JP2005167079A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2005167079A
JP2005167079A JP2003405983A JP2003405983A JP2005167079A JP 2005167079 A JP2005167079 A JP 2005167079A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2003405983 A JP2003405983 A JP 2003405983A JP 2005167079 A JP2005167079 A JP 2005167079A
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JP
Japan
Prior art keywords
light
led
phosphor
silica particles
light emitting
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Withdrawn
Application number
JP2003405983A
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Japanese (ja)
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JP2005167079A5 (en
Inventor
Masahito Kawamura
Atsushi Tsuzuki
Toshio Yamaguchi
寿夫 山口
雅人 河村
敦 都築
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Toyoda Gosei Co Ltd
豊田合成株式会社
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Priority to JP2003405983A priority Critical patent/JP2005167079A/en
Publication of JP2005167079A5 publication Critical patent/JP2005167079A5/ja
Publication of JP2005167079A publication Critical patent/JP2005167079A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device with good light diffusivity without complicating the manufacturing process.
SOLUTION: A case portion 6 is sealed with a sealing resin 7 in which a phosphor 5A and silica particles 5B are mixed, and the phosphor 5A and silica particles 5B are allowed to settle based on specific gravity and disposed around the LED element 2. To do. As a result, the light diffusing portion 5 can be formed by sedimentation in a state where the phosphor 5A is dispersed in the silica particles 5B. The silica particles 5B scatter blue light emitted from the LED element 2 and disperse it irregularly in the light diffusing section 5, whereby the phosphors 5A mixed in the silica particles 5B are efficiently excited. For this reason, the usage-amount of the fluorescent substance required in order to obtain white light can be reduced.
[Selection] Figure 1

Description

  The present invention relates to a light-emitting element and a light-emitting device, and more particularly to a light-emitting device that can efficiently extract light emitted from the light-emitting element to the outside.

  Conventionally, an LED (Light-Emitting Diode) element is used as a light source, a phosphor is excited by light emitted from the LED element, and excitation light emitted from the excited phosphor and emitted from the LED element. There is a light-emitting device that emits wavelength-converted light that is generated by mixing light.

  As such a light emitting device, there is one in which a diffusing agent made of phosphor and magnesium oxide is mixed in a resin case covering an LED element (for example, see Patent Document 1).

  FIG. 4 is a cross-sectional view of the light emitting device described in Patent Document 1. The light emitting device 10 is emitted from the lead frames 11 and 12, the LED element 13 mounted on the lead frame 11, and the LED element 13. Fluorescent agent 14 excited by light, diffusing agent 16 for diffusing the light emitted from LED element 13, lead frames 11 and 12, LED element 13, fluorescent agent 14, and diffusing agent 16 are integrally covered. And a bullet-shaped resin case 15 to be sealed.

According to the light emitting device 10, the diffusing agent 16 mixed in the resin case 15 diffuses the light emitted from the LED element 13, so that the deterioration of the fluorescent agent 14 is suppressed, and the emission color changes and the light amount decreases. It becomes difficult and can be used for a long time.
Japanese Patent No. 3065554 (FIG. 1)

  However, according to the light emitting device described in Patent Document 1, it is necessary to uniformly disperse the fluorescent agent 14 and the diffusing agent 16 in the resin case 15 in order to realize stable long-term usability. There is a problem that the manufacturing process becomes complicated because strict mixing of the agent 14 and the diffusing agent 16 and manufacturing management are required.

  Accordingly, an object of the present invention is to provide a light-emitting device with good light diffusivity without complicating the manufacturing process.

  In order to achieve the above object, the present invention provides a light emitting device formed by sealing an LED element with a light transmissive material, wherein the light transmissive material is a mixture of a granular light diffuser and a phosphor. There is provided a light emitting device including a light diffusion portion including a mixture and having the mixture disposed around the LED element.

  The granular light diffuser preferably contains 5 to 10% by weight of a particle size smaller than the particle size of the phosphor.

  As the granular light diffuser, silica particles subjected to epoxysilane surface treatment can be used.

  Further, in order to achieve the above object, the present invention provides a light emitting device formed by sealing a blue light emitting LED element with a light transmissive material, wherein the light transmissive material has a particle size of 0.2. The mixture includes a mixture of 5 to 10% by weight of silica particles of ˜8 μm and 18% by weight of yellow phosphor having a particle diameter of 10 μm that emits yellow light, and the mixture is disposed around the LED element. Provided is a light-emitting device including a light diffusion portion.

  According to the light emitting device of the present invention, the light diffusing portion is formed by settling a mixture of a granular light diffusing material and a phosphor around the LED element, so that it is good without complicating the manufacturing process. Light diffusibility can be imparted to the light emitting device.

  Further, according to the light emitting device of the present invention, 5 to 10% by weight of silica particles having a particle size of 0.2 to 8 μm and 18% by weight of yellow phosphor having a particle size of 10 μm around the LED element emitting blue light. Since the light diffusing portion is formed by precipitating the mixture in which light is mixed, good light diffusibility can be imparted to the light emitting device without complicating the manufacturing process.

  FIG. 1 is a cross-sectional view of a surface-mounted light-emitting device according to the first embodiment of the present invention. The light emitting device 1 includes a flip chip type LED element 2 made of a GaN-based semiconductor compound, a substrate portion 3 having wiring patterns 3A and 3B for electrically connecting the LED element 2 to an external circuit, and the LED element 2 A light diffusing portion 5 comprising an Au bump 4 for electrically connecting the electrodes of the LED 3 and the wiring patterns 3A, 3B, a phosphor 5A arranged so as to cover the periphery of the LED element 2, and silica particles 5B as a light diffusing agent. And having a reflecting surface 6A formed in an inclined shape so as to radiate light to the outside, and injected into a case portion 6 formed of a resin material such as acrylic resin, and an LED element housing portion of the case portion 6 The light-transmitting sealing resin 7 that seals the LED element 2 and the light diffusion portion 5 is used.

  The LED element 2 is formed by crystal growth of an n-type layer, a layer including a light-emitting layer, and a p-type layer on a sapphire substrate by metal organic compound vapor phase epitaxy (MOVPE), and an emission wavelength of 450 to 480 nm. The blue light is emitted mainly from the sapphire substrate side.

  The board | substrate part 3 is formed with the glass epoxy material, and has wiring pattern 3A, 3B provided so that an outer periphery may be covered with copper foil. The wiring patterns 3A and 3B are provided from the top surface to the side surface and the bottom portion of the substrate portion 3, and can be surface-mounted on an external circuit (not shown) by solder bonding or the like.

  The light diffusion part 5 has silica particles 5B having a particle size of 0.2 to 8 [mu] m having light permeability as a light diffusing agent, and the silica particles 5B are coated with epoxy silane to improve dispersibility in the resin. It is applied to. The addition amount of the silica particles 5B is 5 to 10% by weight. The phosphor 5A is Ce: YAG, which is a yellow phosphor, and has a particle size of about 10 μm. Ce: YAG is excited by the light emitted from the LED element 2 to emit yellow light. The amount of phosphor 5A added is 18% by weight.

  The case part 6 is affixed and fixed on the board | substrate part 3, and has the LED element 2, the light-diffusion part 5, and the sealing resin 7 inside the hollow which makes 6 A of reflective surfaces side. The reflecting surface 6A is formed with a thin aluminum film as a light reflecting film on the surface by sputtering.

  The sealing resin 7 is formed of an epoxy resin excellent in light transmittance and moldability, and the phosphor 5A and the silica particles 5B mixed in the resin in the above-described ratio are settled around the LED element 2. It has the light-diffusion part 5 provided, and the transparent part arrange | positioned on the outer side of the light-diffusion part 5.

  Next, the manufacturing process of the light emitting device 1 according to the first embodiment will be described below.

  2A and 2B are cross-sectional views illustrating the manufacturing process of the light emitting device, where FIG. 2A is a step of mounting an LED element, FIG. 2B is a sealing resin injection process, and FIG. 2C is a sealing resin curing process. First, as shown in FIG. 2A, a case portion 6 injection-molded in a separate process is attached and fixed to a long substrate material provided with wiring patterns 3A and 3B. A hole corresponding to the reflecting surface 6A is previously opened in the case portion 6 by etching or the like. Next, the LED element 2 is ultrasonically bonded to the bottom portion of the case portion 6, that is, the exposed surface of the substrate material of the wiring patterns 3 </ b> A and 3 </ b> B through the Au bump 4. A plurality of LED elements 2 can be arranged at a predetermined interval with respect to a long substrate material.

  Next, as shown in FIG. 2 (b), the phosphor 5A and the silica particles 5B are mixed with the epoxy resin in the above-described proportions and sufficiently stirred to obtain a mixture without aggregation. Next, the epoxy resin mixed with the phosphor 5A and the silica particles 5B is injected into the hole of the case portion 6 to which the LED element 2 is fixed.

  Next, as shown in FIG. 2C, the phosphor 5A and the silica particles 5B are allowed to settle around the LED element 2 by being allowed to stand for a certain period of time with the epoxy resin injected. At this time, the phosphor 5A and the silica particles 5B settle while maintaining a dispersed state, and form the light diffusion portion 5 by being deposited. On the other hand, the epoxy resin separated from the phosphor 5 </ b> A and the silica particles 5 </ b> B becomes transparent and is disposed on the light diffusion portion 5. Next, the whole is heat-treated at a temperature of 120 ° C. to 180 ° C. to thermally cure the epoxy resin, whereby the sealing resin 7 integrated with the case portion 6 is obtained. Next, the light-emitting device 1 is obtained by cutting the whole with an interval according to the arrangement interval of the LED elements 2 by a dicer.

  Next, operation | movement of the light-emitting device 1 of 1st Embodiment is demonstrated below.

  When the wiring patterns 3A and 3B of the light emitting device 1 are connected to a power supply device (not shown) and energized, light is emitted from the light emitting layer of the LED element 2, and mainly from the sapphire substrate disposed above the light emitting layer to the outside of the LED element 2. The light is emitted. Of the light emitted from the sapphire substrate, the light applied to the phosphor 5A excites the phosphor 5A. The excited phosphor 5A emits yellow excitation light. Further, the light applied to the silica particles 5B propagates in an irregular direction according to the shape of the silica particles 5B while being repeatedly transmitted and scattered, reaches the inside of the case portion 6 and is reflected by the reflecting surface 6A. Inside the case portion 6, the blue light emitted from the LED element 2 and the excitation light generated based on the excitation of the phosphor 5 </ b> A are mixed to become white light, which is emitted outside via the sealing resin 7.

According to the first embodiment described above, the following effects are obtained.
(1) The case portion 6 is sealed with an epoxy resin in which the phosphor 5A and the silica particles 5B are mixed, and the phosphor 5A and the silica particles 5B are settled based on the specific gravity so as to be arranged around the LED element 2. Therefore, the light diffusion portion 5 can be formed by sedimentation in a state where the phosphor 5A is dispersed in the silica particles 5B. The silica particles 5B scatter blue light emitted from the LED element 2 and disperse it irregularly in the light diffusing section 5, whereby the phosphors 5A mixed in the silica particles 5B are efficiently excited. For this reason, while being able to improve the light diffusibility to the exterior, the usage-amount of the fluorescent substance required in order to obtain white light can be reduced.
(2) Since the silica particles 5B subjected to the surface treatment with epoxysilane and the phosphor 5A are mixed, the dispersibility of the silica particles 5B and the phosphor 5A in the epoxy resin is improved. It is possible to prevent the particles from physically contacting each other and the dispersibility from being lowered.

  In the first embodiment, the wavelength conversion type light emitting device 1 that generates white light by the LED element 2 that emits blue light and the phosphor 5A that emits yellow light has been described. For example, wavelength conversion using an LED element 2 that emits ultraviolet light and an RGB phosphor that is excited by the ultraviolet light may be used.

  As for the LED element 2, it is also possible to use a face-up type LED element 2 having an electrode on the light emitting surface side instead of the flip chip type LED element 2 described in the first embodiment. Further, the flip-chip type LED element 2 may be connected via a submount member such as aluminum nitride.

  Moreover, it is also possible to use materials, such as an acrylic resin and an epoxy resin, as materials other than glass epoxy also about the board | substrate part 3. FIG.

  Also, the case portion 6 can be made of a material other than acrylic resin such as nylon resin, epoxy resin, or ceramic.

  Further, the light transmissive material constituting the sealing resin 7 is not limited to the epoxy resin, and a silicon resin can also be used.

  Moreover, in 1st Embodiment, although the case part 6 and the some LED element 2 were mounted with respect to a elongate board | substrate material, it cut | disconnected with the dicer and demonstrated the manufacturing process used as the light-emitting device 1, for example, A plurality of openings are formed by etching or the like in the wafer-shaped first material constituting the case portion 6, a wiring pattern is formed in the wafer-shaped second material, and the first material is bonded and bonded to the LED. After the element 2 is mounted, the sealing resin 7 mixed with the phosphor 5A and the silica particles 5B is injected, the light diffusion portion 5 is formed, and the sealing resin 7 is thermally cured, it is cut with a dicer or a laser. Thus, the light emitting device 1 may be formed.

  FIG. 3 is a cross-sectional view of a surface-mounted light-emitting device according to the second embodiment of the present invention. The light emitting device 1 has a configuration in which the LED element 2 is sealed with a sealing resin 7 in which the phosphor 5A and the silica particles 5B are mixed without providing the case portion 6 described in the first embodiment. Yes. In other configurations, the same parts as those in the first embodiment are denoted by common reference numerals.

  In the light emitting device 1 of the second embodiment, a long substrate material provided with the wiring patterns 3A and 3B is accommodated in a mold, and the phosphor 5A and the silica particles 5B are mixed in the mold. It is formed by a method of filling the stop resin 7.

  Next, the manufacturing process of the light emitting device 1 according to the second embodiment will be described below.

  First, the LED element 2 is ultrasonically bonded via the Au bumps 4 at a predetermined interval so as to be positioned on the wiring patterns 3A and 3B provided on the long substrate material. Next, the substrate material to which the LED element 2 is bonded is surrounded by a mold, filled with the sealing resin 7, and left for a certain period of time to cause the phosphor 5A and the silica particles 5B to settle around the LED element 2. At this time, the phosphor 5A and the silica particles 5B settle while maintaining a dispersed state, and form the light diffusion portion 5 by being deposited. On the other hand, the sealing resin 7 separated from the phosphor 5 </ b> A and the silica particles 5 </ b> B becomes transparent and is disposed on the light diffusion portion 5. Next, the sealing resin 7 is integrated with the substrate material by thermally curing the mold together with the mold at a temperature of 120 ° C. to 180 ° C. Next, the mold is separated. Next, the light-emitting device 1 is obtained by cutting the whole with an interval according to the arrangement interval of the LED elements 2 by a dicer.

  According to the second embodiment described above, in addition to the preferable effect of the first embodiment, it is possible to efficiently radiate externally the white light wavelength-converted not only above the LED element 2 but also in the side surface direction. become.

  In addition, the sealing resin 7 of the light emitting device 1 described in the first and second embodiments described above may be configured to condense or diffuse the emitted light by providing an optical shape such as a convex shape or a concave shape. good.

1 is a cross-sectional view of a surface mount light emitting device according to a first embodiment of the present invention. It is sectional drawing which shows the manufacturing process of the light-emitting device of this invention, (a) is the mounting process of a LED element, (b) is the injection | pouring process of sealing resin, (c) is the hardening process of sealing resin. It is sectional drawing of the surface mount-type light-emitting device based on the 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device described in patent document 1,

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, Light-emitting device 2, LED element 3, Board | substrate part 3A, Wiring pattern 4, Bump 5, Light-diffusion part 5A, Phosphor 5B, Silica particle 6, Case part 6A, Reflective surface 7, Sealing resin 10, Light-emitting device 11 , Lead frame 13, LED element 14, fluorescent agent 15, resin case 16, diffusing agent

Claims (4)

  1. In a light emitting device formed by sealing an LED element with a light transmissive material,
    The light-transmitting material includes a mixture of a granular light diffuser and a phosphor, and has a light diffusion portion in which the mixture is disposed around the LED element.
  2.   2. The light emitting device according to claim 1, wherein the granular light diffuser includes 5 to 10% by weight of a particle size smaller than the particle size of the phosphor.
  3.   The light-emitting device according to claim 1, wherein the granular light diffuser is silica particles that have been subjected to a surface treatment with epoxysilane.
  4. In a light emitting device formed by sealing a blue light emitting LED element with a light transmissive material,
    The light transmissive material includes a mixture of 5 to 10% by weight of silica particles having a particle diameter of 0.2 to 8 μm and 18% by weight of a yellow phosphor having a particle diameter of 10 μm that emits yellow light. A light emitting device comprising: a light diffusion portion in which the mixture is arranged around the LED element.

JP2003405983A 2003-12-04 2003-12-04 Light emitting device Withdrawn JP2005167079A (en)

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WO2007046664A1 (en) * 2005-10-21 2007-04-26 Korea Photonics Technology Institute Light diffusion type light emitting diode
WO2007077869A1 (en) * 2006-01-04 2007-07-12 Rohm Co., Ltd. Thin-type light emitting diode lamp, and its manufacturing
JP2007184330A (en) * 2006-01-04 2007-07-19 Rohm Co Ltd Light-emitting device and manufacturing method therefor
JP2007184310A (en) * 2005-12-29 2007-07-19 Citizen Electronics Co Ltd Light emitting device
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JP2010519775A (en) * 2007-02-28 2010-06-03 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH Optoelectronic device having a casing body
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US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
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