JP2012520565A - LED lead frame package, LED package using the same, and method of manufacturing the LED package - Google Patents

LED lead frame package, LED package using the same, and method of manufacturing the LED package Download PDF

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JP2012520565A
JP2012520565A JP2011553937A JP2011553937A JP2012520565A JP 2012520565 A JP2012520565 A JP 2012520565A JP 2011553937 A JP2011553937 A JP 2011553937A JP 2011553937 A JP2011553937 A JP 2011553937A JP 2012520565 A JP2012520565 A JP 2012520565A
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layer
ring
led
sealing layer
led package
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トラン グエン、ザ
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ネペス エルイーディー コーポレーション
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

ＬＥＤリードフレームパッケージ、これを利用したＬＥＤパッケージ及び前記ＬＥＤパッケージの製造方法を開示する。本発明によると、ＬＥＤパッケージの製造において、尖った上部エッジと傾斜した側壁を有する少なくとも二つのリング型突出部と前記リング型突出部間に形成された少なくとも一つのリング型溝上に液状の透明樹脂材料を提供することにより、表面張力を利用して単一な工程で盛り上がった曲面を有する封止層を容易に形成できる。
【選択図】図１An LED lead frame package, an LED package using the LED lead frame package, and a method of manufacturing the LED package are disclosed. According to the present invention, in manufacturing an LED package, a liquid transparent resin is formed on at least two ring-shaped protrusions having a sharp upper edge and inclined side walls and at least one ring-shaped groove formed between the ring-shaped protrusions. By providing the material, it is possible to easily form a sealing layer having a curved surface that is raised in a single process using surface tension.
[Selection] Figure 1

Description

本発明は、ＬＥＤリードフレームパッケージ、これを利用したＬＥＤパッケージ及び前記ＬＥＤパッケージの製造方法に関するものであり、より詳しくは、製造が容易で製造コストを低減できるＬＥＤリードフレームパッケージ、これを利用したＬＥＤパッケージ及び前記ＬＥＤパッケージの製造方法に関するものである。   The present invention relates to an LED lead frame package, an LED package using the same, and a method for manufacturing the LED package, and more particularly, an LED lead frame package that is easy to manufacture and can reduce manufacturing costs, and an LED using the LED lead frame package The present invention relates to a package and a method for manufacturing the LED package.

半導体照明装置であって、ＬＥＤは、白熱灯や蛍光灯のような伝統的な照明装置に比べて多くの長所を有する。例えば、ＬＥＤは寿命が長く、サイズが小さく、且つ電力消費が少なく、水銀汚染がない。これにより、最近は既存の照明装置を代替するための新たな照明装置としてＬＥＤを主に使用している。   A semiconductor lighting device, LED has many advantages over traditional lighting devices such as incandescent lamps and fluorescent lamps. For example, LEDs have a long lifetime, small size, low power consumption, and no mercury contamination. As a result, recently, LEDs are mainly used as new illumination devices for replacing existing illumination devices.

ＬＥＤパッケージの光出力を向上させるために、ＬＥＤパッケージの外側光学層には一般的に盛り上がったレンズ構造が導入される。従来のＬＥＤパッケージにおいて、このような凸レンズ構造は予め別途に作られた後にＬＥＤパッケージ上に装着される。このような凸レンズ構造の追加的な製造及び組立工程により、追加的な製造及び組立装置が要求される。それだけでなく、予め別途に作られた凸レンズ構造をＬＥＤパッケージ上に装着する過程で、前記凸レンズ構造とＬＥＤパッケージ上に既に形成されている封止層間に好ましくない空気層が形成される場合もある。また、従来の技術の場合、ＬＥＤダイ（ｄｉｅ）上にＬＥＤダイを保護するための封止層を形成する過程で、前記封止層の外部表面に盛り上がった曲率を作ることが容易でない。よって、従来のＬＥＤパッケージの製造方法は、製造収率が比較的低く、生産コストが比較的多くかかる。   In order to improve the light output of the LED package, a generally raised lens structure is introduced into the outer optical layer of the LED package. In a conventional LED package, such a convex lens structure is separately prepared and mounted on the LED package. Such an additional manufacturing and assembling process of the convex lens structure requires an additional manufacturing and assembling apparatus. In addition, an undesired air layer may be formed between the convex lens structure and the sealing layer already formed on the LED package in the process of mounting a separately prepared convex lens structure on the LED package. . In the case of the conventional technique, it is not easy to create a raised curvature on the outer surface of the sealing layer in the process of forming the sealing layer for protecting the LED die on the LED die. Therefore, the conventional LED package manufacturing method has a relatively low manufacturing yield and a relatively high production cost.

一方、白色光を発生させる白色ＬＥＤを提供するために、通常、青色又はＵＶ ＬＥＤダイ上に蛍光層を直接塗布する方式を用いている。例えば、青色ＬＥＤダイを使用する場合、蛍光体材料から発生した多様な波長の光が混ざり合ったり、或いは前記の多様な波長の光が青色ＬＥＤダイからの青色励起光と混合して白色光が放出され得る。ところが、ＬＥＤダイ上に蛍光層を直接塗布する方式の場合、ＬＥＤダイと蛍光層が非常に近接しているため、蛍光体材料から発生した光がＬＥＤダイに進んでＬＥＤダイで吸収されるという問題が発生し得る。   On the other hand, in order to provide a white LED that generates white light, a method of directly applying a fluorescent layer on a blue or UV LED die is usually used. For example, when using a blue LED die, light of various wavelengths generated from the phosphor material is mixed, or light of various wavelengths is mixed with blue excitation light from the blue LED die to generate white light. Can be released. However, in the case of the method in which the fluorescent layer is directly applied on the LED die, the LED die and the fluorescent layer are very close to each other, so that light generated from the phosphor material proceeds to the LED die and is absorbed by the LED die. Problems can arise.

これにより、ＬＥＤダイと蛍光層間に透明なスペーサーを置いて、蛍光層から発生した光がＬＥＤダイ又はその周辺の基板に入射して吸収される可能性を減らす技術が提案された。例えば、図１は特許文献１に開示された技術の例を示している。図１を参照すると、基板６２上にＬＥＤダイ６０が実装されており、蛍光層６６はＬＥＤダイ６０を覆う透明なスペーサー６４によりＬＥＤダイ６０から離れている。また、蛍光層６６の外側に保護層６８が形成されている。しかし、このような構造でも、依然と蛍光層６６から発生した光は殆ど妨害なくＬＥＤダイ６０及びその周辺の基板６２上に入射して吸収され得る。   Accordingly, a technique has been proposed in which a transparent spacer is placed between the LED die and the fluorescent layer to reduce the possibility that light generated from the fluorescent layer is incident on and absorbed by the LED die or its peripheral substrate. For example, FIG. 1 shows an example of the technique disclosed in Patent Document 1. Referring to FIG. 1, an LED die 60 is mounted on a substrate 62, and the fluorescent layer 66 is separated from the LED die 60 by a transparent spacer 64 that covers the LED die 60. A protective layer 68 is formed outside the fluorescent layer 66. However, even in such a structure, the light generated from the fluorescent layer 66 can still be incident on the LED die 60 and the substrate 62 around it without being disturbed.

米国特許第５,９５９,３１６号US Pat. No. 5,959,316

本発明の目的は、製造が容易で製造コストを低減できるＬＥＤリードフレームパッケージ、及びこれを利用したＬＥＤパッケージを提供することである。   An object of the present invention is to provide an LED lead frame package that is easy to manufacture and can reduce manufacturing costs, and an LED package using the LED lead frame package.

本発明の他の目的は、蛍光体材料から発生した光がＬＥＤダイに入射して吸収される光吸収損失を低減できるＬＥＤパッケージを提供することである。   Another object of the present invention is to provide an LED package capable of reducing a light absorption loss in which light generated from a phosphor material is incident on and absorbed by the LED die.

本発明のまた別の目的は、製造が容易で製造コストを低減できるＬＥＤパッケージの製造方法を提供することである。   Another object of the present invention is to provide an LED package manufacturing method that is easy to manufacture and can reduce manufacturing costs.

本発明の一類型によるリードフレームパッケージは、防熱ベース；前記防熱ベースの周りに配置された多数の電極；前記防熱ベースと多数の電極を囲んで固定する絶縁性支持部；前記絶縁性支持部の上部表面上に一周するように形成された少なくとも二つのリング型突出部；及び前記リング型突出部間に形成された少なくとも一つのリング型溝を含み得る。   A lead frame package according to a type of the present invention includes: a heat insulating base; a plurality of electrodes disposed around the heat insulating base; an insulating support portion that surrounds and fixes the heat insulating base and the plurality of electrodes; And at least two ring-shaped protrusions formed around the upper surface; and at least one ring-shaped groove formed between the ring-shaped protrusions.

また、本発明の一類型によるＬＥＤパッケージは、上述の構造のリードフレームパッケージを含み得る。   In addition, an LED package according to one type of the present invention may include a lead frame package having the above-described structure.

具体的に前記ＬＥＤパッケージは、前記防熱ベースの底面上に付けられた少なくとも一つのＬＥＤダイ（ｄｉｅ）；前記ＬＥＤダイと前記の多数の電極を電気的に連結する多数のワイヤ；及び前記ＬＥＤダイを覆うように形成された盛り上がった外部表面を有する少なくとも一つの層を備える封止層構造をさらに含み得る。ここで、前記封止層構造の少なくとも一つの層のそれぞれの縁は、前記の少なくとも二つのリング型突出部中の対応する一つまで延び得る。   Specifically, the LED package includes at least one LED die attached on a bottom surface of the heat-proof base; a plurality of wires that electrically connect the LED die and the plurality of electrodes; and the LED die. And a sealing layer structure comprising at least one layer having a raised external surface formed to cover. Here, each edge of the at least one layer of the sealing layer structure may extend to a corresponding one of the at least two ring-shaped protrusions.

一方、本発明の他の類型によるＬＥＤパッケージの製造方法は、防熱ベース、前記防熱ベースの周りに配置された多数の電極、前記防熱ベースと多数の電極を囲んで固定する絶縁性支持部、前記絶縁性支持部の上部表面上に一周するように形成された少なくとも二つのリング型突出部、及び前記リング型突出部間に形成された少なくとも一つのリング型溝を含むリードフレームパッケージを提供すること；前記防熱ベースの上部表面上に少なくとも一つのＬＥＤダイを付けること；前記ＬＥＤダイと前記の多数の電極を電気的に連結すること；及び前記ＬＥＤダイを覆うように盛り上がった外部表面を有する少なくとも一つの層を備える封止層構造を形成することを含み得る。ここで、前記封止層構造の少なくとも一つの層のそれぞれの縁は、前記の少なくとも二つのリング型突出部中の対応する一つまで延び得る。   Meanwhile, a method of manufacturing an LED package according to another type of the present invention includes a heat insulating base, a plurality of electrodes disposed around the heat insulating base, an insulating support portion that surrounds and fixes the heat insulating base and the plurality of electrodes, To provide a lead frame package including at least two ring-shaped protrusions formed so as to make a round on an upper surface of an insulating support, and at least one ring-shaped groove formed between the ring-shaped protrusions. Attaching at least one LED die on the top surface of the thermal barrier base; electrically connecting the LED die and the plurality of electrodes; and at least having an external surface raised to cover the LED die Forming a sealing layer structure comprising one layer may be included. Here, each edge of the at least one layer of the sealing layer structure may extend to a corresponding one of the at least two ring-shaped protrusions.

従来の白色ＬＥＤの一例の構造を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of an example of the conventional white LED. 本発明の一例にかかるＬＥＤリードフレームパッケージの構造を概略的に示す斜視図である。1 is a perspective view schematically showing a structure of an LED lead frame package according to an example of the present invention. 図２に示したＬＥＤリードフレームパッケージの構造を概略的に示す平面図である。FIG. 3 is a plan view schematically showing the structure of the LED lead frame package shown in FIG. 2. 図２に示したＬＥＤリードフレームパッケージから絶縁性支持部を除外した防熱ベースと多数の電極の配置関係を概略的に示す斜視図である。FIG. 3 is a perspective view schematically showing an arrangement relationship between a heat-insulating base excluding an insulating support portion from the LED lead frame package shown in FIG. 2 and a large number of electrodes. 図２に示したＬＥＤリードフレームパッケージの構造を概略的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing the structure of the LED lead frame package shown in FIG. 2. 本発明の一例にかかるＬＥＤパッケージの構造を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the LED package concerning an example of this invention. 本発明の他の例にかかるＬＥＤパッケージの構造を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the LED package concerning the other example of this invention. 本発明にかかるＬＥＤパッケージの製造方法の原理を概略的に説明する断面図である。It is sectional drawing which illustrates roughly the principle of the manufacturing method of the LED package concerning this invention. 本発明にかかるＬＥＤパッケージの製造方法の原理を概略的に説明する断面図である。It is sectional drawing which illustrates roughly the principle of the manufacturing method of the LED package concerning this invention.

以下、添付の図面を参照して、本発明の一実施例にかかるＬＥＤリードフレームパッケージ、これを利用したＬＥＤパッケージ及び前記ＬＥＤパッケージの製造方法について詳しく説明する。以下の図面で同一な参照符号は同一な構成要素を指し、図面上で各構成要素の大きさは、説明の明瞭性と便宜上、誇張する場合がある。   Hereinafter, an LED lead frame package according to an embodiment of the present invention, an LED package using the same, and a method of manufacturing the LED package will be described in detail with reference to the accompanying drawings. In the following drawings, the same reference numerals denote the same components, and the size of each component may be exaggerated for the sake of clarity and convenience in the drawings.

図２は、本発明の一例にかかるＬＥＤリードフレームパッケージ２０の構造を概略的に示す斜視図である。図２を参照すると、本発明の一例にかかるリードフレームパッケージ（ｌｅａｄｆｒａｍｅ ｐａｃｋａｇｅ）２０は、防熱ベース（ｈｅａｔ ｄｉｓｓｉｐａｔｉｏｎ ｂａｓｅ）２、前記防熱ベース２の周りに配置された多数の電極１、及び防熱ベース２と多数の電極１を囲んで固定する絶縁性支持部３を含み得る。ここで前記絶縁性支持部３は、例えばＰＰＡ（ｐｏｌｙ ｐｈｔｈａｌ ａｍｉｄ）プラスチックのような絶縁性プラスチック材料からなり得る。   FIG. 2 is a perspective view schematically showing the structure of the LED lead frame package 20 according to an example of the present invention. Referring to FIG. 2, a leadframe package 20 according to an example of the present invention includes a heat insulation base 2, a plurality of electrodes 1 disposed around the heat insulation base 2, and a heat insulation base 2. And an insulating support 3 that surrounds and fixes the plurality of electrodes 1. Here, the insulating support part 3 may be made of an insulating plastic material such as PPA (poly phthalamide) plastic.

前記ＬＥＤリードフレームパッケージ２０を上述の構造を概略的に示す平面図である図３を参照すると、ＬＥＤリードフレームパッケージ２０は、例えば周りの方向に従って配列された四つの同一な金属電極１を備え得る。四つの電極１は、防熱ベース２の中心軸を中心にして、約９０度の間隔でそれぞれ配列され得、前記防熱ベース２の中心軸に垂直な方向に突出されている。絶縁性支持部３を除外した防熱ベース２と電極１の配置関係を概略的に示す斜視図である図４を参照すると、四つの電極１の上部表面は、防熱ベース２の最も高い地点と同一な高さに形成されている。また、図２〜図４に示したように、電極１の一側端部は防熱ベース２の側面周りと対向しており、他側端部は絶縁性支持部３の外側壁から突出するように配置され得る。このような電極１の上部表面は、例えば銀やアルミニウムのような高反射性材料でコーティングされ得る。図面には、四つの電極１が例示的に示されているが、実施例によって電極１の個数は自由に選択できる。   Referring to FIG. 3, which is a plan view schematically showing the above-described structure of the LED lead frame package 20, the LED lead frame package 20 may include, for example, four identical metal electrodes 1 arranged according to surrounding directions. . The four electrodes 1 can be arranged at intervals of about 90 degrees around the central axis of the heat insulating base 2, and protrude in a direction perpendicular to the central axis of the heat insulating base 2. Referring to FIG. 4, which is a perspective view schematically showing the arrangement relationship between the heat insulating base 2 and the electrode 1 excluding the insulating support portion 3, the upper surfaces of the four electrodes 1 are the same as the highest point of the heat insulating base 2. It is formed at a certain height. As shown in FIGS. 2 to 4, one end of the electrode 1 faces the side of the heat-insulating base 2, and the other end protrudes from the outer wall of the insulating support 3. Can be arranged. The upper surface of the electrode 1 can be coated with a highly reflective material such as silver or aluminum. In the drawing, four electrodes 1 are exemplarily shown, but the number of the electrodes 1 can be freely selected according to the embodiment.

また、図４を参照すると、防熱ベース２はその中心部にキャビティ（ｃａｖｉｔｙ）形態の反射カップ（ｒｅｆｌｅｃｔｉｖｅ ｃｕｐ）１０を有し得る。前記反射カップ１０の底面は、例えば銀やアルミニウムのような高反射性材料でコーティングされ得る。反射カップ１０の上部面は、防熱ベース２の最も高い地点にある。つまり、反射カップ１０の上部面は、電極１の上部表面と同一な高さに形成できる。   Referring to FIG. 4, the heat-insulating base 2 may have a reflective cup 10 in the form of a cavity. The bottom surface of the reflective cup 10 may be coated with a highly reflective material such as silver or aluminum. The upper surface of the reflecting cup 10 is at the highest point of the heat insulating base 2. That is, the upper surface of the reflecting cup 10 can be formed at the same height as the upper surface of the electrode 1.

防熱ベース２と多数の電極１は、図４のように配置された状態で、それらを囲む絶縁性支持部３によって固定される。このために、多数の電極１、防熱ベース２、及び絶縁性支持部３は、例えば射出成形工程により一体に形成できる。   The heat-insulating base 2 and the multiple electrodes 1 are fixed by an insulating support 3 that surrounds them in a state of being arranged as shown in FIG. For this reason, many electrodes 1, the heat-insulating base 2, and the insulating support part 3 can be integrally formed by, for example, an injection molding process.

また、ＬＥＤリードフレームパッケージ２０の断面構造を概略的に示している図５及び前述の図２の斜視図を参照すると、前記リードフレームパッケージ２０は絶縁性支持部３の上部表面上を一周するように形成された少なくとも二つのリング型突出部１１、１２、１３、１４、及び前記リング型突出部１１、１２、１３、１４間に形成された少なくとも一つのリング型溝１５、１６、１７をさらに含み得る。前記の多数のリング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７は、絶縁性支持部３の上部表面上に同心円の形態に形成できる。図５に示したように、多数のリング型突出部１１、１２、１３、１４は、尖った上部エッジと傾斜した側壁を有するように形成できる。   Referring to FIG. 5 schematically showing the cross-sectional structure of the LED lead frame package 20 and the perspective view of FIG. 2 described above, the lead frame package 20 makes a round on the upper surface of the insulating support 3. And at least two ring-shaped protrusions 11, 12, 13, 14 and at least one ring-shaped groove 15, 16, 17 formed between the ring-shaped protrusions 11, 12, 13, 14. May be included. The plurality of ring-shaped protrusions 11, 12, 13, 14 and the ring-shaped grooves 15, 16, 17 can be formed on the upper surface of the insulating support 3 in the form of concentric circles. As shown in FIG. 5, the multiple ring-shaped protrusions 11, 12, 13, and 14 can be formed to have sharp upper edges and inclined side walls.

このような多数のリング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７は、絶縁性支持部３と同一なＰＰＡプラスチックからなり、絶縁性支持部３の一部分であり得る。例えば、前記の多数のリング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７は、移送成形（ｔｒａｎｓｆｅｒ ｍｏｌｄｉｎｇ）工程により絶縁性支持部３の上部表面上に形成され得る。又は、多数の電極１、防熱ベース２及び絶縁性支持部３を一体に形成する射出成形過程で、多数のリング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７も一緒に形成できる。図５には、四つのリング型突出部と三つのリング型溝が例示的に示されているが、その個数は実施例によって自由に選択できる。   A large number of such ring-shaped protrusions 11, 12, 13, 14 and ring-shaped grooves 15, 16, 17 are made of the same PPA plastic as the insulating support 3 and may be a part of the insulating support 3. . For example, the plurality of ring-shaped protrusions 11, 12, 13, 14 and the ring-shaped grooves 15, 16, 17 may be formed on the upper surface of the insulating support 3 by a transfer molding process. Or, in the injection molding process of integrally forming a large number of electrodes 1, a heat-insulating base 2, and an insulating support 3, a large number of ring-shaped protrusions 11, 12, 13, and 14 and ring-shaped grooves 15, 16, and 17 together. Can be formed. FIG. 5 exemplarily shows four ring-shaped protrusions and three ring-shaped grooves, but the number thereof can be freely selected according to the embodiment.

このように多数のリング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７を有する上述の構造のＬＥＤリードフレームパッケージ２０は、ＬＥＤパッケージ（ＬＥＤ ｐａｃｋａｇｅ）の製造に使用される際、多層構造の封止層の形成を容易にし得る。図６は、前記ＬＥＤリードフレームパッケージ２０を利用した本発明の一例にかかるＬＥＤパッケージ３０の構造を概略的に示す断面図である。図６を参照すると、本発明の一例にかかるＬＥＤパッケージ３０は防熱ベース２の底面上に付けられたＬＥＤダイ（ｄｉｅ）４、前記ＬＥＤダイ４と多数の電極１を電気的に連結する多数のワイヤ６、ＬＥＤダイ４を覆うように防熱ベース２の反射カップ１０上に形成された封止層７、前記封止層７を覆うように形成された蛍光層８、及び前記蛍光層８を覆うように形成された光学レンズ層９を含み得る。   Thus, the LED lead frame package 20 having the above-described structure having a large number of ring-shaped protrusions 11, 12, 13, and 14 and ring-shaped grooves 15, 16, and 17 is used for manufacturing an LED package. At this time, the formation of the sealing layer having a multilayer structure can be facilitated. FIG. 6 is a cross-sectional view schematically showing a structure of an LED package 30 according to an example of the present invention using the LED lead frame package 20. Referring to FIG. 6, an LED package 30 according to an example of the present invention includes an LED die 4 attached on the bottom surface of the heat-insulating base 2, and a plurality of electrodes that electrically connect the LED die 4 and the plurality of electrodes 1. The wire 6, the sealing layer 7 formed on the reflective cup 10 of the heat-insulating base 2 so as to cover the LED die 4, the fluorescent layer 8 formed so as to cover the sealing layer 7, and the fluorescent layer 8 are covered. An optical lens layer 9 formed as described above may be included.

ここで、ＬＥＤダイ４は、例えばダイ接着材料５によって防熱ベース２の底面に、つまり、防熱ベース２の反射カップ１０の底面に固定され得る。ダイ接着材料５は、例えば、銀ペースト（ｓｉｌｖｅｒ ｐａｓｔｅ）や、はんだ（ｓｏｌｄｅｒ）を使用できる。防熱ベース２の底面には、単に一つのＬＥＤダイ４が配置されることもあるが、必要に応じて、多数のＬＥＤダイ４が配置されることもある。例えば、ＵＶ ＬＥＤ、青色ＬＥＤ、緑色ＬＥＤ、及び赤色ＬＥＤの少なくとも一つが防熱ベース２の底面に配置され得る。   Here, the LED die 4 can be fixed to the bottom surface of the heat insulating base 2 by, for example, the die bonding material 5, that is, to the bottom surface of the reflection cup 10 of the heat insulating base 2. As the die bonding material 5, for example, a silver paste or solder can be used. Although only one LED die 4 may be disposed on the bottom surface of the heat-insulating base 2, a plurality of LED dies 4 may be disposed as necessary. For example, at least one of a UV LED, a blue LED, a green LED, and a red LED may be disposed on the bottom surface of the heat insulating base 2.

封止層７、蛍光層８、及び光学レンズ層９は、一緒に多層封止層構造を形成する。効率的な光出力のために、封止層７、蛍光層８及び光学レンズ層９は、盛り上がった外部表面を有し得る。また、蛍光層８から発生した光がＬＥＤダイ４に入射してＬＥＤダイ４で吸収されることを防ぐために、封止層７の有効屈折率は可視光の波長帯域で蛍光層８の有効屈折率より小さいこともある。   The sealing layer 7, the fluorescent layer 8, and the optical lens layer 9 together form a multilayer sealing layer structure. For efficient light output, the sealing layer 7, the fluorescent layer 8 and the optical lens layer 9 can have raised external surfaces. In addition, in order to prevent light generated from the fluorescent layer 8 from entering the LED die 4 and being absorbed by the LED die 4, the effective refractive index of the sealing layer 7 is effective refractive index of the fluorescent layer 8 in the visible light wavelength band. It may be smaller than the rate.

蛍光層８は、例えば、ＵＶ光、青色光又は緑色光によって励起されて可視光を発生させる。このために、前記蛍光層８は、ガラス、ポリカーボネート（ｐｏｌｙｃａｒｂｏｎａｔｅ；ＰＣ）、ポリメチルメタクリレート（ｐｏｌｙ（ｍｅｔｈｌｙ ｍｅｔｈａｃｒｙｌａｔｅ）；ＰＭＭＡ）又はシリコン樹脂のような透明な材料に蛍光体材料を均一に混合して行われ得る。前記蛍光体材料は、ＵＶ光、青色光又は緑色光によって励起され、相違する波長の可視光をそれぞれ発生させる少なくとも一種類の蛍光体材料を含み得る。例えば、蛍光体材料は、青色、緑色、黄色、オレンジ色及び赤色のように相違する波長の可視光をそれぞれ発生させる多様な種類の蛍光体材料の少なくとも一つであり得る。緑色、黄色、オレンジ色及び赤色蛍光体は、青色光又は緑色光を少なくとも部分的に吸収したり、又はＵＶ光を完全に吸収して、それぞれ緑色、黄色、オレンジ色及び赤色でピーク波長を有する光スペクトラムを放出できる。また、青色蛍光体は、ＵＶ光を完全に吸収して青色領域のピーク波長を有する光スペクトラムを放出できる。   The fluorescent layer 8 is excited by, for example, UV light, blue light, or green light to generate visible light. For this, the phosphor layer 8 is prepared by uniformly mixing a phosphor material with a transparent material such as glass, polycarbonate (PC), polymethyl methacrylate (PMMA) or silicon resin. Can be done. The phosphor material may include at least one phosphor material that is excited by UV light, blue light, or green light and generates visible light having different wavelengths. For example, the phosphor material may be at least one of various types of phosphor materials that respectively generate visible light having different wavelengths such as blue, green, yellow, orange, and red. Green, yellow, orange and red phosphors have peak wavelengths at green, yellow, orange and red, respectively, absorbing blue light or green light at least partially or fully absorbing UV light The light spectrum can be emitted. Further, the blue phosphor can completely absorb UV light and emit a light spectrum having a peak wavelength in the blue region.

このような蛍光層８を利用して、白色光を放出するＬＥＤパッケージ３０を提供できる。例えば、ＬＥＤダイ４が４５０ｎｍ〜４８０ｎｍの波長範囲の青色光を放出する場合、蛍光層８は青色光によって励起され、黄色ピーク波長を有する光を放出できる。すると、黄色光と残余青色光が混合されながら白色光が作られる。蛍光層８はまた、ＬＥＤダイ４から放出された励起波長の光によって励起され、多様な波長の光を放出する多様な種類の蛍光体材料を含むこともある。この場合、多様な波長の光が混合されながら白色光が作られる。例えば、ＬＥＤダイ４が３８０ｎｍ〜４５０ｎｍ範囲の近紫外線（ｎｅａｒ−ＵＶ）を放出する場合、蛍光層８は近紫外線によって励起され、それぞれ青色、緑色及び赤色のピーク波長を有する光を放出する青色、緑色及び赤色蛍光体材料を含み得る。すると、前記青色、緑色及び赤色の光が混合されながら白色光が作られ得る。   The LED package 30 that emits white light can be provided by using such a fluorescent layer 8. For example, when the LED die 4 emits blue light having a wavelength range of 450 nm to 480 nm, the fluorescent layer 8 can be excited by the blue light and emit light having a yellow peak wavelength. Then, white light is produced while mixing yellow light and residual blue light. The phosphor layer 8 may also include various types of phosphor materials that are excited by the excitation wavelength light emitted from the LED die 4 and emit light of various wavelengths. In this case, white light is produced while light of various wavelengths is mixed. For example, when the LED die 4 emits near-UV in the range of 380 nm to 450 nm, the fluorescent layer 8 is excited by near-ultraviolet and emits light having peak wavelengths of blue, green and red, respectively. Green and red phosphor materials may be included. Then, white light can be produced while the blue, green, and red lights are mixed.

一方、本発明によると、リング型突出部１１、１２、１３、１４とリング型溝１５、１６、１７を利用して前記封止層７、蛍光層８及び光学レンズ層９の大きさと上部表面の曲率を容易に調整できる。図６に示したように、封止層７の縁は第１リング型突出部１１まで延びていて、蛍光層８の縁は第２リング型突出部１２まで延びていて、光学レンズ層の縁は第３リング型突出部１３まで延びている。このようにそれぞれの層７、８、９の縁を、対応するリング型突出部１１、１２、１３に限定させることにより、それぞれの層７、８、９の大きさを容易に限定できる。そして、対応するリング型突出部１１、１２、１３内に限定されたそれぞれの層７、８、９に提供された材料の量を調節することにより、前記のそれぞれの層７、８、９の上部表面の曲率が容易に決められ得る。   Meanwhile, according to the present invention, the size and upper surface of the sealing layer 7, the fluorescent layer 8, and the optical lens layer 9 are utilized using the ring-shaped protrusions 11, 12, 13, 14 and the ring-shaped grooves 15, 16, 17. Can be easily adjusted. As shown in FIG. 6, the edge of the sealing layer 7 extends to the first ring-type protrusion 11, and the edge of the fluorescent layer 8 extends to the second ring-type protrusion 12, and the edge of the optical lens layer Extends to the third ring-shaped protrusion 13. Thus, by limiting the edges of the respective layers 7, 8, 9 to the corresponding ring-shaped protrusions 11, 12, 13, the sizes of the respective layers 7, 8, 9 can be easily limited. And by adjusting the amount of material provided to each layer 7, 8, 9 confined within the corresponding ring-shaped projections 11, 12, 13 of each of said layers 7, 8, 9 The curvature of the upper surface can be easily determined.

以下では、上述の構造のＬＥＤパッケージ３０を製造する方法について詳しく説明する。先ず、防熱ベース２、前記防熱ベース２の周りに配置された多数の電極１、防熱ベース２と多数の電極１を囲んで固定する絶縁性支持部３、前記絶縁性支持部３の上部表面上に形成された多数のリング型突出部１１、１２、１３、１４、及び前記リング型突出部１１、１２、１３、１４間に形成された多数のリング型溝１５、１６、１７を含むリードフレームパッケージ２０を、例えば射出成形工程等を利用して準備する。その後、ダイ接着材料５を利用して防熱ベース２の底面上に少なくとも一つのＬＥＤダイ４を付けた後、多数のワイヤ６によりＬＥＤダイ４と多数の電極１を電気的に連結する。   Hereinafter, a method for manufacturing the LED package 30 having the above-described structure will be described in detail. First, a heat insulating base 2, a large number of electrodes 1 arranged around the heat insulating base 2, an insulating support 3 that surrounds and fixes the heat insulating base 2 and the numerous electrodes 1, and an upper surface of the insulating support 3 A lead frame including a plurality of ring-shaped protrusions 11, 12, 13, 14 formed in the ring-shaped protrusions 11, 12, 13, 14 The package 20 is prepared using, for example, an injection molding process. Thereafter, at least one LED die 4 is attached on the bottom surface of the heat insulating base 2 using the die bonding material 5, and then the LED die 4 and the multiple electrodes 1 are electrically connected by the multiple wires 6.

次に、ＬＥＤダイ４を覆うように防熱ベース２の反射カップ１０に液状の透明樹脂材料を満たす。透明樹脂材料は、例えばシリコン樹脂であり得る。このとき、液状の透明樹脂材料は、例えば第１リング型突出部１１内に限定される限度内で十分な量が提供され得る。すると、液状の透明樹脂材料の外部表面は第１リング型突出部１１の尖った上部エッジ内で表面張力によって盛り上がって形成される。例えば、図８に示したように、透明樹脂材料１８を第１リング型突出部１１内に限定される限度内で十分な量を提供すると、表面張力によって盛り上がった外部表面が形成される。このような盛り上がった外部表面の曲率は、提供された透明樹脂材料１８の量によって決められ得る。もし、多すぎる材料が提供されて透明樹脂材料１８が第１リング型突出部１１から溢れても、図９に示したように、透明樹脂材料１８は、再度第２リング型突出部１２内に限定され得る。このような方式で外部表面が目的とする曲率に到達した後は、熱又はＵＶ照射により液状の透明樹脂材料１８を硬化させると、封止層７が形成される。よって、本発明によると、封止層７の大きさと曲率を容易に限定できる。   Next, the reflective cup 10 of the heat insulating base 2 is filled with a liquid transparent resin material so as to cover the LED die 4. The transparent resin material can be, for example, a silicon resin. At this time, a sufficient amount of the liquid transparent resin material can be provided within a limit limited within the first ring-type projecting portion 11, for example. As a result, the outer surface of the liquid transparent resin material is formed so as to rise due to surface tension within the sharp upper edge of the first ring-type protrusion 11. For example, as shown in FIG. 8, when a sufficient amount of the transparent resin material 18 is provided within the limit limited in the first ring-type protrusion 11, an external surface raised by surface tension is formed. The curvature of such raised external surface can be determined by the amount of transparent resin material 18 provided. If too much material is provided and the transparent resin material 18 overflows from the first ring-type protrusion 11, the transparent resin material 18 again enters the second ring-type protrusion 12 as shown in FIG. 9. It can be limited. After the external surface reaches the target curvature in this manner, the sealing layer 7 is formed by curing the liquid transparent resin material 18 by heat or UV irradiation. Therefore, according to the present invention, the size and curvature of the sealing layer 7 can be easily limited.

その後は、封止層７を覆うように前記封止層７上に蛍光体材料が均一に混合された液状の透明樹脂材料を提供する。例えば、液状のシリコン樹脂と蛍光体材料が均一に混合された混合物を封止層７上に提供できる。このとき、この混合物は第２リング型突出部１２内に限定され、第２リング型突出部１２の尖った上部エッジ内で表面張力によって盛り上がった外部表面を有するようになる。前記混合物の外部表面が目的とする曲率に到達した後、熱又はＵＶ照射により液状の混合物を硬化させると、蛍光層８が形成される。   Thereafter, a liquid transparent resin material in which a phosphor material is uniformly mixed on the sealing layer 7 so as to cover the sealing layer 7 is provided. For example, a mixture in which a liquid silicon resin and a phosphor material are uniformly mixed can be provided on the sealing layer 7. At this time, the mixture is confined within the second ring-shaped protrusion 12 and has an outer surface raised by surface tension within the sharp upper edge of the second ring-shaped protrusion 12. After the external surface of the mixture reaches the desired curvature, the fluorescent layer 8 is formed by curing the liquid mixture by heat or UV irradiation.

最後に、前記蛍光層８を覆うように蛍光層８上に液状の透明樹脂材料を提供する。例えば、液状の透明樹脂材料は、シリコン樹脂であり得る。ここで、蛍光層８上の液状の透明樹脂材料は、第３リング型突出部１３内に限定され、第３リング型突出部１３の尖った上部エッジ内で表面張力によって盛り上がった外部表面を有すようになる。その後、前記蛍光層８上の液状の透明樹脂材料を硬化させて光学レンズ層９が形成され得る。このような方式で、封止層７、蛍光層８及び光学レンズ層９が目的とする大きさ及び外部表面の曲率に容易に形成され得る。   Finally, a liquid transparent resin material is provided on the fluorescent layer 8 so as to cover the fluorescent layer 8. For example, the liquid transparent resin material can be a silicon resin. Here, the liquid transparent resin material on the fluorescent layer 8 is limited to the inside of the third ring-type protruding portion 13 and has an external surface raised by surface tension in the sharp upper edge of the third ring-type protruding portion 13. It becomes. Thereafter, the liquid transparent resin material on the fluorescent layer 8 is cured to form the optical lens layer 9. In this manner, the sealing layer 7, the fluorescent layer 8, and the optical lens layer 9 can be easily formed to have the desired size and curvature of the external surface.

図７は、本発明の他の例にかかるＬＥＤパッケージ４０の構造を概略的に示す断面図である。図６に示したＬＥＤパッケージ３０とは異なり、図７に示したＬＥＤパッケージ４０は、蛍光層８の下部に二つの封止層７、７ａが形成されている。つまり、蛍光層８と第１封止層７間に透明な第２封止層７ａがさらに形成されている。図７に示したＬＥＤパッケージ４０の残りの構成は、図６に示したＬＥＤパッケージ３０の構成と同一である。よって、ＬＥＤパッケージ４０の残りの構成に対する詳細な説明は省略する。   FIG. 7 is a cross-sectional view schematically showing the structure of an LED package 40 according to another example of the present invention. Unlike the LED package 30 shown in FIG. 6, the LED package 40 shown in FIG. 7 has two sealing layers 7 and 7 a formed below the fluorescent layer 8. That is, a transparent second sealing layer 7 a is further formed between the fluorescent layer 8 and the first sealing layer 7. The remaining configuration of the LED package 40 shown in FIG. 7 is the same as that of the LED package 30 shown in FIG. Therefore, detailed description of the remaining configuration of the LED package 40 is omitted.

図７を参照すると、第１封止層７、第２封止層７ａ、蛍光層８及び光学レンズ層９が一緒に多層封止層構造を形成する。効率的な光出力のために、前記第１封止層７、第２封止層７ａ、蛍光層８及び光学レンズ層９は、盛り上がった外部表面を有し得る。また、蛍光層８から発生した光がＬＥＤダイ４に入射してＬＥＤダイ４で吸収されることを防ぐために、第２封止層７ａの有効屈折率は可視光の波長帯域で蛍光層８の有効屈折率より小さく、且つ第１封止層７の有効屈折率よりも小さい。   Referring to FIG. 7, the first sealing layer 7, the second sealing layer 7a, the fluorescent layer 8, and the optical lens layer 9 together form a multilayer sealing layer structure. For efficient light output, the first sealing layer 7, the second sealing layer 7a, the fluorescent layer 8, and the optical lens layer 9 may have a raised external surface. Further, in order to prevent light generated from the fluorescent layer 8 from entering the LED die 4 and being absorbed by the LED die 4, the effective refractive index of the second sealing layer 7a is that of the fluorescent layer 8 in the visible light wavelength band. It is smaller than the effective refractive index and smaller than the effective refractive index of the first sealing layer 7.

図７に示したように、第１封止層７の縁は第１リング型突出部１１まで延びていて、第２封止層７ａの縁は第２リング型突出部１２まで延びていて、蛍光層８の縁は第３リング型突出部１３まで延びていて、光学レンズ層９の縁は第４リング型突出部１４まで延びている。このようにそれぞれの層７、７ａ、８、９の縁を、対応するリング型突出部１１、１２、１３、１４に限定させることにより、それぞれの層７、７ａ、８、９の大きさを容易に限定できる。そして、対応するリング型突出部１１、１２、１３、１４内に限定されたそれぞれの層７、７ａ、８、９に提供された材料の量を調節することにより、前記のそれぞれの層７、７ａ、８、９の上部表面の曲率が容易に決められ得る。   As shown in FIG. 7, the edge of the first sealing layer 7 extends to the first ring-type protrusion 11, and the edge of the second sealing layer 7 a extends to the second ring-type protrusion 12. The edge of the fluorescent layer 8 extends to the third ring type protrusion 13, and the edge of the optical lens layer 9 extends to the fourth ring type protrusion 14. Thus, by limiting the edges of the respective layers 7, 7 a, 8, 9 to the corresponding ring-shaped protrusions 11, 12, 13, 14, the sizes of the respective layers 7, 7 a, 8, 9 are reduced. Can be easily limited. And by adjusting the amount of material provided to each layer 7, 7a, 8, 9 confined within the corresponding ring-shaped protrusions 11, 12, 13, 14, said each layer 7, The curvature of the upper surface of 7a, 8, 9 can be easily determined.

図７に示したＬＥＤパッケージ４０の封止層構造に対する製造方法は、上で詳しく説明したＬＥＤパッケージ３０の製造方法がそのまま適用され得る。但し、第１封止層７上に蛍光層８を形成する前に、第２封止層７ａを形成するという点だけに違いがある。つまり、前述の方式で第１封止層７を先に形成した後に、第１封止層７を覆うように前記第１封止層７上に液状の透明樹脂材料を提供する。例えば、液状の透明樹脂材料はシリコン樹脂であり得る。このとき提供される液状の透明樹脂材料は、第１封止層７の有効屈折率より小さく形成される。例えば、有効屈折率の調節のための添加剤等を液状のシリコン樹脂に添加できる。第１封止層７上の液状の透明樹脂材料は、第２リング型突出部１２内に限定され、第２リング型突出部１２の尖った上部エッジ内で表面張力によって盛り上がった外部表面を有するようになる。その後、第１封止層７上の液状の透明樹脂材料を、熱又はＵＶ照射によって硬化させて第２封止層７ａが形成され得る。その後は、前述の方式と同様に、第２封止層７ａ上に蛍光層８と光学レンズ層９を順に形成する。但し、ここで蛍光層８の材料は、第３リング型突出部１３内に限定されるように満たされ、光学レンズ層９の材料は第４リング型突出部１４内に限定されるように満たされる。   As the manufacturing method for the sealing layer structure of the LED package 40 shown in FIG. 7, the manufacturing method of the LED package 30 described in detail above can be applied as it is. However, the only difference is that the second sealing layer 7 a is formed before the fluorescent layer 8 is formed on the first sealing layer 7. That is, after the first sealing layer 7 is first formed by the above-described method, a liquid transparent resin material is provided on the first sealing layer 7 so as to cover the first sealing layer 7. For example, the liquid transparent resin material can be a silicon resin. The liquid transparent resin material provided at this time is formed smaller than the effective refractive index of the first sealing layer 7. For example, an additive for adjusting the effective refractive index can be added to the liquid silicon resin. The liquid transparent resin material on the first sealing layer 7 is limited to the inside of the second ring-type protrusion 12 and has an external surface raised by surface tension in the sharp upper edge of the second ring-type protrusion 12. It becomes like this. Thereafter, the liquid transparent resin material on the first sealing layer 7 can be cured by heat or UV irradiation to form the second sealing layer 7a. Thereafter, the fluorescent layer 8 and the optical lens layer 9 are sequentially formed on the second sealing layer 7a in the same manner as described above. However, here, the material of the fluorescent layer 8 is filled so as to be limited in the third ring-type protrusion 13, and the material of the optical lens layer 9 is filled so as to be limited in the fourth ring-type protrusion 14. It is.

これまでは、第１封止層７、第２封止層７ａ、蛍光層８及び光学レンズ層９が、共に液状の材料を利用して順に形成されると説明したが、一部の層を別途の過程で予め作って置くこともできる。   So far, it has been described that the first sealing layer 7, the second sealing layer 7a, the fluorescent layer 8 and the optical lens layer 9 are sequentially formed using a liquid material. It can also be made in advance by a separate process.

例えば、蛍光層８を予め作って置くこともできる。この場合、上述の方式でＬＥＤダイ４を覆うように防熱ベース２の反射カップ１０に第１封止層７を形成する。そして、窪んだ内部と盛り上がった外部を有する形態に予め作って置いた蛍光層８の窪んだ領域内に、第２封止層７ａのための液状の透明樹脂材料を提供する。その後、透明樹脂材料が入った蛍光層８を裏返して第１封止層７上に載せた後、熱又はＵＶ照射により前記透明樹脂材料を硬化させる。すると、第１封止層７と蛍光層８間に第２封止層７ａが形成され、蛍光層８は第１封止層７上に機密に固定され得る。その後は、前述のように蛍光層８上に光学レンズ層９を形成できる。   For example, the fluorescent layer 8 can be made and placed in advance. In this case, the 1st sealing layer 7 is formed in the reflective cup 10 of the heat-insulating base 2 so that the LED die 4 may be covered with the above-mentioned system. And the liquid transparent resin material for the 2nd sealing layer 7a is provided in the hollow area | region of the fluorescent layer 8 previously made and placed in the form which has the hollow inside and the raised outside. Thereafter, the fluorescent layer 8 containing the transparent resin material is turned over and placed on the first sealing layer 7, and then the transparent resin material is cured by heat or UV irradiation. Then, the second sealing layer 7 a is formed between the first sealing layer 7 and the fluorescent layer 8, and the fluorescent layer 8 can be secretly fixed on the first sealing layer 7. Thereafter, the optical lens layer 9 can be formed on the fluorescent layer 8 as described above.

また別の方式として、蛍光層８と光学レンズ層９を予め作って置くこともできる。この場合は、予め作って置いた蛍光層８を前述の方式で第１封止層７上に固定させる。その後、予め作って置いた光学レンズ層９を蛍光層８上に付けることができる。また、光学レンズ層９だけを予め作って置くこともできる。この場合は、第１封止層７、第２封止層７ａ及び蛍光層８を液状の材料を利用して順に形成した後で、予め作って置いた光学レンズ層９を蛍光層８上に付ける。   As another method, the fluorescent layer 8 and the optical lens layer 9 can be made in advance. In this case, the fluorescent layer 8 made in advance is fixed on the first sealing layer 7 by the method described above. Thereafter, a pre-made optical lens layer 9 can be applied on the fluorescent layer 8. Alternatively, only the optical lens layer 9 can be made and placed in advance. In this case, after the first sealing layer 7, the second sealing layer 7a, and the fluorescent layer 8 are formed in order using a liquid material, the optical lens layer 9 that has been prepared and placed on the fluorescent layer 8 is formed in advance. wear.

白色光ＬＥＤパッケージを製造しようとする場合は、上述のように、蛍光層８を含む多層封止層構造を使用できる。しかし、もし特定の波長の光だけを提供するカラーＬＥＤパッケージを製造しようとする場合は、その波長の光を放出するＬＥＤダイ４を防熱ベース２の底面上に付け、ＬＥＤダイ４上には単に一つの透明な封止層だけを形成することもできる。例えば、図８に示したように、一つの透明樹脂材料１８を第１〜第４リング型突出部１１〜１４のいずれかのリング型突出部内に限定させ、そのまま硬化させてカラーＬＥＤパッケージを完成することもできる。   When it is intended to manufacture a white light LED package, a multilayer encapsulating layer structure including the fluorescent layer 8 can be used as described above. However, if a color LED package that provides only light of a specific wavelength is to be manufactured, an LED die 4 that emits light of that wavelength is attached to the bottom surface of the heat-insulating base 2, and the LED die 4 is simply placed on the LED die 4. Only one transparent sealing layer can be formed. For example, as shown in FIG. 8, one transparent resin material 18 is limited to one of the ring-type protrusions of the first to fourth ring-type protrusions 11 to 14, and is cured as it is to complete a color LED package. You can also

これまで、本発明の理解を助けるために、ＬＥＤリードフレームパッケージ、これを利用したＬＥＤパッケージ及び前記ＬＥＤパッケージの製造方法に対する例示的な実施例を説明し、添付の図面に示した。しかし、このような実施例は、単に本発明を例示するためのものであり、これを制限しないという点を理解しなければならない。そして、本発明は図示や説明に局限されないという点を理解しなければならない。これは、多様な他の変形が本技術分野で通常の知識を有する者によって成される場合があるためである。   To facilitate understanding of the present invention, an exemplary embodiment for an LED lead frame package, an LED package using the LED lead frame package, and a method of manufacturing the LED package has been described and shown in the accompanying drawings. However, it should be understood that such examples are merely illustrative of the invention and do not limit it. It should be understood that the present invention is not limited to the illustrations and descriptions. This is because a variety of other variations may be made by those having ordinary knowledge in the art.

Claims (25)

防熱ベース；
前記防熱ベースの周りに配置された多数の電極；
前記防熱ベースと多数の電極を囲んで固定する絶縁性支持部；
前記絶縁性支持部の上部表面上に一周するように形成された少なくとも二つのリング型突出部；及び
前記リング型突出部間に形成された少なくとも一つのリング型溝を含むリードフレームパッケージ。 Heat-resistant base;
A number of electrodes disposed around the thermal barrier;
An insulating support that surrounds and fixes the heat insulating base and a number of electrodes;
A lead frame package comprising: at least two ring-shaped protrusions formed on the upper surface of the insulating support portion; and at least one ring-shaped groove formed between the ring-shaped protrusions. 前記絶縁性支持部は、ＰＰＡプラスチックからなる請求項１に記載のリードフレームパッケージ。   The lead frame package according to claim 1, wherein the insulating support portion is made of PPA plastic. 前記の多数の電極は、一側端部が前記防熱ベースの側面と対向し、他側端部が前記絶縁性支持部の外側壁から突出するように配置される請求項１に記載のリードフレームパッケージ。   2. The lead frame according to claim 1, wherein the plurality of electrodes are arranged such that one end portion thereof faces a side surface of the heat-insulating base and the other end portion protrudes from an outer wall of the insulating support portion. package. 前記防熱ベースは、底面が反射性材料でコーティングされた反射カップを有する請求項１に記載のリードフレームパッケージ。   The lead frame package according to claim 1, wherein the heat insulating base includes a reflective cup having a bottom surface coated with a reflective material. 前記の少なくとも二つのリング型突出部は、尖った上部エッジと傾斜した側壁を有する請求項１に記載のリードフレームパッケージ。   The lead frame package of claim 1, wherein the at least two ring-shaped protrusions have sharp upper edges and inclined sidewalls. 前記防熱ベース、多数の電極及び絶縁性支持部は、射出成形工程により一体に形成される請求項１に記載のリードフレームパッケージ。   The lead frame package according to claim 1, wherein the heat insulating base, the plurality of electrodes, and the insulating support are integrally formed by an injection molding process. 前記リング型突出部とリング型溝は、移送成形（ｔｒａｎｓｆｅｒ ｍｏｌｄｉｎｇ）工程により、前記絶縁性支持部の上部表面上に形成される請求項１に記載のリードフレームパッケージ。   The lead frame package according to claim 1, wherein the ring-shaped protrusion and the ring-shaped groove are formed on the upper surface of the insulating support part by a transfer molding process. 請求項１〜７のいずれかに記載のリードフレームパッケージを含むＬＥＤパッケージ。   The LED package containing the lead frame package in any one of Claims 1-7. 前記ＬＥＤパッケージは：
前記防熱ベースの底面上に付けられた少なくとも一つのＬＥＤダイ（ｄｉｅ）；
前記ＬＥＤダイと前記の多数の電極を電気的に連結する多数のワイヤ；及び
前記ＬＥＤダイを覆うように形成されたものであり、盛り上がった外部表面を有する少なくとも一つの層を備える封止層構造をさらに含み、
前記封止層構造の少なくとも一つの層のそれぞれの縁は、前記の少なくとも二つのリング型突出部中の対応する一つまで延びている請求項８に記載のＬＥＤパッケージ。 The LED package is:
At least one LED die attached on the bottom surface of the thermal barrier;
A plurality of wires for electrically connecting the LED die and the plurality of electrodes; and a sealing layer structure formed to cover the LED die and having at least one layer having a raised external surface Further including
9. The LED package of claim 8, wherein each edge of at least one layer of the encapsulating layer structure extends to a corresponding one of the at least two ring-shaped protrusions. 前記ＬＥＤダイは、ＵＶ ＬＥＤ、青色ＬＥＤ、緑色ＬＥＤ及び赤色ＬＥＤ中の少なくとも一つを含む請求項９に記載のＬＥＤパッケージ。   The LED package according to claim 9, wherein the LED die includes at least one of a UV LED, a blue LED, a green LED, and a red LED. 前記封止層構造は、単に一つの透明な封止層を有する請求項９に記載のＬＥＤパッケージ。   The LED package according to claim 9, wherein the sealing layer structure has only one transparent sealing layer. 前記封止層構造の少なくとも一つの層に提供された層材料の量を調節することにより、前記の少なくとも一つの層の上部表面の曲率が決められる請求項９に記載のＬＥＤパッケージ。   The LED package of claim 9, wherein the curvature of the upper surface of the at least one layer is determined by adjusting the amount of layer material provided to at least one layer of the encapsulating layer structure. 前記封止層構造は：
前記ＬＥＤダイを直接覆うように形成された透明な第１封止層；
前記第１封止層上を覆う蛍光層；及び
前記蛍光層上を覆う光学レンズ層を含む請求項９に記載のＬＥＤパッケージ。 The sealing layer structure is:
A transparent first sealing layer formed to directly cover the LED die;
The LED package according to claim 9, comprising: a fluorescent layer covering the first sealing layer; and an optical lens layer covering the fluorescent layer. 前記第１封止層の有効屈折率は、可視光の波長帯域において前記蛍光層の有効屈折率より小さい請求項１３に記載のＬＥＤパッケージ。   The LED package according to claim 13, wherein an effective refractive index of the first sealing layer is smaller than an effective refractive index of the fluorescent layer in a visible light wavelength band. 前記封止層構造は、前記第１封止層と前記蛍光層間に形成された透明な第２封止層をさらに含む請求項１３に記載のＬＥＤパッケージ。   The LED package according to claim 13, wherein the sealing layer structure further includes a transparent second sealing layer formed between the first sealing layer and the fluorescent layer. 前記第２封止層の有効屈折率は、可視光の波長帯域において前記第１封止層の有効屈折率と前記蛍光層の有効屈折率より小さい請求項１５に記載のＬＥＤパッケージ。   The LED package according to claim 15, wherein the effective refractive index of the second sealing layer is smaller than the effective refractive index of the first sealing layer and the effective refractive index of the fluorescent layer in a wavelength band of visible light. 前記蛍光層は、ガラス、ＰＣ、ＰＭＭＡ、又はシリコン樹脂に蛍光体材料を均一に混合してなる請求項１６に記載のＬＥＤパッケージ。   The LED package according to claim 16, wherein the phosphor layer is formed by uniformly mixing a phosphor material with glass, PC, PMMA, or silicon resin. 前記蛍光体材料は、ＵＶ光、青色光又は緑色光によって励起されて可視光を発生させる請求項１７に記載のＬＥＤパッケージ。   The LED package according to claim 17, wherein the phosphor material is excited by UV light, blue light, or green light to generate visible light. 前記蛍光体材料は、ＵＶ光、青色光又は緑色光によって励起され、相違する波長の可視光をそれぞれ発生させる少なくとも一種類の蛍光体材料を含む請求項１８に記載のＬＥＤパッケージ。   The LED package according to claim 18, wherein the phosphor material includes at least one phosphor material that is excited by UV light, blue light, or green light to generate visible light having different wavelengths. 防熱ベース、前記防熱ベースの周りに配置された多数の電極、前記防熱ベースと多数の電極を囲んで固定する絶縁性支持部、前記絶縁性支持部の上部表面上に一周するように形成された少なくとも二つのリング型突出部、及び前記リング型突出部間に形成された少なくとも一つのリング型溝を含むリードフレームパッケージを提供すること；
前記防熱ベースの底面上に少なくとも一つのＬＥＤダイを付けること；
前記ＬＥＤダイと前記の多数の電極を電気的に連結すること；及び
前記ＬＥＤダイを覆うように盛り上がった外部表面を有する少なくとも一つの層を備える封止層構造を形成することを含み、
前記封止層構造の少なくとも一つの層のそれぞれの縁は、前記の少なくとも二つのリング型突出部中の対応する一つまで延びるＬＥＤパッケージの製造方法。 A heat insulating base, a plurality of electrodes arranged around the heat insulating base, an insulating support portion that surrounds and fixes the heat insulating base and the plurality of electrodes, and formed so as to make a round on the upper surface of the insulating support portion. Providing a lead frame package including at least two ring-shaped protrusions and at least one ring-shaped groove formed between the ring-shaped protrusions;
Attaching at least one LED die on the bottom surface of the thermal barrier;
Electrically connecting the LED die and the plurality of electrodes; and forming a sealing layer structure comprising at least one layer having a raised external surface to cover the LED die;
A method of manufacturing an LED package, wherein each edge of at least one layer of the sealing layer structure extends to a corresponding one of the at least two ring-shaped protrusions. 前記封止層構造の形成は：
前記ＬＥＤダイを覆うように防熱ベース上に液状の透明樹脂材料を提供すること；及び
前記液状の透明樹脂材料を硬化させて第１封止層を形成することを含み、
前記第１封止層は、前記リング型突出部中の第１リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有する請求項２０に記載のＬＥＤパッケージの製造方法。 The formation of the sealing layer structure is:
Providing a liquid transparent resin material on a heat insulating base so as to cover the LED die; and curing the liquid transparent resin material to form a first sealing layer,
21. The manufacture of an LED package according to claim 20, wherein the first sealing layer has a raised outer surface formed by surface tension within a sharp upper edge of the first ring-shaped protrusion in the ring-shaped protrusion. Method. 前記第１封止層を覆うように前記第１封止層上に液状の透明樹脂材料を提供すること；
前記第１封止層上に液状の透明樹脂材料を硬化させて第２封止層を形成すること；
前記第２封止層を覆うように前記第２封止層上に蛍光体材料が均一に混合された液状の透明樹脂材料を提供すること；
前記蛍光体材料が混合された液状の透明樹脂材料を硬化させて蛍光層を形成すること；
前記蛍光層を覆うように前記蛍光層上に液状の透明樹脂材料を提供すること；及び
前記蛍光層上の液状の透明樹脂材料を硬化させて光学レンズ層を形成することを更に含む請求項２１に記載のＬＥＤパッケージの製造方法。 Providing a liquid transparent resin material on the first sealing layer so as to cover the first sealing layer;
Curing a liquid transparent resin material on the first sealing layer to form a second sealing layer;
Providing a liquid transparent resin material in which a phosphor material is uniformly mixed on the second sealing layer so as to cover the second sealing layer;
Curing a liquid transparent resin material mixed with the phosphor material to form a phosphor layer;
The method further comprises: providing a liquid transparent resin material on the fluorescent layer so as to cover the fluorescent layer; and curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer. The manufacturing method of the LED package as described in 2. 前記第２封止層は、前記リング型突出部中の第２リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有し、前記蛍光層は前記リング型突出部中の第３リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有し、前記光学レンズ層は前記リング型突出部中の第４リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有する請求項２２に記載のＬＥＤパッケージの製造方法。   The second sealing layer has a raised outer surface formed by surface tension within a sharp upper edge of the second ring-shaped protrusion in the ring-shaped protrusion, and the fluorescent layer has the ring-shaped protrusion. A raised outer surface formed by surface tension within a sharp upper edge of the third ring-shaped protrusion in the section, and the optical lens layer has a sharpened edge of the fourth ring-shaped protrusion in the ring-shaped protrusion. 23. A method of manufacturing an LED package according to claim 22, wherein the LED package has a raised outer surface formed by surface tension within the upper edge. 前記第１封止層を覆うように前記第１封止層上に蛍光体材料が均一に混合された液状の透明樹脂材料を提供すること；
前記蛍光体材料が混合された液状の透明樹脂材料を硬化させて蛍光層を形成すること；
前記蛍光層を覆うように前記蛍光層上に液状の透明樹脂材料を提供すること；及び
前記蛍光層上の液状の透明樹脂材料を硬化させて光学レンズ層を形成することをさらに含む請求項２１に記載のＬＥＤパッケージの製造方法。 Providing a liquid transparent resin material in which a phosphor material is uniformly mixed on the first sealing layer so as to cover the first sealing layer;
Curing a liquid transparent resin material mixed with the phosphor material to form a phosphor layer;
The method further comprises: providing a liquid transparent resin material on the fluorescent layer so as to cover the fluorescent layer; and curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer. The manufacturing method of the LED package as described in 2. 前記蛍光層は前記リング型突出部中の第２リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有し、前記光学レンズ層は前記リング型突出部中の第３リング型突出部の尖った上部エッジ内で表面張力によって形成された盛り上がった外部表面を有する請求項２４に記載のＬＥＤパッケージの製造方法。   The fluorescent layer has a raised outer surface formed by surface tension within a sharp upper edge of a second ring-shaped protrusion in the ring-shaped protrusion, and the optical lens layer is in the ring-shaped protrusion. 25. The method of manufacturing an LED package according to claim 24, wherein the LED package has a raised outer surface formed by surface tension within a sharp upper edge of the third ring-shaped protrusion.
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CN102318091A (en) 2012-01-11
KR20100106297A (en) 2010-10-01
EP2406835A4 (en) 2013-09-18
RU2488195C2 (en) 2013-07-20
SG173518A1 (en) 2011-09-29
TW201044646A (en) 2010-12-16
WO2010104276A3 (en) 2010-11-25
RU2011134604A (en) 2013-04-20
KR101111256B1 (en) 2012-02-22

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