KR20130110997A - Lens for light emitting diode and method for manufacturing the same - Google Patents

Lens for light emitting diode and method for manufacturing the same Download PDF

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Publication number
KR20130110997A
KR20130110997A KR1020120033409A KR20120033409A KR20130110997A KR 20130110997 A KR20130110997 A KR 20130110997A KR 1020120033409 A KR1020120033409 A KR 1020120033409A KR 20120033409 A KR20120033409 A KR 20120033409A KR 20130110997 A KR20130110997 A KR 20130110997A
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KR
South Korea
Prior art keywords
lens
lens unit
led
light
substrate
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KR1020120033409A
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Korean (ko)
Inventor
김다혜
김은주
Original Assignee
서울반도체 주식회사
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Priority to KR1020120033409A priority Critical patent/KR20130110997A/en
Publication of KR20130110997A publication Critical patent/KR20130110997A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B2003/0093—Simple or compound lenses characterised by the shape

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)

Abstract

Provided are a lens for an LED and a method of manufacturing the same. The lens for LED includes a first lens unit covering an LED chip mounted on a substrate; And a second lens unit disposed on the first lens unit, the second lens unit including a lower surface that is in surface contact with an upper surface of the first lens unit and an outer surface extending from the lower surface in an upper direction of the substrate. The tangent line taken with respect to the outer surface of the second lens portion at the edge of the lower surface forms an obtuse angle with the substrate. Method of manufacturing a lens for an LED comprises the steps of: molding a first light-transmitting resin on an LED chip mounted on a substrate to form a first lens unit; And forming a second lens unit on the first lens unit by molding a second light-transmissive resin having a higher viscosity than the first light-transmissive resin at a temperature higher than a temperature at which the first lens unit is formed. Lens for LED according to the present invention can have a high light extraction efficiency and a wide light directivity characteristics.

Description

Lens for light emitting diode and method for manufacturing thereof {Lens for light emitting diode and method for manufacturing the same}

The present invention relates to a lens and a method for manufacturing the same, and more particularly, to a lens for LED and improved manufacturing method of light extraction efficiency.

A light emitting diode (LED) is a device that emits light by an electric potential applied from the outside using characteristics of a P-N junction semiconductor. Such LEDs are attracting attention as an ideal light emitting source in various display devices, backlight sources, and lighting based on the advantages of low power consumption, long life, small size, light weight, and environmental friendliness.

On the other hand, the light emitting device using the LED includes a lens for controlling the path and the direction of the light emitted from the LED chip according to the purpose of use. The lens may be formed on the opening of the package body in which the LED chip is located, or directly on the substrate on which the LED chip is mounted. The lens may be formed by molding a liquid resin such as, for example, silicone or epoxy resin, and is manufactured to have a generally convex hemispherical shape in order to minimize total internal reflection of light emitted from the LED chip and to widen the direct angle of light. do.

However, when molding a hemispherical lens by molding a liquid resin, the resin droplet has a sufficient height (length from the bottom of the lens measured from the center axis of the lens to the top of the lens) due to the resin droplet spreading phenomenon. There is a problem that it is difficult to mold the lens. This acts as a limiting factor in ensuring high light emission characteristics of the lens.

Table 1 below measures the height change of the lens according to the increase in the lens diameter (average width of the bottom surface of the lens) when molding a hemispherical lens by molding a liquid resin according to a conventional method.

Lens diameter (d) 5 mm 6 mm 7 mm Lens Height (h) / Lens Radius (r) 0.89 0.77 0.59

Referring to Table 1, even if the lens diameter increases, the corresponding lens height does not increase, and as the diameter of the lens increases, the overall shape of the lens becomes a flat shape having a large radius of curvature.

On the other hand, Figure 1, when molding a hemispherical lens by molding a liquid resin according to the conventional method on the LED chip, it measures the change in the amount of light emitted from the lens as the lens diameter increases. In FIG. 1, the y-axis (light quantity ratio) means a value obtained by dividing the amount of light emitted through the lens by the amount of light emitted directly into the air from the LED chip before molding the lens.

Referring to FIG. 1, it can be seen that the amount of light extracted after forming the lens is increased than before forming the lens on the LED chip. However, it can be seen that as the diameter of the lens increases, the ratio of the amount of light extracted gradually decreases.

That is, when the molding lens is formed by the conventional method, it is difficult to implement a lens having a desired curved surface and a sufficient height, and the result is that as the diameter of the lens increases, the amount of light extracted is reduced. Therefore, there is a practical limit to maximize the light extraction efficiency using a conventional molding lens.

The technical problem to be solved by the present invention is to provide a lens for LED and a method of manufacturing the same that can ensure a wide light directivity, and improve the light extraction efficiency.

In order to solve the above technical problem, an aspect of the present invention provides a lens for an LED. The lens may include a first lens unit covering an LED chip mounted on a substrate; And a second lens unit disposed on the first lens unit, the second lens unit including a lower surface joined to an upper surface of the first lens unit and an outer surface extending from the lower surface to an upper direction of the substrate. The tangent line taken with respect to the outer surface of the second lens portion at the edge of the lower surface of the second lens portion forms an obtuse angle (meaning an angle measured inside the lens) with the substrate.

An upper surface of the first lens unit may have a convex shape, and an outer surface of the second lens unit may have an elliptical surface or a spherical surface.

The first lens unit and the second lens unit may have different refractive indices.

The LED lens may include a phosphor in at least one of the inside of the first lens unit and the inside of the second lens unit, or on at least one surface of an upper surface of the first lens unit and an outer surface of the second lens unit. It may include a phosphor layer located.

In order to solve the above technical problem, another aspect of the present invention provides a method of manufacturing an LED lens. The method includes molding a first light-transmitting resin on an LED chip mounted on a substrate to form a first lens portion; And forming a second lens part on the first lens part by molding a second light transmitting resin having a higher viscosity than the first light transmitting resin at a temperature higher than a temperature at which the first lens part is formed.

In this case, the second light transmitting resin may be molded while heating the substrate, and the substrate may be heated to a temperature of 50 ° C to 200 ° C.

Meanwhile, before forming the first lens unit, the method may further include forming an annular dam portion surrounding the LED chip while being spaced apart from the LED chip, wherein the first light-transmitting resin may be molded in the dam portion. have.

In this case, the dam portion may be formed to a height of 50㎛ to 500㎛.

In addition, at least one of the first light transmitting resin and the second light transmitting resin may include a phosphor.

In addition, the method of manufacturing a lens for an LED includes forming a phosphor layer on an upper surface of the first lens unit before forming the second lens unit and a phosphor on an outer surface of the second lens unit after forming the second lens unit. It may further comprise at least one step of forming a layer.

As described above, by using the lens for LED according to the present invention, the light directing angle of the light emitting device can be widened and light extraction efficiency can be improved. In addition, it is possible to easily manufacture a lens having excellent optical properties, and the height of the lens can be secured sufficiently high, so that the light extraction efficiency can be prevented from being reduced even when the diameter of the lens is increased.

However, the technical effects of the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned will be clearly understood by those skilled in the art from the following description.

Figure 1 shows the change in the amount of light according to the increase in the diameter of the lens for the LED formed by a conventional method.
2 is a cross-sectional view showing a state in which the lens for the LED according to an embodiment of the present invention is attached to the substrate on which the LED chip is mounted.
3 is a graph illustrating optical characteristics of a light emitting device having a lens for LEDs illustrated in FIG. 2.
4 is a cross-sectional view showing a state that the lens for the LED according to the embodiment of the present invention is attached to the substrate on which the dam is formed.
5 is a cross-sectional view illustrating a structure in which a phosphor layer is formed on an LED lens according to an embodiment of the present invention.
6 is a cross-sectional view showing a state in which the lens for the LED according to an embodiment of the present invention is applied to the bulb-type lighting module.
7 is a cross-sectional view showing a state in which the lens for the LED according to an embodiment of the present invention is applied to the LED fluorescent lamp module.
8 is a graph showing optical characteristics of the LED fluorescent lamp module shown in FIG.
9 is a cross-sectional view showing a state in which the lens for the LED according to an embodiment of the present invention is applied to the backlight unit.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the present invention is not limited to the embodiments described herein but may be embodied in other forms and includes all equivalents and alternatives falling within the spirit and scope of the present invention.

Where a portion is referred to herein as being "on" another portion or substrate, it may be formed directly on the other portion or substrate, or a third portion may be interposed therebetween. In the present specification, directional expressions of the upper side, upper side, upper side, and the like can be understood as meaning lower, lower, lower, and the like according to the standard. That is, the expression of the spatial direction should be understood as a relative direction and should not be construed as limiting the absolute direction. Also, it is to be understood that the terms “first”, “second” or “third” are used to distinguish between elements, rather than to impose any limitation on the elements.

In the drawings, the thicknesses of layers and regions may be exaggerated or reduced for clarity, and portions other than essential components of the present disclosure may be omitted for convenience of description. Like numbers refer to like elements throughout.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is a cross-sectional view illustrating a state in which an LED lens 150 is attached to a substrate 110 on which an LED chip 120 is mounted, according to an embodiment of the present invention.

Hereinafter, in describing the embodiments of the present disclosure, the substrate 110 on which the LED chip 120 is mounted may be formed with a metal wiring pattern electrically connected to the LED chip 120, and the LED chip 120 Is to be mounted directly on the substrate 110 or to be mounted on the substrate 110 while being located in the package body.

2, the LED lens 150 according to the present embodiment includes a first lens unit 130 covering the LED chip 120, and a second lens unit located on the first lens unit 130. 140. In this case, the second lens unit 140 may have a lower surface 142 which is in surface contact with the upper surface 132 of the first lens unit 130, and a lower surface 142 of the second lens unit 140. Has an outer surface 144 extending in an upper direction of the substrate 110.

In particular, the outer surface 144 of the second lens unit 140 is the outer surface 144 of the second lens unit 140 at the edge 143 of the lower surface 142 of the second lens unit 140. The tangent T taken with respect to) has a shape that forms an obtuse angle (meaning the angle θ measured inside the lens, which is the same below) with the substrate 110.

That is, the LED lens 150 according to the present exemplary embodiment has a structure in which the first lens unit 130 and the second lens unit 140 are coupled by surface bonding, and an outer surface of the second lens unit 140 is provided. 144 is formed to form an angle greater than 90 ° with the substrate 110 at least at a point 143 that meets the lower surface 142 of the second lens unit 140.

3 is a graph illustrating optical characteristics of a light emitting device having the lens 150 for LEDs illustrated in FIG. 2. FIG. 3A is a light direction angle graph measured when only the first lens unit 130 is formed in FIG. 2, and FIG. 3B is a state in which the second lens unit 140 is formed in FIG. 2. The measured light direct angle graph. Referring to FIG. 3, it can be seen that the case where both the first and second lens units 130 and 140 are formed is significantly wider than the case where only the first lens unit 130 is formed, and has a high light extraction efficiency. Can be.

LED lens 150 according to the present invention is provided with the shape of the second lens unit 140 as described above, the remaining portion of the outer surface 144 of the second lens unit 140 not previously defined The upper surface 132 of the first lens unit 130 may be implemented in various shapes.

For example, as shown in FIG. 2, the upper surface 132 of the first lens unit 130 may have a convex shape. In addition, the outer surface 144 of the second lens unit 140 may have an oval or spherical shape as a whole. In this case, the probability that the light emitted from the LED chip is totally reflected inside the first lens unit 130 or inside the second lens unit 140 may be minimized.

The refractive indexes of the first lens unit 130 and the second lens unit 140 may be the same or different. In particular, by selecting different refractive indices of the first lens unit 130 and the second lens unit 140, the light directivity distribution can be adjusted by the refractive index. However, the refractive index of the first lens unit 130 has a refractive index of the second lens unit 140 to increase the amount of light emitted through the first and second lens units 130 and 140 sequentially. Larger is preferred.

The lens 150 for the LED having the structure shown in FIG. 2 may be manufactured by various methods, and as an example, may be manufactured by the following method.

First, the first lens unit 130 is formed by molding the first light-transmitting resin on the LED chip 120 mounted on the substrate 110. Subsequently, the second lens is molded by molding a second light-transmissive resin having a higher viscosity than the first light-transmissive resin at a temperature higher than a temperature at which the first lens 130 is formed on the first lens unit 130. The part 140 is formed.

The first and second light-transmissive resins may be selected the same or different from each other in materials such as silicone resin, epoxy resin, acrylic resin and polycarbonate resin. In particular, the second light-transmissive resin may further include a thickener in the resin in order to have a higher viscosity than the first light-transmissive resin.

Molding of the first and second light transmissive resins may be performed using a dispenser commonly used in the art.

When the first light-transmitting resin is molded to form the first lens unit 130, the resin droplets discharged from the dispenser spread radially while covering the LED chip 120, and are generally 90 ° or less with the substrate 110. Form a contact angle. Therefore, the upper surface 132 of the first lens unit 130 formed by curing the first light-transmissive resin may have a convex shape. In this case, the diameter (average width of the bottom surface of the first lens unit) of the first lens unit 130 may be adjusted to various sizes according to the viscosity and curing time of the first light-transmissive resin. In general, the larger the viscosity of the resin and the shorter the curing time of the resin, the smaller the diameter is formed.

The second light-transmissive resin is molded on the upper surface 132 of the first lens unit 130, but is molded at a temperature higher than the temperature at which the first light-transmissive resin is molded. For example, the second lens unit 140 may be formed at a higher temperature than the first lens unit 130 by heating the substrate 110 in the process of molding the second light transmitting resin. The heating temperature of the substrate may be determined according to the viscosity of the second light transmissive resin, and may be preferably set at a temperature of 50 ° C to 200 ° C.

The second light-transmissive resin has a relatively higher viscosity than the first light-transmissive resin, and thus has a stronger surface tension than the first light-transmissive resin. Therefore, in the process of molding and curing the second light-transmissive resin, spreading of the resin droplets can be minimized. In addition, curing can be promoted by molding the second light-transmissive resin at high temperature conditions. Accordingly, the second lens unit may be formed to maintain the shape of the second transparent resin droplet to the maximum, and as a result, the second lens unit (at the edge 143 of the lower surface 142 of the second lens unit 140) may be formed. The tangent T taken with respect to the outer surface 144 of the 140 may have an obtuse angle with the substrate 110.

On the other hand, the first light-transmitting resin may be formed in the dam portion after forming a ring-shaped dam (dam) to surround the LED chip 120.

4A and 4B are cross-sectional views illustrating a structure in which a first lens unit 130 and a second lens unit 140 are formed on a substrate 110 on which a dam unit 125 is formed. 4A and 4B, the first lens unit 130 is formed inside the dam unit 125, and the second lens unit 140 is formed on the first lens unit 130. In this case, the outer surface 144 of the second lens unit 140 is formed to extend in the upper direction of the substrate 110 from the inside of the dam unit 125 (see FIG. 4A), or the substrate from the outside of the dam unit 125. It may be formed extending in the upper direction of 110 (see Fig. 4b). Thus, in FIGS. 4A and 4B, the edge 143 of the lower surface 142 of the second lens unit 140 is located inside and outside the dam unit 125, respectively, and the second lens at the edge 143. The tangent T taken with respect to the outer surface 144 of the part 140 forms an obtuse angle with the substrate 110.

The shape of the dam 125 may be circular, elliptical or polygonal. The dam 125 may be formed in various sizes, but may be formed in a height of 50 μm to 500 μm in consideration of the size of the LED chip and the directing angle of light.

The dam unit 125 may be formed by molding a dam forming resin around the LED chip 120 positioned on the substrate 110 using a conventional dispenser. However, the present invention is not limited thereto, and the dam part 125 may be formed by attaching a ring-shaped structure separately prepared through injection molding or the like to the substrate 110. However, in order to simplify the process and reduce the cost, it is preferable to form the dam part 125 by the former method.

The formation of the dam 125 may be particularly useful when the first translucent resin used for molding the first lens 130 is excellent in transparency but low in viscosity. The dam unit 125 is preferably made of a transparent material in order to prevent the light extraction efficiency from being lowered by the dam unit 125. In addition, the dam unit 125 may be removed as necessary after the lens 150 is formed.

According to the above method, it is possible to easily manufacture a lens that can widen the light directing angle, and to secure a sufficiently high height of the lens, thereby preventing the light extraction efficiency from being reduced even when the diameter of the lens is increased. .

Furthermore, after manufacturing the LED lens 150 by the above-described method, the second lens unit 140 is etched, or a reflective film is applied to some surfaces of the outer surface 144 of the second lens unit 140. It is also possible to control the path of the light emitted by forming in the desired direction.

Meanwhile, the LED lens 150 according to the present exemplary embodiment may be manufactured such that the first and second lens units 130 and 140 perform a function of the wavelength conversion unit in addition to the function of the optical unit.

For example, the first and second lens units 130 and 140 may be formed by dispersing a phosphor in at least one of the first and second translucent resins. In this case, the wavelength conversion unit may be integrally introduced in the process of forming the lens units 130 and 140 without performing an additional step.

Alternatively, before forming the second lens unit 140, after forming the phosphor layer on the upper surface 132 of the first lens unit 130 and after forming the second lens unit 140. The wavelength converter may be introduced by performing at least one step of forming a phosphor layer on the outer surface 144 of the second lens unit 140. That is, the remote phosphor may be formed using the structures of the first lens unit 130 and the second lens unit 140.

5 is a cross-sectional view illustrating a structure in which phosphor layers 210 and 220 are formed on at least one of an upper surface 132 of the first lens unit 130 and an outer surface 144 of the second lens unit 140. In this case, since the phosphor layers 210 and 220 may be spaced apart from the LED chip, light scattered backward from the phosphor layers 210 and 220 may be absorbed by the LED chip, thereby preventing the light efficiency from being reduced. have. In addition, deterioration of the phosphor layers 210 and 220 due to heat generated from the LED chip may be minimized.

As such, since the wavelength conversion unit may be introduced into the lens units 130 and 140 in various forms, high color rendering and various correlation color temperatures may be realized.

As previously described, the lens for LED according to the present invention has a wide light directivity angle and high light extraction efficiency. In addition, the light directivity distribution may be adjusted by changing the structures and refractive indices of the first and second lens units. Therefore, based on these advantages, the lens for LED according to the present invention can be effectively applied to various light emitting devices.

 For example, as shown in FIG. 6, the LED lens 150 according to the present invention may be applied to a bulb-type lighting module in various forms. The bulb-type lighting may include a base structure 100, a substrate 110 on which the LED chip 120 is mounted, and a lens 150 covering the LED chip 120. In addition, if necessary, the cover lens 300 is fastened to the base structure 100 may be further included, the cover lens 300 may include a phosphor. In FIGS. 6A and 6B, the substrate 110 to which the lens 150 is attached may be disposed in the horizontal and vertical directions with respect to the base structure 100, and may exhibit a wide light directing angle in both cases. Can be.

As another example, as shown in Figure 7, the LED lens 150 according to the present invention can be applied to the LED fluorescent module. The LED fluorescent lamp module may include a plurality of LED chips 120 mounted on a rectangular substrate 110, a lens 150 positioned on the LED chips 120, and a main body 600 accommodating the substrate 110. ). In addition, the cover part 700 may be further included as fastened to the main body part 600 as necessary, and the cover part 700 may include phosphors.

FIG. 8 is a graph showing optical characteristics of each of (a) and (b) the case where the lens according to the present invention is not formed on the LED chip in the LED fluorescent module shown in FIG. 7. Referring to FIG. 8, it can be seen that the hot spot phenomenon is minimized when the lens according to the present invention is formed. In addition, since the lens for LED according to the present invention has excellent light extraction efficiency, there is an advantage that can be produced in the fluorescent lamp module using a small number of LED packages.

As another example, as shown in Figure 9, the LED lens 150 according to the present invention can be applied to the light source of the backlight unit. The backlight unit includes a light guide plate 800, a reflector plate 820, a diffuser plate 840, and a light source unit 860, and the light source unit 860 includes a lens 150 for an LED according to the present invention. In addition, when the reflective film is formed on the inner surface of the light source unit 860 or on the surface of the lens 150, for example, the outer surface of the second lens unit 140, side light distribution to the light guide plate 800 may be further increased. have.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, This is possible.

110: substrate 120: LED chip
130: first lens unit 132: upper surface of the first lens unit
140: second lens unit 142: lower surface of the second lens unit
144: outer surface of the second lens unit 150: lens for LED

Claims (13)

In the lens disposed on the LED chip mounted on the substrate,
A first lens unit covering the LED chip; And
A second lens unit disposed on the first lens unit, the second lens unit including a lower surface joined to an upper surface of the first lens unit and an outer surface extending from the lower surface to an upper direction of the substrate;
The tangent line taken with respect to the outer surface of the second lens portion at the edge of the lower surface of the second lens portion forms an obtuse angle (meaning an angle measured inside the lens) with the substrate. The method of claim 1,
The upper surface of the first lens unit is a lens for LED having a convex shape. The method of claim 1,
The outer surface of the second lens unit is an LED lens having the shape of an ellipsoid or spherical surface. The method of claim 1,
The first lens unit and the second lens unit has a different refractive index for the LED lens. The method of claim 1,
LED lens including a phosphor in at least one of the inside of the first lens unit and the inside of the second lens unit. The method of claim 1,
And a phosphor layer positioned on at least one of an upper surface of the first lens unit and an outer surface of the second lens unit. In the manufacturing method of the lens disposed on the LED chip mounted on the substrate,
Molding a first light-transmitting resin on the LED chip to form a first lens unit; And
Molding a second lens unit on the first lens unit at a temperature higher than a temperature at which the first lens unit is formed, forming a second lens unit by molding a second light-transmissive resin having a higher viscosity than the first light-transmissive resin Lens manufacturing method. The method of claim 7, wherein
The method of manufacturing a lens for an LED, wherein the second light-transmitting resin is molded while heating the substrate. 9. The method of claim 8,
Method of manufacturing a lens for the LED is heated to the temperature of the substrate 50 ℃ to 200 ℃. The method of claim 7, wherein
Before forming the first lens part, further comprising forming an annular dam part surrounding the LED chip while being spaced apart from the LED chip,
The first light-transmitting resin is molded in the dam portion manufacturing method for the LED. The method of claim 10,
The dam part is a lens for LED manufacturing method is formed to a height of 50㎛ to 500㎛. The method of claim 7, wherein
At least one of the first light-transmissive resin and the second light-transmissive resin manufacturing method of a lens for an LED comprising a phosphor. The method of claim 7, wherein
At least one of forming a phosphor layer on an upper surface of the first lens unit before forming the second lens unit and forming a phosphor layer on an outer surface of the second lens unit after forming the second lens unit Lens manufacturing method for a LED further comprising.
KR1020120033409A 2012-03-30 2012-03-30 Lens for light emitting diode and method for manufacturing the same KR20130110997A (en)

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Cited By (2)

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CN104373897A (en) * 2014-11-25 2015-02-25 创维液晶器件(深圳)有限公司 LED secondary lens and LED lamp
US11060693B2 (en) 2017-06-19 2021-07-13 Signify Holding B.V. Output lenses for LEDs and a method of forming an output lens

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