KR101791173B1 - Light emitting package array - Google Patents

Light emitting package array Download PDF

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Publication number
KR101791173B1
KR101791173B1 KR1020100106920A KR20100106920A KR101791173B1 KR 101791173 B1 KR101791173 B1 KR 101791173B1 KR 1020100106920 A KR1020100106920 A KR 1020100106920A KR 20100106920 A KR20100106920 A KR 20100106920A KR 101791173 B1 KR101791173 B1 KR 101791173B1
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KR
South Korea
Prior art keywords
light
light emitting
lens
emitting device
molding part
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KR1020100106920A
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Korean (ko)
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KR20120045405A (en
Inventor
김완호
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100106920A priority Critical patent/KR101791173B1/en
Publication of KR20120045405A publication Critical patent/KR20120045405A/en
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Publication of KR101791173B1 publication Critical patent/KR101791173B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

An embodiment includes a circuit board having a plurality of recesses; A light emitting element array provided on each of the plurality of recesses; A phosphor molding part array surrounding each of the light emitting elements; And a plurality of lenses surrounding each of the phosphor molding parts.

Description

[0001] LIGHT EMITTING PACKAGE ARRAY [0002]

An embodiment relates to a light emitting device package.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using semiconductor materials of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize white light rays with high efficiency. Also, compared to conventional light sources such as fluorescent lamps and incandescent lamps, low power consumption, It has the advantages of response speed, safety, and environmental friendliness.

Therefore, a transmission module of the optical communication means, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting element capable of replacing a fluorescent lamp or an incandescent lamp Diode lighting, automotive headlights, and traffic lights.

BACKGROUND ART A light emitting device package in which a light emitting element is mounted on a package body and is electrically connected is widely used in a lighting device or a display device.

The embodiment attempts to secure a light output angle of the light emitting device package array and to provide high color rendering property.

An embodiment includes a circuit board having a plurality of recesses; A light emitting element array provided on each of the plurality of recesses; A phosphor molding part array surrounding each of the light emitting elements; And a plurality of lenses surrounding each of the phosphor molding parts.

Here, the depth of the recess may be 1/3 to 1/6 of the thickness of the circuit board.

The depth of the recess may be 3 to 5 times the height of the light emitting device.

The edge of the concave portion may be spaced apart from the edge of the light emitting device by 50 to 150 micrometers.

The side surface of the concave portion may be inclined widely in the lens direction.

The ratio of the width of the base to the width of the lens may be 1 to 7 to 1.5 to 7.

Each of the phosphor molding units may have a height of 400 to 500 micrometers.

The height of the lens may be 2 to 3 millimeters.

A concave portion may be provided at the center of the lens.

The height of the concave portion may be 1 to 1.5 micrometer.

Another embodiment includes a circuit board having a plurality of recesses; A light emitting element array disposed on the plurality of recesses, the light emitting element array being sequentially provided with light emitting elements for emitting red light and green light between light emitting elements emitting blue light; A phosphor molding part array enclosing the light emitting elements emitting the blue light; And a plurality of lenses surrounding each of the phosphor molding parts.

The light emitting device package may further include a light emitting element emitting the red light and a lens formed on the light emitting element emitting green light.

The power supplied to the light emitting device emitting the blue light may be 180 to 220% of the power supplied to the light emitting device emitting the red light and the green light.

Another embodiment provides a method of manufacturing a circuit board, comprising: preparing a circuit board having a plurality of recesses; Fixing the light emitting device array on the plurality of recesses; Forming a phosphor molding part array to surround the light emitting elements by supplying phosphor materials to the respective light emitting elements; And forming a plurality of lenses surrounding each of the phosphor molding parts.

Another embodiment provides a method of manufacturing a circuit board, comprising: preparing a circuit board having a plurality of recesses; A light emitting device array is fixed on the plurality of recesses, the light emitting device array includes a light emitting device sequentially emitting red light and green light between light emitting devices emitting blue light; Forming an array of phosphor molding parts surrounding the light emitting element for emitting the blue light by supplying the phosphor resin to the light emitting element emitting the blue light; And forming a plurality of lenses surrounding each of the phosphor molding parts.

The light emitting device package according to the embodiment is provided with a wide light output angle and a high color rendering property.

1 is a view showing a first embodiment of a light emitting device package array,
2A to 2G are diagrams illustrating a manufacturing process of the light emitting device package array of FIG. 1,
FIG. 3 is a detailed view of the structure of the light emitting device package in FIG. 1,
4 is a view showing a second embodiment of a light emitting device package array,
5A to 5G are views showing a manufacturing process of the light emitting device package array of FIG. 4,
6 is a view showing a third embodiment of the light emitting device package array.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

FIG. 1 is a view showing a first embodiment of a light emitting device package array, and FIG. 3 is a detailed view of the structure of the light emitting device package in FIG.

In the light emitting device package according to the present embodiment, a plurality of recesses are provided on the circuit board 100, and one light emitting device 130 is disposed in each of the plurality of recesses. In FIG. 1, the concave portions are provided in a reverse trapezoidal shape, but they may have other shapes, for example, a rectangular shape.

Although the depth of the concave portion is shown to be about 1/3 of the depth of the circuit board 100 in the figure, the thickness of the circuit board 100 is about 1.5 to 2.1 millimeters, 1/3 to 1/6, that is, a depth of 300 to 500 micrometers. If the height of the light emitting device 130 is about 100 micrometers, the recessed portion may be formed to be three to five times as high as the height of the light emitting device 130.

The edge of the concave portion may be spaced apart from the edge of the light emitting device 130 by 50 to 150 micrometers. That is, the side surface of the concave portion may be inclined widely in the direction of the lens 160. If the inclined side surface is too close to the light emitting device 130, deterioration of the circuit substrate 100 may occur due to heat have. In addition, if the inclined side surface is provided too far from the light emitting device 130, the luminance of each package may be lowered.

The concave portion includes two electrode layers 121 and 122, and two electrodes of the light emitting device 130 may be bonded to the electrodes 140 and 140, respectively. An array of phosphor molding parts 150 surrounding the respective light emitting devices 130 and surrounding the respective phosphor molding parts 150 and a lens 160 may be provided.

 The phosphor molding part 150 may have a height c of 400 to 500 micrometers. The phosphor molding 150 may be sufficient to surround the light emitting device 130 and change the wavelength of light emitted from the light emitting device 130. If the wavelength is too large, the light emitting efficiency may be lowered. Here, the light emitting device 130 may have a height of about 500 micrometers.

A printed circuit board or the like is used as the circuit board 100. A circuit is formed by patterning a conductive material such as copper (Cu) on the first layer, and aluminum (Al) A material having excellent thermal conductivity is provided.

In the embodiment, a recess is provided on the surface of the circuit board and two layers of electrodes 121 and 122 are provided to directly conduct the first layer of the circuit board 100. Here, the layers of the electrodes 121 and 122 may be a (+) electrode and a (-) electrode, respectively. The electrode layers 121 and 122 may be electrically insulated from each other. The electrode layers 121 and 122 may be formed of a material having a high reflectance so that the light emitted from the light emitting device 130 is reflected without being absorbed by the circuit board 100. [

The two electrode layers 121 and 122 are disposed opposite to each other with the light emitting element 130 interposed therebetween. The light emitting element 130 is mounted on the light emitting element 130 in one electrode layer 121 And the other electrode layer 122 can connect the light emitting device 130 and the circuit board 100 through the wires 140. [

The light emitting device 130 may be bonded to the circuit board 100 using an adhesive 135 having a high thermal conductivity and the light emitting device 130 may be a light emitting diode. The light emitting element may be a vertical type or horizontal type light emitting element.

The phosphor molding part 150 is filled in the recess to surround the light emitting device 130. The phosphor molding part 150 may be formed of a light transmitting resin containing a phosphor, and the light transmitting resin may be silicone or epoxy. When the light emitting device 130 emits blue light, when the phosphor molding part 150 including the yellow fluorescent material is disposed, the light emitting device package can emit white light.

That is, the phosphor molding unit 150 may include a phosphor that absorbs light of the first wavelength emitted from the light emitting device 130 and emits light of the second wavelength. In this case, the second wavelength may be a wavelength longer than the first wavelength, . Further, the phosphor and the molding part may be arranged as separate layers.

The lens 160 is disposed on the phosphor molding part 150 and is made of an organic compound having good light transmittance such as silicone gel. The lens 160 condenses the light emitted from the light emitting device 130 into a predetermined region.

In order to optimize the light converging effect, the ratio of the width (a) of the base of the concave portion and the width (b) of the lens 160 may be 1 to 7 to 1.5 to 7. Also, the lens 160 may have a height d of 2 to 3 millimeters. A concave portion is provided at the center of the lens 160, and the height e of the concave portion may be 1 to 1.5. Here, the height (e) of the concave portion is calculated from the bottom of the concave portion 110 by the height of the lowest face of the concave portion.

If the width of the lens 160 is too narrow or wide, the light output angle of the light emitting device package may become too wide or narrow. In the light emitting device according to the embodiment, since the light emitting device 130 is directly disposed on the concave portion on the circuit board 100, the package body and the like can be omitted, and the shapes of the phosphor molding part 150 and the lens 160 are A primary lens and a secondary lens, and a recessed portion is formed on the lens 160 to broaden the light output angle of the light emitting device package by about 140 degrees.

2A to 2G are views showing a manufacturing process of the light emitting device package array of FIG. Hereinafter, a manufacturing process of the light emitting device package array of FIG. 1 will be described with reference to FIGS. 2A to 2G. FIG.

First, the circuit board 100 is prepared as shown in FIG. 2A. The circuit board 100 may be a printed circuit board or the like. The first layer may be formed by patterning a conductive material such as copper (Cu) to form a circuit. Aluminum A material having excellent thermal conductivity is provided.

As shown in FIG. 2B, the surface of the circuit board 100 is etched to pattern a plurality of recessed portions 110. The concave portion 110 is a region in which the light emitting device is disposed, and may be a region in which light emitted from the light emitting device is reflected. The recess may be patterned in various shapes, but the bottom on which the light emitting device is to be disposed should be flat and the side surface may be inclined to be advantageous for light extraction efficiency.

As shown in FIG. 2C, electrode layers 121 and 122 are formed on the concave portions 110, respectively. The two electrodes 121 and 122 may be spaced apart from each other and insulated from each other and may be formed of a material having a high reflectivity or may be coated with a material having high reflectance on the electrode layers 121 and 122 made of a conductive material. The electrodes 121 and 122 may be arranged to be electrically connected to the circuit board 100, respectively.

In FIG. 2C, the two electrodes 121 and 122 are arranged to be symmetrical with respect to each other. However, one electrode may be extended to the bottom of the concave portion. In this case, the light emitting element is provided on the extended electrode, The electrode may be electrically connected to the light emitting element by wire bonding or the like.

As shown in FIG. 2D, the light emitting device 130 is disposed in the concave portion 110. One light emitting device 130 may be disposed on one recess 110 and the light emitting device 130 may be fixed on the bottom surface of the recess 110 by using an adhesive 135.

As shown in FIG. 2E, the light emitting device 130 is electrically connected to the electrode layers 121 and 122 through the bonding of the wires 140. At this time, when the light emitting device 130 is fixed with the conductive adhesive 135, only one wire 140 bonding may be required. In addition, the wire bonding method is only one example, and the light emitting element 130 can be energized with the electrode layers 121 and 122 by other methods such as flip chip bonding.

As shown in FIG. 2F, the phosphor molding part 150 is filled in the concave part 110 so as to surround the light emitting device 130. In the drawing, the center of the phosphor molding part 150 is convexly filled, but may be filled close to the horizontal plane. The phosphor molding part 150 may be formed by filling a mixed resin powder such as silicon or epoxy with a phosphor powder 155 and curing the material.

As shown in FIG. 2G, the lens 160 is formed on the phosphor molding part 150. The lens 160 may be formed by applying a material having excellent light-shielding properties such as silicone gel. At this time, the lens 160 may have a structure as described above, and a lens material may be coated on the phosphor molding part 150 using an injection mold and cured.

The material coating and curing of the phosphor molding part 150 and the lens 160 are performed by simultaneously applying a plurality of phosphor molding parts 150 and the entire material of the lens 160 on a plurality of light emitting device arrays 130 Patterning and curing.

4 is a view showing a second embodiment of the light emitting device package array.

The light emitting device package according to the present embodiment continuously mounts a light emitting device package that emits red (R), white (W), and green (G) to ensure high color rendering. In order to emit light, a light emitting element emitting light of different wavelengths may be disposed. In order to emit white light, a phosphor emitting yellow phosphor may be disposed on a light emitting element emitting blue wavelength light .

Specifically, it is as follows.

The light emitting device package according to the present embodiment includes a plurality of recesses on a circuit board 100, and one light emitting device 130R, 130B, and 130G may be disposed in each of the recesses. In FIG. 4, the concave portions are provided in the shape of an inverted trapezoid, and may have another shape, for example, a rectangular shape. The light emitting device 130R that emits red light, the light emitting device 130B that emits blue light, and the light emitting device 130G that emits green light are arranged successively. The light emitting elements may be arranged in a different order from that shown in the figure, but the light emitting elements emitting different light must be arranged successively.

In the recess, two electrode layers 121 and 122 are provided. Two electrodes of the light emitting devices 130R, 130B, and 103G may be bonded to the electrodes 140 and 140, respectively. A molding part 150 'is provided on the light emitting devices 130R and 130G emitting red light and green light and a phosphor molding part 150 is provided on the light emitting device 130B emitting blue light.

That is, the light emitting devices 130R and 130G emitting red light and green light may be provided with a molding part 150 'that does not require color conversion and protects the light emitting devices 130R and 130G. The phosphor molding part 130B may be provided with the phosphor molding part 150 because the color conversion to the white light is necessary. The lens 160 may be provided on the phosphor molding part 150 on the light emitting device 130B emitting the blue light to enlarge the projection angle of the white light. That is, the molding part 150 'may be formed of a translucent resin containing a phosphor, and the translucent resin may be silicone or epoxy.

The sizes of the molding part 150 ', the phosphor molding part 150 and the lens 160 are the same as those of the embodiment shown in FIG. 1. The size of the molding part 150' (150). That is, the molding part 150 'and the phosphor molding part 150 may be provided at a height (c) of 400 to 500 micrometers, wherein the light emitting devices 130R, 103B, As shown in FIG.

The structure and composition of the circuit board 100 and the electrodes 121 and 122 are the same as those of the embodiment shown in FIG.

The two electrode layers 121 and 122 are provided opposite to each other with the light emitting elements 130R, 130B and 130G interposed therebetween. One electrode layer 121 is provided with a light emitting element 130, And the other electrode layer 122 can connect the light emitting devices 130R, 130B, and 130G to the circuit board 100 through the wires 140. The light emitting devices 130R, 130B,

The light emitting devices 130R, 130B and 130G may be bonded onto the circuit board 100 using an adhesive 135 having a good thermal conductivity and the light emitting device 130 may be a light emitting diode . The light emitting element may be a vertical type or horizontal type light emitting element.

The lens 160 is disposed on the phosphor molding part 150 and is made of an organic compound having good light transmittance such as silicone gel and the lens 160 is emitted from the light emitting devices 130R, And condenses the distribution of the light into a predetermined area. In order to realize light emitted from the light emitting devices 130R, 130B and 130G as white light, in order to secure the light projection angle of the white light emitted from the light emitting device 130B, (160) can be disposed.

At this time, the power supplied to the light emitting device 130B emitting blue light may be twice as much as the power supplied to the light emitting devices 130R and 130G emitting red light and green light. The above values may have an error of +/- 10%. The white light is emitted due to the yellow phosphor molding part 150 on the light emitting device 130B emitting the blue light, but white light including a part of the blue light can be emitted. Therefore, the light emitting devices 130R and 130G emit weaker red light and green light than the white light, thereby realizing light close to white.

5A to 5G are views illustrating a manufacturing process of the light emitting device package array of FIG. Hereinafter, a manufacturing process of the light emitting device package array of FIG. 4 will be described with reference to FIGS. 5A to 5G. FIG.

First, the circuit board 100 is prepared as shown in FIG. 5A. The circuit board 100 may be a printed circuit board or the like. The first layer may be formed by patterning a conductive material such as copper (Cu) to form a circuit. Aluminum A material having excellent thermal conductivity is provided.

As shown in FIG. 5B, the surface of the circuit board 100 is etched to pattern the plurality of recessed portions 110. The concave portion 110 is a region in which the light emitting device is disposed, and may be a region in which light emitted from the light emitting device is reflected. The recess may be patterned in various shapes, but the bottom on which the light emitting device is to be disposed should be flat and the side surface may be inclined to be advantageous for light extraction efficiency.

5C, electrode layers 121 and 122 are formed on the concave portions 110, respectively. The two electrodes 121 and 122 may be spaced apart from each other and insulated from each other and may be formed of a material having a high reflectivity or may be coated with a material having high reflectance on the electrode layers 121 and 122 made of a conductive material. The electrodes 121 and 122 may be arranged to be electrically connected to the circuit board 100, respectively.

In FIG. 5C, the two electrodes 121 and 122 are arranged to be symmetrical with respect to each other. However, one electrode may be extended to the bottom of the concave portion. In this case, the light emitting element is provided on the extended electrode, The electrode may be electrically connected to the light emitting element by wire bonding or the like.

As shown in FIG. 5D, the light emitting devices 130R, 130B, and 130G are disposed in the concave portions 110. FIG. One light emitting device 130R, 130B and 130G may be disposed on one recess 110 and the light emitting devices 130R, 130B and 130G may be fixed using an adhesive 135 on the bottom surface of the recess 110 . The arrangement order of the light emitting devices 130R, 130B, and 130G may be different from that shown in the drawing, but the light emitting devices 130R, 130B, and 130G, which emit light in different wavelength regions adjacent to the one light emitting device 130R, 130B, and 130G may be provided.

As shown in FIG. 5E, the light emitting devices 130R, 130B, and 130G are electrically connected to the electrode layers 121 and 122 through the wire 140 bonding. At this time, when the light emitting devices 130R, 130B, and 130G are fixed with the conductive adhesive 135, only one wire 140 bonding may be required. Also, the wire bonding method is only one example, and the light emitting devices 130R, 130B, and 130G can be electrically connected to the electrode layers 121 and 122 by other methods such as flip chip bonding.

As shown in FIG. 25, the phosphor molding part 150 and the molding part 150 'are filled in the recess 110 so as to surround the light emitting devices 130R, 130B and 130G. The molding part 150 'is disposed on the light emitting devices 130R and 130G emitting the red light and the green light and the phosphor molding part 150 is disposed on the light emitting device 130B emitting the blue light.

In addition, the center of the molding part 150 'and the phosphor molding part 150 are shown to be convex, but they may be filled near the horizontal plane. The phosphor molding part 150 may be formed by filling a material obtained by mixing a phosphor powder with a composite resin powder such as silicon or epoxy and curing the material. The molding part 150 'may be formed of a material such as silicon or epoxy And a composite resin powder.

5G, a lens 160 is formed on the phosphor molding part 150. The phosphor molding part 150 may be formed by a conventional method. The lens 160 may be formed by applying a material having excellent light-shielding properties such as silicone gel. At this time, the lens 160 may have a structure as described above, and a lens material may be coated on the phosphor molding part 150 using an injection mold and cured.

The material application and curing of the phosphor molding part 150 and the lens 160 are performed by simultaneously applying a plurality of phosphor molding parts 150 and the entire material of the lens 160 on a plurality of light emitting device arrays, .

6 is a view showing a third embodiment of the light emitting device package array.

The present embodiment is the same as the embodiment shown in FIG. 4, but a lens 165 is also provided on the light emitting devices 130R and 130G emitting red light and green light. Unlike the lens 160 on the light emitting device 130B that emits blue light, the lens 165 may not have a concave portion in the center, and more diffusion of white light than red light and green light is required.

A plurality of light emitting device packages according to the embodiments may be arranged on a printed circuit board or the like, and a light guide plate, a prism sheet, a diffusion sheet, or the like may be disposed on the light path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member can function as a light unit. Still another embodiment may be implemented as a display device, an indicating device, a lighting system including the semiconductor light emitting device or the light emitting device package described in the above embodiments, for example, the lighting system may include a lamp, a streetlight .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: circuit board 110: concave
121, 122: electrodes 130, 130R, 130B, 130G:
135: Adhesive 140: Wire
150: phosphor molding part 150 ': molding part
155: Phosphor powder 160. 165: Lens

Claims (15)

A circuit board having a plurality of first recesses;
Light emitting elements respectively provided on the plurality of first concave portions and emitting blue light, green light, and red light, respectively;
A phosphor molding part disposed on the light emitting element for emitting the blue light, the phosphor molding part including a yellow fluorescent material;
A molding part composed of a translucent resin disposed on the light emitting element that emits the green light and the red light, respectively; And
A first lens disposed above the light emitting element that emits the blue light, and a second lens disposed above the green light and the light emitting element that emits the red light,
The first lens has a second concave portion at the center of its upper portion, the upper portion of the second lens is convex, a light emitting element emitting red light is disposed adjacent to one side of the light emitting element emitting blue light, Emitting elements emitting green light are arranged adjacent to each other,
Wherein the blue light is mixed with the light excited by the blue light and excited by the blue light to emit white light. The method according to claim 1,
Wherein a depth of the first recessed portion is 1/3 to 1/6 the thickness of the circuit board. The method according to claim 1,
Wherein a depth of the first recess is 3 to 5 times the height of the light emitting device. The method according to claim 1,
And the edges of the first recess are spaced apart from the edge of the light emitting device by 50 to 150 micrometers. The method according to claim 1,
Wherein a side surface of the first recessed portion is inclined from a bottom surface of the first recessed portion to a width in a direction of the first lens and the second lens. The method according to claim 1,
Wherein the ratio of the width of the bottom surface of the first concave portion to the width of the first lens is 1 to 7 to 1.5 to 7. The method according to claim 1,
Wherein each of the phosphor molding parts has a height of 400 to 500 micrometers. The method according to claim 1,
And the height of the first lens is 2 to 3 millimeters. delete The method according to claim 1,
And the height of the second recess is 1 to 1.5 micrometer. delete delete The method according to claim 1,
Wherein the power supplied to the light emitting device emitting blue light is 180 to 220% of power supplied to the light emitting devices emitting the red light and the green light. delete delete
KR1020100106920A 2010-10-29 2010-10-29 Light emitting package array KR101791173B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100106920A KR101791173B1 (en) 2010-10-29 2010-10-29 Light emitting package array

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Application Number Priority Date Filing Date Title
KR1020100106920A KR101791173B1 (en) 2010-10-29 2010-10-29 Light emitting package array

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009060068A (en) * 2007-08-31 2009-03-19 Ledtech Electronics Corp Array type light emitting device with high color rendering properties

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009060068A (en) * 2007-08-31 2009-03-19 Ledtech Electronics Corp Array type light emitting device with high color rendering properties

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