KR20100106297A - Led leadframe package, led package using the same, and method of fabricating the led package - Google Patents

Led leadframe package, led package using the same, and method of fabricating the led package Download PDF

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Publication number
KR20100106297A
KR20100106297A KR1020107005556A KR20107005556A KR20100106297A KR 20100106297 A KR20100106297 A KR 20100106297A KR 1020107005556 A KR1020107005556 A KR 1020107005556A KR 20107005556 A KR20107005556 A KR 20107005556A KR 20100106297 A KR20100106297 A KR 20100106297A
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South Korea
Prior art keywords
layer
ring
encapsulation layer
led
heat dissipation
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KR1020107005556A
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Korean (ko)
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KR101111256B1 (en
Inventor
더 트랜 위응
용지 헤
프랭크 쉬
Original Assignee
주식회사 네패스엘이디
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Priority claimed from US12/381,408 external-priority patent/US8058667B2/en
Priority claimed from US12/381,409 external-priority patent/US8039862B2/en
Application filed by 주식회사 네패스엘이디 filed Critical 주식회사 네패스엘이디
Publication of KR20100106297A publication Critical patent/KR20100106297A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

PURPOSE: An LED leadframe package, an led package using the same, and a method of fabricating the led package are provided to form a embossed curved side by using surface tension. CONSTITUTION: An LED die(4) is attached to the bottom of the heat dissipation base(2). A plurality of wires(6) electrically connects the LED die and plurality of electrodes(1). A sealing layer(7) is formed on a reflective cup of a heat dissipation based to cover the LED die. A fluorescent layer(8) is formed in order to cover the sealing layer. An optical lens layer(9) is formed in order to cover the fluorescent layer. The LED die is fixed on the bottom of the heat dissipation plate through a die adhesive. The sealing layer, fluorescent layer, and the optical lens layer are laminated.

Description

LED lead frame package, LED package using same and manufacturing method of LED package {LED leadframe package, LED package using the same, and method of fabricating the LED package}

The present invention relates to an LED lead frame package, an LED package using the same, and a method of manufacturing the LED package. More particularly, an LED lead frame package that can be easily manufactured and can reduce manufacturing costs, an LED package using the same, and the LED A method for manufacturing a package.

As semiconductor lighting devices, LEDs have many advantages over traditional lighting devices such as incandescent and fluorescent lamps. For example, LEDs have long life, small size, low power consumption, and no mercury pollution. Accordingly, recently, LED is mainly used as a new lighting device to replace the existing lighting device.

In order to improve the light output of the LED package, a convex lens structure is generally introduced into the outer optical layer of the LED package. In conventional LED packages, such convex lens structures are made separately beforehand and mounted on the LED packages. Due to this additional manufacturing and assembly process of the convex lens structure, additional manufacturing and assembly devices are required. In addition, in the process of mounting a previously made convex lens structure on the LED package, an unwanted air layer may be formed between the convex lens structure and the encapsulation layer already formed on the LED package. Also, in the case of the prior art, it is not easy to create convex curvature on the outer surface of the encapsulation layer in the process of forming an encapsulation layer for protecting the LED die on the LED die. Therefore, the conventional LED package manufacturing method has a relatively low production yield and a relatively high production cost.

On the other hand, in order to provide a white LED that generates white light, a method of applying a fluorescent layer directly on a blue or UV LED die is typically used. For example, when using a blue LED die, light of various wavelengths generated in the phosphor material may be mixed with each other or light of the various wavelengths may be mixed with blue excitation light from the blue LED die to emit white light. However, in the case of directly applying a fluorescent layer on the LED die, since the LED die and the fluorescent layer is very close, there may be a problem that the light generated from the phosphor material proceeds to the LED die and absorbed in the LED die.

Accordingly, a technique of providing a transparent spacer between the LED die and the fluorescent layer has been proposed to reduce the possibility that light generated in the fluorescent layer is incident on and absorbed by the LED die or a substrate around the LED die. For example, FIG. 1 shows an example of such a technique disclosed in US Pat. No. 5,959,316. Referring to FIG. 1, an LED die 60 is mounted on a substrate 62, and the fluorescent layer 66 is separated from the LED die 60 by a transparent spacer 64 covering the LED die 60. In addition, the protective layer 68 is formed outside the fluorescent layer 66. However, even in such a structure, the light generated in the fluorescent layer 66 can be incident and absorbed onto the LED die 60 and the surrounding substrate 62 with little interference.

An object of the present invention is to provide an LED lead frame package and an LED package using the same, which is easy to manufacture and can reduce the manufacturing cost.

It is another object of the present invention to provide an LED package capable of reducing the light absorption loss in which light generated from the phosphor material is incident on and absorbed by the LED die.

Still another object of the present invention is to provide a method of manufacturing an LED package which can be easily manufactured and can reduce manufacturing costs.

A lead frame package according to one type of the present invention includes a heat dissipation base; A plurality of electrodes disposed around the heat dissipation base; An insulating support part surrounding and surrounding the heat dissipation base and the plurality of electrodes; At least two ring-shaped protrusions formed to circumscribe over an upper surface of the insulating support; And at least one ring groove formed between the ring protrusions.

For example, the insulating support may be made of PPA plastic.

The plurality of electrodes may be disposed such that one end thereof faces the side of the heat dissipation base and the other end thereof protrudes from an outer wall of the insulating support.

The heat dissipation base may include a reflective cup having a bottom surface coated with a reflective material.

The at least two ring-shaped protrusions may be formed with pointed upper edges and inclined sidewalls.

The heat dissipation base, the plurality of electrodes, and the insulating support may be integrally formed through an injection molding process.

The ring-shaped protrusions and ring-shaped grooves may be formed on the upper surface of the insulating support through a transfer molding process.

In addition, the LED package according to one type of the present invention may include a lead frame package having the above-described structure.

Specifically, the LED package, at least one LED die (die) attached on the bottom surface of the heat dissipation base; A plurality of wires electrically connecting the LED die and the plurality of electrodes; And an encapsulation layer structure having at least one layer having a convex outer surface formed to cover the LED die. Here, an edge of each of the at least one layer of the encapsulation layer structure may extend to a corresponding one of the at least two ring-shaped protrusions.

The LED die may include at least one of, for example, a UV LED, a blue LED, a green LED, and a red LED.

The encapsulation layer structure can have, for example, only one transparent encapsulation layer.

According to the invention, the curvature of the top surface of the at least one layer can be determined by adjusting the amount of layer material provided in at least one layer of the encapsulation layer structure.

In addition, the encapsulation layer structure, the transparent first encapsulation layer formed to directly cover the LED die; A fluorescent layer covering the first encapsulation layer; And an optical lens layer covering the fluorescent layer.

Here, the effective refractive index of the first encapsulation layer may be smaller than the effective refractive index of the fluorescent layer in the wavelength band of visible light.

In addition, the encapsulation layer structure may further include a transparent second encapsulation layer formed between the first encapsulation layer and the fluorescent layer.

The effective refractive index of the second encapsulation layer may be smaller than the effective refractive index of the first encapsulation layer and the effective refractive index of the fluorescent layer in the wavelength band of visible light.

For example, the fluorescent layer may be formed by uniformly mixing the phosphor material with glass, PC, PMMA, or silicone resin.

The phosphor material may be excited by, for example, UV light, blue light or green light to generate visible light.

For example, the phosphor material may include at least one kind of phosphor material that is excited by UV light, blue light or green light to generate visible light of different wavelengths, respectively.

On the other hand, the manufacturing method of the LED package according to another type of the present invention, a heat dissipation base, a plurality of electrodes disposed around the heat dissipation base, an insulating support for enclosing and fixing the heat dissipation base and the plurality of electrodes, an upper portion of the insulating support Providing a lead frame package comprising at least two ring-shaped protrusions formed around the surface and at least one ring-shaped groove formed between the ring-shaped protrusions; Attaching at least one LED die on an upper surface of the heat dissipation base; Electrically connecting the LED die and the plurality of electrodes; And forming an encapsulation layer structure having at least one layer having a convex outer surface to cover the LED die. Here, an edge of each of the at least one layer of the encapsulation layer structure may extend to a corresponding one of the at least two ring-shaped protrusions.

In addition, the forming of the encapsulation layer structure may include providing a liquid transparent resin material over a heat dissipation base to cover the LED die; And curing the liquid transparent resin material to form a first encapsulation layer. Here, the first encapsulation layer may have a convex outer surface formed by surface tension within the pointed upper edge of the first ring-shaped protrusion of the ring-shaped protrusions.

In addition, the manufacturing method of the LED package, the step of providing a transparent transparent resin material over the first encapsulation layer to cover the first encapsulation layer; Curing the liquid transparent resin material on the first encapsulation layer to form a second encapsulation layer; Providing a liquid transparent resin material in which a phosphor material is uniformly mixed on the second encapsulation layer so as to cover the second encapsulation layer; Curing the liquid transparent resin material mixed with the phosphor material to form a phosphor layer; Providing a liquid transparent resin material over the fluorescent layer to cover the fluorescent layer; And curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer.

Wherein the second encapsulation layer has a convex outer surface formed by surface tension within the pointed upper edge of the second ring-shaped protrusion of the ring-shaped protrusions, and the fluorescent layer has a pointed top of the third ring-shaped protrusion of the ring-shaped protrusions. It has a convex outer surface formed by surface tension in the edge, and the optical lens layer may have a convex outer surface formed by surface tension in the pointed upper edge of the fourth ring-shaped protrusion of the ring-shaped protrusions.

In addition, the manufacturing method of the LED package, comprising: providing a liquid transparent resin material in which the phosphor material is uniformly mixed on the first encapsulation layer to cover the first encapsulation layer; Curing the liquid transparent resin material mixed with the phosphor material to form a phosphor layer; Providing a liquid transparent resin material over the fluorescent layer to cover the fluorescent layer; And curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer.

Wherein the fluorescent layer has a convex outer surface formed by surface tension within a pointed upper edge of a second ring-shaped protrusion of the ring-shaped protrusions, and the optical lens layer has a pointed top edge of a third ring-shaped protrusion of the ring-shaped protrusions. It may have a convex outer surface formed by surface tension within.

According to the present invention, in manufacturing an LED package, a surface is provided by providing a liquid transparent resin material over at least two ring-shaped protrusions having pointed top edges and inclined sidewalls and at least one ring-shaped groove formed between the ring-shaped protrusions. The tension can be used to easily form an encapsulation layer having a convex curved surface in a single process.

1 is a cross-sectional view schematically showing the structure of one example of the conventional white LEDs.
2 is a perspective view schematically showing the structure of the LED lead frame package according to an embodiment of the present invention.
3 is a plan view schematically showing the structure of the LED lead frame package shown in FIG.
FIG. 4 is a perspective view schematically illustrating an arrangement relationship between a heat dissipation base and a plurality of electrodes except for an insulating support in the LED lead frame package shown in FIG. 2.
FIG. 5 is a cross-sectional view schematically illustrating the structure of the LED lead frame package shown in FIG. 2.
6 is a cross-sectional view schematically showing the structure of an LED package according to an embodiment of the present invention.
7 is a schematic cross-sectional view of a structure of an LED package according to another embodiment of the present invention.
8 and 9 are cross-sectional views schematically illustrating the principle of the LED package manufacturing method according to the present invention.

Hereinafter, an LED lead frame package, an LED package using the same, and a manufacturing method of the LED package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the size of each element in the drawings may be exaggerated for clarity and convenience of description.

2 is a perspective view schematically showing the structure of the LED lead frame package 20 according to an embodiment of the present invention. 2, a leadframe package 20 according to an embodiment of the present invention may include a heat dissipation base 2 and a plurality of electrodes disposed around the heat dissipation base 2. (1), and an insulating support 3 for surrounding and fixing the heat dissipation base 2 and the plurality of electrodes 1 may be included. In this case, the insulating support 3 may be made of an insulating plastic material such as, for example, poly phthal amid (PPA) plastic.

Referring to FIG. 3, which is a plan view schematically showing the structure of the LED lead frame package 20 as viewed from above, the LED lead frame package 20 may include four identical metal electrodes 1 arranged along a circumferential direction, for example. It may be provided. The four electrodes 1 may be arranged at intervals of about 90 degrees with respect to the central axis of the heat dissipation base 2 and protrude in a direction perpendicular to the central axis of the heat dissipation base 2. Referring to FIG. 4, which is a perspective view schematically showing the arrangement relationship between the heat dissipation base 2 and the electrodes 1 excluding the insulating support 3, the upper surface of the four electrodes 1 is the highest of the heat dissipation base 2. It is formed at the same height as the point. 2 to 4, one end of the electrode 1 faces the side circumference of the heat dissipation base 2, and the other end may be disposed to protrude from the outer wall of the insulating support 3. have. The upper surface of this electrode 1 may be coated with a highly reflective material, for example silver or aluminum. Although four electrodes 1 are exemplarily illustrated in the drawing, the number of electrodes 1 may be freely selected according to an embodiment.

Also, referring to FIG. 4, the heat dissipation base 2 may have a reflective cup 10 in the form of a cavity at the center thereof. The bottom surface of the reflective cup 10 may be coated with a highly reflective material such as silver or aluminum, for example. The upper surface of the reflective cup 10 is at the highest point of the heat dissipation base 2. That is, the upper surface of the reflective cup 10 may be formed at the same height as the upper surface of the electrodes 1.

In the state where the heat dissipation base 2 and the plurality of electrodes 1 are arranged as shown in FIG. 4, the heat dissipation base 2 and the plurality of electrodes 1 are fixed by the insulating support 3 surrounding them. To this end, the plurality of electrodes 1, the heat dissipation base 2 and the insulating support 3 may be integrally formed together, for example, through an injection molding process.

In addition, referring to the perspective view of FIG. 5 and FIG. 2, which schematically illustrates the cross-sectional structure of the LED lead frame package 20, the lead frame package 20 is formed around the upper surface of the insulating support 3. And at least two ring-shaped protrusions 11, 12, 13, 14 and at least one ring-shaped groove 15, 16, 17 formed between the ring-shaped protrusions 11, 12, 13, 14. Can be. The plurality of ring-shaped protrusions 11, 12, 13 and 14 and the ring-shaped grooves 15, 16 and 17 may be formed in the form of concentric circles on the upper surface of the insulating support 3. As shown in FIG. 5, the plurality of ring-shaped protrusions 11, 12, 13, 14 may be formed with pointed upper edges and inclined sidewalls.

The plurality of ring-shaped protrusions 11, 12, 13, 14 and the ring-shaped grooves 15, 16, and 17 may be made of the same PPA plastic as the insulating support 3, and may be part of the insulating support 3. . For example, the plurality of ring-shaped protrusions 11, 12, 13, 14 and ring-shaped grooves 15, 16, 17 may be formed on the upper surface of the insulating support 3 through a transfer molding process. have. Alternatively, the plurality of ring-shaped protrusions 11, 12, 13, and 14 and the ring-shaped grooves 15 and 16 may be formed in the injection molding process of integrally forming the plurality of electrodes 1, the heat dissipation base 2, and the insulating support 3 together. 17 may also be formed together. Although four ring-shaped protrusions and three ring-shaped grooves are exemplarily illustrated in FIG. 5, the number may be freely selected according to an embodiment.

The LED lead frame package 20 having the above-described structure having a plurality of ring-shaped protrusions 11, 12, 13, and 14 and ring-shaped grooves 15, 16, and 17 may be used for manufacturing an LED package. At this time, the formation of the encapsulation layers of the multilayer structure can be facilitated. 6 is a cross-sectional view schematically showing the structure of the LED package 30 according to an embodiment of the present invention using the LED lead frame package 20. Referring to FIG. 6, the LED package 30 according to an embodiment of the present invention includes an LED die 4 attached to the bottom surface of the heat dissipation base 2, the LED die 4, and a plurality of electrodes ( A plurality of wires 6 electrically connecting 1), an encapsulation layer 7 formed on the reflective cup 10 of the heat dissipation base 2 to cover the LED die 4, and the encapsulation layer 7 to cover the encapsulation layer 7. The formed fluorescent layer 8 and the optical lens layer 9 formed to cover the fluorescent layer 8 may be included.

Here, the LED die 4 may be fixed to the bottom surface of the heat dissipation base 2, for example by the die adhesive material 5, ie to the bottom surface of the reflective cup 10 of the heat dissipation base 2. The die bonding material 5 may use silver paste or solder, for example. Although only one LED die 4 may be disposed on the bottom surface of the heat dissipation base 2, it is also possible to arrange a plurality of LED dies 4 as necessary. For example, at least one of a UV LED, a blue LED, a green LED, and a red LED may be disposed on the bottom surface of the heat dissipation base 2.

The encapsulation layer 7, the fluorescent layer 8 and the optical lens layer 9 together form a multilayer encapsulation layer structure. The encapsulation layer 7, the fluorescent layer 8 and the optical lens layer 9 may have convex outer surfaces for efficient light output. In addition, in order to prevent the light generated in the fluorescent layer 8 from entering the LED die 4 and being absorbed by the LED die 4, the effective refractive index of the encapsulation layer 7 is determined by the fluorescent layer 8 in the wavelength band of visible light. May be less than the effective refractive index of

The fluorescent layer 8 is excited by, for example, UV light, blue light or green light to generate visible light. To this end, the fluorescent layer 8 is made by uniformly mixing the phosphor material with a transparent material such as glass, polycarbonate (PC), polymethyl methacrylate (PMMA) or silicone resin. Can be. The phosphor material may comprise at least one kind of phosphor material which is excited by UV light, blue light or green light to generate visible light of different wavelengths, respectively. For example, the phosphor material may be at least one of various kinds of phosphor materials that each generate different wavelengths of visible light, such as blue, green, yellow, orange and red. Green, yellow, orange and red phosphors can at least partially absorb blue or green light or fully absorb UV light to emit a light spectrum with peak wavelengths in green, yellow, orange and red, respectively. In addition, the blue phosphor can completely absorb UV light and emit a light spectrum having a peak wavelength in the blue region.

The fluorescent layer 8 may be used to provide an LED package 30 that emits white light. For example, when the LED die 4 emits blue light in the wavelength range of 450 nm to 480 nm, the fluorescent layer 8 may be excited by blue light to emit light having a yellow peak wavelength. This produces white light while the yellow light and the remaining blue light are mixed. The phosphor layer 8 may also include various kinds of phosphor materials that are excited by light of the excitation wavelength emitted from the LED die 4 to emit light of various wavelengths. In this case, white light is produced while light of various wavelengths is mixed. For example, in the case where the LED die 4 emits near-UV in the range of 380 nm to 450 nm, the fluorescent layer 8 is excited by the near ultraviolet to produce peak wavelengths of blue, green and red, respectively. Blue, green and red phosphor materials that emit light having. Then, white light may be generated while the blue, green, and red lights are mixed.

Meanwhile, according to the present invention, the encapsulation layer 7, the fluorescent layer 8, and the optical lens layer 9 are formed by using the ring-shaped protrusions 11, 12, 13, and 14 and the ring-shaped grooves 15, 16, and 17. The size and curvature of the upper surface can be easily adjusted. As shown in FIG. 6, the edge of the encapsulation layer 7 extends to the first ring-shaped protrusion 11, the edge of the fluorescent layer 8 extends to the second ring-shaped protrusion 12, and the optical lens. The edge of the layer 9 extends to the third ring-shaped protrusion 13. By thus limiting the edges of the respective layers 7, 8, 9 to the corresponding ring-shaped protrusions 11, 12, 13, the size of the respective layers 7, 8, 9 can be easily defined. And the curvature of the upper surface of each layer 7, 8, 9 by adjusting the amount of material provided in each layer 7, 8, 9 defined in the corresponding ring-shaped protrusions 11, 12, 13. This can be easily determined.

Hereinafter, a method of manufacturing the LED package 30 having the above-described structure will be described in detail. First, the heat dissipation base 2, the plurality of electrodes 1 disposed around the heat dissipation base 2, the insulating support part 3 for enclosing and fixing the heat dissipation base 2 and the electrodes 1, and the insulating property. A plurality of ring-shaped protrusions 11, 12, 13, 14 formed on the upper surface of the support 3, and a plurality of ring-shaped grooves 15, 16, 17 formed between the ring-shaped protrusions 11, 12, 13, 14. The lead frame package 20 including) is prepared using, for example, an injection molding process or the like. Thereafter, at least one LED die 4 is attached onto the bottom surface of the heat dissipation base 2 using the die attaching material 5, and then the LED die 4 and the plurality of wires through the plurality of wires 6. The electrode 1 is electrically connected.

Next, the liquid transparent resin material is filled in the reflecting cup 10 of the heat dissipation base 2 so that the LED die 4 may be covered. The transparent resin material may be, for example, a silicone resin. At this time, the liquid transparent resin material may be provided in a sufficient amount within a limit defined, for example, in the first ring-shaped protrusion 11. The outer surface of the liquid transparent resin material is then convexly formed by surface tension within the pointed upper edge of the first ring-shaped protrusion 11. For example, as shown in FIG. 8, providing a sufficient amount of the transparent resin material 18 within the limits defined in the first ring-shaped protrusion 11 forms a convex outer surface by surface tension. The curvature of this convex outer surface can be determined by the amount of transparent resin material 18 provided. If too much material is provided so that the transparent resin material 18 flows over the first ring-shaped protrusion 11, as shown in FIG. 9, the transparent resin material 18 is again in the second ring-shaped protrusion 12. May be limited. After the outer surface reaches the desired curvature in this manner, the encapsulation layer 7 is formed by curing the liquid transparent resin material 18 through heat or UV irradiation. Therefore, according to the present invention, the size and curvature of the encapsulation layer 7 can be easily defined.

Thereafter, a liquid transparent resin material in which a phosphor material is uniformly mixed is provided on the sealing layer 7 so as to cover the sealing layer 7. For example, a mixture in which the liquid silicone resin and the phosphor material are uniformly mixed may be provided over the encapsulation layer 7. The mixture is then defined within the second ring-shaped protrusion 12 and has a convex outer surface by surface tension within the pointed upper edge of the second ring-shaped protrusion 12. After the outer surface of the mixture reaches the desired curvature, the fluorescent layer 8 is formed by curing the liquid mixture via heat or UV irradiation.

Finally, a liquid transparent resin material is provided over the fluorescent layer 8 so as to cover the fluorescent layer 8. For example, the liquid transparent resin material may be a silicone resin. Here, the liquid transparent resin material on the fluorescent layer 8 is defined in the third ring-shaped protrusion 13 and has a convex outer surface by surface tension in the pointed upper edge of the third ring-shaped protrusion 13. Thereafter, the optical lens layer 9 may be formed by curing the liquid transparent resin material on the fluorescent layer 8. In this way, the encapsulation layer 7, the fluorescent layer 8 and the optical lens layer 9 can be easily formed with the desired size and curvature of the outer surface.

7 is a cross-sectional view schematically showing the structure of the LED package 40 according to another embodiment of the present invention. Unlike the LED package 30 illustrated in FIG. 6, the LED package 40 illustrated in FIG. 7 has two encapsulation layers 7 and 7a formed under the fluorescent layer 8. That is, the transparent second sealing layer 7a is further formed between the fluorescent layer 8 and the first sealing layer 7. The rest of the configuration of the LED package 40 shown in FIG. 7 is the same as that of the LED package 30 shown in FIG. 6. Therefore, detailed description of the remaining configuration of the LED package 40 will be omitted.

Referring to FIG. 7, the first encapsulation layer 7, the second encapsulation layer 7a, the fluorescent layer 8, and the optical lens layer 9 together form a multi-layer encapsulation layer structure. The first encapsulation layer 7, the second encapsulation layer 7a, the fluorescent layer 8, and the optical lens layer 9 may have convex outer surfaces for efficient light output. In addition, in order to prevent the light generated in the fluorescent layer 8 from entering the LED die 4 and being absorbed by the LED die 4, the effective refractive index of the second encapsulation layer 7a is the fluorescent layer in the wavelength band of visible light. It is smaller than the effective refractive index of (8), and smaller than the effective refractive index of the 1st sealing layer 7. FIG.

As shown in FIG. 7, the edge of the first encapsulation layer 7 extends to the first ring-shaped protrusion 11, and the edge of the second encapsulation layer 7a extends to the second ring-shaped protrusion 12. The edge of the fluorescent layer 8 extends to the third ring-shaped protrusion 13, and the edge of the optical lens layer 9 extends to the fourth ring-shaped protrusion 14. By thus limiting the edges of the respective layers 7, 7a, 8, 9 to the corresponding ring-shaped protrusions 11, 12, 13, 14, the size of each layer 7, 7a, 8, 9 is easily achieved. It can be limited. And by controlling the amount of material provided in each of the layers 7, 7a, 8, 9 defined in the corresponding ring-shaped protrusions 11, 12, 13, 14. The curvature of the top surface of the can be easily determined.

The manufacturing method for the encapsulation layer structure of the LED package 40 shown in FIG. 7 may be applied to the manufacturing method of the LED package 30 described above in detail. However, there is a difference only in that the second encapsulation layer 7a is formed before the fluorescent layer 8 is formed on the first encapsulation layer 7. That is, after the first encapsulation layer 7 is first formed in the manner described above, a liquid transparent resin material is provided over the first encapsulation layer 7 so as to cover the first encapsulation layer 7. For example, the liquid transparent resin material may be a silicone resin. The liquid transparent resin material provided at this time is formed to be smaller than the effective refractive index of the first encapsulation layer 7. For example, an additive for controlling the effective refractive index may be added to the liquid silicone resin. The liquid transparent resin material on the first encapsulation layer 7 is defined in the second ring-shaped protrusion 12 and has a convex outer surface by surface tension in the pointed upper edge of the second ring-shaped protrusion 12. Thereafter, the liquid transparent resin material on the first encapsulation layer 7 may be cured through heat or UV irradiation to form the second encapsulation layer 7a. After that, in the same manner as described above, the fluorescent layer 8 and the optical lens layer 9 are sequentially formed on the second encapsulation layer 7a. Here, the material of the fluorescent layer 8 is filled to be limited in the third ring-shaped protrusion 13, and the material of the optical lens layer 9 is filled to be limited in the fourth ring-shaped protrusion 14.

Until now, the first encapsulation layer 7, the second encapsulation layer 7a, the fluorescent layer 8, and the optical lens layer 9 are all described as being sequentially formed using a liquid material. It is also possible to make it in advance through the process.

For example, the fluorescent layer 8 may be made in advance. In this case, the first encapsulation layer 7 is formed in the reflective cup 10 of the heat dissipation base 2 to cover the LED die 4 in the manner described above. Then, a liquid transparent resin material for the second encapsulation layer 7a is provided in the concave region of the fluorescent layer 8 made in advance in the form having the concave inside and the convex outside. Thereafter, the fluorescent layer 8 containing the transparent resin material is inverted and placed on the first encapsulation layer 7, and then the transparent resin material is cured by heat or UV irradiation. Then, a second encapsulation layer 7a is formed between the first encapsulation layer 7 and the fluorescent layer 8, and the fluorescent layer 8 can be fixed to the first encapsulation layer 7 in an airtight manner. Then, as described above, the optical lens layer 9 may be formed on the fluorescent layer 8.

Alternatively, the fluorescent layer 8 and the optical lens layer 9 may be made in advance. In this case, the fluorescent layer 8 prepared in advance is fixed on the first encapsulation layer 7 in the manner described above. Thereafter, the optical lens layer 9 prepared in advance can be attached onto the fluorescent layer 8. In addition, only the optical lens layer 9 may be made in advance. In this case, the first encapsulation layer 7, the second encapsulation layer 7a, and the fluorescent layer 8 are sequentially formed using a liquid material, and then the optical lens layer 9 prepared in advance is formed into a fluorescent layer ( 8) Attach on.

When manufacturing a white light LED package, as described above, a multilayer encapsulation layer structure including the fluorescent layer 8 may be used. However, if one wishes to manufacture a color LED package that only provides light of a particular wavelength, an LED die 4 emitting light of that wavelength is attached on the bottom surface of the heat dissipation base 2 and above the LED die 4. Only one transparent encapsulation layer may be formed. For example, as shown in FIG. 8, one transparent resin material 18 is confined within the ring-shaped protrusion of any one of the first to fourth ring-shaped protrusions 11 to 14, and cured as it is to color the color LED package. You can also complete it.

So far, exemplary embodiments of an LED lead frame package, an LED package using the same, and a method of manufacturing the LED package have been described and illustrated in the accompanying drawings in order to help understanding of the present invention. However, it should be understood that such embodiments are merely illustrative of the invention and do not limit it. And it is to be understood that the invention is not limited to the details shown and described. This is because various other modifications may occur to those skilled in the art.

Claims (25)

Heat dissipation base;
A plurality of electrodes disposed around the heat dissipation base;
An insulating support part surrounding and surrounding the heat dissipation base and the plurality of electrodes;
At least two ring-shaped protrusions formed to circumscribe over an upper surface of the insulating support; And
And at least one ring groove formed between the ring protrusions. The method of claim 1,
The insulating support portion is a lead frame package made of PPA plastic. The method of claim 1,
The plurality of electrodes is a lead frame package is disposed so that one end is opposed to the side of the heat dissipation base and the other end protrudes from the outer wall of the insulating support. The method of claim 1,
And the heat dissipation base has a reflective cup coated with a reflective material on a bottom surface thereof. The method of claim 1,
Wherein said at least two ring-shaped protrusions have sharp top edges and inclined sidewalls. The method of claim 1,
The heat dissipation base, the plurality of electrodes and the insulating support are integrally formed through an injection molding process. The method of claim 1,
The ring-shaped protrusion and the ring-shaped groove are formed on the upper surface of the insulating support through a transfer molding process. An LED package comprising a lead frame package according to any one of the preceding claims. The method of claim 8,
The LED package is:
At least one LED die attached to a bottom surface of the heat dissipation base;
A plurality of wires electrically connecting the LED die and the plurality of electrodes; And
An encapsulation layer structure formed to cover the LED die, the encapsulation layer structure having at least one layer having a convex outer surface,
An edge of each of the at least one layer of the encapsulation layer structure extends to a corresponding one of the at least two ring-shaped protrusions. The method of claim 9,
The LED die comprises at least one of a UV LED, a blue LED, a green LED and a red LED. The method of claim 9,
The encapsulation layer structure has only one transparent encapsulation layer. The method of claim 9,
The curvature of the top surface of the at least one layer is determined by adjusting the amount of layer material provided in at least one layer of the encapsulation layer structure. The method of claim 9,
The encapsulation layer structure is:
A transparent first encapsulation layer formed to directly cover the LED die;
A fluorescent layer covering the first encapsulation layer; And
LED package comprising an optical lens layer covering the fluorescent layer. The method of claim 13,
The effective refractive index of the first encapsulation layer is less than the effective refractive index of the fluorescent layer in the wavelength band of visible light. The method of claim 13,
The encapsulation layer structure further includes a transparent second encapsulation layer formed between the first encapsulation layer and the fluorescent layer. The method of claim 15,
The effective refractive index of the second encapsulation layer is less than the effective refractive index of the first encapsulation layer and the effective refractive index of the fluorescent layer in the wavelength band of visible light. 17. The method of claim 16,
The fluorescent layer is a LED package formed by uniformly mixing the phosphor material in glass, PC, PMMA, or silicone resin. The method of claim 17,
Wherein said phosphor material is excited by UV light, blue light or green light to generate visible light. The method of claim 18,
Wherein said phosphor material comprises at least one type of phosphor material that is excited by UV light, blue light or green light to generate visible light of different wavelengths, respectively. A heat dissipation base, a plurality of electrodes disposed around the heat dissipation base, an insulating support portion surrounding and fixing the heat dissipation base and the plurality of electrodes, at least two ring-shaped protrusions formed to circumscribe over an upper surface of the insulating support portion, and the ring-shaped protrusions Providing a lead frame package comprising at least one ring-shaped groove formed therebetween;
Attaching at least one LED die on a bottom surface of the heat dissipation base;
Electrically connecting the LED die and the plurality of electrodes; And
Forming an encapsulation layer structure having at least one layer having a convex outer surface to cover said LED die,
An edge of each of the at least one layer of the encapsulation layer structure extends to a corresponding one of the at least two ring-shaped protrusions. The method of claim 20,
Forming the encapsulation layer structure is:
Providing a liquid transparent resin material over a heat dissipation base to cover the LED die; And
Curing the liquid transparent resin material to form a first encapsulation layer,
And wherein the first encapsulation layer has a convex outer surface formed by surface tension within a pointed upper edge of the first ring-shaped protrusions of the ring-shaped protrusions. The method of claim 21,
Providing a liquid transparent resin material over the first encapsulation layer to cover the first encapsulation layer;
Curing the liquid transparent resin material on the first encapsulation layer to form a second encapsulation layer;
Providing a liquid transparent resin material in which a phosphor material is uniformly mixed on the second encapsulation layer so as to cover the second encapsulation layer;
Curing the liquid transparent resin material mixed with the phosphor material to form a phosphor layer;
Providing a liquid transparent resin material over the fluorescent layer to cover the fluorescent layer; And
And curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer. The method of claim 22,
The second encapsulation layer has a convex outer surface formed by surface tension in the pointed upper edge of the second ring-shaped protrusion of the ring-shaped protrusions, and the fluorescent layer is in the pointed top edge of the third ring-shaped protrusion of the ring-shaped protrusions. And a convex outer surface formed by surface tension, and wherein the optical lens layer has a convex outer surface formed by surface tension within a pointed upper edge of a fourth ring-shaped protrusion of the ring-shaped protrusions. The method of claim 21,
Providing a liquid transparent resin material in which a phosphor material is uniformly mixed on the first encapsulation layer so as to cover the first encapsulation layer;
Curing the liquid transparent resin material mixed with the phosphor material to form a phosphor layer;
Providing a liquid transparent resin material over the fluorescent layer to cover the fluorescent layer; And
And curing the liquid transparent resin material on the fluorescent layer to form an optical lens layer. The method of claim 24,
The fluorescent layer has a convex outer surface formed by surface tension in the pointed upper edge of the second ring-shaped protrusion of the ring-shaped protrusions, and the optical lens layer is in the pointed top edge of the third ring-shaped protrusion of the ring-shaped protrusions. A method of manufacturing an LED package having a convex outer surface formed by surface tension.
KR1020107005556A 2009-03-10 2010-02-24 LED leadframe package, LED package using the same, and method of fabricating the LED package KR101111256B1 (en)

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US12/381,408 US8058667B2 (en) 2009-03-10 2009-03-10 Leadframe package for light emitting diode device
US12/381,409 US8039862B2 (en) 2009-03-10 2009-03-10 White light emitting diode package having enhanced white lighting efficiency and method of making the same
PCT/KR2010/001134 WO2010104276A2 (en) 2009-03-10 2010-02-24 Led leadframe package, led package using the same, and method of manufacturing the led package

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EP2406835A2 (en) 2012-01-18
AU2010221920A1 (en) 2011-09-29

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