US20120218627A1 - Optical lens assembly having fluorescent layer - Google Patents
Optical lens assembly having fluorescent layer Download PDFInfo
- Publication number
- US20120218627A1 US20120218627A1 US13/034,708 US201113034708A US2012218627A1 US 20120218627 A1 US20120218627 A1 US 20120218627A1 US 201113034708 A US201113034708 A US 201113034708A US 2012218627 A1 US2012218627 A1 US 2012218627A1
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- US
- United States
- Prior art keywords
- optical lens
- partition
- lens assembly
- partition frame
- fluorescent layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/12—Beam splitting or combining systems operating by refraction only
- G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
Definitions
- the present invention relates an optical lens assembly, and especially to an optical lens assembly having a fluorescent layer for preventing the moisture from entering the fluorescent layer formed therein, and thereby the optical performance of the fluorescent layer can be maintained over a long period, and thus the optical lens assembly of the present invention can be applied to the array-type LED packaging.
- An LED is a semiconductor light source, which operates based on the recombination of carriers (electrons and holes) in a semiconductor.
- carriers electrosprays
- An electron carrier in the conduction band combines with a hole in the valence band, it loses energy equal to the bandgap in the form of an emitted photon; i.e., light.
- the LEDs have the advantages of compact size, fast start-up time, and high efficiency so that they can be applied to various applications especially in the field of solid-state lighting.
- FIG. 1 is a cross-sectional view showing a conventional LED package structure, which includes a substrate 10 a , a package module 12 a , a lead frame 14 a , and an encapsulation layer 16 a .
- the substrate 10 a is installed at the bottom of the package structure.
- the package module 12 a is served to integrate the substrate 10 a and the lead frame 14 a .
- the LED chips 18 a are arranged on the substrate 10 a in an array form, and the substrate 10 a is made of a metal material.
- the LED chips 18 a are electrically connected to the lead frame 14 a .
- the encapsulation layer 16 a is tightly connected to the package module 12 a .
- An insulating protective layer 20 a is formed on the LED chips 18 a for covering the LED chips 18 a .
- a fluorescent layer 22 a is formed on the insulating protective layer 20 a.
- the fluorescent layer formed above the LED chips is directly in contact with moisture in the air. It is known that a fluorescent material can absorb moisture from the air, and would result in the deterioration in light emission properties, and the level of white light would gradually decay. Moreover, the fluorescent layer can directly absorb heat generated by light irradiation. In general, the heat resistant temperature and thermal stability of a fluorescent layer are relatively low, and thereby once heat generated by light irradiation is conducted to the fluorescent layer, the fluorescent material would deteriorate over time, and consequently the illumination efficiency is decreased and the chromaticity is altered.
- a primary objective of the present invention is to provide an optical lens assembly having a fluorescent layer.
- the fluorescent layer in the optical lens assembly was sealed under a vacuum, and thereby when the optical lens assembly of the present invention is used in the optical device, the moisture is prevented from entering the fluorescent layer, and thereby the optical performance of the fluorescent layer can be maintained over a long period.
- Another objective of the present invention is to provide an optical lens assembly having a fluorescent layer.
- the structure of the optical lens assembly having a fluorescent layer is simple, and the optical lens assembly of the present invention can be prefabricated before it is applied to the array-type LED packaging, and thereby the packaging efficiency is increased.
- an optical lens assembly having a fluorescent layer which comprises: a partition frame having a partition ring which protrudes inwardly from an inner wall surface of the partition frame, wherein a L-shaped structure is defined by a top surface of the partition ring and the inner wall surface of the partition frame, and a reverse L-shaped structure is defined by a bottom surface of the partition ring and the inner wall surface of the partition frame; two optical lenses comprising a top optical lens and a bottom optical lens, wherein the top optical lens and the bottom optical lens are respectively disposed on the top surface and the bottom surface of the partition ring, and wherein a slot space is defined by the top optical lens, the bottom optical lens, and the partition ring of the partition frame; and a fluorescent layer accommodated within the slot space.
- FIG. 1 is a cross sectional view showing a conventional LED package structure
- FIG. 2 is an exploded view showing the optical lens assembly having a fluorescent layer according to the present invention
- FIG. 3 is a cross sectional view showing the optical lens assembly having a fluorescent layer according to the present invention.
- FIG. 4 is a schematic view showing a top optical lens according to one embodiment of the present invention.
- FIG. 5 is a schematic view showing a partition frame according to the first embodiment of the present invention.
- FIG. 5 a is a schematic view showing the partition frame of FIG. 5 assembled with the fluorescent layer, the top optical lens, and the bottom optical lens;
- FIG. 6 is a schematic view showing the partition frame according to the second embodiment of the present invention.
- FIG. 6 a is a schematic view showing the partition frame of FIG. 6 assembled with the fluorescent layer, the top optical lens, and the bottom optical lens;
- FIG. 7 is a schematic view showing an optical lens assembly having a fluorescent layer applied to an array-type LED according to one embodiment of the present invention.
- FIG. 8 is a schematic view showing an optical lens assembly having a fluorescent layer applied to an array-type LED according to another embodiment of the present invention.
- FIG. 2 is an exploded view showing the optical lens assembly having a fluorescent layer according to the present invention.
- FIG. 3 is a cross sectional view showing the optical lens assembly having a fluorescent layer according to the present invention.
- the optical lens assembly having a fluorescent layer according to the present invention comprises a partition frame 1 with a partition ring 11 protruding inwardly from an inner wall surface of the partition frame, two optical lenses 3 and 5 , and a fluorescent layer 7 .
- a partition frame 1 is provided, and a partition ring 11 protrudes inwardly from the inner wall surface of the partition frame 1 .
- the partition ring 11 protruding inwardly from the inner wall surface of the partition frame 1 has a top surface 111 and a bottom surface 113 .
- An L-shaped structure is defined by the top surface 111 of the partition ring 11 and the inner wall surface (which is above the partition ring 11 ) of the partition frame 1 .
- a reverse L-shaped structure is defined by the bottom surface 113 of the partition ring 11 and the inner wall surface (which is below the partition ring 11 ) of the partition frame 1 .
- the shape of the partition frame 1 includes round, elliptical, rectangular, and polygonal shapes.
- the material of the partition frame 1 comprises at least one of glass, aluminum, bronze, ceramic and an alloy composed of at least one of aluminum and bronze, or comprises at least one of liquid crystal polymer (LCP), polyphthalamide (PPA), and all high temperature resistant materials.
- LCP liquid crystal polymer
- PPA polyphthalamide
- the shape of the partition ring 11 includes round, elliptical, rectangular, and polygonal shapes.
- the partition ring 11 of the partition frame 1 is made of UV-curable adhesive, silicone, epoxy resin, or polyimide.
- Two optical lenses include a top optical lens 3 and a bottom optical lens 5 .
- the top optical lens 3 and the bottom optical lens 5 are respectively installed on the top surface 111 and the bottom surface 113 of the partition ring 11 .
- a slot space is defined by the top optical lens 3 , the bottom optical lens 5 and the partition ring 11 of the partition frame 1 .
- the fluorescent layer 7 can be accommodated in the slot space by the dispensing method.
- the top optical lens 3 or the bottom optical lens 5 can be a flat slab lens, and the top optical lens 3 can also be a convex lens as shown in FIG. 4 .
- FIG. 5 is a schematic view showing the partition frame according to the first embodiment of the present invention.
- FIG. 5 a is a schematic view showing the partition frame of FIG. 5 assembled with the fluorescent layer 7 , the top optical lens 3 , and the bottom optical lens 5 .
- At least two slots 115 can be located diametrically opposite to each other in the partition frame 1 .
- the at least two slots 115 are formed through the partition ring 11 to communicate the interior and exterior of the partition frame 1 , and the fluorescent material can be filled in the slot space through one of the at least two slots 115 so as to form a fluorescent layer 7 in the slot space.
- a filling material is used to seal the at least two slots, 115 (not shown), and the filling material includes a nail member, and an adhesive.
- the adhesive includes at least one of UV-curable adhesive, silicone, epoxy resin and polyimide, and the material of the nail member includes at least one of plastic and metal.
- the slot space is evacuated through the at least two slots 115 , and then a fluorescent material is filled in the slot space so as to form a fluorescent layer 7 .
- FIG. 6 which is a schematic view showing the partition frame according to the second embodiment of the present invention.
- FIG. 6 a is a schematic view showing the partition frame of FIG. 6 assembled with the fluorescent layer 7 , the top optical lens 3 , and the bottom optical lens 5 .
- the two slots 115 are formed on the surfaces of the L-shaped structure or the reverse L-shaped structure, and one opening end of each of two slots 115 is arranged on the inner surface of the partition ring 11 , and the other opening end of each of the two slots is arranged on the top surface of the partition frame 1 .
- the adhesive 8 is used to seal the at least two slots 115 .
- the adhesive 8 includes at least one of UV-curable adhesive, silicone, epoxy resin, and polyimide.
- the slot space is evacuated through the at least two slots 115 , and then a fluorescent material is filled in the slot space so as to form a fluorescent layer.
- FIG. 7 which is a schematic view showing an array-type LED according to one embodiment of the present invention.
- FIG. 8 which is a schematic view showing an array-type LED according to another embodiment of the present invention.
- An array-type LED includes a substrate 100 and a package body 200 .
- the substrate 100 is disposed at the bottom of the array-type LED and is installed with a plurality of LED light-emitting elements 300 .
- the LED light-emitting elements 300 are arranged on the substrate 100 in an array form.
- the LED light-emitting elements 300 are electrically connected to two lead frames 400 installed in the package body 200 by wire bonding.
- a chip protective layer 500 and a silicone layer 600 are sequentially formed on top of the light emitting units 300 .
- a frame fastening slot 210 is installed in the partition frame 1 corresponding to the assembling position for a package body 200 on the partition frame 1 so that the package module 200 can be assembled with the partition frame 1 . Therefore, the partition frame assembly of the present invention can be assembled with various LED package bodies.
- the top optical lens 3 can be a convex lens as shown in FIG. 8 .
Abstract
Description
- 1. Field of the Invention
- The present invention relates an optical lens assembly, and especially to an optical lens assembly having a fluorescent layer for preventing the moisture from entering the fluorescent layer formed therein, and thereby the optical performance of the fluorescent layer can be maintained over a long period, and thus the optical lens assembly of the present invention can be applied to the array-type LED packaging.
- 2. The Prior Arts
- An LED is a semiconductor light source, which operates based on the recombination of carriers (electrons and holes) in a semiconductor. When an electron carrier in the conduction band combines with a hole in the valence band, it loses energy equal to the bandgap in the form of an emitted photon; i.e., light. The LEDs have the advantages of compact size, fast start-up time, and high efficiency so that they can be applied to various applications especially in the field of solid-state lighting.
- Referring to
FIG. 1 , which is a cross-sectional view showing a conventional LED package structure, which includes asubstrate 10 a, apackage module 12 a, alead frame 14 a, and anencapsulation layer 16 a. Thesubstrate 10 a is installed at the bottom of the package structure. Thepackage module 12 a is served to integrate thesubstrate 10 a and thelead frame 14 a. TheLED chips 18 a are arranged on thesubstrate 10 a in an array form, and thesubstrate 10 a is made of a metal material. TheLED chips 18 a are electrically connected to thelead frame 14 a. Theencapsulation layer 16 a is tightly connected to thepackage module 12 a. An insulatingprotective layer 20 a is formed on theLED chips 18 a for covering theLED chips 18 a. Then, afluorescent layer 22 a is formed on the insulatingprotective layer 20 a. - However, one disadvantage of the prior art is that the fluorescent layer formed above the LED chips is directly in contact with moisture in the air. It is known that a fluorescent material can absorb moisture from the air, and would result in the deterioration in light emission properties, and the level of white light would gradually decay. Moreover, the fluorescent layer can directly absorb heat generated by light irradiation. In general, the heat resistant temperature and thermal stability of a fluorescent layer are relatively low, and thereby once heat generated by light irradiation is conducted to the fluorescent layer, the fluorescent material would deteriorate over time, and consequently the illumination efficiency is decreased and the chromaticity is altered.
- Moreover, if a fluorescent material is formed on an LED chip by filling or coating method, an extra amount of the fluorescent material have to be provided for ensuring that the fluorescent material will form substantially uniformly on the LED chip, which will increase the manufacturing cost. Furthermore, if the fluorescent layer has flaws, the LED chip can not be reused. Conventionally, various optical tests can only be carried out after the formation of the fluorescent layer. Therefore, there is a need to provide an LED package structure which can be optically tested in advance, has relatively low manufacturing cost, and has excellent optical mixing and heat dissipation properties.
- A primary objective of the present invention is to provide an optical lens assembly having a fluorescent layer. The fluorescent layer in the optical lens assembly was sealed under a vacuum, and thereby when the optical lens assembly of the present invention is used in the optical device, the moisture is prevented from entering the fluorescent layer, and thereby the optical performance of the fluorescent layer can be maintained over a long period.
- Another objective of the present invention is to provide an optical lens assembly having a fluorescent layer. The structure of the optical lens assembly having a fluorescent layer is simple, and the optical lens assembly of the present invention can be prefabricated before it is applied to the array-type LED packaging, and thereby the packaging efficiency is increased.
- To achieve the foregoing objectives, the present invention provides an optical lens assembly having a fluorescent layer, which comprises: a partition frame having a partition ring which protrudes inwardly from an inner wall surface of the partition frame, wherein a L-shaped structure is defined by a top surface of the partition ring and the inner wall surface of the partition frame, and a reverse L-shaped structure is defined by a bottom surface of the partition ring and the inner wall surface of the partition frame; two optical lenses comprising a top optical lens and a bottom optical lens, wherein the top optical lens and the bottom optical lens are respectively disposed on the top surface and the bottom surface of the partition ring, and wherein a slot space is defined by the top optical lens, the bottom optical lens, and the partition ring of the partition frame; and a fluorescent layer accommodated within the slot space.
- The present invention will be apparent to those skilled in the art by reading the following detailed description of a preferred embodiment thereof, with reference to the attached drawings, in which:
-
FIG. 1 is a cross sectional view showing a conventional LED package structure; -
FIG. 2 is an exploded view showing the optical lens assembly having a fluorescent layer according to the present invention; -
FIG. 3 is a cross sectional view showing the optical lens assembly having a fluorescent layer according to the present invention; -
FIG. 4 is a schematic view showing a top optical lens according to one embodiment of the present invention; -
FIG. 5 is a schematic view showing a partition frame according to the first embodiment of the present invention; -
FIG. 5 a is a schematic view showing the partition frame ofFIG. 5 assembled with the fluorescent layer, the top optical lens, and the bottom optical lens; -
FIG. 6 is a schematic view showing the partition frame according to the second embodiment of the present invention; -
FIG. 6 a is a schematic view showing the partition frame ofFIG. 6 assembled with the fluorescent layer, the top optical lens, and the bottom optical lens; -
FIG. 7 is a schematic view showing an optical lens assembly having a fluorescent layer applied to an array-type LED according to one embodiment of the present invention; and -
FIG. 8 is a schematic view showing an optical lens assembly having a fluorescent layer applied to an array-type LED according to another embodiment of the present invention. - The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 2 is an exploded view showing the optical lens assembly having a fluorescent layer according to the present invention.FIG. 3 is a cross sectional view showing the optical lens assembly having a fluorescent layer according to the present invention. The optical lens assembly having a fluorescent layer according to the present invention comprises apartition frame 1 with apartition ring 11 protruding inwardly from an inner wall surface of the partition frame, twooptical lenses fluorescent layer 7. As shown inFIGS. 2 and 3 , apartition frame 1 is provided, and apartition ring 11 protrudes inwardly from the inner wall surface of thepartition frame 1. Thepartition ring 11 protruding inwardly from the inner wall surface of thepartition frame 1 has atop surface 111 and abottom surface 113. An L-shaped structure is defined by thetop surface 111 of thepartition ring 11 and the inner wall surface (which is above the partition ring 11) of thepartition frame 1. A reverse L-shaped structure is defined by thebottom surface 113 of thepartition ring 11 and the inner wall surface (which is below the partition ring 11) of thepartition frame 1. The shape of thepartition frame 1 includes round, elliptical, rectangular, and polygonal shapes. - The material of the
partition frame 1 comprises at least one of glass, aluminum, bronze, ceramic and an alloy composed of at least one of aluminum and bronze, or comprises at least one of liquid crystal polymer (LCP), polyphthalamide (PPA), and all high temperature resistant materials. The shape of thepartition ring 11 includes round, elliptical, rectangular, and polygonal shapes. Thepartition ring 11 of thepartition frame 1 is made of UV-curable adhesive, silicone, epoxy resin, or polyimide. - Two optical lenses include a top
optical lens 3 and a bottomoptical lens 5. The topoptical lens 3 and the bottomoptical lens 5 are respectively installed on thetop surface 111 and thebottom surface 113 of thepartition ring 11. A slot space is defined by the topoptical lens 3, the bottomoptical lens 5 and thepartition ring 11 of thepartition frame 1. Thefluorescent layer 7 can be accommodated in the slot space by the dispensing method. The topoptical lens 3 or the bottomoptical lens 5 can be a flat slab lens, and the topoptical lens 3 can also be a convex lens as shown inFIG. 4 . -
FIG. 5 is a schematic view showing the partition frame according to the first embodiment of the present invention.FIG. 5 a is a schematic view showing the partition frame ofFIG. 5 assembled with thefluorescent layer 7, the topoptical lens 3, and the bottomoptical lens 5. At least twoslots 115 can be located diametrically opposite to each other in thepartition frame 1. The at least twoslots 115 are formed through thepartition ring 11 to communicate the interior and exterior of thepartition frame 1, and the fluorescent material can be filled in the slot space through one of the at least twoslots 115 so as to form afluorescent layer 7 in the slot space. - A filling material is used to seal the at least two slots, 115 (not shown), and the filling material includes a nail member, and an adhesive. The adhesive includes at least one of UV-curable adhesive, silicone, epoxy resin and polyimide, and the material of the nail member includes at least one of plastic and metal. The slot space is evacuated through the at least two
slots 115, and then a fluorescent material is filled in the slot space so as to form afluorescent layer 7. - Referring to
FIG. 6 , which is a schematic view showing the partition frame according to the second embodiment of the present invention.FIG. 6 a is a schematic view showing the partition frame ofFIG. 6 assembled with thefluorescent layer 7, the topoptical lens 3, and the bottomoptical lens 5. The twoslots 115 are formed on the surfaces of the L-shaped structure or the reverse L-shaped structure, and one opening end of each of twoslots 115 is arranged on the inner surface of thepartition ring 11, and the other opening end of each of the two slots is arranged on the top surface of thepartition frame 1. The adhesive 8 is used to seal the at least twoslots 115. The adhesive 8 includes at least one of UV-curable adhesive, silicone, epoxy resin, and polyimide. The slot space is evacuated through the at least twoslots 115, and then a fluorescent material is filled in the slot space so as to form a fluorescent layer. - Referring to
FIG. 7 , which is a schematic view showing an array-type LED according to one embodiment of the present invention. Referring toFIG. 8 , which is a schematic view showing an array-type LED according to another embodiment of the present invention. An array-type LED includes asubstrate 100 and apackage body 200. Thesubstrate 100 is disposed at the bottom of the array-type LED and is installed with a plurality of LED light-emittingelements 300. The LED light-emittingelements 300 are arranged on thesubstrate 100 in an array form. The LED light-emittingelements 300 are electrically connected to twolead frames 400 installed in thepackage body 200 by wire bonding. A chipprotective layer 500 and asilicone layer 600 are sequentially formed on top of thelight emitting units 300. Aframe fastening slot 210 is installed in thepartition frame 1 corresponding to the assembling position for apackage body 200 on thepartition frame 1 so that thepackage module 200 can be assembled with thepartition frame 1. Therefore, the partition frame assembly of the present invention can be assembled with various LED package bodies. The topoptical lens 3 can be a convex lens as shown inFIG. 8 . - Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.
Claims (10)
Priority Applications (1)
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US13/034,708 US8248701B1 (en) | 2011-02-25 | 2011-02-25 | Optical lens assembly having fluorescent layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US13/034,708 US8248701B1 (en) | 2011-02-25 | 2011-02-25 | Optical lens assembly having fluorescent layer |
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US8248701B1 US8248701B1 (en) | 2012-08-21 |
US20120218627A1 true US20120218627A1 (en) | 2012-08-30 |
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US13/034,708 Expired - Fee Related US8248701B1 (en) | 2011-02-25 | 2011-02-25 | Optical lens assembly having fluorescent layer |
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TWI667507B (en) * | 2018-04-20 | 2019-08-01 | 大立光電股份有限公司 | Annular optical component, camera and image capturing unit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4989967A (en) * | 1988-04-08 | 1991-02-05 | Ryoji Matsuda | Lens for spectacles |
US5808817A (en) * | 1996-05-30 | 1998-09-15 | Nikon Corporation | Lens barrel |
US20100061097A1 (en) * | 2008-09-08 | 2010-03-11 | Lsi Industries, Inc. | Led inground light |
US20110204746A1 (en) * | 2008-01-30 | 2011-08-25 | Seiko Instruments Inc. | Driving module, and electronic apparatus including the same |
-
2011
- 2011-02-25 US US13/034,708 patent/US8248701B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4989967A (en) * | 1988-04-08 | 1991-02-05 | Ryoji Matsuda | Lens for spectacles |
US5808817A (en) * | 1996-05-30 | 1998-09-15 | Nikon Corporation | Lens barrel |
US20110204746A1 (en) * | 2008-01-30 | 2011-08-25 | Seiko Instruments Inc. | Driving module, and electronic apparatus including the same |
US20100061097A1 (en) * | 2008-09-08 | 2010-03-11 | Lsi Industries, Inc. | Led inground light |
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US8248701B1 (en) | 2012-08-21 |
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