JP2005167079A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2005167079A
JP2005167079A JP2003405983A JP2003405983A JP2005167079A JP 2005167079 A JP2005167079 A JP 2005167079A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2005167079 A JP2005167079 A JP 2005167079A
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light
emitting device
phosphor
led element
silica particles
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JP2005167079A5 (en )
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Masahito Kawamura
Atsushi Tsuzuki
Toshio Yamaguchi
寿夫 山口
雅人 河村
敦 都築
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Toyoda Gosei Co Ltd
豊田合成株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device wherein optical diffusivity is good without complicating manufacturing processes. <P>SOLUTION: The light emitting device is so constituted that a case 6 is sealed with sealing resin 7 in which phosphor 5A and silica particles 5B are mixed, and the phosphor 5A and the silica particles 5B are sedimented based on specific gravity and arranged at the periphery of an LED element 2. As a result, the phosphor 5A is sedimented in the state of variance into the silica particles 5B, and an optical diffusion part 5 can be formed. The silica particles 5B scatter blue light emitted from the LED element 2 and disperse it irregularly into the optical diffusion part 5, so that the phosphor 5A intermingled in the silica particle 5B is excited efficiently. As a result, the consumption of the phosphor which is required for obtaining white light can be reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、発光素子および発光装置に関し、特に、発光素子から放射される光を効率良く外部に取り出すことのできる発光装置に関する。 The present invention relates to a light emitting element and a light emitting device, particularly, to a light emitting device which can extract light emitted from the light emitting element to the outside efficiently.

従来、LED(Light-Emitting Diode:発光ダイオード)素子を光源として使用し、LED素子から放射される光によって蛍光体を励起し、励起された蛍光体から放射される励起光とLED素子から放射される光とを混合することにより生じる波長変換光を放射する発光装置がある。 Conventionally, LED: using (Light-Emitting Diode light emitting diode) device as a light source to excite the phosphor by light emitted from the LED element is emitted from the excitation light and the LED elements emitted from the excited phosphor emitting device is to emit wavelength-converted light generated by mixing the light that.

係る発光装置として、蛍光体と酸化マグネシウムからなる拡散剤をLED素子を覆う樹脂ケースに混入したものがある(例えば、特許文献1参照。)。 As a light-emitting device according, there is obtained by mixing a diffusing agent comprising magnesium oxide and a phosphor in a resin case covering the LED element (for example, see Patent Document 1.).

図4は、特許文献1に記載される発光装置の断面図である、この発光装置10は、リードフレーム11および12と、リードフレーム11に搭載されるLED素子13と、LED素子13から放射される光によって励起される蛍光剤14と、LED素子13から放射される光を拡散する拡散剤16と、リードフレーム11,12、LED素子13、蛍光剤14、および拡散剤16を一体的に覆って封止する砲弾形状の樹脂ケース15とを有して形成されている。 Figure 4 is a cross-sectional view of a light emitting device described in Patent Document 1, the light emitting device 10 includes a lead frame 11 and 12, the LED elements 13 mounted on the lead frame 11, emitted from the LED element 13 a fluorescent material 14 excited by light that, the diffusing agent 16 for diffusing the light emitted from the LED element 13, covers the lead frame 11, 12, LED element 13, a fluorescent material 14, and the diffusing agent 16 integrally and a resin case 15 of the shell-shaped for sealing are formed Te.

この発光装置10によると、樹脂ケース15に混入された拡散剤16がLED素子13から放射される光を拡散するため、蛍光剤14の劣化が抑えられて発光色の変化や光量の低下が生じにくくなり、長時間の使用を可能にすることができる。 According to the light emitting device 10, for diffusing light diffusing agent 16 mixed in the resin case 15 is emitted from the LED element 13, decrease in emission color change or light amount occur deterioration of the fluorescent material 14 is suppressed will Nikuku, it is possible to allow for long-term use.
特許第3065544号公報(図1) Patent No. 3065544 Publication (Fig. 1)

しかし、特許文献1に記載された発光装置によると、安定した長期使用性を実現するには樹脂ケース15内に均一に蛍光剤14および拡散剤16を分散させる必要があるため、樹脂材料、蛍光剤14、および拡散剤16の厳密な混合、および製造管理が必要となって製造工程が煩雑化するという問題がある。 However, according to the light emitting device described in Patent Document 1, a stable order to achieve a long-term use properties, it is necessary to disperse uniformly fluorescent material 14 and the diffusing agent 16 to the resin case 15, a resin material, a fluorescent agent 14, and strict mixing diffusing agent 16, and manufacturing management is required manufacturing process there is a problem that complicated.

従って、本発明の目的は、製造工程を煩雑化することなく、光拡散性が良好な発光装置を提供することにある。 Accordingly, an object of the present invention, without complicating the manufacturing process is that the light diffusion property to provide good light emitting device.

本発明は、上記の目的を達成するため、LED素子を光透過性材料で封止して形成される発光装置において、前記光透過性材料は、粒状の光拡散体と蛍光体とを混合した混合体を含むとともに前記混合体を前記LED素子の周囲に配置した光拡散部を有することを特徴とする発光装置を提供する。 The present invention for achieving the above object, in a light emitting device formed by sealing an LED element of a light transmissive material, the light-transmitting material, a mixture of a light diffuser and a phosphor particulate the mixture with containing mixture to provide a light emitting device characterized by having a light diffusing portion disposed around the LED element.

前記粒状の光拡散体は、前記蛍光体の粒径より小なる粒径を5〜10重量%含むことが好ましい。 Light diffuser of the particulate preferably contains 5 to 10 wt% the particle size small consisting particle size of the phosphor.

前記粒状の光拡散体は、エポキシシランの表面処理を施されたシリカ粒子を用いることができる。 Light diffuser of the particulate may be used silica particles subjected to surface treatment epoxysilane.

また、本発明は、上記の目的を達成するため、青色光を放射するLED素子を光透過性材料で封止して形成される発光装置において、前記光透過性材料は、粒径0.2〜8μmのシリカ粒子を5〜10重量%と、黄色光を放射する粒径10μmの黄色蛍光体を18重量%とを混合した混合体を含むとともに前記混合体を前記LED素子の周囲に配置した光拡散部を有することを特徴とする発光装置を提供する。 Further, the present invention is to achieve the above object, in a light emitting device formed by sealing an LED element that emits blue light of a light transmissive material, the light-transmitting material has a particle size 0.2 and 5-10% by weight of silica particles ~8Myuemu, and placing the mixture with containing mixture obtained by mixing a 18% by weight of yellow fluorescent material of particle size 10μm that emits yellow light around the LED element to provide a light emitting device characterized by having a light diffusing portion.

本発明の発光装置によれば、LED素子の周囲に粒状の光拡散体と蛍光体とを混合した混合体を沈降させることによって光拡散部を形成するため、製造工程を煩雑化せずに良好な光拡散性を発光装置に付与することができる。 According to the light emitting device of the present invention, for forming the light diffusing portion by precipitating mixture prepared by mixing a light diffusing member of the granular and the phosphor around the LED elements, good without complicating the manufacturing process the a light diffusing property can be imparted to the light-emitting device.

また、本発明の発光装置によれば、青色光を放射するLED素子の周囲に粒状の粒径0.2〜8μmのシリカ粒子5〜10重量%と粒径10μmの黄色蛍光体18重量%とを混合した混合体を沈降させることによって光拡散部を形成するため、製造工程を煩雑化せずに良好な光拡散性を発光装置に付与することができる。 Further, according to the light-emitting device of the present invention, a yellow phosphor 18 wt% of silica particles 5 to 10 wt% and a particle size 10μm granular particle size 0.2~8μm around the LED element that emits blue light for forming the light diffusing portion by precipitating mixed mixture and can be imparted to the light-emitting device excellent light diffusibility, without complicating the manufacturing process.

図1は、本発明の第1の実施の形態に係る表面実装型発光装置の断面図である。 Figure 1 is a cross-sectional view of a surface mounted light emitting device according to a first embodiment of the present invention. この発光装置1は、GaN系半導体化合物からなるフリップチップタイプのLED素子2と、LED素子2を外部回路と電気的に接続するための配線パターン3A、3Bを有する基板部3と、LED素子2の電極と配線パターン3A、3Bとを電気的に接続するAuバンプ4と、LED素子2の周囲を覆うように配置される蛍光体5Aおよび光拡散剤としてのシリカ粒子5Bからなる光拡散部5と、光を外部に放射させるように傾斜形状に形成される反射面6Aを有し、アクリル樹脂等の樹脂材料で形成されるケース部6と、ケース部6のLED素子収容部に注入されてLED素子2および光拡散部5を封止する光透過性の封止樹脂7によって構成されている。 The light emitting device 1 includes an LED element 2 of the flip chip type consisting of GaN-based semiconductor compound, the wiring pattern 3A for connecting the LED element 2 to an external circuit electrically, a substrate 3 having a 3B, the LED element 2 electrodes and wiring patterns 3A of the Au bumps 4 for electrically connecting the 3B, the light diffusing portion 5 made of silica particles 5B of the phosphor 5A and the light diffusing agent is disposed to cover the periphery of the LED element 2 When having a reflective surface 6A which is formed in an inclined shape so as to emit light to the outside, the case portion 6 formed of a resin material such as an acrylic resin, is injected into the LED element receiving portion of the case portion 6 It is constituted by LED element 2 and the light diffusion portion 5 optically transparent sealing resin 7 for sealing.

LED素子2は、サファイア基板上に有機金属化合物気相成長法(MOVPE)によってn型層、発光層を含む層、およびp型層を結晶成長させることによって形成されており、発光波長450〜480nmの青色光を主としてサファイア基板側から放射するように形成されている。 LED element 2, n-type layer by metal organic compound vapor phase epitaxy (MOVPE) on a sapphire substrate, is formed by a layer containing a light emitting layer, and a p-type layer that is grown, the emission wavelength 450~480nm the blue light is mainly formed so as to emit from the sapphire substrate side.

基板部3は、ガラスエポキシ材料によって形成されており、銅箔によって外周を覆うように設けられる配線パターン3A、3Bを有している。 Board unit 3 is formed by a glass epoxy material, a wiring pattern 3A provided so as to cover the outer periphery by a copper foil, and a 3B. 配線パターン3A、3Bは、基板部3の上面から側面、および底部にかけて設けられており、半田接合等によって図示しない外部回路への表面実装が可能である。 Wiring patterns 3A, 3B are a side from the upper surface of the base plate 3, and is provided toward the bottom, it is possible to surface mount to an external circuit (not shown) by solder bonding or the like.

光拡散部5は、光拡散剤として光透過性を有する粒径0.2〜8μmのシリカ粒子5Bを有し、シリカ粒子5Bは、樹脂中での分散性を向上させるためにエポキシシランを表面に塗布している。 Light diffusion portion 5 has a silica particle 5B particle size 0.2~8μm having optical transparency as a light diffusion agent, the silica particles. 5B, the surface of the epoxy silanes to improve dispersibility in the resin It has been applied to. シリカ粒子5Bの添加量は、5〜10重量%である。 The addition amount of the silica particles. 5B is a 5 to 10% by weight. また、蛍光体5Aは、黄色蛍光体であるCe:YAGであり、粒径は約10μmである。 The phosphor 5A is, Ce is yellow phosphor: a YAG, a particle size of approximately 10 [mu] m. Ce:YAGはLED素子2から放射される光によって励起されて黄色光を放射する。 Ce: YAG is excited by light emitted from the LED element 2 emits yellow light. 蛍光体5Aの添加量は、18重量%である。 The addition amount of the phosphor 5A is a 18% by weight.

ケース部6は、基板部3上に貼り付け固定されており、反射面6Aを側面とする窪みの内部にLED素子2、光拡散部5、および封止樹脂7を有している。 Case 6 is pasted fixed on the substrate portion 3, LED element 2 to the inside of the recess to the reflective surface 6A and the side surface, it has the light diffusion portion 5, and a sealing resin 7. 反射面6Aは、スパッタリングによって表面にアルミニウムの薄膜を光反射膜として形成されている。 Reflective surface 6A is formed of aluminum thin film as a light reflection film on the surface by sputtering.

封止樹脂7は、光透過性および成形性に優れるエポキシ樹脂によって形成されており、樹脂中に上記した割合で混入された蛍光体5Aおよびシリカ粒子5BをLED素子2の周囲に沈降させることにより設けられる光拡散部5と、光拡散部5の外側に配置される透明部とを有している。 Sealing resin 7 is formed by a light transmission and an epoxy resin which is excellent in formability, by precipitating the phosphor 5A and silica particles 5B which are mixed at a ratio described above in the resin around the LED element 2 a light diffusion portion 5 provided, and a transparent portion disposed outside the light diffusing portion 5.

次に、第1の実施の形態の発光装置1の製造工程について以下に説明する。 It will now be discussed manufacturing process of the light emitting device 1 of the first embodiment.

図2は、発光装置の製造工程を示す断面図であり、(a)はLED素子の搭載工程、(b)は封止樹脂の注入工程、(c)は封止樹脂の硬化工程である。 Figure 2 is a sectional view showing a light emitting device, it is (a) the step mounting the LED elements, (b) the injection process of the sealing resin, (c) the step of curing the sealing resin. まず、図2(a)に示すように、配線パターン3Aおよび3Bを設けられた長尺上の基板材料に別工程で射出成形されたケース部6を貼り付け固定する。 First, as shown in FIG. 2 (a), attaching to fix the casing part 6 which is injection molded in a separate process to the substrate material on long provided a wiring pattern 3A and 3B. ケース部6にはエッチング等によって予め反射面6Aに応じた孔が開口されている。 The case 6 holes corresponding to the pre-reflective surface 6A by etching or the like is opened. 次に、ケース部6の底部、すなわち、配線パターン3Aおよび3Bの露出した基板材料の表面にAuバンプ4を介してLED素子2を超音波接合する。 Then, the bottom of the case portion 6, i.e., via the Au bumps 4 to the ultrasonic bonding of the LED element 2 on the exposed surface of the substrate material of the wiring patterns 3A and 3B. LED素子2は、長尺上の基板材料に対して複数を所定の間隔で配置することができる。 LED element 2 can be arranged a plurality at a predetermined interval with respect to the substrate material on long.

次に、図2(b)に示すように、蛍光体5Aおよびシリカ粒子5Bを前述の割合でエポキシ樹脂に混合し、十分な攪拌を行って凝集のない混合体とする。 Next, as shown in FIG. 2 (b), a phosphor 5A and silica particles 5B mixed in the epoxy resin at a ratio of above, the aggregate-free mixture to provide sufficient agitation. 次に、LED素子2を固定されているケース部6の孔に蛍光体5Aおよびシリカ粒子5Bを混入されたエポキシ樹脂を注入する。 Then, injecting the phosphor 5A and silica particles 5B mixed epoxy resin in the hole of the case portion 6 that the LED element 2 is fixed.

次に、図2(c)に示すように、エポキシ樹脂を注入した状態で一定時間放置してLED素子2の周囲に蛍光体5Aおよびシリカ粒子5Bを沈降させる。 Next, as shown in FIG. 2 (c), to precipitate phosphor 5A and silica particles 5B around the LED element 2 and left for a certain time while injecting the epoxy resin. このとき、蛍光体5Aおよびシリカ粒子5Bは、分散状態を保ったまま沈降し、堆積することによって光拡散部5を形成する。 At this time, the phosphor 5A and silica particles. 5B settle while maintaining the dispersed state, to form a light diffusion portion 5 by depositing. 一方、蛍光体5Aおよびシリカ粒子5Bと分離したエポキシ樹脂は透明となり、光拡散部5上に配置される。 On the other hand, an epoxy resin separate from the phosphor 5A and silica particles 5B becomes transparent, is disposed on the light diffusing portion 5. 次に、全体を120℃から180℃の温度で加熱処理することによってエポキシ樹脂を熱硬化させることによりケース部6と一体化した封止樹脂7とする。 Then, the sealing resin 7 which is integrated with the casing part 6 by thermally curing the epoxy resin by heating at a temperature of 180 ° C. The overall from 120 ° C.. 次に、ダイサーによってLED素子2の配置間隔に応じた間隔で全体を切り分けることにより発光装置1が得られる。 Next, the light emitting device 1 can be obtained by carving the whole interval corresponding to the arrangement interval of the LED element 2 by Dicer.

次に、第1の実施の形態の発光装置1の動作について以下に説明する。 It will now be discussed the operation of the light emitting device 1 of the first embodiment.

発光装置1の配線パターン3Aおよび3Bを図示しない電源装置に接続して通電することにより、LED素子2の発光層において発光し、主として発光層の上側に配置されるサファイア基板からLED素子2の外部に光が放射される。 By energizing connected to a power supply device (not shown) the wiring pattern 3A and 3B of the light-emitting device 1 emits the light-emitting layer of the LED element 2, mainly outside from the sapphire substrate of the LED element 2 disposed above the light-emitting layer light is emitted to. サファイア基板から放射された光のうち、蛍光体5Aに照射される光は蛍光体5Aを励起させる。 Of the light emitted from the sapphire substrate, light is irradiated to the phosphor. 5A excite phosphor 5A. 励起された蛍光体5Aは黄色の励起光を放射する。 Excited phosphor 5A emits excitation light yellow. また、シリカ粒子5Bに照射される光はシリカ粒子5Bの形状に応じて不規則な方向に透過、散乱を繰り返しながら伝播し、ケース部6内部に行き渡るとともに反射面6Aによって反射される。 The light is irradiated to the silica particles. 5B transmitted in random directions in accordance with the shape of the silica particles 5B, while repeating scattering propagates, it is reflected by the reflecting surface 6A with prevailing inside case portion 6. ケース部6内部において、LED素子2から放射された青色光と蛍光体5Aの励起に基づいて生じる励起光とが混合されることによって白色光となり、封止樹脂7を介して外部放射される。 Inside case portion 6 becomes a white light by the excitation light generated based from LED element 2 to the excitation of the emitted blue light and the phosphor 5A is mixed, it is externally radiated through the sealing resin 7.

上記した第1の実施の形態によると、以下の効果が得られる。 According to the first embodiment described above, the following effects can be obtained.
(1)蛍光体5Aとシリカ粒子5Bとを混合したエポキシ樹脂でケース部6を封止し、蛍光体5Aとシリカ粒子5Bを比重に基づいて沈降させてLED素子2の周囲に配置するようにしたため、シリカ粒子5B中に蛍光体5Aが分散した状態で沈降して光拡散部5を形成することができる。 (1) The case portion 6 with an epoxy resin mixed with the phosphor 5A and silica particles 5B sealed, to place around the LED element 2 and phosphor 5A and silica particles 5B precipitated on the basis of specific gravity because the can phosphor 5A in the silica particles 5B to form a light diffusion portion 5 settled in a dispersed state. シリカ粒子5BはLED素子2から放射された青色光を散乱して光拡散部5中に不規則に分散させることにより、シリカ粒子5B中に混在している蛍光体5Aが効率良く励起される。 By silica particles. 5B to scattered blue light emitted from the LED element 2 are randomly dispersed in the light diffusion portion 5, phosphor 5A which are mixed in the silica particles 5B is efficiently excited. このため、外部への光拡散性が向上するとともに、白色光を得るのに必要な蛍光体の使用量を低減することができる。 Therefore, the improved light diffusing properties to the outside, it is possible to reduce the amount of required phosphor to obtain a white light.
(2)エポキシシランによる表面処理を施したシリカ粒子5Bと蛍光体5Aとを混合しているため、エポキシ樹脂中へシリカ粒子5Bおよび蛍光体5Aの分散性が向上し、特に、蛍光体5Aの粒子同士が物理的に接触して分散性が低下することを防げる。 (2) Since the mixture of the silica particles 5B phosphor 5A subjected to surface treatment with epoxy silane, dispersibility of the silica particles 5B and phosphor 5A is improved into an epoxy resin, in particular, the phosphor 5A grains can be prevented that the dispersibility in physical contact is reduced.

なお、第1の実施の形態では、青色光を発するLED素子2と、黄色光を発する蛍光体5Aによって白色光を生じる波長変換型の発光装置1を説明したが、白色光を生じる波長変換は上記したものに限定されず、例えば、紫外光を発するLED素子2と紫外光によって励起されるRGB蛍光体を用いた波長変換であっても良い。 In the first embodiment, the LED element 2 that emits blue light has been described a light emitting device 1 of the wavelength conversion type resulting white light by the phosphor 5A that emits yellow light, a wavelength conversion to produce white light not limited to those described above, for example, it may be a wavelength conversion using the RGB phosphor excited by the LED element 2 and the ultraviolet light emitted ultraviolet light.

また、LED素子2についても、第1の実施の形態で説明したフリップチップタイプのLED素子2に代えて光放射面側に電極を有するフェイスアップタイプのLED素子2を用いることも可能である。 Further, the LED element 2 is also possible to use an LED element 2 face-up type having an electrode on the light emitting surface side in place of the LED elements 2 of the flip chip type described in the first embodiment. また、フリップチップタイプのLED素子2を窒化アルミニウム等のサブマウント部材を介して接続するものであっても良い。 Further, it may be used to connect the LED element 2 of the flip chip type through the sub-mount member such as aluminum nitride.

また、基板部3についてもガラスエポキシ以外の材料としてアクリル樹脂、エポキシ樹脂等の材料を用いることも可能である。 It is also possible to use an acrylic resin as a material other than glass epoxy also board portion 3, a material such as epoxy resin.

また、ケース部6についてもアクリル樹脂以外の材料としてナイロン樹脂、エポキシ樹脂、あるいはセラミック等の材料を用いることも可能である。 Further, nylon resin as the material other than an acrylic resin also for the case 6, it is also possible to use an epoxy resin or a material such as ceramic.

また、封止樹脂7を構成する光透過性材料についてもエポキシ樹脂に限定されるものではなく、シリコン樹脂を用いることも可能である。 Further, the invention is not limited to the epoxy resin also for the light transmitting material constituting the sealing resin 7, it is also possible to use a silicone resin.

また、第1の実施の形態では、長尺状の基板材料に対してケース部6および複数のLED素子2を搭載し、ダイサーで切断して発光装置1とする製造工程について説明したが、例えば、ケース部6を構成するウエハー状の第1の材料にエッチング等によって複数の開口を形成し、ウエハー状の第2の材料に配線パターンを形成して第1の材料と貼り付け接合し、LED素子2の搭載、蛍光体5Aおよびシリカ粒子5Bを混入された封止樹脂7の注入、光拡散部5の形成、および封止樹脂7の熱硬化を行った後にダイサー、あるいはレーザー等で切断して発光装置1を形成するようにしても良い。 In the first embodiment, equipped with a casing part 6 and a plurality of LED elements 2 with respect to the elongated substrate material has been described manufacturing process of the light emitting device 1 is cut by a dicer, for example, , a plurality of openings formed by etching or the like to the first material wafers like constituting the casing section 6, joined and paste the first material to form a wiring pattern on the second material wafer-like, LED mounting the element 2, the injection of the sealing resin 7 which is mixed phosphor 5A and silica particles 5B, the formation of the light diffusion portion 5, and heat curing of the sealing resin 7 was cut with a dicer or a laser or the like after performing it may be formed a light emitting device 1 Te.

図3は、本発明の第2の実施の形態に係る表面実装型発光装置の断面図である。 Figure 3 is a cross-sectional view of a surface mounted light emitting device according to a second embodiment of the present invention. この発光装置1は、第1の実施の形態で説明したケース部6を設けずに蛍光体5Aおよびシリカ粒子5Bを混入された封止樹脂7でLED素子2を封止した構成を有している。 The light emitting device 1 has a configuration sealing the LED element 2 with a phosphor 5A and silica particles 5B sealing resin 7 which is mixed without providing the case portion 6 described in the first embodiment there. また、その他の構成において、第1の実施の形態と同一の部分については共通の引用数字を付している。 Also, in other configurations are denoted by the common reference numerals for the form of the same parts of the first embodiment.

第2の実施の形態の発光装置1では、配線パターン3Aおよび3Bを設けられた長尺上の基板材料を金型に収容し、金型内に蛍光体5Aとシリカ粒子5Bとを混合した封止樹脂7を充填する方法により形成する。 In the light emitting device 1 of the second embodiment, sealing of the substrate material on long provided a wiring pattern 3A and 3B accommodated in a mold, by mixing a phosphor 5A and silica particles 5B into a mold formed by a method of filling a sealing resin 7.

次に、第2の実施の形態の発光装置1の製造工程について以下に説明する。 It will now be discussed manufacturing process of the light emitting device 1 of the second embodiment.

まず、長尺上の基板材料上に設けられる配線パターン3Aおよび3Bに位置するように所定の間隔でAuバンプ4を介してLED素子2を超音波接合する。 First, ultrasonic bonding the LED element 2 via Au bumps 4 at a predetermined interval so as to be positioned on the wiring pattern 3A and 3B are provided on the substrate material on the long. 次に、LED素子2を接合された基板材料を金型で包囲して封止樹脂7を充填し、一定時間放置してLED素子2の周囲に蛍光体5Aおよびシリカ粒子5Bを沈降させる。 Next, the substrate material bonded to LED element 2 surrounds a mold filled with a sealing resin 7, to precipitate phosphor 5A and silica particles 5B around the LED element 2 and left for a certain time. このとき、蛍光体5Aおよびシリカ粒子5Bは、分散状態を保ったまま沈降し、堆積することによって光拡散部5を形成する。 At this time, the phosphor 5A and silica particles. 5B settle while maintaining the dispersed state, to form a light diffusion portion 5 by depositing. 一方、蛍光体5Aおよびシリカ粒子5Bと分離した封止樹脂7は透明となり、光拡散部5上に配置される。 On the other hand, the sealing resin 7 which is separated from the phosphor 5A and silica particles 5B becomes transparent, it is disposed on the light diffusing portion 5. 次に、金型とともに全体を120℃から180℃の温度で加熱処理することによって封止樹脂7を熱硬化させることにより基板材料と一体化する。 Then, a sealing resin 7 by heat treatment at a temperature of 180 ° C. The overall from 120 ° C. with the mold is integrated with the substrate material by heat-curing. 次に、金型を分離する。 Then, to separate the mold. 次に、ダイサーによってLED素子2の配置間隔に応じた間隔で全体を切り分けることにより発光装置1が得られる。 Next, the light emitting device 1 can be obtained by carving the whole interval corresponding to the arrangement interval of the LED element 2 by Dicer.

上記した第2の実施の形態によると、第1の実施の形態の好ましい効果に加えてLED素子2の上側だけでなく側面方向にも波長変換された白色光を効率良く外部放射させることが可能になる。 According to the second embodiment described above, white light was also wavelength converted laterally not only preferred upper LED element 2 in addition to the effects of the first embodiment efficiently can be radiated outside become.

なお、上記した第1および第2の実施の形態で説明した発光装置1の封止樹脂7に凸状、凹状といった光学形状を設けて放射される光の集光、あるいは拡散を行う構成としても良い。 Even a structure to perform a focusing or diffusing the first and second exemplary convex sealing resin 7 of a light-emitting device 1 described in the embodiment, light emitted by providing an optical shape such concave described above good.

本発明の第1の実施の形態に係る表面実装型発光装置の断面図である。 Is a cross-sectional view of a surface mounted light emitting device according to a first embodiment of the present invention. 本発明の発光装置の製造工程を示す断面図であり、(a)はLED素子の搭載工程、(b)は封止樹脂の注入工程、(c)は封止樹脂の硬化工程である。 Is a cross-sectional view showing a light emitting device of the present invention is (a) the step mounting the LED elements, (b) the injection process of the sealing resin, (c) the step of curing the sealing resin. 本発明の第2の実施の形態に係る表面実装型発光装置の断面図である。 Is a cross-sectional view of a surface mounted light emitting device according to a second embodiment of the present invention. 特許文献1に記載される発光装置の断面図である、 Is a cross-sectional view of a light emitting device described in Patent Document 1,

符号の説明 DESCRIPTION OF SYMBOLS

1、発光装置 2、LED素子 3、基板部 3A、配線パターン4、バンプ 5、光拡散部 5A、蛍光体 5B、シリカ粒子6、ケース部 6A、反射面 7、封止樹脂 10、発光装置11、リードフレーム 13、LED素子 14、蛍光剤15、樹脂ケース 16、拡散剤 1, the light emitting device 2, LED element 3, a substrate portion 3A, the wiring pattern 4, the bumps 5, the light diffusing portion 5A, phosphor 5B, silica particles 6, case unit 6A, the reflection surface 7, a sealing resin 10, the light emitting device 11 , the lead frame 13, LED element 14, a fluorescent agent 15, the resin case 16, a diffusing agent

Claims (4)

  1. LED素子を光透過性材料で封止して形成される発光装置において、 In the light-emitting device is formed by sealing an LED element of a light transmitting material,
    前記光透過性材料は、粒状の光拡散体と蛍光体とを混合した混合体を含むとともに前記混合体を前記LED素子の周囲に配置した光拡散部を有することを特徴とする発光装置。 The light-transmitting material, the light emitting device characterized in that it comprises a light diffusing portion disposed the mixture around the LED element with containing mixture obtained by mixing a light diffuser and a phosphor particulate.
  2. 前記粒状の光拡散体は、前記蛍光体の粒径より小なる粒径を5〜10重量%含むことを特徴とする請求項1記載の発光装置。 The light diffuser of the particulate light-emitting device according to claim 1, characterized in that it comprises 5 to 10 wt% the particle size small consisting particle size of the phosphor.
  3. 前記粒状の光拡散体は、エポキシシランの表面処理を施されたシリカ粒子であることを特徴とする請求項1記載の発光装置。 Light diffuser of the particulate light-emitting device according to claim 1, characterized in that the silica particles subjected to surface treatment epoxysilane.
  4. 青色光を放射するLED素子を光透過性材料で封止して形成される発光装置において、 In the light-emitting device is formed by sealing an LED element that emits blue light of a light transmitting material,
    前記光透過性材料は、粒径0.2〜8μmのシリカ粒子を5〜10重量%と、黄色光を放射する粒径10μmの黄色蛍光体を18重量%とを混合した混合体を含むとともに前記混合体を前記LED素子の周囲に配置した光拡散部を有することを特徴とする発光装置。 Together with the light-transmitting material comprises a 5-10 wt% of silica particles having a particle diameter 0.2~8Myuemu, a mixture obtained by mixing a 18% by weight of yellow fluorescent material of particle size 10μm that emits yellow light the light emitting device characterized in that it comprises a light diffusing portion disposed the mixture around the LED element.

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