CN103515502A - Light emitting diode device - Google Patents

Light emitting diode device Download PDF

Info

Publication number
CN103515502A
CN103515502A CN201210221166.7A CN201210221166A CN103515502A CN 103515502 A CN103515502 A CN 103515502A CN 201210221166 A CN201210221166 A CN 201210221166A CN 103515502 A CN103515502 A CN 103515502A
Authority
CN
China
Prior art keywords
emitting diode
substrate
light
diode assembly
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210221166.7A
Other languages
Chinese (zh)
Inventor
黄哲瑄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Original Assignee
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rongchuang Energy Technology Co ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical Rongchuang Energy Technology Co ltd
Priority to CN201210221166.7A priority Critical patent/CN103515502A/en
Priority to TW101129294A priority patent/TW201401568A/en
Publication of CN103515502A publication Critical patent/CN103515502A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

A light emitting diode device comprises a substrate with a circuit structure, a light emitting diode grain and a lens, wherein the substrate is provided with the upper surface and the lower surface, the upper surface and the lower surface are arranged oppositely, the upper surface of the substrate is provided with a rough structure, the light emitting diode grain is arranged on the upper surface of the substrate and is electrically connected with the circuit structure, the lens is arranged on the upper surface of the substrate, the light emitting diode grain is covered with the lens, and the lens is in contact with the rough structure on the upper surface of the substrate and is attached to the rough structure in an adhesive mode. The light emitting diode device is strong in binding force between the lens and the substrate, and has the advantage of high reliability.

Description

Light-emitting diode assembly
Technical field
The present invention relates to a kind of semiconductor device, relate in particular to a kind of light-emitting diode assembly.
Background technology
Than traditional light emitting source, light-emitting diode (Light Emitting Diode, LED) there is the advantages such as lightweight, volume is little, it is low to pollute, the life-span is long, it is as a kind of novel light emitting source, be applied to more and more in the middle of each field, as street lamp, traffic lights, signal lamp, shot-light and decorative lamp etc.
Existing light-emitting diode assembly generally includes substrate, be positioned at the LED crystal particle on substrate and be arranged on substrate and cover the lens of LED crystal particle.This kind of common light-emitting diode assembly adopts adhesive that lens are bonded on substrate conventionally, but the reliability of this kind of structural design is not good, makes the bond strength between substrate and lens not good enough, and lens are easy to depart from and peel off from substrate.
Summary of the invention
In view of this, be necessary to provide the light-emitting diode assembly of a kind of lens and substrate fluid-tight engagement.
, comprising substrate, LED crystal particle and the lens with circuit structure, this substrate has upper surface and the lower surface being oppositely arranged, and the upper surface place of this substrate is provided with coarse structure; This LED crystal particle is arranged on upper surface of base plate and is electrically connected to this circuit structure; In these lens are arranged on upper surface of base plate and LED crystal particle is located at, these lens contact with the coarse structure of upper surface of base plate and are bonded on this coarse structure via viscose glue.
This kind of light-emitting diode assembly is provided with coarse structure at the upper surface place of substrate, and by gluing connecing, lens are bonded on this coarse structure, thereby utilize coarse structure greatly to increase the contact area of viscose glue and substrate, thereby can obviously strengthen the bond strength of lens and substrate, improve the reliability of light-emitting diode assembly, can effectively prevent that lens from departing from and peeling off from substrate.
With reference to the accompanying drawings, in conjunction with embodiment, the invention will be further described.
Accompanying drawing explanation
The cutaway view of the light-emitting diode assembly that Fig. 1 provides for embodiment of the present invention.
Fig. 2 is the schematic diagram of disassembling of light-emitting diode assembly shown in Fig. 1.
Fig. 3 is the vertical view of light-emitting diode assembly shown in Fig. 1.
The cutaway view of the light-emitting diode assembly that is equipped with reflector layer that Fig. 4 provides for embodiment of the present invention.
The cutaway view of light-emitting diode assembly of the change embodiment that Fig. 5 provides for embodiment of the present invention.
The vertical view of the light-emitting diode assembly of the another change embodiment that Fig. 6 provides for embodiment of the present invention.
The vertical view of the light-emitting diode assembly of a change embodiment again that Fig. 7 provides for embodiment of the present invention.
Main element symbol description
Substrate 11
Upper surface 110
Lower surface 112
Coarse structure 114
Projection 1140
Reflector layer 1141
Circuit structure 12
The first electrode 121
The second electrode 122
LED crystal particle 13
Lens 14
Exiting surface 140
Incidence surface 142
Bonding plane 144
Receiving space 146
Viscose glue 15
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Referring to Fig. 1, Fig. 2 and Fig. 3, the light-emitting diode assembly 10 that embodiment of the present invention provides comprises substrate 11, is formed on circuit structure 12 in substrate 11, is arranged on LED crystal particle 13 and lens 14 on substrate 11.
This substrate 11 can be made by insulating material, and it is for bearer circuit structure 12, LED crystal particle 13 and lens 14.This substrate 11 has upper surface 110 and the lower surface 112 being oppositely arranged.Upper surface 110 places of this substrate 11 are provided with coarse structure 114.This coarse structure 114 is continuous ring-type and around being distributed in around LED crystal particle 13.Particularly, in the present embodiment, this coarse structure 114 comprises a plurality of ball bumps 1140 that are convexly equipped with on substrate 11 upper surfaces 110.
This circuit structure 12 is embedded in substrate 11 inside, for providing electrical connection to LED crystal particle 13.This circuit structure 12 comprises the first electrode 121 and the second electrode 122, and this first electrode 121 and the second electrode 122 are separated from each other.In the present embodiment, this first electrode 121 and the second electrode 122 come out in the upper surface 110 1 side parts of substrate 11 respectively, for LED crystal particle 13, are electrically connected to.Understandably, this first electrode 121 and the second electrode 122 can not be exposed to substrate 11 outsides completely yet, and are electrically connected to LED crystal particle 13 by form respectively the weld pad being electrically connected to the first electrode 121, the second electrode 122 at substrate 11 upper surfaces 110.
This LED crystal particle 13 arranges on substrate 11 and is electrically connected to circuit structure 12.In the present embodiment, this LED crystal particle 13 is arranged on protruding the first electrode 121 that is exposed to substrate 11 upper surfaces 110, and be electrically connected to respectively described this first electrode 121 and the second electrode 122 by metal wire, to obtain extraneous electric energy via this first electrode 121 and the second electrode 122.Understandably, circuit structure 12 be fixed and be electrically connected to this LED crystal particle 13 also can by the mode of upside-down mounting (Flip Chip).
These lens 14 are arranged on the upper surface 110 of substrate 11 and in LED crystal particle 13 is located at.These lens 14 contact and are bonded on this coarse structure 114 via viscose glue 15 with the coarse structure 114 of substrate 11 upper surfaces 110.In the present embodiment, these lens 14 comprise the bonding plane 144 with incidence surface 142 towards the exiting surface 140 of the direction projection away from substrate 11, incidence surface 142 relative with exiting surface 140 and that cave in towards exiting surface 140 and connection exiting surface 140.Incidence surface 142 definition one receiving spaces 146 of this depression.In this receiving space 146 is located at LED crystal particle 13, this incidence surface 142 towards LED crystal particle 13 to receive the light from LED crystal particle 13, this exiting surface 140 is for exporting light to the external world, this bonding plane 144 is bonded on this coarse structure 114 via viscose glue 15.
Compared to planarizing substrate of the prior art surface, coarse structure 114 in the present embodiment can significantly increase the contact area of viscose glue 15 and substrate 11, thereby can obviously promote adhesion between viscose glue 15 and substrate 11, and then the bond strength of reinforcement lens and substrate, improve the reliability of light-emitting diode assembly 10, effectively prevent that lens 14 from departing from and peeling off from substrate 11.
It should be noted that, as shown in Figure 4, the surface of described coarse structure 114 also can additionally be formed with reflector layer 1141, thereby, when the part light of directive lens 14 is reflected back, this reflector layer 1141 can reflect this part light and by this part light lens 14 that again lead, thereby improves the light extraction efficiency of light-emitting diode assembly 10.
It should be noted that:
1. a plurality of protruding 1140 of this coarse structure 114 be not limited on the upper surface 110 that is arranged on substrate 11, a plurality of protruding 1140 of this coarse structure 114 also can be arranged on the circuit structure 12 that upper surface 110 1 sides expose as shown in Figure 5, because adopting the metal with reflective function conventionally, makes circuit structure 12, therefore when a plurality of protruding 1140 of coarse structure 114 is arranged on circuit structure 12, the surface of this coarse structure 114 can have without reflector layer 1141 is additionally set the function that improves light extraction efficiency;
2. this coarse structure 114 is not limited to continuous ring-type, and it can be also discontinuous ring-type;
3. the plurality of protruding 1140 shape also can be zigzag as shown in Figure 6 or as shown in Figure 7 wavy etc.;
4. the substrate 11 described in circuit structure 12 can be printing board PCB of the prior art.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.

Claims (10)

1. a light-emitting diode assembly, comprising:
The substrate with circuit structure, this substrate has upper surface and the lower surface being oppositely arranged, and the upper surface place of this substrate is provided with coarse structure;
LED crystal particle, this LED crystal particle is arranged on upper surface of base plate and is electrically connected to this circuit structure; And
Lens, in these lens are arranged on upper surface of base plate and LED crystal particle is located at, these lens contact with the coarse structure of upper surface of base plate and are bonded on this coarse structure via viscose glue.
2. light-emitting diode assembly as claimed in claim 1, is characterized in that, described coarse structure is discrete to be distributed in around LED crystal particle.
3. light-emitting diode assembly as claimed in claim 1, is characterized in that, described coarse structure is in the form of a ring and around being distributed in around described LED crystal particle.
4. light-emitting diode assembly as claimed in claim 1, is characterized in that, the upper surface one side part that described circuit structure is embedded and this substrate inner at substrate exposes this circuit structure.
5. light-emitting diode assembly as claimed in claim 4, is characterized in that, on the circuit structure exposing described in described LED crystal particle is arranged on.
6. light-emitting diode assembly as claimed in claim 5, is characterized in that, described coarse structure is a plurality of projections that are convexly equipped with on the electrode exposing.
7. light-emitting diode assembly as claimed in claim 6, is characterized in that, described each projection is spherical.
8. light-emitting diode assembly as claimed in claim 1, is characterized in that, described coarse structure is a plurality of projections that are convexly equipped with at upper surface of base plate.
9. light-emitting diode assembly as claimed in claim 8, is characterized in that, described each projection is spherical.
10. light-emitting diode assembly as claimed in claim 8, is characterized in that, described a plurality of convex surfaces are formed with reflector layer.
CN201210221166.7A 2012-06-29 2012-06-29 Light emitting diode device Pending CN103515502A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201210221166.7A CN103515502A (en) 2012-06-29 2012-06-29 Light emitting diode device
TW101129294A TW201401568A (en) 2012-06-29 2012-08-14 Light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210221166.7A CN103515502A (en) 2012-06-29 2012-06-29 Light emitting diode device

Publications (1)

Publication Number Publication Date
CN103515502A true CN103515502A (en) 2014-01-15

Family

ID=49897900

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210221166.7A Pending CN103515502A (en) 2012-06-29 2012-06-29 Light emitting diode device

Country Status (2)

Country Link
CN (1) CN103515502A (en)
TW (1) TW201401568A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581011B (en) * 2016-03-11 2017-05-01 Optical lens

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070045646A1 (en) * 2005-09-01 2007-03-01 Low Tek B Surface mount optoelectronic component with lens
CN101142692A (en) * 2005-03-11 2008-03-12 首尔半导体株式会社 Led package having an array of light emitting cells coupled in series
CN201122607Y (en) * 2007-12-05 2008-09-24 葳天科技股份有限公司 Light emitting diode structure
CN101950788A (en) * 2010-08-13 2011-01-19 重庆大学 Power type white LED based on fluorescence lens
US20110068356A1 (en) * 2009-09-21 2011-03-24 Walsin Lihwa Corporation Method of manufacturing light emitting diode packaging lens and light emmiting diode package
CN201829528U (en) * 2010-07-23 2011-05-11 刘胜 Light emitting diode device encapsulating structure with fixing device
CN102130110A (en) * 2010-12-24 2011-07-20 哈尔滨工业大学 Multi-chipset high-power LED encapsulation structure
CN102194980A (en) * 2010-03-09 2011-09-21 Lg伊诺特有限公司 Light emitting diode package and lighting system including the same
CN102318091A (en) * 2009-03-10 2012-01-11 株式会社纳沛斯Led LED leadframe package, LED package using the same, and method of manufacturing the LED package
CN102324424A (en) * 2011-09-22 2012-01-18 华南师范大学 White-light LED (Light Emitting Diode) packaged by fluorescent transparent ceramic lens
CN202142529U (en) * 2011-07-04 2012-02-08 陈建兴 Multi-grain light-emitting diode (LED) component assembly
CN102444818A (en) * 2010-10-05 2012-05-09 连展科技（深圳）有限公司 Complementary color light source device
CN102447044A (en) * 2010-12-10 2012-05-09 奉化市匡磊半导体照明有限公司 Insulating base light-emitting chip packaging structure

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101142692A (en) * 2005-03-11 2008-03-12 首尔半导体株式会社 Led package having an array of light emitting cells coupled in series
US20070045646A1 (en) * 2005-09-01 2007-03-01 Low Tek B Surface mount optoelectronic component with lens
CN201122607Y (en) * 2007-12-05 2008-09-24 葳天科技股份有限公司 Light emitting diode structure
CN102318091A (en) * 2009-03-10 2012-01-11 株式会社纳沛斯Led LED leadframe package, LED package using the same, and method of manufacturing the LED package
US20110068356A1 (en) * 2009-09-21 2011-03-24 Walsin Lihwa Corporation Method of manufacturing light emitting diode packaging lens and light emmiting diode package
CN102194980A (en) * 2010-03-09 2011-09-21 Lg伊诺特有限公司 Light emitting diode package and lighting system including the same
CN201829528U (en) * 2010-07-23 2011-05-11 刘胜 Light emitting diode device encapsulating structure with fixing device
CN101950788A (en) * 2010-08-13 2011-01-19 重庆大学 Power type white LED based on fluorescence lens
CN102444818A (en) * 2010-10-05 2012-05-09 连展科技（深圳）有限公司 Complementary color light source device
CN102447044A (en) * 2010-12-10 2012-05-09 奉化市匡磊半导体照明有限公司 Insulating base light-emitting chip packaging structure
CN102130110A (en) * 2010-12-24 2011-07-20 哈尔滨工业大学 Multi-chipset high-power LED encapsulation structure
CN202142529U (en) * 2011-07-04 2012-02-08 陈建兴 Multi-grain light-emitting diode (LED) component assembly
CN102324424A (en) * 2011-09-22 2012-01-18 华南师范大学 White-light LED (Light Emitting Diode) packaged by fluorescent transparent ceramic lens

Also Published As

Publication number Publication date
TW201401568A (en) 2014-01-01

Similar Documents

Publication Publication Date Title
US10084117B2 (en) Light emitting device
TWI418063B (en) Led package and method for manufacturing the same
US7679099B2 (en) Low thermal resistance high power LED
CN102185091B (en) Light-emitting diode device and manufacturing method thereof
WO2006030671A1 (en) Reflector for led and led device
CN102072422A (en) Packaging structure of high-power LED (light emitting diode) light source module
CN103187504A (en) Package structure of light emitting diode
WO2016194370A1 (en) Light-emitting module
TW201236205A (en) LED light source
US20090108268A1 (en) Composite light-emitting-diode packaging structure
CN102683546B (en) Semiconductor package structure and manufacturing method thereof
CN107123721B (en) LED packaging structure with lens and packaging method
CN103822143A (en) LED (light emitting diode) street lamp light source module with silicon substrates
CN103515502A (en) Light emitting diode device
US20210062989A1 (en) Vehicle lamp using semiconductor light-emitting device
CN102456806A (en) Packaging structure of light emitting diode
CN203038968U (en) LED illumination module
CN212907791U (en) LED support, LED lamp pearl, module and illuminator
CN202205814U (en) Light emitting diode device
CN203836739U (en) Silicon-substrate LED road lamp light source module
CN203445117U (en) Led packaging structure and automobile lamp
TWI479701B (en) Light emitting diode
CN112234135A (en) LED support, lamp bead, manufacturing method, module and display device
CN205335256U (en) Integrate LED packaging structure
CN104319337A (en) Substrate-free LED device and manufacturing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140115