when excited. , A material that generates light of a first wavelength or first wavelength band, wherein the second luminescent material is a second wavelength that is different from the first wavelength or first wavelength band when excited. An illumination device, wherein the illumination device is a material that generates light of a wavelength or a second wavelength band.
固体発光素子は、照明表面を有しており、
ルミネッセント要素は、固体発光素子から、発光表面の最大寸法に少なくとも等しい距離だけ、間隔を置いて配置されている
ことを特徴とする照明装置。 The lighting device according to claim 1.
The solid state light emitting device has an illumination surface,
The luminaire is characterized in that the luminescent elements are spaced from the solid state light emitting element by a distance at least equal to the maximum dimension of the light emitting surface.
固体発光素子は、照明表面を有しており、
ルミネッセント要素は、ルミネッセント要素表面を有しており、
該ルミネッセント要素表面は、照明表面の少なくとも２倍の面積である
ことを特徴とする照明装置。 The lighting device according to claim 1.
The solid state light emitting device has an illumination surface,
The luminescent element has a luminescent element surface;
The illumination device characterized in that the surface of the luminescent element is at least twice the area of the illumination surface.
少なくとも第１及び第２の固体発光素子と、
少なくとも１つのルミネッセント材料からなる少なくとも１つのルミネッセント要素であって、第１及び第２の固体発光素子から離間して配置されたルミネッセント要素と
からなることを特徴とする照明装置。 A lighting device,
At least first and second solid state light emitting devices;
An illuminating device comprising: at least one luminescent element made of at least one luminescent material, the luminescent element being spaced apart from the first and second solid state light emitting elements.
第１の固体発光素子は、第１の発光照明表面を有し、
第２の固体発光素子は、第２の発光照明表面を有し、
ルミネッセント要素は、第１の固体発光素子から、第１の発光照明表面の最大寸法に少なくとも等しい距離だけ、間隔を置いて配置されており、
ルミネッセント要素は、第２の固体発光素子から、第２１の発光照明表面の最大寸法に少なくとも等しい距離だけ、間隔を置いて配置されている
ことを特徴とする照明装置。 The lighting device according to claim 9.
The first solid state light emitting device has a first light emitting illumination surface;
The second solid state light emitting device has a second light emitting illumination surface,
The luminescent element is spaced from the first solid state light emitter by a distance that is at least equal to the maximum dimension of the first light emitting illumination surface;
The luminaire is characterized in that the luminescent element is spaced from the second solid state light emitting element by a distance at least equal to the maximum dimension of the twenty-first light emitting illumination surface.
第１の固体発光素子は、第１の発光ダイオードであり、
第２の固体発光素子は、第２の発光ダイオードである
ことを特徴とする照明装置。 The lighting device according to claim 9.
The first solid state light emitting device is a first light emitting diode,
The lighting device, wherein the second solid state light emitting element is a second light emitting diode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75313805P | 2005-12-22 | 2005-12-22 | |
| US60/753,138 | 2005-12-22 | ||
| US83177506P | 2006-07-19 | 2006-07-19 | |
| US60/831,775 | 2006-07-19 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008547566A Division JP2009527071A (en) | 2005-12-22 | 2006-12-21 | Lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2012054242A true JP2012054242A (en) | 2012-03-15 |
Family
ID=38189126
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008547566A Pending JP2009527071A (en) | 2005-12-22 | 2006-12-21 | Lighting device |
| JP2011229011A Pending JP2012054242A (en) | 2005-12-22 | 2011-10-18 | Lighting device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008547566A Pending JP2009527071A (en) | 2005-12-22 | 2006-12-21 | Lighting device |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7614759B2 (en) |
| EP (1) | EP1969633B1 (en) |
| JP (2) | JP2009527071A (en) |
| KR (1) | KR20090009772A (en) |
| CN (1) | CN101351891B (en) |
| BR (1) | BRPI0620397A2 (en) |
| TW (1) | TWI396814B (en) |
| WO (1) | WO2007073496A2 (en) |
Families Citing this family (260)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10309587B2 (en) | 2002-08-30 | 2019-06-04 | GE Lighting Solutions, LLC | Light emitting diode component |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| KR101148332B1 (en) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | High powered light emitter packages with compact optics |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| US7521667B2 (en) | 2003-06-23 | 2009-04-21 | Advanced Optical Technologies, Llc | Intelligent solid state lighting |
| US7145125B2 (en) | 2003-06-23 | 2006-12-05 | Advanced Optical Technologies, Llc | Integrating chamber cone light using LED sources |
| US7355284B2 (en) | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
| US7872430B2 (en) | 2005-11-18 | 2011-01-18 | Cree, Inc. | Solid state lighting panels with variable voltage boost current sources |
| US7959325B2 (en) * | 2005-11-18 | 2011-06-14 | Cree, Inc. | Solid state lighting units and methods of forming solid state lighting units |
| WO2007061811A1 (en) | 2005-11-18 | 2007-05-31 | Cree, Inc. | Solid state lighting panels with variable voltage boost current sources |
| US8514210B2 (en) | 2005-11-18 | 2013-08-20 | Cree, Inc. | Systems and methods for calibrating solid state lighting panels using combined light output measurements |
| TWI421438B (en) | 2005-12-21 | 2014-01-01 | 克里公司 | Lighting device |
| EP2372224A3 (en) | 2005-12-21 | 2012-08-01 | Cree, Inc. | Lighting Device and Lighting Method |
| JP2009527071A (en) | 2005-12-22 | 2009-07-23 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device |
| US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
| US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
| US7821194B2 (en) | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
| US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
| US8998444B2 (en) | 2006-04-18 | 2015-04-07 | Cree, Inc. | Solid state lighting devices including light mixtures |
| TWI460880B (en) | 2006-04-18 | 2014-11-11 | Cree Inc | Lighting device and lighting method |
| US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
| EP2008019B1 (en) | 2006-04-20 | 2015-08-05 | Cree, Inc. | Lighting device and lighting method |
| WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
| KR20140116536A (en) | 2006-05-31 | 2014-10-02 | 크리, 인코포레이티드 | Lighting device and method of lighting |
| US7766508B2 (en) * | 2006-09-12 | 2010-08-03 | Cree, Inc. | LED lighting fixture |
| US7665862B2 (en) * | 2006-09-12 | 2010-02-23 | Cree, Inc. | LED lighting fixture |
| CN101595342B (en) * | 2006-10-23 | 2012-10-24 | 科锐公司 | Lighting devices and methods of installing light engine housings and/or trim elements in lighting device housings |
| US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
| TWI496315B (en) | 2006-11-13 | 2015-08-11 | Cree Inc | Lighting device, illuminated enclosure and lighting methods |
| EP2095014B1 (en) | 2006-11-14 | 2017-05-10 | Cree, Inc. | Light engine assemblies |
| US8439531B2 (en) * | 2006-11-14 | 2013-05-14 | Cree, Inc. | Lighting assemblies and components for lighting assemblies |
| WO2008067441A1 (en) | 2006-11-30 | 2008-06-05 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| US9441793B2 (en) * | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
| WO2008070607A1 (en) | 2006-12-04 | 2008-06-12 | Cree Led Lighting Solutions, Inc. | Lighting assembly and lighting method |
| WO2008073794A1 (en) | 2006-12-07 | 2008-06-19 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
| US8258682B2 (en) | 2007-02-12 | 2012-09-04 | Cree, Inc. | High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods |
| US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
| US20080198572A1 (en) | 2007-02-21 | 2008-08-21 | Medendorp Nicholas W | LED lighting systems including luminescent layers on remote reflectors |
| CN101657671B (en) | 2007-02-22 | 2012-07-11 | 科锐公司 | Lighting devices, methods of lighting, light filters and methods of filtering light |
| US7638811B2 (en) * | 2007-03-13 | 2009-12-29 | Cree, Inc. | Graded dielectric layer |
| US7824070B2 (en) | 2007-03-22 | 2010-11-02 | Cree, Inc. | LED lighting fixture |
| CN101680638B (en) | 2007-05-07 | 2015-07-29 | 科锐公司 | Light fixture |
| WO2008137984A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting devices and methods for lighting |
| US8049709B2 (en) | 2007-05-08 | 2011-11-01 | Cree, Inc. | Systems and methods for controlling a solid state lighting panel |
| EP2156090B1 (en) | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
| BRPI0811561A2 (en) | 2007-05-08 | 2015-06-16 | Cree Led Lighting Solutions | Lighting device and lighting method |
| KR20100022969A (en) | 2007-05-08 | 2010-03-03 | 크리 엘이디 라이팅 솔루션즈, 인크. | Lighting device and lighting method |
| EP2142843B1 (en) | 2007-05-08 | 2016-12-14 | Cree, Inc. | Lighting device and lighting method |
| EP2142844B1 (en) | 2007-05-08 | 2017-08-23 | Cree, Inc. | Lighting device and lighting method |
| US7942556B2 (en) * | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
| JP5773646B2 (en) | 2007-06-25 | 2015-09-02 | キユーデイー・ビジヨン・インコーポレーテツド | Compositions and methods comprising depositing nanomaterials |
| WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
| US7863635B2 (en) | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
| US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
| EP2210036B1 (en) | 2007-10-10 | 2016-11-23 | Cree, Inc. | Lighting device and method of making |
| US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
| US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US8376577B2 (en) * | 2007-11-05 | 2013-02-19 | Xicato, Inc. | Modular solid state lighting device |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
| WO2009093163A2 (en) * | 2008-01-22 | 2009-07-30 | Koninklijke Philips Electronics N.V. | Illumination device with led and a transmissive support comprising a luminescent material |
| US8350461B2 (en) | 2008-03-28 | 2013-01-08 | Cree, Inc. | Apparatus and methods for combining light emitters |
| WO2009123932A2 (en) * | 2008-04-02 | 2009-10-08 | 3M Innovative Properties Company | Traffic signal systems |
| JP5654447B2 (en) * | 2008-04-08 | 2015-01-14 | コーニンクレッカ フィリップス エヌ ヴェ | An illumination device comprising an LED and a transmissive support having a luminescent material. |
| US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
| JP2011524064A (en) | 2008-05-06 | 2011-08-25 | キユーデイー・ビジヨン・インコーポレーテツド | Solid state lighting device containing quantum confined semiconductor nanoparticles |
| WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
| US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
| KR20110044228A (en) * | 2008-08-08 | 2011-04-28 | 시카토, 인코포레이티드. | Color tunable light source |
| US8858032B2 (en) * | 2008-10-24 | 2014-10-14 | Cree, Inc. | Lighting device, heat transfer structure and heat transfer element |
| US8445824B2 (en) * | 2008-10-24 | 2013-05-21 | Cree, Inc. | Lighting device |
| US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
| US10197240B2 (en) * | 2009-01-09 | 2019-02-05 | Cree, Inc. | Lighting device |
| US7967652B2 (en) | 2009-02-19 | 2011-06-28 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
| US8333631B2 (en) | 2009-02-19 | 2012-12-18 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
| US8950910B2 (en) | 2009-03-26 | 2015-02-10 | Cree, Inc. | Lighting device and method of cooling lighting device |
| US8337030B2 (en) | 2009-05-13 | 2012-12-25 | Cree, Inc. | Solid state lighting devices having remote luminescent material-containing element, and lighting methods |
| US9841162B2 (en) | 2009-05-18 | 2017-12-12 | Cree, Inc. | Lighting device with multiple-region reflector |
| US8921876B2 (en) | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
| US8716952B2 (en) | 2009-08-04 | 2014-05-06 | Cree, Inc. | Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement |
| US8648546B2 (en) * | 2009-08-14 | 2014-02-11 | Cree, Inc. | High efficiency lighting device including one or more saturated light emitters, and method of lighting |
| US9605844B2 (en) | 2009-09-01 | 2017-03-28 | Cree, Inc. | Lighting device with heat dissipation elements |
| US8901845B2 (en) | 2009-09-24 | 2014-12-02 | Cree, Inc. | Temperature responsive control for lighting apparatus including light emitting devices providing different chromaticities and related methods |
| US9713211B2 (en) | 2009-09-24 | 2017-07-18 | Cree, Inc. | Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof |
| US10264637B2 (en) | 2009-09-24 | 2019-04-16 | Cree, Inc. | Solid state lighting apparatus with compensation bypass circuits and methods of operation thereof |
| KR20120094477A (en) | 2009-09-25 | 2012-08-24 | 크리, 인코포레이티드 | Lighting device with low glare and high light level uniformity |
| WO2011037882A2 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device having heat dissipation element |
| WO2011037876A1 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device having heat dissipation element |
| US8602579B2 (en) | 2009-09-25 | 2013-12-10 | Cree, Inc. | Lighting devices including thermally conductive housings and related structures |
| US9464801B2 (en) | 2009-09-25 | 2016-10-11 | Cree, Inc. | Lighting device with one or more removable heat sink elements |
| US9285103B2 (en) | 2009-09-25 | 2016-03-15 | Cree, Inc. | Light engines for lighting devices |
| US9353933B2 (en) | 2009-09-25 | 2016-05-31 | Cree, Inc. | Lighting device with position-retaining element |
| US8777449B2 (en) | 2009-09-25 | 2014-07-15 | Cree, Inc. | Lighting devices comprising solid state light emitters |
| US9068719B2 (en) | 2009-09-25 | 2015-06-30 | Cree, Inc. | Light engines for lighting devices |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| US9030120B2 (en) | 2009-10-20 | 2015-05-12 | Cree, Inc. | Heat sinks and lamp incorporating same |
| US9217542B2 (en) | 2009-10-20 | 2015-12-22 | Cree, Inc. | Heat sinks and lamp incorporating same |
| US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
| US8466611B2 (en) | 2009-12-14 | 2013-06-18 | Cree, Inc. | Lighting device with shaped remote phosphor |
| US8604461B2 (en) | 2009-12-16 | 2013-12-10 | Cree, Inc. | Semiconductor device structures with modulated doping and related methods |
| US8536615B1 (en) | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
| US8508116B2 (en) | 2010-01-27 | 2013-08-13 | Cree, Inc. | Lighting device with multi-chip light emitters, solid state light emitter support members and lighting elements |
| US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
| US20110267821A1 (en) | 2010-02-12 | 2011-11-03 | Cree, Inc. | Lighting device with heat dissipation elements |
| US8773007B2 (en) | 2010-02-12 | 2014-07-08 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| CN102782391B (en) | 2010-02-12 | 2016-08-03 | 科锐公司 | Solid state illumination device and assembly method thereof |
| EP2534407A2 (en) | 2010-02-12 | 2012-12-19 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| US9518715B2 (en) * | 2010-02-12 | 2016-12-13 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| WO2011103204A2 (en) * | 2010-02-17 | 2011-08-25 | Intellilight Corp. | Lighting unit having lighting strips with light emitting elements and a remote luminescent material |
| US8632196B2 (en) * | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
| US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
| US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
| US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
| US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
| US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
| US20110227102A1 (en) | 2010-03-03 | 2011-09-22 | Cree, Inc. | High efficacy led lamp with remote phosphor and diffuser configuration |
| WO2011109092A2 (en) | 2010-03-03 | 2011-09-09 | Cree, Inc. | Led lamp with remote phosphor and diffuser configuration |
| US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
| US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
| US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
| WO2011109097A1 (en) | 2010-03-03 | 2011-09-09 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
| US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
| US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
| US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
| US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
| US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
| US9991427B2 (en) * | 2010-03-08 | 2018-06-05 | Cree, Inc. | Photonic crystal phosphor light conversion structures for light emitting devices |
| US8508127B2 (en) * | 2010-03-09 | 2013-08-13 | Cree, Inc. | High CRI lighting device with added long-wavelength blue color |
| JP2013528902A (en) | 2010-04-26 | 2013-07-11 | シカト・インコーポレイテッド | Mounting tool for LED-based lighting module to fixed member |
| US8237381B2 (en) | 2010-05-04 | 2012-08-07 | Xicato, Inc. | Flexible electrical connection of an LED-based illumination device to a light fixture |
| US8476836B2 (en) | 2010-05-07 | 2013-07-02 | Cree, Inc. | AC driven solid state lighting apparatus with LED string including switched segments |
| US8896197B2 (en) | 2010-05-13 | 2014-11-25 | Cree, Inc. | Lighting device and method of making |
| US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
| MX346857B (en) | 2010-06-18 | 2017-04-03 | Xicato Inc | Led-based illumination module on -board diagnostics. |
| US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
| KR20130099951A (en) | 2010-08-20 | 2013-09-06 | 리서치 트라이앵글 인스티튜트, 인터내셔널 | Color-tunable lighting devices and methods for tunning color output of lighting devices |
| WO2012024591A1 (en) | 2010-08-20 | 2012-02-23 | Research Triangle Institute, International | Photoluminescent nanofiber composites, methods for fabrication, and related lighting devices |
| WO2012024607A2 (en) | 2010-08-20 | 2012-02-23 | Research Triangle Institute, International | Lighting devices utilizing optical waveguides and remote light converters, and related methods |
| US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
| US8297767B2 (en) | 2010-09-07 | 2012-10-30 | Xicato, Inc. | LED-based illumination modules with PTFE color converting surfaces |
| US9140429B2 (en) | 2010-10-14 | 2015-09-22 | Cree, Inc. | Optical element edge treatment for lighting device |
| US9648673B2 (en) | 2010-11-05 | 2017-05-09 | Cree, Inc. | Lighting device with spatially segregated primary and secondary emitters |
| US8491140B2 (en) | 2010-11-05 | 2013-07-23 | Cree, Inc. | Lighting device with multiple emitters and remote lumiphor |
| US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
| US8425065B2 (en) | 2010-12-30 | 2013-04-23 | Xicato, Inc. | LED-based illumination modules with thin color converting layers |
| US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
| US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
| US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
| US8796952B2 (en) | 2011-03-03 | 2014-08-05 | Cree, Inc. | Semiconductor light emitting devices having selectable and/or adjustable color points and related methods |
| US8791642B2 (en) | 2011-03-03 | 2014-07-29 | Cree, Inc. | Semiconductor light emitting devices having selectable and/or adjustable color points and related methods |
| US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
| US8899767B2 (en) | 2011-03-31 | 2014-12-02 | Xicato, Inc. | Grid structure on a transmissive layer of an LED-based illumination module |
| US9316368B2 (en) | 2011-04-18 | 2016-04-19 | Cree, Inc. | LED luminaire including a thin phosphor layer applied to a remote reflector |
| US8604684B2 (en) | 2011-05-16 | 2013-12-10 | Cree, Inc. | UV stable optical element and LED lamp using same |
| US9839083B2 (en) | 2011-06-03 | 2017-12-05 | Cree, Inc. | Solid state lighting apparatus and circuits including LED segments configured for targeted spectral power distribution and methods of operating the same |
| CN103765077A (en) | 2011-06-28 | 2014-04-30 | 克利公司 | Compact high efficiency remote LED module |
| US8742671B2 (en) | 2011-07-28 | 2014-06-03 | Cree, Inc. | Solid state lighting apparatus and methods using integrated driver circuitry |
| US8449129B2 (en) | 2011-08-02 | 2013-05-28 | Xicato, Inc. | LED-based illumination device with color converting surfaces |
| US8403529B2 (en) | 2011-08-02 | 2013-03-26 | Xicato, Inc. | LED-based illumination module with preferentially illuminated color converting surfaces |
| US8485692B2 (en) | 2011-09-09 | 2013-07-16 | Xicato, Inc. | LED-based light source with sharply defined field angle |
| CN102720957A (en) * | 2011-12-04 | 2012-10-10 | 深圳市光峰光电技术有限公司 | Light emitting device, projection device and illuminating device |
| US9217560B2 (en) | 2011-12-05 | 2015-12-22 | Xicato, Inc. | Reflector attachment to an LED-based illumination module |
| JP2015506071A (en) * | 2011-12-16 | 2015-02-26 | コーニンクレッカ フィリップス エヌ ヴェ | Optical apparatus provided with diffractive optical element |
| CN103975041B (en) | 2011-12-16 | 2017-10-10 | 皇家飞利浦有限公司 | For the phosphor in LED waterglass |
| US9151457B2 (en) | 2012-02-03 | 2015-10-06 | Cree, Inc. | Lighting device and method of installing light emitter |
| US9151477B2 (en) | 2012-02-03 | 2015-10-06 | Cree, Inc. | Lighting device and method of installing light emitter |
| US8820951B2 (en) | 2012-02-06 | 2014-09-02 | Xicato, Inc. | LED-based light source with hybrid spot and general lighting characteristics |
| US8779687B2 (en) | 2012-02-13 | 2014-07-15 | Xicato, Inc. | Current routing to multiple LED circuits |
| US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| US8680785B2 (en) | 2012-05-18 | 2014-03-25 | Xicato, Inc. | Variable master current mirror |
| US9818919B2 (en) | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
| US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
| US9887327B2 (en) | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
| US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
| US20140003044A1 (en) | 2012-09-06 | 2014-01-02 | Xicato, Inc. | Integrated led based illumination device |
| US9353917B2 (en) | 2012-09-14 | 2016-05-31 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
| WO2014058641A2 (en) | 2012-10-10 | 2014-04-17 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
| US9182091B2 (en) | 2012-12-14 | 2015-11-10 | Remphos Technologies Llc | LED panel light fixture |
| US8882298B2 (en) | 2012-12-14 | 2014-11-11 | Remphos Technologies Llc | LED module for light distribution |
| US8845380B2 (en) | 2012-12-17 | 2014-09-30 | Xicato, Inc. | Automated color tuning of an LED based illumination device |
| US8870617B2 (en) | 2013-01-03 | 2014-10-28 | Xicato, Inc. | Color tuning of a multi-color LED based illumination device |
| CN103090228A (en) * | 2013-01-15 | 2013-05-08 | 东莞雷笛克光学有限公司 | Combined type anti-dazzle illuminating system |
| US9345091B2 (en) | 2013-02-08 | 2016-05-17 | Cree, Inc. | Light emitting device (LED) light fixture control systems and related methods |
| US9565782B2 (en) | 2013-02-15 | 2017-02-07 | Ecosense Lighting Inc. | Field replaceable power supply cartridge |
| US8770800B1 (en) | 2013-03-15 | 2014-07-08 | Xicato, Inc. | LED-based light source reflector with shell elements |
| US9587790B2 (en) | 2013-03-15 | 2017-03-07 | Cree, Inc. | Remote lumiphor solid state lighting devices with enhanced light extraction |
| CN104241262B (en) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | Light emitting device and display device |
| US9591726B2 (en) | 2013-07-02 | 2017-03-07 | Xicato, Inc. | LED-based lighting control network communication |
| US9596737B2 (en) | 2013-07-02 | 2017-03-14 | Xicato, Inc. | Multi-port LED-based lighting communications gateway |
| US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
| WO2015017091A1 (en) | 2013-08-01 | 2015-02-05 | Cree, Inc. | Light emitting diode package with encapsulant having curved and planar surfaces |
| USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9927111B2 (en) | 2013-09-17 | 2018-03-27 | Xicato, Inc. | LED based illumination device with integrated output window |
| US20150138752A1 (en) | 2013-10-28 | 2015-05-21 | Next Lighting Corp. | Linear lamp replacement |
| US9425896B2 (en) | 2013-12-31 | 2016-08-23 | Xicato, Inc. | Color modulated LED-based illumination |
| US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
| US9788379B2 (en) | 2014-03-28 | 2017-10-10 | Xicato, Inc. | Deep dimming of an LED-based illumination device |
| US9781799B2 (en) | 2014-05-05 | 2017-10-03 | Xicato, Inc. | LED-based illumination device reflector having sense and communication capability |
| WO2016022707A1 (en) | 2014-08-06 | 2016-02-11 | Cree, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
| USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
| US9799804B2 (en) | 2014-10-28 | 2017-10-24 | Matrix Lighting Ltd. | Light-emitting device with near full spectrum light output |
| US10431568B2 (en) | 2014-12-18 | 2019-10-01 | Cree, Inc. | Light emitting diodes, components and related methods |
| US9869450B2 (en) | 2015-02-09 | 2018-01-16 | Ecosense Lighting Inc. | Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector |
| US11306897B2 (en) | 2015-02-09 | 2022-04-19 | Ecosense Lighting Inc. | Lighting systems generating partially-collimated light emissions |
| US9960848B2 (en) | 2015-02-27 | 2018-05-01 | Xicato, Inc. | Commissioning of devices on a lighting communications network |
| US9930741B2 (en) | 2015-02-27 | 2018-03-27 | Xicato, Inc. | Synchronized light control over a wireless network |
| US9853730B2 (en) | 2015-02-27 | 2017-12-26 | Xicato, Inc. | Lighting based authentication of a mobile electronic device |
| USD777122S1 (en) | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
| US9788397B2 (en) | 2015-02-27 | 2017-10-10 | Xicato, Inc. | Lighting communication advertising packets |
| US9651227B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Low-profile lighting system having pivotable lighting enclosure |
| US9746159B1 (en) | 2015-03-03 | 2017-08-29 | Ecosense Lighting Inc. | Lighting system having a sealing system |
| US9651216B2 (en) | 2015-03-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting systems including asymmetric lens modules for selectable light distribution |
| US9568665B2 (en) | 2015-03-03 | 2017-02-14 | Ecosense Lighting Inc. | Lighting systems including lens modules for selectable light distribution |
| WO2016164645A1 (en) | 2015-04-08 | 2016-10-13 | Xicato, Inc. | Led-based illumination systems having sense and communication capability |
| US10009980B2 (en) | 2015-05-18 | 2018-06-26 | Xicato, Inc. | Lighting communications gateway |
| US10422998B1 (en) | 2015-06-03 | 2019-09-24 | Mark Belloni | Laser transformer lens |
| USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
| US9780266B2 (en) | 2015-06-30 | 2017-10-03 | Cree, Inc. | Stabilized quantum dot structure and method of making a stabilized quantum dot structure |
| USD785218S1 (en) | 2015-07-06 | 2017-04-25 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
| US20170012186A1 (en) * | 2015-07-09 | 2017-01-12 | Dun-Hua Cao | Novel white light led packaging structure and process for manufacturing the same |
| USD782093S1 (en) | 2015-07-20 | 2017-03-21 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
| USD782094S1 (en) | 2015-07-20 | 2017-03-21 | Ecosense Lighting Inc. | LED luminaire having a mounting system |
| US9651232B1 (en) | 2015-08-03 | 2017-05-16 | Ecosense Lighting Inc. | Lighting system having a mounting device |
| US9750092B2 (en) | 2015-10-01 | 2017-08-29 | Xicato, Inc. | Power management of an LED-based illumination device |
| US9786639B2 (en) | 2015-12-03 | 2017-10-10 | Cree, Inc. | Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters |
| CN109315050B (en) | 2016-01-28 | 2020-05-29 | 生态照明公司 | Method for producing tunable white light with high color rendering |
| CN109315037B (en) | 2016-01-28 | 2022-07-01 | 生态照明公司 | System for providing tunable white light with high color rendering |
| WO2019139638A1 (en) | 2018-01-11 | 2019-07-18 | Ecosense Lighting Inc | Multi-channel systems for providing tunable light and functional diode emissions |
| US10555397B2 (en) | 2016-01-28 | 2020-02-04 | Ecosense Lighting Inc. | Systems and methods for providing tunable warm white light |
| US10492264B2 (en) | 2016-01-28 | 2019-11-26 | EcoSense Lighting, Inc. | Lighting systems for providing tunable white light with functional diode emissions |
| CN109417841B (en) | 2016-01-28 | 2021-10-29 | 生态照明公司 | Composition for LED light conversion |
| US10234127B2 (en) | 2016-02-08 | 2019-03-19 | Cree, Inc. | LED luminaire having enhanced thermal management |
| US10211660B2 (en) | 2016-02-08 | 2019-02-19 | Cree, Inc. | LED lighting device with adaptive profiles for controlling power consumption |
| US11719882B2 (en) | 2016-05-06 | 2023-08-08 | Ideal Industries Lighting Llc | Waveguide-based light sources with dynamic beam shaping |
| US10416377B2 (en) | 2016-05-06 | 2019-09-17 | Cree, Inc. | Luminaire with controllable light emission |
| US9772074B1 (en) | 2016-10-07 | 2017-09-26 | Rafail Bronstein | Laser diodes based illumination device |
| US9756696B1 (en) | 2016-10-17 | 2017-09-05 | Cree, Inc. | Configurable LED lighting apparatus |
| US10539308B2 (en) | 2017-02-06 | 2020-01-21 | Ideal Industries Lighting Llc | Modular overhead lighting system |
| US10502935B2 (en) | 2017-03-03 | 2019-12-10 | Ideal Industries Lighting Llc | Image sensor modules and luminaires incorporating the same |
| US10260683B2 (en) | 2017-05-10 | 2019-04-16 | Cree, Inc. | Solid-state lamp with LED filaments having different CCT's |
| MX2019015105A (en) | 2017-06-16 | 2020-08-03 | Ideal Ind Lighting Llc | Optic assemblies and fixtures comprising the same. |
| US10741730B2 (en) | 2017-11-10 | 2020-08-11 | Cree, Inc. | Stabilized luminescent nanoparticles comprising a perovskite semiconductor and method of fabrication |
| US10347799B2 (en) | 2017-11-10 | 2019-07-09 | Cree, Inc. | Stabilized quantum dot composite and method of making a stabilized quantum dot composite |
| WO2019140309A1 (en) | 2018-01-11 | 2019-07-18 | Ecosense Lighting Inc. | Switchable systems for white light with high color rendering and biological effects |
| EP3737469A4 (en) | 2018-01-11 | 2021-11-10 | Ecosense Lighting Inc. | Display lighting systems with circadian effects |
| US10499481B1 (en) | 2018-05-24 | 2019-12-03 | Ideal Industries Lighting Llc | LED lighting device with LED board on network |
| US10608148B2 (en) | 2018-05-31 | 2020-03-31 | Cree, Inc. | Stabilized fluoride phosphor for light emitting diode (LED) applications |
| US20220001200A1 (en) | 2018-11-08 | 2022-01-06 | Ecosense Lighting Inc. | Switchable bioactive lighting |
| US11322669B2 (en) * | 2018-12-21 | 2022-05-03 | Lumileds Llc | Color uniformity in converted light emitting diode using nano-structures |
| CA3147174A1 (en) | 2019-09-03 | 2021-03-11 | Jin Hong Lim | Luminaires and components thereof |
| US11892652B1 (en) | 2020-04-07 | 2024-02-06 | Mark Belloni | Lenses for 2D planar and curved 3D laser sheets |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045206A (en) * | 2001-05-24 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Illuminating light source |
| JP2003249688A (en) * | 2002-02-26 | 2003-09-05 | Sanyo Electric Co Ltd | Light emitting device |
| JP2004056075A (en) * | 2002-05-31 | 2004-02-19 | Stanley Electric Co Ltd | Light-emitting device and method of manufacturing the same |
| JP2004071357A (en) * | 2002-08-06 | 2004-03-04 | Shigeo Fujita | Lighting device |
| JP2005228996A (en) * | 2004-02-13 | 2005-08-25 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2005332963A (en) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | Light emitting device |
| JP2005537651A (en) * | 2002-08-30 | 2005-12-08 | ゲルコアー リミテッド ライアビリティ カンパニー | Covered LED with improved efficiency |
Family Cites Families (531)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508494Y1 (en) | 1970-11-13 | 1975-03-14 | ||
| US3805937A (en) * | 1970-12-29 | 1974-04-23 | Glory Kogyo Kk | Automatic money dispensing machine |
| NL7302483A (en) | 1972-02-22 | 1973-08-24 | ||
| JPS48102585A (en) * | 1972-04-04 | 1973-12-22 | ||
| US4042552A (en) | 1972-09-19 | 1977-08-16 | Warner-Lambert Company | Composition for hydrophilic lens blank and method of casting |
| US4081764A (en) * | 1972-10-12 | 1978-03-28 | Minnesota Mining And Manufacturing Company | Zinc oxide light emitting diode |
| US3927290A (en) | 1974-11-14 | 1975-12-16 | Teletype Corp | Selectively illuminated pushbutton switch |
| JPS5225484A (en) | 1975-08-21 | 1977-02-25 | Mitsubishi Electric Corp | Mixing light illuminating method |
| US4107238A (en) | 1976-01-22 | 1978-08-15 | Exxon Research & Engineering Co. | Graft copolymerization process |
| JPS5371375U (en) | 1976-11-17 | 1978-06-15 | ||
| US4141941A (en) | 1977-09-21 | 1979-02-27 | American Optical Corporation | Contact lens casting method |
| US4337506A (en) | 1978-12-20 | 1982-06-29 | Terada James I | Adjustable lamp |
| JPS5722581Y2 (en) | 1979-08-21 | 1982-05-17 | ||
| US4476620A (en) | 1979-10-19 | 1984-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of making a gallium nitride light-emitting diode |
| US4325146A (en) * | 1979-12-20 | 1982-04-13 | Lennington John W | Non-synchronous object identification system |
| US4320268A (en) | 1980-02-19 | 1982-03-16 | General Electric Company | Illuminated keyboard for electronic devices and the like |
| US4388678A (en) | 1980-10-14 | 1983-06-14 | Turner Wheeler M | Reading and viewing lamp |
| US4408157A (en) | 1981-05-04 | 1983-10-04 | Associated Research, Inc. | Resistance measuring arrangement |
| JPS587492U (en) | 1981-07-09 | 1983-01-18 | 株式会社東芝 | High frequency heating device |
| US4420398A (en) | 1981-08-13 | 1983-12-13 | American National Red Cross | Filteration method for cell produced antiviral substances |
| JPS58182639U (en) | 1982-05-31 | 1983-12-06 | ヤンマー農機株式会社 | Threshing machine swing sorting device |
| EP0147551B1 (en) | 1983-10-14 | 1990-01-17 | Omron Tateisi Electronics Co. | Electronic switching device |
| JPS60106175A (en) | 1983-11-14 | 1985-06-11 | Mitsubishi Electric Corp | Semiconductor memory device |
| JPS6194362U (en) | 1984-11-26 | 1986-06-18 | ||
| US4562018A (en) | 1985-01-28 | 1985-12-31 | Neefe Charles W | Method of casting optical surfaces on lens blanks |
| JPS61144890U (en) | 1985-02-28 | 1986-09-06 | ||
| JPH0335568Y2 (en) | 1985-04-30 | 1991-07-29 | ||
| JPH0416447Y2 (en) | 1985-07-22 | 1992-04-13 | ||
| US4826424A (en) | 1985-09-25 | 1989-05-02 | Canon Kabushiki Kaisha | Lens barrel made by injection molding |
| US5140220A (en) | 1985-12-02 | 1992-08-18 | Yumi Sakai | Light diffusion type light emitting diode |
| JPS62143942U (en) | 1986-03-07 | 1987-09-10 | ||
| JPH0428269Y2 (en) | 1986-04-15 | 1992-07-08 | ||
| JPH077180Y2 (en) | 1986-05-23 | 1995-02-22 | 沖電気工業株式会社 | Booklet printing device |
| JPS63126103A (en) | 1986-11-15 | 1988-05-30 | 中松 義郎 | Radiation apparatus for light or the like |
| US5753730A (en) | 1986-12-15 | 1998-05-19 | Mitsui Toatsu Chemicals, Inc. | Plastic lenses having a high-refractive index, process for the preparation thereof and casting polymerization process for preparing sulfur-containing urethane resin lens and lens prepared thereby |
| US5094185A (en) | 1987-11-24 | 1992-03-10 | Lumel, Inc. | Electroluminescent lamps and phosphors |
| US5132045A (en) | 1988-03-16 | 1992-07-21 | Mitsubishi Rayon Co., Ltd. | Acrylic phosphor paste compositions and phosphor coatings obtained therefrom |
| JPH01139664U (en) | 1988-03-17 | 1989-09-25 | ||
| CN1040810A (en) | 1988-04-30 | 1990-03-28 | 三井东圧化学株式会社 | Polysulfide base resin lens and preparation method thereof |
| JPH01287973A (en) | 1988-05-13 | 1989-11-20 | Takiron Co Ltd | Dot matrix light emitting indicator |
| GB2226272B (en) | 1988-11-02 | 1993-01-13 | Nat Res Dev | Contact lens cast moulding and packaging |
| US4918497A (en) | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
| US5027168A (en) | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
| US4918487A (en) | 1989-01-23 | 1990-04-17 | Coulter Systems Corporation | Toner applicator for electrophotographic microimagery |
| DE3916875A1 (en) | 1989-05-24 | 1990-12-06 | Ullmann Ulo Werk | Signal light esp. multi-compartment signal lights for motor vehicle - uses green, red, and blue LED's combined so that single light is given with help of mix optics |
| US5087949A (en) | 1989-06-27 | 1992-02-11 | Hewlett-Packard Company | Light-emitting diode with diagonal faces |
| US4966862A (en) | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
| US5407799A (en) * | 1989-09-14 | 1995-04-18 | Associated Universities, Inc. | Method for high-volume sequencing of nucleic acids: random and directed priming with libraries of oligonucleotides |
| JPH0644567B2 (en) | 1989-12-18 | 1994-06-08 | 株式会社日立製作所 | Semiconductor shape improvement method |
| US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
| JPH087614Y2 (en) | 1990-05-08 | 1996-03-04 | 中部電力株式会社 | Wire cap |
| US5087883A (en) * | 1990-09-10 | 1992-02-11 | Mr. Coffee, Inc. | Differential conductivity meter for fluids and products containing such meters |
| US5110278A (en) | 1990-11-30 | 1992-05-05 | Pilkington Visioncare, Inc. | Injection molding apparatus for producing a toric lens casting mold arbor |
| JP2765256B2 (en) | 1991-04-10 | 1998-06-11 | 日立電線株式会社 | Light emitting diode |
| US5134550A (en) | 1991-06-28 | 1992-07-28 | Young Richard A | Indirect lighting fixture |
| JPH05152609A (en) | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | Light emitting diode |
| US5595440A (en) | 1992-01-14 | 1997-01-21 | Musco Corporation | Means and method for highly controllable lighting of areas or objects |
| US5264997A (en) | 1992-03-04 | 1993-11-23 | Dominion Automotive Industries Corp. | Sealed, inductively powered lamp assembly |
| JPH05327012A (en) | 1992-05-15 | 1993-12-10 | Sanyo Electric Co Ltd | Silicon carbide light emitting diode |
| DE4228895C2 (en) | 1992-08-29 | 2002-09-19 | Bosch Gmbh Robert | Motor vehicle lighting device with multiple semiconductor light sources |
| JP2822819B2 (en) | 1992-11-09 | 1998-11-11 | 日亜化学工業株式会社 | Multicolor light emitting device |
| JPH06177427A (en) | 1992-12-03 | 1994-06-24 | Rohm Co Ltd | Light emitting diode lamp |
| JPH06177429A (en) | 1992-12-08 | 1994-06-24 | Nichia Chem Ind Ltd | Blue color led device |
| EP0677160B1 (en) | 1992-12-31 | 1997-07-16 | Minnesota Mining And Manufacturing Company | Pole light having a programmable footprint |
| JP2964822B2 (en) | 1993-02-19 | 1999-10-18 | 日亜化学工業株式会社 | Manufacturing method of light emitting diode |
| DE4311937A1 (en) | 1993-04-10 | 1994-10-13 | Telefunken Microelectron | Light-emitting device |
| US5416342A (en) | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
| EP0714348A4 (en) | 1993-07-27 | 1998-05-06 | Physical Optics Corp | Light source destructuring and shaping device |
| US5338944A (en) | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
| GB9320291D0 (en) | 1993-10-01 | 1993-11-17 | Brown John H | Optical directing devices for light emitting diodes |
| US5410519A (en) * | 1993-11-19 | 1995-04-25 | Coastal & Offshore Pacific Corporation | Acoustic tracking system |
| US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
| JPH07176794A (en) | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
| JP2596709B2 (en) | 1994-04-06 | 1997-04-02 | 都築 省吾 | Illumination light source device using semiconductor laser element |
| CA2134902C (en) | 1994-04-07 | 2000-05-16 | Friedrich Bertignoll | Light diffusing apparatus |
| US5561346A (en) | 1994-08-10 | 1996-10-01 | Byrne; David J. | LED lamp construction |
| US5604135A (en) | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
| US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
| US5631190A (en) | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
| JPH08162676A (en) | 1994-12-02 | 1996-06-21 | Nichia Chem Ind Ltd | Light emitting diode |
| US5585640A (en) | 1995-01-11 | 1996-12-17 | Huston; Alan L. | Glass matrix doped with activated luminescent nanocrystalline particles |
| US5477430A (en) | 1995-03-14 | 1995-12-19 | Delco Electronics Corporation | Fluorescing keypad |
| US5614734A (en) * | 1995-03-15 | 1997-03-25 | Yale University | High efficency LED structure |
| US5739554A (en) | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
| JP3792268B2 (en) | 1995-05-23 | 2006-07-05 | ローム株式会社 | Manufacturing method of chip type light emitting device |
| JPH0950728A (en) | 1995-08-07 | 1997-02-18 | Fuji Polymertech Kk | Illuminated switch |
| US5834889A (en) * | 1995-09-22 | 1998-11-10 | Gl Displays, Inc. | Cold cathode fluorescent display |
| JPH09153646A (en) | 1995-09-27 | 1997-06-10 | Toshiba Corp | Optical semiconductor device and manufacture of the same |
| JPH09138402A (en) | 1995-11-15 | 1997-05-27 | Kouha:Kk | Led back light device for illuminating liquid crystal display device |
| US5688042A (en) | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
| ES2177198T3 (en) | 1995-12-29 | 2002-12-01 | Cree Inc | PIXEL PROVIDED WITH UPPER LED CONTACTS ON A FLAT AND SCREENS THAT INCLUDE IT. |
| JP2947156B2 (en) | 1996-02-29 | 1999-09-13 | 双葉電子工業株式会社 | Phosphor manufacturing method |
| JP3264615B2 (en) | 1996-02-29 | 2002-03-11 | ホーヤ株式会社 | Plastic lens injection molding method |
| JPH09246603A (en) | 1996-03-08 | 1997-09-19 | Nichia Chem Ind Ltd | Light emitting diode and display unit using it |
| US5957564A (en) | 1996-03-26 | 1999-09-28 | Dana G. Bruce | Low power lighting display |
| US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
| JP3009626B2 (en) | 1996-05-20 | 2000-02-14 | 日吉電子株式会社 | LED luminous bulb |
| US5803579A (en) | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
| US20040239243A1 (en) | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
| US6550949B1 (en) * | 1996-06-13 | 2003-04-22 | Gentex Corporation | Systems and components for enhancing rear vision from a vehicle |
| JPH1012929A (en) | 1996-06-25 | 1998-01-16 | Hitachi Cable Ltd | Mounting structure for light emitting diode |
| DE19638667C2 (en) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
| EP1439586B1 (en) | 1996-06-26 | 2014-03-12 | OSRAM Opto Semiconductors GmbH | Light-emitting semiconductor component with luminescence conversion element |
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| JP2927279B2 (en) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | Light emitting diode |
| US5851063A (en) | 1996-10-28 | 1998-12-22 | General Electric Company | Light-emitting diode white light source |
| JPH10145476A (en) | 1996-11-08 | 1998-05-29 | Casio Comput Co Ltd | Electronic equipment with display part and operating part |
| US6076936A (en) | 1996-11-25 | 2000-06-20 | George; Ben | Tread area and step edge lighting system |
| JPH10163535A (en) | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | White light-emitting element |
| JP3065263B2 (en) | 1996-12-27 | 2000-07-17 | 日亜化学工業株式会社 | Light emitting device and LED display using the same |
| EP0960353B1 (en) | 1997-02-13 | 2010-04-14 | Honeywell International Inc. | Illumination system with light recycling to enhance brightness |
| JP2000509912A (en) | 1997-03-03 | 2000-08-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | White light emitting diode |
| US5850126A (en) | 1997-04-11 | 1998-12-15 | Kanbar; Maurice S. | Screw-in led lamp |
| JP3985065B2 (en) | 1997-05-14 | 2007-10-03 | 忠弘 大見 | Porous silicon substrate forming method and porous silicon substrate forming apparatus |
| US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
| US6784463B2 (en) | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| US5882553A (en) | 1997-06-09 | 1999-03-16 | Guide Corporation | Multi-color lens assembly injection molding process and apparatus |
| KR100561502B1 (en) | 1997-06-30 | 2006-03-17 | 바슈 앤드 롬 인코포레이티드 | Injection molding process for rotationally asymmetric contact lens surfaces |
| US6319425B1 (en) | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
| US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| US6292901B1 (en) | 1997-08-26 | 2001-09-18 | Color Kinetics Incorporated | Power/data protocol |
| US5962971A (en) | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
| US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| GB2329238A (en) | 1997-09-12 | 1999-03-17 | Hassan Paddy Abdel Salam | LED light source |
| US6201262B1 (en) | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
| JP3091911B2 (en) | 1997-10-09 | 2000-09-25 | 株式会社ジェッター | Coin polishing machine |
| US6480299B1 (en) | 1997-11-25 | 2002-11-12 | University Technology Corporation | Color printer characterization using optimization theory and neural networks |
| JPH11177129A (en) | 1997-12-16 | 1999-07-02 | Rohm Co Ltd | Chip type led, led lamp and led display |
| US6105177A (en) | 1997-12-26 | 2000-08-22 | Paulson Manufacturing Corp. | Protective goggles |
| JP3241338B2 (en) | 1998-01-26 | 2001-12-25 | 日亜化学工業株式会社 | Semiconductor light emitting device |
| US6294800B1 (en) | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
| US6255670B1 (en) | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
| US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
| US6278135B1 (en) | 1998-02-06 | 2001-08-21 | General Electric Company | Green-light emitting phosphors and light sources using the same |
| JP2607796Y2 (en) | 1998-02-09 | 2002-07-08 | 株式会社ケンウッド | Magnetic circuit for speaker |
| JP3541709B2 (en) | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | Method of forming light emitting diode |
| DE19813269A1 (en) * | 1998-03-25 | 1999-09-30 | Hoechst Diafoil Gmbh | Sealable polyester film with high oxygen barrier, process for its production and its use |
| JP3704941B2 (en) | 1998-03-30 | 2005-10-12 | 日亜化学工業株式会社 | Light emitting device |
| JP3618221B2 (en) | 1998-04-13 | 2005-02-09 | 日亜化学工業株式会社 | Light emitting device |
| DE19829197C2 (en) | 1998-06-30 | 2002-06-20 | Siemens Ag | Component emitting and / or receiving radiation |
| JP4109756B2 (en) | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | Light emitting diode |
| TW406442B (en) | 1998-07-09 | 2000-09-21 | Sumitomo Electric Industries | White colored LED and intermediate colored LED |
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| EP1115163A4 (en) | 1998-09-10 | 2001-12-05 | Rohm Co Ltd | Semiconductor light-emitting device and method for manufacturing the same |
| JP3490906B2 (en) | 1998-09-22 | 2004-01-26 | 日亜化学工業株式会社 | Semiconductor device and manufacturing method thereof |
| WO2000019546A1 (en) | 1998-09-28 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Lighting system |
| US6404125B1 (en) | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
| US6391231B1 (en) | 1998-11-23 | 2002-05-21 | Younger Mfg. Co. | Method for side-fill lens casting |
| US6177688B1 (en) | 1998-11-24 | 2001-01-23 | North Carolina State University | Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates |
| US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| JP3667125B2 (en) | 1998-12-07 | 2005-07-06 | 日亜化学工業株式会社 | Optical semiconductor device and manufacturing method thereof |
| US6149283A (en) | 1998-12-09 | 2000-11-21 | Rensselaer Polytechnic Institute (Rpi) | LED lamp with reflector and multicolor adjuster |
| JP4350183B2 (en) | 1998-12-16 | 2009-10-21 | 東芝電子エンジニアリング株式会社 | Semiconductor light emitting device |
| JP3613041B2 (en) | 1998-12-16 | 2005-01-26 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| US6373188B1 (en) | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
| JP3366586B2 (en) | 1998-12-28 | 2003-01-14 | 日亜化学工業株式会社 | Light emitting diode |
| JP2000208822A (en) | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | Semiconductor light-emitting device |
| US6212213B1 (en) | 1999-01-29 | 2001-04-03 | Agilent Technologies, Inc. | Projector light source utilizing a solid state green light source |
| US20010042866A1 (en) | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
| WO2000046862A1 (en) | 1999-02-05 | 2000-08-10 | Japan Energy Corporation | Photoelectric conversion functional element and production method thereof |
| US6329676B1 (en) | 1999-03-01 | 2001-12-11 | Toru Takayama | Flat panel solid state light source |
| US6521916B2 (en) | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
| US6193392B1 (en) | 1999-05-27 | 2001-02-27 | Pervaiz Lodhie | Led array with a multi-directional, multi-functional light reflector |
| US6705745B1 (en) | 1999-06-08 | 2004-03-16 | 911Ep, Inc. | Rotational led reflector |
| EP1059668A3 (en) | 1999-06-09 | 2007-07-18 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| JP2000353826A (en) | 1999-06-09 | 2000-12-19 | Sanyo Electric Co Ltd | Hybrid integrated circuit device and light irradiating device |
| KR100425566B1 (en) | 1999-06-23 | 2004-04-01 | 가부시키가이샤 시티즌 덴시 | Light emitting diode |
| JP3690968B2 (en) | 1999-06-30 | 2005-08-31 | 日亜化学工業株式会社 | LIGHT EMITTING DEVICE AND METHOD FOR FORMING THE SAME |
| US6335538B1 (en) * | 1999-07-23 | 2002-01-01 | Impulse Dynamics N.V. | Electro-optically driven solid state relay system |
| US6367949B1 (en) | 1999-08-04 | 2002-04-09 | 911 Emergency Products, Inc. | Par 36 LED utility lamp |
| JP3798195B2 (en) | 1999-08-12 | 2006-07-19 | ローム株式会社 | Chip type light emitting device |
| JP3833019B2 (en) | 1999-08-31 | 2006-10-11 | 日亜化学工業株式会社 | Light emitting diode |
| JP2001144331A (en) * | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | Light-emitting device |
| US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
| US6918677B2 (en) | 1999-09-15 | 2005-07-19 | Michael Shipman | Illuminated keyboard |
| US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
| US6712486B1 (en) * | 1999-10-19 | 2004-03-30 | Permlight Products, Inc. | Mounting arrangement for light emitting diodes |
| DE19952932C1 (en) | 1999-11-03 | 2001-05-03 | Osram Opto Semiconductors Gmbh | LED white light source with broadband excitation |
| JP4422832B2 (en) * | 1999-11-05 | 2010-02-24 | アビックス株式会社 | LED light |
| JP2001144334A (en) | 1999-11-17 | 2001-05-25 | Nichia Chem Ind Ltd | Optical semiconductor device and forming method therefor |
| US6762563B2 (en) | 1999-11-19 | 2004-07-13 | Gelcore Llc | Module for powering and monitoring light-emitting diodes |
| US6597179B2 (en) * | 1999-11-19 | 2003-07-22 | Gelcore, Llc | Method and device for remote monitoring of LED lamps |
| AUPQ431399A0 (en) | 1999-11-29 | 1999-12-23 | Procter, Jeffrey Kenneth | Light emitting diode reflector |
| US6357889B1 (en) * | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
| US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
| US6410942B1 (en) | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
| US6350041B1 (en) | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
| JP5965095B2 (en) | 1999-12-03 | 2016-08-10 | クリー インコーポレイテッドＣｒｅｅ Ｉｎｃ． | Light-emitting diode with improved light extraction by internal and external optical elements |
| JP3685057B2 (en) | 1999-12-08 | 2005-08-17 | 日亜化学工業株式会社 | LED lamp and manufacturing method thereof |
| US6573537B1 (en) | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
| US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
| US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| JP2000315826A (en) | 2000-01-01 | 2000-11-14 | Nichia Chem Ind Ltd | Light emitting device, formation thereof, gun type light emitting diode, chip type led |
| JP3696021B2 (en) | 2000-01-20 | 2005-09-14 | 三洋電機株式会社 | Light irradiation device |
| TW465123B (en) | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
| WO2001059851A1 (en) | 2000-02-09 | 2001-08-16 | Nippon Leiz Corporation | Light source |
| DE10006738C2 (en) | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Light-emitting component with improved light decoupling and method for its production |
| TW480744B (en) | 2000-03-14 | 2002-03-21 | Lumileds Lighting Bv | Light-emitting diode, lighting device and method of manufacturing same |
| JP4406490B2 (en) | 2000-03-14 | 2010-01-27 | 株式会社朝日ラバー | Light emitting diode |
| EP1134300A3 (en) | 2000-03-17 | 2002-05-22 | Hitachi Metals, Ltd. | Fe-Ni alloy |
| US6522065B1 (en) | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
| US6538371B1 (en) * | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
| US6394621B1 (en) | 2000-03-30 | 2002-05-28 | Hanewinkel, Iii William Henry | Latching switch for compact flashlight providing an easy means for changing the power source |
| JP2001307506A (en) | 2000-04-17 | 2001-11-02 | Hitachi Ltd | White light emitting device and illuminator |
| US6603258B1 (en) | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
| JP2003533030A (en) | 2000-04-26 | 2003-11-05 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Manufacturing method of light emitting diode chip and light emitting diode structure element based on GaN |
| US6621211B1 (en) * | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
| US6501100B1 (en) | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
| EP1206802B1 (en) * | 2000-05-29 | 2008-03-19 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Led-based white-light emitting lighting unit |
| JP4386693B2 (en) | 2000-05-31 | 2009-12-16 | パナソニック株式会社 | LED lamp and lamp unit |
| US6577073B2 (en) | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| JP2001345485A (en) | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | Light emitting device |
| US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
| JP3589187B2 (en) | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | Method for forming light emitting device |
| JP2002076443A (en) | 2000-08-29 | 2002-03-15 | Citizen Electronics Co Ltd | Reflection cup for led chip |
| US6636003B2 (en) | 2000-09-06 | 2003-10-21 | Spectrum Kinetics | Apparatus and method for adjusting the color temperature of white semiconduct or light emitters |
| JP2002141556A (en) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | Light emitting diode with improved light extraction efficiency |
| US6490104B1 (en) * | 2000-09-15 | 2002-12-03 | Three-Five Systems, Inc. | Illumination system for a micro display |
| JP3466144B2 (en) | 2000-09-22 | 2003-11-10 | 士郎 酒井 | How to roughen the surface of a semiconductor |
| JP3609709B2 (en) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | Light emitting diode |
| US6998281B2 (en) | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
| US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
| US6642666B1 (en) | 2000-10-20 | 2003-11-04 | Gelcore Company | Method and device to emulate a railway searchlight signal with light emitting diodes |
| JP3938908B2 (en) | 2000-10-20 | 2007-06-27 | 仗祐 中田 | Light-emitting or light-receiving semiconductor device and manufacturing method thereof |
| JP2002133938A (en) | 2000-10-24 | 2002-05-10 | Toyoda Gosei Co Ltd | Fluorescent luminaire |
| JP2002150821A (en) | 2000-11-06 | 2002-05-24 | Citizen Electronics Co Ltd | Flat light source |
| US6441558B1 (en) | 2000-12-07 | 2002-08-27 | Koninklijke Philips Electronics N.V. | White LED luminary light control system |
| JP5110744B2 (en) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Light emitting device and manufacturing method thereof |
| AT410266B (en) | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | LIGHT SOURCE WITH A LIGHT-EMITTING ELEMENT |
| US20020087532A1 (en) | 2000-12-29 | 2002-07-04 | Steven Barritz | Cooperative, interactive, heuristic system for the creation and ongoing modification of categorization systems |
| US6930737B2 (en) | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
| US6624350B2 (en) | 2001-01-18 | 2003-09-23 | Arise Technologies Corporation | Solar power management system |
| JP2002217450A (en) | 2001-01-22 | 2002-08-02 | Sanken Electric Co Ltd | Semiconductor light-emitting device and method of manufacturing the same |
| MY131962A (en) | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| JP3636079B2 (en) | 2001-01-26 | 2005-04-06 | 日亜化学工業株式会社 | Package molded body and light emitting device |
| US6850515B2 (en) | 2001-01-30 | 2005-02-01 | The Regents Of The University Of California | Optical layer multicasting using a single sub-carrier header and a multicast switch with active header insertion via light circulation |
| US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6601984B2 (en) | 2001-02-14 | 2003-08-05 | Estec Co., Ltd. | LED illuminating device and lighting apparatus employing the same |
| JP2002261333A (en) | 2001-03-05 | 2002-09-13 | Toyoda Gosei Co Ltd | Light-emitting device |
| JP3830083B2 (en) | 2001-03-07 | 2006-10-04 | スタンレー電気株式会社 | Semiconductor device and manufacturing method thereof |
| JP4066608B2 (en) | 2001-03-16 | 2008-03-26 | 日亜化学工業株式会社 | Package molded body and manufacturing method thereof |
| JP4430264B2 (en) | 2001-03-19 | 2010-03-10 | 日亜化学工業株式会社 | Surface mount light emitting device |
| JP2002278674A (en) | 2001-03-21 | 2002-09-27 | Polymatech Co Ltd | Highly recyclable keypad with key top and method for separating the same |
| JP2003115204A (en) | 2001-10-04 | 2003-04-18 | Toyoda Gosei Co Ltd | Shading reflection type device and light source |
| JP2002289923A (en) | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
| US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
| JP2002299699A (en) | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | Light-emitting device and method of manufacturing the same |
| JP4101468B2 (en) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | Method for manufacturing light emitting device |
| DE10216008A1 (en) | 2001-04-12 | 2002-10-24 | Toyoda Gosei Kk | Led lamp |
| EP1253373A3 (en) | 2001-04-24 | 2005-03-16 | Mitsui Chemicals, Inc. | Lamp reflector and reflector |
| US6685852B2 (en) * | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
| US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
| JP2002344029A (en) * | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | Method of adjusting color tone of light-emitting diode |
| US6616862B2 (en) | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
| JP3767420B2 (en) | 2001-05-29 | 2006-04-19 | 豊田合成株式会社 | Light emitting element |
| US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
| US6878972B2 (en) | 2001-06-08 | 2005-04-12 | Agilent Technologies, Inc. | Light-emitting diode with plastic reflector cup |
| JP4789350B2 (en) | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | Manufacturing method of light emitting diode |
| US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
| US6576488B2 (en) | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
| JP4098568B2 (en) | 2001-06-25 | 2008-06-11 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
| US6758587B2 (en) | 2001-06-25 | 2004-07-06 | Grote Industries, Inc. | Light emitting diode license lamp with reflector |
| JP2003017756A (en) | 2001-06-28 | 2003-01-17 | Toyoda Gosei Co Ltd | Light emitting diode |
| US6578986B2 (en) | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
| JP3548735B2 (en) * | 2001-06-29 | 2004-07-28 | 士郎 酒井 | Method of manufacturing gallium nitride based compound semiconductor |
| JP2003036707A (en) | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | Lighting device and its manufacturing method |
| US20030030063A1 (en) * | 2001-07-27 | 2003-02-13 | Krzysztof Sosniak | Mixed color leds for auto vanity mirrors and other applications where color differentiation is critical |
| JP2003046117A (en) | 2001-07-30 | 2003-02-14 | Kyocera Corp | Method for manufacturing semiconductor light-emitting element |
| JP4147755B2 (en) | 2001-07-31 | 2008-09-10 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| DE10137042A1 (en) * | 2001-07-31 | 2003-02-20 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Planar light source based on LED |
| US6737681B2 (en) | 2001-08-22 | 2004-05-18 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
| CN100477297C (en) | 2001-08-23 | 2009-04-08 | 奥村幸康 | Color temperature-regulable LED lamp |
| US6926435B2 (en) | 2001-08-23 | 2005-08-09 | Wavien, Inc. | Led illumination engine using a reflector |
| JP3645207B2 (en) | 2001-09-03 | 2005-05-11 | 日亜化学工業株式会社 | Light emitting diode |
| JP3749243B2 (en) | 2001-09-03 | 2006-02-22 | 松下電器産業株式会社 | Semiconductor light emitting device, light emitting apparatus, and method for manufacturing semiconductor light emitting device |
| US7331681B2 (en) | 2001-09-07 | 2008-02-19 | Litepanels Llc | Lighting apparatus with adjustable lenses or filters |
| TW506145B (en) | 2001-10-04 | 2002-10-11 | United Epitaxy Co Ltd | High Luminescence LED having transparent substrate flip-chip type LED die |
| US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
| US7264366B2 (en) * | 2001-10-18 | 2007-09-04 | Ilight Technologies, Inc. | Illumination device for simulating neon or similar lighting using phosphorescent dye |
| US7858403B2 (en) | 2001-10-31 | 2010-12-28 | Cree, Inc. | Methods and systems for fabricating broad spectrum light emitting devices |
| US6734465B1 (en) | 2001-11-19 | 2004-05-11 | Nanocrystals Technology Lp | Nanocrystalline based phosphors and photonic structures for solid state lighting |
| TW574523B (en) * | 2001-11-23 | 2004-02-01 | Ind Tech Res Inst | Color filter of liquid crystal display |
| US6784462B2 (en) | 2001-12-13 | 2004-08-31 | Rensselaer Polytechnic Institute | Light-emitting diode with planar omni-directional reflector |
| US6571064B1 (en) | 2001-12-17 | 2003-05-27 | Concord Camera Corp. | LED reflector device |
| US6552495B1 (en) * | 2001-12-19 | 2003-04-22 | Koninklijke Philips Electronics N.V. | Adaptive control system and method with spatial uniform color metric for RGB LED based white light illumination |
| US6851834B2 (en) * | 2001-12-21 | 2005-02-08 | Joseph A. Leysath | Light emitting diode lamp having parabolic reflector and diffuser |
| JP4077312B2 (en) | 2001-12-28 | 2008-04-16 | 株式会社東芝 | LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE |
| TW520616B (en) | 2001-12-31 | 2003-02-11 | Ritdisplay Corp | Manufacturing method of organic surface light emitting device |
| US7153015B2 (en) | 2001-12-31 | 2006-12-26 | Innovations In Optics, Inc. | Led white light optical system |
| JP3802424B2 (en) | 2002-01-15 | 2006-07-26 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
| JP3782357B2 (en) | 2002-01-18 | 2006-06-07 | 株式会社東芝 | Manufacturing method of semiconductor light emitting device |
| US6635503B2 (en) | 2002-01-28 | 2003-10-21 | Cree, Inc. | Cluster packaging of light emitting diodes |
| JP4207781B2 (en) | 2002-01-28 | 2009-01-14 | 日亜化学工業株式会社 | Nitride semiconductor device having supporting substrate and method for manufacturing the same |
| JP2003234509A (en) | 2002-02-08 | 2003-08-22 | Citizen Electronics Co Ltd | Light emitting diode |
| US20030153861A1 (en) | 2002-02-11 | 2003-08-14 | Royer George R. | Wound treatment bandage |
| US6644841B2 (en) | 2002-03-01 | 2003-11-11 | Gelcore Llc | Light emitting diode reflector |
| SG173925A1 (en) | 2002-03-22 | 2011-09-29 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
| US7093958B2 (en) | 2002-04-09 | 2006-08-22 | Osram Sylvania Inc. | LED light source assembly |
| DE10216394B3 (en) | 2002-04-12 | 2004-01-08 | Osram Opto Semiconductors Gmbh | LED module |
| TW546854B (en) | 2002-05-21 | 2003-08-11 | Harvatek Corp | White light emitting device |
| JP2003347601A (en) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Light emitting diode illuminator |
| US20030222268A1 (en) | 2002-05-31 | 2003-12-04 | Yocom Perry Niel | Light sources having a continuous broad emission wavelength and phosphor compositions useful therefor |
| JP2003017755A (en) | 2002-06-13 | 2003-01-17 | Nichia Chem Ind Ltd | Light emitting device |
| US20040012027A1 (en) * | 2002-06-13 | 2004-01-22 | Cree Lighting Company | Saturated phosphor solid state emitter |
| JP2004031856A (en) | 2002-06-28 | 2004-01-29 | Sumitomo Electric Ind Ltd | ZnSe-BASED LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD |
| US8100552B2 (en) | 2002-07-12 | 2012-01-24 | Yechezkal Evan Spero | Multiple light-source illuminating system |
| JP2004055772A (en) | 2002-07-18 | 2004-02-19 | Citizen Electronics Co Ltd | Led light emitting device |
| US20040021299A1 (en) * | 2002-08-02 | 2004-02-05 | Tsai Ruey Yun | Folding device for wheelchair |
| JP4360788B2 (en) * | 2002-08-29 | 2009-11-11 | シチズン電子株式会社 | Backlight for liquid crystal display panel and method of manufacturing light emitting diode used therefor |
| KR100697803B1 (en) | 2002-08-29 | 2007-03-20 | 시로 사카이 | Light-emitting device having light-emitting elements |
| US7768189B2 (en) * | 2004-08-02 | 2010-08-03 | Lumination Llc | White LEDs with tunable CRI |
| US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
| JP3991961B2 (en) | 2002-09-05 | 2007-10-17 | 日亜化学工業株式会社 | Side-emitting type light emitting device |
| JP4349782B2 (en) | 2002-09-11 | 2009-10-21 | 東芝ライテック株式会社 | LED lighting device |
| KR101182041B1 (en) | 2002-09-19 | 2012-09-11 | 크리 인코포레이티드 | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor |
| TW546859B (en) | 2002-09-20 | 2003-08-11 | Formosa Epitaxy Inc | Structure and manufacturing method of GaN light emitting diode |
| JP2004119839A (en) | 2002-09-27 | 2004-04-15 | Toshiba Corp | Optical semiconductor device and its manufacturing method |
| US6744077B2 (en) | 2002-09-27 | 2004-06-01 | Lumileds Lighting U.S., Llc | Selective filtering of wavelength-converted semiconductor light emitting devices |
| JP2004127988A (en) | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | White light emitting device |
| US6784460B2 (en) | 2002-10-10 | 2004-08-31 | Agilent Technologies, Inc. | Chip shaping for flip-chip light emitting diode |
| US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| US6957899B2 (en) | 2002-10-24 | 2005-10-25 | Hongxing Jiang | Light emitting diodes for high AC voltage operation and general lighting |
| US7213942B2 (en) | 2002-10-24 | 2007-05-08 | Ac Led Lighting, L.L.C. | Light emitting diodes for high AC voltage operation and general lighting |
| JP4277508B2 (en) | 2002-10-28 | 2009-06-10 | パナソニック電工株式会社 | Semiconductor light emitting device |
| DE10250383B4 (en) | 2002-10-29 | 2007-05-10 | Diemount Gmbh | Light-emitting diode arrangement with reflector |
| TW200414572A (en) | 2002-11-07 | 2004-08-01 | Matsushita Electric Ind Co Ltd | LED lamp |
| US6880954B2 (en) * | 2002-11-08 | 2005-04-19 | Smd Software, Inc. | High intensity photocuring system |
| US6840654B2 (en) | 2002-11-20 | 2005-01-11 | Acolyte Technologies Corp. | LED light and reflector |
| TW569479B (en) | 2002-12-20 | 2004-01-01 | Ind Tech Res Inst | White-light LED applying omnidirectional reflector |
| US6871982B2 (en) * | 2003-01-24 | 2005-03-29 | Digital Optics International Corporation | High-density illumination system |
| JP2004253364A (en) | 2003-01-27 | 2004-09-09 | Matsushita Electric Ind Co Ltd | Lighting system |
| US7091653B2 (en) | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector |
| US7091661B2 (en) * | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a reflective polarizer |
| JP2004238441A (en) | 2003-02-04 | 2004-08-26 | Nitto Denko Corp | Optical semiconductor element sealing resin |
| US7042020B2 (en) | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
| US6936857B2 (en) | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
| JP2004253309A (en) | 2003-02-21 | 2004-09-09 | Nichia Chem Ind Ltd | Special purpose led illumination with color rendering properties |
| WO2004077580A2 (en) * | 2003-02-26 | 2004-09-10 | Cree, Inc. | White light source using emitting diode and phosphor and method of fabrication |
| JP2004266124A (en) | 2003-03-03 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
| US20040184270A1 (en) | 2003-03-17 | 2004-09-23 | Halter Michael A. | LED light module with micro-reflector cavities |
| US20040218387A1 (en) | 2003-03-18 | 2004-11-04 | Robert Gerlach | LED lighting arrays, fixtures and systems and method for determining human color perception |
| JP4504662B2 (en) | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | LED lamp |
| US6964507B2 (en) | 2003-04-25 | 2005-11-15 | Everbrite, Llc | Sign illumination system |
| KR101148332B1 (en) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | High powered light emitter packages with compact optics |
| US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| WO2004100611A1 (en) | 2003-05-06 | 2004-11-18 | Ilumera Group Ag | Led lighting module and system |
| US6968640B2 (en) | 2003-05-09 | 2005-11-29 | Kil Suo Lee | Half mirror reflector having LED road sign |
| US7040774B2 (en) | 2003-05-23 | 2006-05-09 | Goldeneye, Inc. | Illumination systems utilizing multiple wavelength light recycling |
| JP2004356116A (en) | 2003-05-26 | 2004-12-16 | Citizen Electronics Co Ltd | Light emitting diode |
| JP4399663B2 (en) | 2003-06-06 | 2010-01-20 | スタンレー電気株式会社 | LED lighting device |
| US6976769B2 (en) | 2003-06-11 | 2005-12-20 | Cool Options, Inc. | Light-emitting diode reflector assembly having a heat pipe |
| JP3878579B2 (en) | 2003-06-11 | 2007-02-07 | ローム株式会社 | Optical semiconductor device |
| US7000999B2 (en) | 2003-06-12 | 2006-02-21 | Ryan Jr Patrick Henry | Light emitting module |
| JP2005005482A (en) | 2003-06-12 | 2005-01-06 | Citizen Electronics Co Ltd | Led light emitting device and color display device using the same |
| US7906790B2 (en) | 2003-06-24 | 2011-03-15 | GE Lighting Solutions, LLC | Full spectrum phosphor blends for white light generation with LED chips |
| WO2005013365A2 (en) | 2003-07-30 | 2005-02-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting module, and lighting apparatus |
| DE10335077A1 (en) | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | LED module |
| JP3969660B2 (en) | 2003-08-05 | 2007-09-05 | スタンレー電気株式会社 | White LED lamp |
| US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| JP4140042B2 (en) * | 2003-09-17 | 2008-08-27 | スタンレー電気株式会社 | LED light source device using phosphor and vehicle headlamp using LED light source device |
| US7329024B2 (en) * | 2003-09-22 | 2008-02-12 | Permlight Products, Inc. | Lighting apparatus |
| JP2005101296A (en) | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | Device, module, and lighting apparatus of variable color light emitting diode |
| US6972438B2 (en) | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
| JP2005109212A (en) | 2003-09-30 | 2005-04-21 | Stanley Electric Co Ltd | Semiconductor light emitting device |
| DE10347463A1 (en) | 2003-10-02 | 2005-04-21 | Pintsch Bamag Ag | LED signal light for railway vehicles has first (white), second (green), third (yellow) and fourth (red) LEDs that radiate simultaneously in while light mode |
| JP2005116363A (en) | 2003-10-08 | 2005-04-28 | Pioneer Plasma Display Corp | Plasma display panel |
| US7102172B2 (en) | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
| US20050082562A1 (en) * | 2003-10-15 | 2005-04-21 | Epistar Corporation | High efficiency nitride based light emitting device |
| JP4458804B2 (en) * | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | White LED |
| US6841804B1 (en) | 2003-10-27 | 2005-01-11 | Formosa Epitaxy Incorporation | Device of white light-emitting diode |
| JP4590905B2 (en) | 2003-10-31 | 2010-12-01 | 豊田合成株式会社 | Light emitting element and light emitting device |
| US7070301B2 (en) | 2003-11-04 | 2006-07-04 | 3M Innovative Properties Company | Side reflector for illumination using light emitting diode |
| JP2005142311A (en) | 2003-11-06 | 2005-06-02 | Tzu-Chi Cheng | Light-emitting device |
| JP2005144679A (en) | 2003-11-11 | 2005-06-09 | Roland Dg Corp | Inkjet printer |
| JP4047266B2 (en) | 2003-11-19 | 2008-02-13 | 株式会社小糸製作所 | Lamp |
| KR100669408B1 (en) * | 2003-11-24 | 2007-01-15 | 삼성에스디아이 주식회사 | Plasma display panel |
| TWI263356B (en) | 2003-11-27 | 2006-10-01 | Kuen-Juei Li | Light-emitting device |
| JP2005166937A (en) | 2003-12-02 | 2005-06-23 | Toyoda Gosei Co Ltd | Light emitting device |
| JP2005167079A (en) | 2003-12-04 | 2005-06-23 | Toyoda Gosei Co Ltd | Light emitting device |
| KR100731454B1 (en) | 2003-12-05 | 2007-06-21 | 미츠비시덴키 가부시키가이샤 | Light emitting device and illumination instrument using the same |
| US7095056B2 (en) | 2003-12-10 | 2006-08-22 | Sensor Electronic Technology, Inc. | White light emitting device and method |
| US7281818B2 (en) | 2003-12-11 | 2007-10-16 | Dialight Corporation | Light reflector device for light emitting diode (LED) array |
| JP4289144B2 (en) | 2003-12-15 | 2009-07-01 | シチズン電子株式会社 | Light emitting diode |
| US7066623B2 (en) | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
| JP4637478B2 (en) | 2003-12-26 | 2011-02-23 | 日本パイオニクス株式会社 | Vapor growth equipment |
| JP4530739B2 (en) | 2004-01-29 | 2010-08-25 | 京セラ株式会社 | Light emitting element mounting substrate and light emitting device |
| WO2005078338A1 (en) | 2004-02-17 | 2005-08-25 | Kelly William M | A utility lamp |
| JP2005268770A (en) | 2004-02-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | White light emitting element and white light source |
| US7250715B2 (en) | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
| JP2005243973A (en) | 2004-02-26 | 2005-09-08 | Kyocera Corp | Light-emitting device and luminaire |
| US7261441B2 (en) | 2004-02-27 | 2007-08-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED device and method for directing LED light |
| EP1571715A1 (en) | 2004-03-04 | 2005-09-07 | Nan Ya Plastics Corporation | Method for producing white light emission by means of secondary light exitation and its product |
| US7256557B2 (en) | 2004-03-11 | 2007-08-14 | Avago Technologies General Ip(Singapore) Pte. Ltd. | System and method for producing white light using a combination of phosphor-converted white LEDs and non-phosphor-converted color LEDs |
| US7009343B2 (en) * | 2004-03-11 | 2006-03-07 | Kevin Len Li Lim | System and method for producing white light using LEDs |
| JP2005266124A (en) | 2004-03-17 | 2005-09-29 | Sharp Corp | Powder discharging apparatus and image forming apparatus |
| US7009285B2 (en) | 2004-03-19 | 2006-03-07 | Lite-On Technology Corporation | Optoelectronic semiconductor component |
| US7083302B2 (en) | 2004-03-24 | 2006-08-01 | J. S. Technology Co., Ltd. | White light LED assembly |
| US7517728B2 (en) | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| JP2005294736A (en) | 2004-04-05 | 2005-10-20 | Stanley Electric Co Ltd | Manufacturing method for semiconductor light emitting device |
| JP4665209B2 (en) | 2004-04-15 | 2011-04-06 | スタンレー電気株式会社 | Flat illumination LED |
| JP4128564B2 (en) | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | Light emitting device |
| US20050243556A1 (en) | 2004-04-30 | 2005-11-03 | Manuel Lynch | Lighting system and method |
| US7837348B2 (en) * | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
| KR101433343B1 (en) * | 2004-05-05 | 2014-08-22 | 렌슬러 폴리테크닉 인스티튜트 | High efficiency light source using solid-state emitter and down-conversion material |
| US7315119B2 (en) | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
| US8188503B2 (en) | 2004-05-10 | 2012-05-29 | Permlight Products, Inc. | Cuttable illuminated panel |
| KR100658700B1 (en) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Light emitting device with RGB diodes and phosphor converter |
| US7278760B2 (en) | 2004-05-24 | 2007-10-09 | Osram Opto Semiconductor Gmbh | Light-emitting electronic component |
| JP2005353816A (en) | 2004-06-10 | 2005-12-22 | Olympus Corp | Light emitting device, method for manufacturing the same, illuminant using the same, and projector |
| KR100665298B1 (en) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | Light emitting device |
| JP2008503087A (en) | 2004-06-18 | 2008-01-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED with improved light emissivity profile |
| CN100411207C (en) | 2004-06-28 | 2008-08-13 | 京瓷株式会社 | Light emitting device and lighting device |
| US7255469B2 (en) | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
| TWI299914B (en) | 2004-07-12 | 2008-08-11 | Epistar Corp | Light emitting diode with transparent electrically conductive layer and omni directional reflector |
| TWI274209B (en) * | 2004-07-16 | 2007-02-21 | Chi Lin Technology Co Ltd | Light emitting diode and backlight module having light emitting diode |
| JP2006036930A (en) | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | Resin for encapsulating optical semiconductor element |
| US20060181192A1 (en) | 2004-08-02 | 2006-08-17 | Gelcore | White LEDs with tailorable color temperature |
| US7453195B2 (en) | 2004-08-02 | 2008-11-18 | Lumination Llc | White lamps with enhanced color contrast |
| JP4817629B2 (en) | 2004-09-15 | 2011-11-16 | 京セラ株式会社 | LIGHT EMITTING ELEMENT AND LIGHTING DEVICE USING THE LIGHT EMITTING ELEMENT |
| US7135664B2 (en) | 2004-09-08 | 2006-11-14 | Emteq Lighting and Cabin Systems, Inc. | Method of adjusting multiple light sources to compensate for variation in light output that occurs with time |
| KR100524098B1 (en) * | 2004-09-10 | 2005-10-26 | 럭스피아 주식회사 | Semiconductor device capable of emitting light and the menufacturing mehtod of the same |
| US20060056169A1 (en) | 2004-09-10 | 2006-03-16 | Pervaiz Lodhie | Light module using led clusters |
| US7737459B2 (en) * | 2004-09-22 | 2010-06-15 | Cree, Inc. | High output group III nitride light emitting diodes |
| US8513686B2 (en) | 2004-09-22 | 2013-08-20 | Cree, Inc. | High output small area group III nitride LEDs |
| US8174037B2 (en) | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
| US7249877B2 (en) | 2004-09-23 | 2007-07-31 | Osram Sylvania Inc. | Led lamp bulb assembly and reflector system |
| US7633097B2 (en) * | 2004-09-23 | 2009-12-15 | Philips Lumileds Lighting Company, Llc | Growth of III-nitride light emitting devices on textured substrates |
| US7144131B2 (en) | 2004-09-29 | 2006-12-05 | Advanced Optical Technologies, Llc | Optical system using LED coupled with phosphor-doped reflective materials |
| DE102004047766C5 (en) * | 2004-09-30 | 2014-02-27 | Osram Opto Semiconductors Gmbh | lighting device |
| US20060067073A1 (en) * | 2004-09-30 | 2006-03-30 | Chu-Chi Ting | White led device |
| KR20060030350A (en) | 2004-10-05 | 2006-04-10 | 삼성전자주식회사 | White light generating unit, backlight assembly having the same and liquid crystal display apparatus having the same |
| US7125160B2 (en) | 2004-10-29 | 2006-10-24 | Applied Innovative Technologies, Inc. | Led light collection and uniform transmission system using a conical reflector with a roughed up inner surface |
| US7462502B2 (en) | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
| US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
| US7344902B2 (en) | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| US20060113548A1 (en) | 2004-11-29 | 2006-06-01 | Ching-Chung Chen | Light emitting diode |
| US20060120073A1 (en) | 2004-12-06 | 2006-06-08 | Pickard Paul K | Emergency ballast |
| CN101073155B (en) | 2004-12-06 | 2010-09-29 | 皇家飞利浦电子股份有限公司 | Single chip LED as compact color variable light source |
| US8288942B2 (en) | 2004-12-28 | 2012-10-16 | Cree, Inc. | High efficacy white LED |
| TWI239671B (en) | 2004-12-30 | 2005-09-11 | Ind Tech Res Inst | LED applied with omnidirectional reflector |
| US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| US7413918B2 (en) | 2005-01-11 | 2008-08-19 | Semileds Corporation | Method of making a light emitting diode |
| US7221044B2 (en) | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
| JP2006216717A (en) | 2005-02-02 | 2006-08-17 | Harvatek Corp | Wafer level electro-optical semiconductor assembly structure and its manufacturing method |
| JP4715227B2 (en) | 2005-02-21 | 2011-07-06 | パナソニック株式会社 | Manufacturing method of semiconductor light emitting device |
| US7465075B2 (en) | 2005-03-21 | 2008-12-16 | Visteon Global Technologies, Inc. | Lens assembly for an automobile light assembly having LED light source |
| US20080296589A1 (en) | 2005-03-24 | 2008-12-04 | Ingo Speier | Solid-State Lighting Device Package |
| US7358954B2 (en) | 2005-04-04 | 2008-04-15 | Cree, Inc. | Synchronized light emitting diode backlighting systems and methods for displays |
| US8101498B2 (en) | 2005-04-21 | 2012-01-24 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| US20060245184A1 (en) | 2005-04-29 | 2006-11-02 | Galli Robert D | Iris diffuser for adjusting light beam properties |
| US7918591B2 (en) * | 2005-05-13 | 2011-04-05 | Permlight Products, Inc. | LED-based luminaire |
| TWM277882U (en) * | 2005-05-31 | 2005-10-11 | Sheng-Li Yang | Diffusion type light source structure |
| JP2006339362A (en) | 2005-06-01 | 2006-12-14 | Ngk Spark Plug Co Ltd | Wiring board for mounting light emitting element |
| CN101138104B (en) | 2005-06-23 | 2011-08-24 | 伦斯勒工业学院 | Package design for producing white light with short-wavelength leds and down-conversion materials |
| US7382091B2 (en) | 2005-07-27 | 2008-06-03 | Lung-Chien Chen | White light emitting diode using phosphor excitation |
| TW200717866A (en) | 2005-07-29 | 2007-05-01 | Toshiba Kk | Semiconductor light emitting device |
| JP2007067326A (en) | 2005-09-02 | 2007-03-15 | Shinko Electric Ind Co Ltd | Light emitting diode and method of manufacturing same |
| JP2007080885A (en) | 2005-09-09 | 2007-03-29 | New Japan Chem Co Ltd | Optical semiconductor sealing agent, optical semiconductor and its manufacturing method |
| US7293908B2 (en) | 2005-10-18 | 2007-11-13 | Goldeneye, Inc. | Side emitting illumination systems incorporating light emitting diodes |
| JP2007122950A (en) | 2005-10-26 | 2007-05-17 | Fujikura Ltd | Lighting system |
| US7718449B2 (en) | 2005-10-28 | 2010-05-18 | Lumination Llc | Wafer level package for very small footprint and low profile white LED devices |
| US7959325B2 (en) | 2005-11-18 | 2011-06-14 | Cree, Inc. | Solid state lighting units and methods of forming solid state lighting units |
| JP2007141737A (en) | 2005-11-21 | 2007-06-07 | Sharp Corp | Lighting system, liquid crystal display device, control method of lighting system, lighting system control program and recording medium |
| US7514721B2 (en) | 2005-11-29 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Luminescent ceramic element for a light emitting device |
| TWI421438B (en) | 2005-12-21 | 2014-01-01 | 克里公司 | Lighting device |
| EP2372224A3 (en) | 2005-12-21 | 2012-08-01 | Cree, Inc. | Lighting Device and Lighting Method |
| US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
| US8112921B2 (en) | 2005-12-21 | 2012-02-14 | Cree, Inc. | Sign and method for lighting |
| JP2009527071A (en) * | 2005-12-22 | 2009-07-23 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device |
| WO2007073001A1 (en) | 2005-12-22 | 2007-06-28 | Showa Denko K.K. | Light-emitting diode and method for fabricant thereof |
| JP2007180430A (en) | 2005-12-28 | 2007-07-12 | Toshiba Lighting & Technology Corp | Light-emitting diode device |
| KR101408622B1 (en) | 2006-01-20 | 2014-06-17 | 크리, 인코포레이티드 | Shifting spectral content in solid state light emitters by spatially separating lumiphor films |
| US7852009B2 (en) | 2006-01-25 | 2010-12-14 | Cree, Inc. | Lighting device circuit with series-connected solid state light emitters and current regulator |
| US7682850B2 (en) | 2006-03-17 | 2010-03-23 | Philips Lumileds Lighting Company, Llc | White LED for backlight with phosphor plates |
| US7364338B2 (en) | 2006-03-29 | 2008-04-29 | Tpo Displays Corp. | Systems for providing backlight module with stacked light source |
| JP2007273763A (en) | 2006-03-31 | 2007-10-18 | Sony Corp | Semiconductor device and its manufacturing method |
| US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
| TWI460880B (en) | 2006-04-18 | 2014-11-11 | Cree Inc | Lighting device and lighting method |
| US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
| EP2008019B1 (en) | 2006-04-20 | 2015-08-05 | Cree, Inc. | Lighting device and lighting method |
| US7625103B2 (en) | 2006-04-21 | 2009-12-01 | Cree, Inc. | Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods |
| US7648257B2 (en) | 2006-04-21 | 2010-01-19 | Cree, Inc. | Light emitting diode packages |
| US7777166B2 (en) | 2006-04-21 | 2010-08-17 | Cree, Inc. | Solid state luminaires for general illumination including closed loop feedback control |
| CN102437152A (en) | 2006-04-24 | 2012-05-02 | 克利公司 | Side-view surface mount white LED |
| US7722220B2 (en) | 2006-05-05 | 2010-05-25 | Cree Led Lighting Solutions, Inc. | Lighting device |
| EP2027412B1 (en) | 2006-05-23 | 2018-07-04 | Cree, Inc. | Lighting device |
| EP2027602A4 (en) | 2006-05-23 | 2012-11-28 | Cree Inc | Lighting device and method of making |
| WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
| CN101573843B (en) | 2006-05-31 | 2012-09-12 | 科锐公司 | Lighting device and method of lighting |
| KR20140116536A (en) | 2006-05-31 | 2014-10-02 | 크리, 인코포레이티드 | Lighting device and method of lighting |
| EP2035745B1 (en) | 2006-05-31 | 2020-04-29 | IDEAL Industries Lighting LLC | Lighting device with color control, and method of lighting |
| US8080828B2 (en) | 2006-06-09 | 2011-12-20 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED with window layer and phosphor layer |
| US7703945B2 (en) | 2006-06-27 | 2010-04-27 | Cree, Inc. | Efficient emitting LED package and method for efficiently emitting light |
| EP2060155A2 (en) | 2006-08-23 | 2009-05-20 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
| US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| EP2573923B1 (en) | 2006-09-13 | 2019-04-03 | Cree, Inc. | Circuit for supplying electrical power |
| EP2066968B1 (en) | 2006-09-18 | 2016-04-27 | Cree, Inc. | Lighting devices, lighting assemblies, fixtures and methods using same |
| EP2076712B1 (en) | 2006-09-21 | 2020-08-12 | IDEAL Industries Lighting LLC | Lighting assembly, method of installing same, and method of removing same |
| JP5351034B2 (en) | 2006-10-12 | 2013-11-27 | クリー インコーポレイテッド | LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF |
| CN101595342B (en) | 2006-10-23 | 2012-10-24 | 科锐公司 | Lighting devices and methods of installing light engine housings and/or trim elements in lighting device housings |
| US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| TWI496315B (en) | 2006-11-13 | 2015-08-11 | Cree Inc | Lighting device, illuminated enclosure and lighting methods |
| US8439531B2 (en) | 2006-11-14 | 2013-05-14 | Cree, Inc. | Lighting assemblies and components for lighting assemblies |
| EP2095014B1 (en) | 2006-11-14 | 2017-05-10 | Cree, Inc. | Light engine assemblies |
| US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| WO2008067441A1 (en) | 2006-11-30 | 2008-06-05 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| WO2008067515A1 (en) | 2006-11-30 | 2008-06-05 | Cree Led Lighting Solutions, Inc. | Light fixtures, lighting devices, and components for the same |
| WO2008073794A1 (en) | 2006-12-07 | 2008-06-19 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| EP3223313B1 (en) | 2007-01-22 | 2021-04-14 | Cree, Inc. | Monolithic light emitter having multiple light emitting sub-devices |
| CN101652861B (en) | 2007-01-22 | 2013-01-23 | 科锐公司 | Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters |
| US8258682B2 (en) | 2007-02-12 | 2012-09-04 | Cree, Inc. | High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods |
| US7815341B2 (en) | 2007-02-14 | 2010-10-19 | Permlight Products, Inc. | Strip illumination device |
| CN101657671B (en) | 2007-02-22 | 2012-07-11 | 科锐公司 | Lighting devices, methods of lighting, light filters and methods of filtering light |
| US7824070B2 (en) | 2007-03-22 | 2010-11-02 | Cree, Inc. | LED lighting fixture |
| US7967480B2 (en) | 2007-05-03 | 2011-06-28 | Cree, Inc. | Lighting fixture |
| CN101680638B (en) | 2007-05-07 | 2015-07-29 | 科锐公司 | Light fixture |
| BRPI0811561A2 (en) | 2007-05-08 | 2015-06-16 | Cree Led Lighting Solutions | Lighting device and lighting method |
| EP2142843B1 (en) | 2007-05-08 | 2016-12-14 | Cree, Inc. | Lighting device and lighting method |
| KR20100022969A (en) | 2007-05-08 | 2010-03-03 | 크리 엘이디 라이팅 솔루션즈, 인크. | Lighting device and lighting method |
| WO2008137984A1 (en) | 2007-05-08 | 2008-11-13 | Cree Led Lighting Solutions, Inc. | Lighting devices and methods for lighting |
| EP2156090B1 (en) | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
| EP2142844B1 (en) | 2007-05-08 | 2017-08-23 | Cree, Inc. | Lighting device and lighting method |
| JP4458116B2 (en) | 2007-05-30 | 2010-04-28 | 住友電気工業株式会社 | Group III nitride semiconductor layer bonded substrate for epitaxial layer growth and semiconductor device |
| US8042971B2 (en) * | 2007-06-27 | 2011-10-25 | Cree, Inc. | Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods |
| US20090173958A1 (en) | 2008-01-04 | 2009-07-09 | Cree, Inc. | Light emitting devices with high efficiency phospor structures |
| US8740400B2 (en) | 2008-03-07 | 2014-06-03 | Intematix Corporation | White light illumination system with narrow band green phosphor and multiple-wavelength excitation |
| JP5388666B2 (en) * | 2008-04-21 | 2014-01-15 | キヤノン株式会社 | Surface emitting laser |
| US20110018013A1 (en) * | 2009-07-21 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Thin-film flip-chip series connected leds |
-
2006
- 2006-12-21 JP JP2008547566A patent/JP2009527071A/en active Pending
- 2006-12-21 TW TW095148130A patent/TWI396814B/en active
- 2006-12-21 CN CN200680048120.2A patent/CN101351891B/en active Active
- 2006-12-21 BR BRPI0620397-3A patent/BRPI0620397A2/en not_active IP Right Cessation
- 2006-12-21 EP EP06848729.7A patent/EP1969633B1/en active Active
- 2006-12-21 US US11/614,180 patent/US7614759B2/en active Active
- 2006-12-21 WO PCT/US2006/048875 patent/WO2007073496A2/en active Search and Examination
- 2006-12-21 KR KR1020087017800A patent/KR20090009772A/en not_active Application Discontinuation
-
2009
- 2009-09-30 US US12/570,712 patent/US8328376B2/en active Active
-
2011
- 2011-10-18 JP JP2011229011A patent/JP2012054242A/en active Pending
-
2012
- 2012-10-25 US US13/660,131 patent/US8858004B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045206A (en) * | 2001-05-24 | 2003-02-14 | Matsushita Electric Ind Co Ltd | Illuminating light source |
| JP2003249688A (en) * | 2002-02-26 | 2003-09-05 | Sanyo Electric Co Ltd | Light emitting device |
| JP2004056075A (en) * | 2002-05-31 | 2004-02-19 | Stanley Electric Co Ltd | Light-emitting device and method of manufacturing the same |
| JP2004071357A (en) * | 2002-08-06 | 2004-03-04 | Shigeo Fujita | Lighting device |
| JP2005537651A (en) * | 2002-08-30 | 2005-12-08 | ゲルコアー リミテッド ライアビリティ カンパニー | Covered LED with improved efficiency |
| JP2005228996A (en) * | 2004-02-13 | 2005-08-25 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2005332963A (en) * | 2004-05-19 | 2005-12-02 | Shoei Chem Ind Co | Light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070236911A1 (en) | 2007-10-11 |
| EP1969633B1 (en) | 2018-08-29 |
| JP2009527071A (en) | 2009-07-23 |
| US8328376B2 (en) | 2012-12-11 |
| KR20090009772A (en) | 2009-01-23 |
| BRPI0620397A2 (en) | 2011-11-16 |
| WO2007073496A2 (en) | 2007-06-28 |
| US7614759B2 (en) | 2009-11-10 |
| US8858004B2 (en) | 2014-10-14 |
| CN101351891A (en) | 2009-01-21 |
| US20100020532A1 (en) | 2010-01-28 |
| EP1969633A4 (en) | 2012-06-27 |
| WO2007073496A3 (en) | 2008-04-10 |
| EP1969633A2 (en) | 2008-09-17 |
| US20130070442A1 (en) | 2013-03-21 |
| TW200738999A (en) | 2007-10-16 |
| CN101351891B (en) | 2014-11-19 |
| TWI396814B (en) | 2013-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012054242A (en) | Lighting device | |
| US8337071B2 (en) | Lighting device | |
| JP5781730B2 (en) | Illumination device, illuminated enclosure, and illumination method | |
| US7722220B2 (en) | Lighting device | |
| KR101408622B1 (en) | Shifting spectral content in solid state light emitters by spatially separating lumiphor films | |
| JP5171841B2 (en) | Illumination device and illumination method | |
| TWI531277B (en) | Lighting device, enclosure and method of lighting | |
| US8994045B2 (en) | Lighting device having luminescent material between a reflective cup and a solid state light emitter | |
| JP2009538531A (en) | LIGHTING DEVICE AND MANUFACTURING METHOD | |
| JP2010502014A (en) | Lighting device and lighting method | |
| JP2010509788A (en) | LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF | |
| US10379277B2 (en) | Lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130222 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130308 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130530 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130604 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130705 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130726 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131025 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131030 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140120 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140205 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140604 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140612 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20140829 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150812 |