JP2009111140A - Light-emitting device and method of manufacturing the same - Google Patents

Light-emitting device and method of manufacturing the same Download PDF

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JP2009111140A
JP2009111140A JP2007281627A JP2007281627A JP2009111140A JP 2009111140 A JP2009111140 A JP 2009111140A JP 2007281627 A JP2007281627 A JP 2007281627A JP 2007281627 A JP2007281627 A JP 2007281627A JP 2009111140 A JP2009111140 A JP 2009111140A
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light
resin
light emitting
emitting device
leads
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Kunihiko Hakata
邦彦 博田
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
Sanyo Consumer Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device of wide directivity, capable of extracting light in all directions. <P>SOLUTION: The light emitting device 1 includes a package 2 wherein a plurality of leads 41, 42, and 43 are integrated, with a part of them exposed, using a first resin 5, a light emitting element 3 which is fixed on any of the plurality of leads and is electrically connected to any of them, and a second resin 7 for sealing the light emitting element 3. The first and second resin 5 and 7 are translucent, and the first and second resin 5 and 7 function as lightguide bodies, thereby increasing the amount of light extracted toward the backside. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光素子から発せられた光を広範囲に照射するに適した発光装置とその製造方法に関する。   The present invention relates to a light-emitting device suitable for irradiating light emitted from a light-emitting element over a wide range and a method for manufacturing the same.

特許文献１は、白色樹脂を用いたパッケージの反射枠の中に発光素子とそのモールド用の樹脂を配置した構造を開示している。パッケージはリードフレームが利用され、枠部分を白色樹脂によって形成することで反射構造とし、発光素子から発した光を一方向に指向性を高めて取り出す構成となっている。   Patent Document 1 discloses a structure in which a light emitting element and a resin for molding thereof are arranged in a reflection frame of a package using a white resin. A lead frame is used for the package, and the frame portion is formed of a white resin to form a reflective structure, and light emitted from the light emitting element is extracted in one direction with increased directivity.

また、特許文献２には、反射枠の構造を採用することなく、発光素子を蛍光材料含有の樹脂にてモールドした構造となっている。
特開２００３−１６８８２４号公報 特表２００３−５１９９２９号公報 Further, Patent Document 2 has a structure in which a light emitting element is molded with a resin containing a fluorescent material without adopting a structure of a reflection frame.
JP 2003-168824 A Special Table 2003-519929

特許文献１に開示の反射枠構造は、光を全方向に拡散することに不向きな構造である。特許文献２に開示の反射枠なしの構造は、モールド樹脂を一度に成型するので、樹脂形状のきめ細かな設定が困難である。特に、樹脂中に、蛍光材料や光拡散材料を含有する場合、樹脂とその含有材料の比重の関係で、含有材料の最適配置が困難になり易い。   The reflection frame structure disclosed in Patent Document 1 is unsuitable for diffusing light in all directions. Since the structure without a reflection frame disclosed in Patent Document 2 is molded at a time, it is difficult to finely set the resin shape. In particular, when the resin contains a fluorescent material or a light diffusing material, the optimum arrangement of the contained material tends to be difficult due to the specific gravity of the resin and the contained material.

そこで本発明は、光の指向性を抑制し、光を全方向に取り出すことが容易な発光装置を提供することを課題の１つとする。
また、モールド樹脂の設計が容易な発光装置を提供することを課題の１つとする。 Thus, an object of the present invention is to provide a light-emitting device in which directivity of light is suppressed and light can be easily extracted in all directions.
Another object is to provide a light-emitting device in which a mold resin can be easily designed.

本発明の第１局面の発光装置は、複数のリードをその一部を露出させた状態で第１の樹脂によって一体化したパッケージと、前記複数のリードのいずれかの上に固定され前記複数のリードのいずれかに電気的に接続された発光素子と、前記発光素子を封止する第２の樹脂とを備える発光装置において、前記第１及び第２の樹脂を光透過性の樹脂としたことを特徴とする。   The light-emitting device according to the first aspect of the present invention includes a package in which a plurality of leads are integrated with a first resin in a state where a part of the leads is exposed, and the plurality of leads fixed on any of the plurality of leads. In a light emitting device including a light emitting element electrically connected to one of the leads and a second resin that seals the light emitting element, the first and second resins are light-transmitting resins. It is characterized by.

第１及び第２の樹脂を光透過性の樹脂とすることにより、両方の樹脂を導光体として機能させることができ、発光素子を配置したリードの裏側にも光を導くことができる。   By using the first and second resins as light-transmitting resins, both resins can function as light guides, and light can be guided to the back side of the leads on which the light emitting elements are arranged.

本発明の第１局面の発光装置は、前記第１の樹脂を前記第２の樹脂よりも耐熱温度が高い樹脂とすることができる。   In the light emitting device according to the first aspect of the present invention, the first resin may be a resin having a higher heat resistant temperature than the second resin.

前記第１の樹脂を前記第２の樹脂よりも耐熱温度が高い樹脂とすることにより、第２の樹脂の硬化に際して、第１の樹脂の熱による溶融や熱変の発生を防止して装置の形状を安定なものとすることができる。   By making the first resin a resin having a higher heat resistance temperature than the second resin, when the second resin is cured, the first resin is prevented from being melted by heat or subjected to thermal change. The shape can be made stable.

本発明の第１局面の発光装置は、前記発光素子の左右に位置する前記第１の樹脂によって形成される側壁の上部外側面を、上から下に向かうに従って左右方向の外側に広がる形状とすることができる。   In the light-emitting device according to the first aspect of the present invention, the upper outer surface of the side wall formed by the first resin located on the left and right sides of the light-emitting element has a shape that spreads outward in the left-right direction from top to bottom. be able to.

側壁の上部外側面を、上から下に向かうに従って左右方向の外側に広がる形状とすることにより、側壁を透過する光を裏面方向に案内することができ、裏面方向から出射する光の量を多くすることができる。   By forming the upper outer surface of the side wall in a shape that spreads outward in the left-right direction as it goes from top to bottom, the light transmitted through the side wall can be guided in the back surface direction, and the amount of light emitted from the back surface direction is increased. can do.

本発明の第１局面の発光装置は、前記第２の樹脂を蛍光材料を含有するものとすることができる。   In the light-emitting device according to the first aspect of the present invention, the second resin may contain a fluorescent material.

樹脂に含有させた蛍光材料によって、発光素子の光を色を他の色に変換することができる。   The light of the light emitting element can be converted into another color by the fluorescent material contained in the resin.

本発明の第２局面の発光装置の製造方法は、複数のリードをその一部を露出させた状態で光透過性の第１の樹脂によって一体化したパッケージを準備する工程と、前記複数のリードのいずれかの上に発光素子を固定する工程と、前記発光素子と前記複数のリードのいずれかを電気的に接続する工程と、前記複数のリードのいずれかの上に固定された前記発光素子を光透過性の第２の樹脂によって封止する工程、とを備えたことを特徴とする。   According to a second aspect of the present invention, there is provided a method for manufacturing a light emitting device, comprising: preparing a package in which a plurality of leads are integrated with a light transmissive first resin in a state where a part of the leads is exposed; A step of fixing a light emitting element on any of the above, a step of electrically connecting the light emitting element and any of the plurality of leads, and the light emitting element fixed on any of the plurality of leads And a step of sealing with a light transmissive second resin.

光透過性樹脂によって形成されたパッケージに発光素子を固定した後、光透過性の第２の樹脂によって封止するので、両方の樹脂を導光体として機能させることができ、発光素子を配置したリードの裏側にも光を導くことができる発光装置を提供することができる。   Since the light emitting element is fixed to the package formed of the light transmissive resin and then sealed with the light transmissive second resin, both resins can function as a light guide, and the light emitting element is arranged. A light emitting device capable of guiding light to the back side of the lead can be provided.

本発明の第２局面の発光装置の製造方法は、前記第２の樹脂の中に蛍光材料を含有させることができる。第２の樹脂に蛍光材料を含有させることにより、第１の樹脂に蛍光材料を含有させる必要がなくなり、第１、第２の樹脂の設計時の自由度を高めることができる。   In the method for manufacturing a light emitting device according to the second aspect of the present invention, a fluorescent material can be contained in the second resin. By including the fluorescent material in the second resin, it is not necessary to include the fluorescent material in the first resin, and the degree of freedom in designing the first and second resins can be increased.

発光装置の光を広範囲に取り出すことができ、広指向性の発光装置を提供することができる。   Light from the light-emitting device can be extracted over a wide range, and a wide-directional light-emitting device can be provided.

以下、本発明の実施形態を図面を参照して説明する。図１は、本発明の発光装置１の長手方向（図３（Ｄ）のＡ−Ａ）の断面図、図２は発光装置１の短手方向（図３（Ｄ）のＢ−Ｂ）の断面図である。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of the light emitting device 1 according to the present invention in the longitudinal direction (AA in FIG. 3D), and FIG. 2 is the lateral direction of the light emitting device 1 (BB in FIG. 3D). It is sectional drawing.

発光装置１は、リードフレーム型のパッケージ２に発光素子３を搭載し、発光素子３を樹脂封止して構成している。
パッケージ２は、リードフレーム４を用いて構成された複数のリード４１，４２,４３をその一部を露出させた状態で第１の樹脂５によって一体化して構成している。
発光素子３は、前記複数のリード４１，４２,４３のいずれかの上に接着材料によって固定し、前記複数のリード４１，４２,４３のいずれかにワイヤーボンド線６によって電気的に接続している。この例では、発光素子を固定したリード上と、そのリードに隣接した別のリードにワイヤーボンド線６を配線している。パッケージに搭載する発光素子の数は、２個の例を示しているが、それに限られるものではなく、発光装置１の形状に応じて、任意の数に設定することができる。
パッケージ２に搭載した発光素子３は、第１の樹脂５とは異なる第２の樹脂７を用いて封止している。 The light emitting device 1 is configured by mounting a light emitting element 3 on a lead frame type package 2 and sealing the light emitting element 3 with a resin.
The package 2 is configured by integrating a plurality of leads 41, 42, 43 formed using the lead frame 4 with the first resin 5 in a state where a part of the leads 41, 42, 43 is exposed.
The light emitting element 3 is fixed on one of the plurality of leads 41, 42, 43 with an adhesive material, and is electrically connected to one of the plurality of leads 41, 42, 43 by a wire bond line 6. Yes. In this example, the wire bond line 6 is wired on the lead to which the light emitting element is fixed and another lead adjacent to the lead. The number of light emitting elements mounted on the package is two, but is not limited thereto, and can be set to any number according to the shape of the light emitting device 1.
The light emitting element 3 mounted on the package 2 is sealed with a second resin 7 different from the first resin 5.

以下、発光装置１の構造を、図３（Ａ）〜図３（Ｄ）に示す製造工程を参照して詳細に説明する。
図３（Ａ）に示すように、複数のリード４１，４２,４３がタイバー４４によって連結されたリードフレームを準備する。リードフレームは金属製、例えば鉄系、あるいは銅系の材料で構成され、複数のリード４１，４２,４３がタイバー４４を介してメインフレーム（図示せず）に連結されている。図３（Ａ）は、１つの発光装置１のリード部分しか示していないが、複数個の発光装置を構成するリードがタイバー４４を介してメインフレーム（図示せず）に連結されている。
次に、図３（Ｂ）に示すように、このリードフレームに例えばインサート成型によって、第１の樹脂５を形成する。第１の樹脂５は光透過性の樹脂で形成され、例えばナイロンにガラス成分を含有させた耐熱性の高い透明な樹脂を用いている。複数のリード４１，４２,４３は、それぞれの上面の一部が、第１の樹脂５から露出した状態を保って第１の樹脂５によって一体化される。
第１の樹脂５は、その上面の外周部分に、リード４１，４２,４３の上面よりも高い側壁５１が一体に形成されている。この側壁５１は、第２の樹脂７の形成に際してその外観形状を整える役割がある。このようにして、リードフレームを利用した樹脂枠タイプのパッケージ２が用意される。 Hereinafter, the structure of the light-emitting device 1 will be described in detail with reference to the manufacturing steps shown in FIGS. 3 (A) to 3 (D).
As shown in FIG. 3A, a lead frame in which a plurality of leads 41, 42, 43 are connected by a tie bar 44 is prepared. The lead frame is made of a metal, for example, an iron-based or copper-based material, and a plurality of leads 41, 42, 43 are connected to a main frame (not shown) via tie bars 44. Although FIG. 3A shows only the lead portion of one light emitting device 1, the leads constituting the plurality of light emitting devices are connected to a main frame (not shown) via tie bars 44.
Next, as shown in FIG. 3B, the first resin 5 is formed on the lead frame by, for example, insert molding. The first resin 5 is formed of a light transmissive resin, and for example, a transparent resin having high heat resistance in which a glass component is contained in nylon is used. The plurality of leads 41, 42, 43 are integrated by the first resin 5 while maintaining a state in which a part of each upper surface is exposed from the first resin 5.
Side walls 51 that are higher than the upper surfaces of the leads 41, 42, and 43 are integrally formed on the outer peripheral portion of the upper surface of the first resin 5. The side wall 51 has a role of adjusting the external shape when the second resin 7 is formed. In this way, a resin frame type package 2 using a lead frame is prepared.

次に、図３（Ｃ）に示すように、リード４２の上面に発光素子３，３を接着材料によって固定する。この例では、発光素子の正負の電極がいずれも素子の上面に位置する発光素子３を用いているので、発光素子３の裏面を絶縁性の接着材料でリードに固定している。
発光素子３を固定した後、発光素子３への電気的な接続を施す。この例では、ワイヤーボンド線６を用いて、発光素子３の正負の一方の電極と発光素子を固定したリード４２間を接続し、ワイヤーボンド線６を用いて、発光素子の正負の他方の電極と発光素子を固定したリード４２とは別のリード４１，４３間を接続している。 Next, as shown in FIG. 3C, the light emitting elements 3 and 3 are fixed to the upper surface of the lead 42 with an adhesive material. In this example, since the light emitting element 3 in which both positive and negative electrodes of the light emitting element are located on the upper surface of the element is used, the back surface of the light emitting element 3 is fixed to the lead with an insulating adhesive material.
After fixing the light emitting element 3, electrical connection to the light emitting element 3 is performed. In this example, the wire bond line 6 is used to connect between the positive and negative electrodes of the light emitting element 3 and the lead 42 to which the light emitting element is fixed, and the wire bond line 6 is used to connect the other positive and negative electrode of the light emitting element. The leads 41 and 43 other than the lead 42 to which the light emitting element is fixed are connected.

次に、図３（Ｄ）に示すように、第２の樹脂７を用いて発光素子３，３をワイヤーボンド線６とともに封止する。第２の樹脂７は、光透過性のシリコン樹脂やエポキシ樹脂を用いることができる。
この第２の樹脂７は、第１の樹脂５に接して配置されるので、第２の樹脂７を形成する際に第１の樹脂５の溶融や熱変形を防ぐ為に、硬化時の温度が第１の樹脂５の耐熱温度よりも低い樹脂を用いる。
第２の樹脂７は、光透過性のシリコン樹脂やエポキシ樹脂を単独で用いることができるが、この例では、発光素子３の光を波長変換して出力する蛍光材料（図示せず）を含有させたものを用いている。
発光素子３として青色の光を出力する素子を用いる場合、その光を受けて黄色系統の光を出力する蛍光材料を用いれば、両方の光が混色されて白色系の光が取り出される。蛍光材料に赤色成分を多く出力することができるものを用いれば、昼光色（電球色）のように赤み成分の多い光を出力することができる。 Next, as shown in FIG. 3D, the light emitting elements 3 and 3 are sealed together with the wire bond line 6 using the second resin 7. As the second resin 7, a light transmissive silicon resin or an epoxy resin can be used.
Since the second resin 7 is disposed in contact with the first resin 5, the temperature at the time of curing is used in order to prevent the first resin 5 from being melted or thermally deformed when the second resin 7 is formed. However, a resin whose temperature is lower than the heat resistance temperature of the first resin 5 is used.
As the second resin 7, a light-transmitting silicon resin or epoxy resin can be used alone, but in this example, it contains a fluorescent material (not shown) that converts the wavelength of the light emitted from the light-emitting element 3 and outputs it. We use what we let.
When an element that outputs blue light is used as the light-emitting element 3, if a fluorescent material that receives the light and outputs yellow light is used, both lights are mixed and white light is extracted. If a fluorescent material that can output a large amount of red component is used, light having a large redness component such as daylight color (bulb color) can be output.

蛍光材料は、発光素子３から離れて位置するに従い発光素子３の発する光によって励起されにくくなり、色ムラの要因になるので、発光素子の近くに集中させて蛍光材料を配置することが色ムラを抑える上で好ましい。例えば、第２の樹脂７よりも比重が大きな蛍光材料を用いることにより、蛍光材料を樹脂７の底に沈降させて、蛍光材料を発光素子３の近くに集中的に配置している。
上記のように第２の樹脂７を第１の樹脂５と別々に形成するので、樹脂と蛍光材料の選択に際して、第１の樹脂５と蛍光材料のマッチングを考慮する必要がなくなる。したがって、樹脂と蛍光材料の選択に際して、第１の樹脂５による制約を受けにくくなり、蛍光材料を最適位置に配置する上での設計が容易になる。 As the fluorescent material becomes farther away from the light emitting element 3, it becomes difficult to be excited by the light emitted from the light emitting element 3, which causes color unevenness. Therefore, it is necessary to concentrate the fluorescent material near the light emitting element and arrange the color unevenness. It is preferable in order to suppress this. For example, by using a fluorescent material having a specific gravity greater than that of the second resin 7, the fluorescent material is settled on the bottom of the resin 7, and the fluorescent material is concentrated near the light emitting element 3.
Since the second resin 7 is formed separately from the first resin 5 as described above, it is not necessary to consider matching between the first resin 5 and the fluorescent material when selecting the resin and the fluorescent material. Therefore, when selecting the resin and the fluorescent material, it is difficult to be restricted by the first resin 5, and the design for arranging the fluorescent material at the optimum position becomes easy.

第２の樹脂７は、図２に示すように、第１の樹脂５の側壁５１によって形成された枠部分の最上部まで充填しているが、発光素子３を覆うように素子の周囲にのみ配置することもできる。   As shown in FIG. 2, the second resin 7 is filled up to the top of the frame portion formed by the side wall 51 of the first resin 5, but only around the element so as to cover the light emitting element 3. It can also be arranged.

第２の樹脂７が硬化すると、リード４１,４３をアウターリードとして必要な長さを残して切断するとともに、タイバー４４を側壁５１の近くで切断することにより、発光装置１をリードフレームから切り離して個々の発光装置１を完成させる。   When the second resin 7 is cured, the leads 41 and 43 are cut as the outer leads leaving a necessary length, and the tie bar 44 is cut near the side wall 51 to separate the light emitting device 1 from the lead frame. Each light emitting device 1 is completed.

このようにして完成した発光装置１は、第１の樹脂５の側壁５１から突き出たリード４１，４３のアウターリード間に所定電圧を加えると、発光素子３に一定の電流が供給されて発光素子３が点灯する。発光素子３から出た光の一部は蛍光材料を励起する。この蛍光材料から出た光と発光素子の光は、矢印で示すように、装置の上面方向に出射されるが、その一部は、光透過性の第１、第２の樹脂５，７を伝わってリード４１,４２,４３の裏側にも回り込み、発光装置１の裏面側からも取り出される。ここで、リード４１,４２,４３の裏面をより広く覆うように、第１の樹脂５を形成しておくことが、光をリード４１,４２,４３の裏側により多く導くことができる点で好ましい。したがって、リード４１,４２,４３の裏面が露出しないように、発光装置１は、その裏面全面が第１の樹脂で覆ったわれた状態とすることが、裏面からの光取出しを増加させることができ、広指向性を実現する上で好ましい。   In the light emitting device 1 thus completed, when a predetermined voltage is applied between the outer leads of the leads 41 and 43 protruding from the side wall 51 of the first resin 5, a constant current is supplied to the light emitting element 3 and the light emitting element 1 3 lights up. Part of the light emitted from the light emitting element 3 excites the fluorescent material. The light emitted from the fluorescent material and the light emitted from the light emitting element are emitted in the direction of the upper surface of the device as indicated by arrows, but a part of the light is transmitted through the first and second resins 5 and 7 that are light transmissive. It is transmitted to the back side of the leads 41, 42, 43 and is taken out from the back side of the light emitting device 1. Here, it is preferable that the first resin 5 is formed so as to cover the back surfaces of the leads 41, 42, and 43 more widely because light can be guided more to the back side of the leads 41, 42, and 43. . Therefore, the light emitting device 1 can increase light extraction from the back surface by setting the entire back surface of the light emitting device 1 to be covered with the first resin so that the back surfaces of the leads 41, 42, and 43 are not exposed. This is preferable for realizing wide directivity.

図４は、発光装置１の上下左右方向の相対出力の分布を示している。図２中に示すように、０°（３６０°）は装置１の左方向、９０°は装置１の上（表面）方向、１８０°は装置１の右方向、２７０°は装置１の下（裏面）方向を示している。
図４（Ａ）は上記実施形態における相対出力の分布を示し、図４（Ｂ）は第２の樹脂を光反射性の白色樹脂にて構成した従来例における相対出力の分布を示している。図４（Ａ）と図４（Ｂ）を参照すると、上記の実施形態は、従来例とを比較すると、２７０°（裏面方向）方向の光量が、相対光量において０．１から０．４に大幅に増加していることが分かる。したがって、上記の実施形態によれば、光の出射方向を一方向ではなく、全方向に広げることができ、広指向性を実現できる。 FIG. 4 shows a distribution of relative outputs in the vertical and horizontal directions of the light emitting device 1. As shown in FIG. 2, 0 ° (360 °) is the left direction of the device 1, 90 ° is the upper (surface) direction of the device 1, 180 ° is the right direction of the device 1, and 270 ° is the lower side of the device 1 ( The direction of the back surface is shown.
4A shows the distribution of relative output in the above embodiment, and FIG. 4B shows the distribution of relative output in the conventional example in which the second resin is made of a light-reflecting white resin. Referring to FIGS. 4A and 4B, in the above embodiment, the light amount in the 270 ° (back surface direction) direction is changed from 0.1 to 0.4 in the relative light amount when compared with the conventional example. It can be seen that it has increased significantly. Therefore, according to the above embodiment, the light emission direction can be expanded in all directions, not in one direction, and wide directivity can be realized.

図５,６は、本発明の別の実施形態を示している。先の実施形態との相違点は、前記発光素子の左右に位置する前記第１の樹脂５によって形成される側面５２を、上下方向の中央部が外側に膨らんだ形状とし、側壁５１の上部外側面を、上から下に向かうに従って左右方向の外側に広がる形状とした点である。
図５に示す実施形態は、前記第１の樹脂５によって形成される側面５２を、上下方向の中央部が外側に膨らんだ形状とするに際して、上中下の領域５２ａ、５２ｂ、５２ｃをそれぞれ直線で結んだ形状としたものである。
図６に示す実施形態は、前記第１の樹脂５によって形成される側面５２を、上下方向の中央部が外側に膨らんだ形状とするに際して、上中下の領域５２ａ、５２ｂ、５２ｃをそれぞれ円弧状の曲線で結んだ形状としたものである。
このような上下方向の中央部が外側に膨らんだ側面形状とすることにより、側面から出射する光の臨界角を調整して、側面を透過して側方に出て行く光を裏面方向に効果的に案内することができ、裏面方向への相対的な光量を増加することができる。
本発明は、上記の実施形態に限定されるものではなく、本発明の趣旨を外れない範囲で種々の変更を行うことができる。 5 and 6 show another embodiment of the present invention. The difference from the previous embodiment is that the side surface 52 formed by the first resin 5 located on the left and right sides of the light emitting element has a shape in which the central portion in the vertical direction bulges outward, It is the point which made the side surface the shape which spreads outside in the left-right direction as it goes from top to bottom.
In the embodiment shown in FIG. 5, when the side surface 52 formed by the first resin 5 has a shape in which the central portion in the vertical direction bulges outward, the upper, middle, and lower regions 52 a, 52 b, and 52 c are straight lines, respectively. The shape tied in
In the embodiment shown in FIG. 6, when the side surface 52 formed by the first resin 5 has a shape in which the central portion in the vertical direction bulges outward, the upper, middle, and lower regions 52 a, 52 b, and 52 c are respectively circular. The shape is connected by an arcuate curve.
By adopting a side shape that bulges outward in the vertical center, the critical angle of light emitted from the side surface is adjusted, and light that passes through the side surface and exits to the side is effective in the back direction. Guidance and the relative light quantity in the direction of the back surface can be increased.
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

本発明は、発光素子の光を広範囲に照射する用途の発光装置とその製造方法に適用することができる。このような発光装置は、電球のフィラメント部分を構成する光源として利用することができる。   The present invention can be applied to a light-emitting device for use in irradiating light of a light-emitting element over a wide range and a manufacturing method thereof. Such a light-emitting device can be used as a light source constituting the filament portion of the light bulb.

本発明の実施形態に係る発光装置の長手方向の断面図である。It is sectional drawing of the longitudinal direction of the light-emitting device which concerns on embodiment of this invention. 本発明の実施形態に係る発光装置の短手方向の断面図である。It is sectional drawing of the transversal direction of the light-emitting device which concerns on embodiment of this invention. 本発明の実施形態に係る発光装置の製造工程を示す図である。It is a figure which shows the manufacturing process of the light-emitting device which concerns on embodiment of this invention. 発光装置の指向特性を示す図で、（Ａ）は本発明の実施形態に係る発光装置の特性、（Ｂ）は従来例に係る発光装置の特性を示している。It is a figure which shows the directional characteristic of a light-emitting device, (A) has shown the characteristic of the light-emitting device which concerns on embodiment of this invention, (B) has shown the characteristic of the light-emitting device which concerns on a prior art example. 本発明の別の実施形態に係る発光装置の短手方向の断面図である。It is sectional drawing of the transversal direction of the light-emitting device which concerns on another embodiment of this invention. 本発明のさらに別の実施形態に係る発光装置の短手方向の断面図である。It is sectional drawing of the transversal direction of the light-emitting device which concerns on another embodiment of this invention.

符号の説明Explanation of symbols

１ 発光装置
３ 発光素子
４１ リード
４２ リード
４３ リード
５ 第１の樹脂
７ 第２の樹脂 DESCRIPTION OF SYMBOLS 1 Light-emitting device 3 Light-emitting element 41 Lead 42 Lead 43 Lead 5 1st resin 7 2nd resin

Claims (6)

複数のリードをその一部を露出させた状態で第１の樹脂によって一体化したパッケージと、前記複数のリードのいずれかの上に固定され前記複数のリードのいずれかに電気的に接続された発光素子と、前記発光素子を封止する第２の樹脂とを備える発光装置において、前記第１及び第２の樹脂を光透過性の樹脂としたことを特徴とする発光装置。   A package in which a plurality of leads are integrated with a first resin with a part thereof exposed, and the lead is fixed on one of the plurality of leads and electrically connected to one of the plurality of leads A light-emitting device comprising a light-emitting element and a second resin that seals the light-emitting element, wherein the first and second resins are light-transmitting resins. 前記第１の樹脂は、前記第２の樹脂よりも耐熱温度が高い樹脂としたことを特徴とする請求項１記載の発光装置。   The light emitting device according to claim 1, wherein the first resin is a resin having a heat resistant temperature higher than that of the second resin. 前記発光素子の左右に位置する前記第１の樹脂によって形成される側壁の上部外側面を、上から下に向かうに従って左右方向の外側に広がる形状としたことを特徴とする請求項１あるいは２に記載の発光装置。   The upper outer surface of the side wall formed by the first resin located on the left and right sides of the light emitting element has a shape that spreads outward in the left-right direction from top to bottom. The light-emitting device of description. 前記第２の樹脂は、その中に蛍光材料を含有することを特徴とする請求項１〜３のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the second resin contains a fluorescent material therein. 複数のリードをその一部を露出させた状態で光透過性の第１の樹脂によって一体化したパッケージを準備する工程と、前記複数のリードのいずれかの上に発光素子を固定する工程と、前記発光素子と前記複数のリードのいずれかを電気的に接続する工程と、前記複数のリードのいずれかの上に固定された前記発光素子を光透過性の第２の樹脂によって封止する工程とを備えたことを特徴とする発光装置の製造方法。   A step of preparing a package in which a plurality of leads are partially integrated with a light transmissive first resin in a state where a part of the leads is exposed; a step of fixing a light emitting element on any of the plurality of leads; Electrically connecting the light emitting element and any of the plurality of leads, and sealing the light emitting element fixed on any of the plurality of leads with a light transmissive second resin. A method for manufacturing a light-emitting device. 前記第２の樹脂は、その中に蛍光材料を含有することを特徴とする請求項５に記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to claim 5, wherein the second resin contains a fluorescent material therein.
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