JP2012033518A - 接合構造体製造方法および加熱溶融処理方法ならびにこれらのシステム - Google Patents
接合構造体製造方法および加熱溶融処理方法ならびにこれらのシステム Download PDFInfo
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- JP2012033518A JP2012033518A JP2010166448A JP2010166448A JP2012033518A JP 2012033518 A JP2012033518 A JP 2012033518A JP 2010166448 A JP2010166448 A JP 2010166448A JP 2010166448 A JP2010166448 A JP 2010166448A JP 2012033518 A JP2012033518 A JP 2012033518A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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Abstract
【解決手段】
複数の基板50a、50bに仮止め剤55を塗布して、仮止め剤55を介して基板同士を仮止めした状態でヒータ33によって加熱し、半田54の溶融する前または半田54の溶融中に仮止め剤55を蒸発させつつ、溶融した半田54を介して基板50a、50bを半田接合する
【選択図】図6
Description
<第1実施の形態>
本発明の第1実施形態の接合構造体製造技術は、複数の被接合部材間を半田接合または共晶接合して接合構造体を製造する技術に関する。この接合構造体製造技術は、機械的な半田接合にも用いることができるが、好ましくは、基板同士、チップ同士、あるいは、基板とチップとを半田接合する技術であり、一対の基板の電極構造同士、チップの電極構造同士、および基板の電極構造とチップの電極構造とを半田接合により電気的に接続するものである。
<第2実施の形態>
次に、本発明の第2実施形態について説明する。上記の第1実施形態では、仮止め剤を基板上に面状に塗布する場合を説明した。しかしながら、第2実施形態では、複数の箇所においてスポット状に仮止め剤が塗布される。この点を除いて、本実施形態の接合構造体製造技術は、第1実施形態の場合と同様であるので、第1実施形態にける部材と同様の部材には、本実施形態においても同じ部材番号を用いて示すとともに、詳しい説明を省略する。
<第3実施形態>
上記の第1、第2実施形態においては、仮止め剤55として、フラックスではない有機剤、つまり、非還元性の有機剤である仮止め剤を基板に塗布して基板間を仮止めする場合を説明した。
<第4実施形態>
次に本発明の第4実施形態について説明する。
<実施例>
<第1実施例>
シリコン基板(5mm角、25mm角)に、銅製のカッパーポスト52と、カッパーポスト52上のバリア層(Ni/Pd/Au)53と、バリア層53上に形成されたSn−Ag半田バンプ54とが形成された基板50a、50bを用意した。上記の基板50a、50bは、一対用意した。なお、半田バンプ54の直径が100ミクロンであり、隣接する半田バンプ間のピッチ(中心間の距離)が250ミクロンのものを用いた。
この結果、基板50a、50bには位置ずれがなく、良好に半田接合された。
<第2実施例>
半田バンプ54の直径が20ミクロンであり、隣接する半田バンプ間のピッチ(中心間の距離)が40ミクロンのものを用いた。その他の条件は、上記第1実施例と同様とした。この場合も、基板50a、50bの位置ずれは、2μm以下となっており、良好に半田接合された。
<第3実施例>
上記の第1実施例と同じ基板において、ターピネオールを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で薄めて製造した仮止め剤を用いて仮止めした。粘度調整剤の割合は0重量%、30重量%、50重量%、70重量%、90重量%とした場合で、それぞれ実施した。この場合も、第1実施例と同様に、位置ずれが少なく、良好に半田接合された。ただし、収率は、第1実施例の場合と比べて若干低下した。
<第4実施例>
上記の第2実施例と同じ基板において、ターピネオールを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で薄めて製造した仮止め剤を用いて仮止めした。この場合も、第2実施例と同様に、位置ずれが少なく、良好に半田接合された。ただし、収率は、第2実施例の場合と比べて悪かった。
<第5実施例>
上記の第1実施例と同じ基板において、プロピレングリコールフェニル・エーテルを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で薄めて製造した仮止め剤を用いて仮止めした。粘度調整剤の割合は0重量%、30重量%、50重量%、70重量%、90重量%とした場合で、それぞれ実施した。この場合も、位置ずれが少なく、良好に半田接合された。ただし、収率は、第1実施例および第3実施例の場合と比べて悪かった。
<第6実施例>
上記の第2実施例と同じ基板において、プロピレングリコールフェニル・エーテルを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で薄めて製造した仮止め剤を用いて仮止めした。この場合も、第2実施例と同様に、位置ずれが少なく、良好に半田接合された。ただし、収率は、第2実施例および第4実施例の場合と比べて悪かった。
<第7実施例>
上記の第1実施例と同じ基板において、同じ仮止め剤を4箇所(4点)において、スポット状に離散的に塗布した。このとき、仮止め剤による仮止め作用により位置ずれを軽減して、半田接合することができた。なお、本実施例においては、半田接合前の時点で、基板50a、50b間に20μm程度の小さな位置ずれを生じさせたサンプルでも実験してみたが、仮止め作用により大きな位置ずれを防止することができれば、半田バンプ54が溶融することによる半田の表面張力の作用によって、セルフアライメント(自己整合)されて、位置ずれが解消した。したがって、実用的には、仮止め剤を離散的に塗布するによっても、複数の基板同士を半田接合して半田付け基板を製造する際に、クリーニング処理を省略できるにもかかわらず、複数の基板間の位置ずれを軽減できることがわかった。
<第8実施例>
上記の第2実施例と同じ基板において、同じ仮止め剤を4箇所において、スポット状に離散的に塗布した。この場合も、複数の基板間の位置ずれを軽減できた。
<第9実施例>
第1実施例と同じ基板において、ターピネオールを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で0%〜90重量%に薄めて製造した仮止め剤を、4箇所でスポット状に離散的に塗布した。また、第2実施例と同じ基板においても、同様に、仮止め剤を、4箇所でスポット状に離散的に塗布した。これらにおいても、複数の基板間の位置ずれを軽減でき、実用できる水準であった。
<第10実施例>
第1実施例と同じ基板において、プロピレングリコールフェニル・エーテルを粘度調整剤(2,4−ジエチル−1,5−ペンタンジオール)で0〜90重量%に薄めて製造した仮止め剤を、4箇所でスポット状に離散的に塗布した。また、第2実施例と同じ基板においても、同様に、仮止め剤を、4箇所でスポット状に離散的に塗布した。これらにおいても、複数の基板間の位置ずれを軽減でき、実用できる水準であった。
20 仮止め装置、
21 ディスペンサ、
22 アライメント機構、
30 半田溶融装置、
31 チャンバ、
32 カルボン酸の供給部、
33 ヒータ、
34 供給系、
35 バルブ、
36 密閉容器、
37 バルブ、
38 キャリアガス供給管、
39 排気ポンプ、
40 カルボン酸回収部、
41 窒素供給管、
42 バルブ、
50(50a、50b) 半導体基板、
51 半導体基板本体、
52 カッパーポスト(第1突起部)、
53 バリア層、
54 半田バンプ、
55 仮止め剤、
56 アンダーフィル樹脂。
Claims (25)
- 加熱溶融材を介して複数の被接合部材間を接合して接合構造体を製造する接合構造体製造方法において、
前記複数の被接合部材の少なくとも一方に加熱溶融材が形成された被接合部材を準備する段階と、
前記複数の被接合部材が互いに対向する面上に有機剤を塗布して、当該有機剤を介して複数の被接合部材間を仮止めする仮止め段階と、
前記加熱溶融材を溶融して当該加熱溶融材を介して複数の被接合部材間を接合する接合段階と、
前記接合段階の前または後に、前記有機剤を加熱により蒸発させる蒸発段階と、を有することを特徴とする接合構造体製造方法。 - 加熱溶融材を介して複数の被接合部材間を接合して接合構造体を製造する接合構造体製造方法において、
前記複数の被接合部材の少なくとも一方に加熱溶融材が形成された被接合部材を準備する段階と、
前記複数の被接合部材が互いに対向する面上に有機剤を塗布して、当該有機剤を介して複数の被接合部材間を仮止めする仮止め段階と、
仮止めされた複数の被接合部材を加熱して、前記加熱溶融材の溶融する前または前記加熱溶融材の溶融中に前記有機剤を蒸発させる蒸発段階と、
前記加熱溶融材を溶融して当該加熱溶融材を介して複数の被接合部材間を接合する接合段階と、を有することを特徴とする請求項1に記載の接合構造体製造方法。 - 前記加熱溶融材は、半田材または共晶接合材であり、前記接合段階は、複数の被接合部材間を半田接合または共晶接合することを特徴とする請求項2に記載の接合構造体製造方法。
- 前記接合段階は、前記複数の被接合部材のうちの一方の被接合部材に設けられた電極構造と、他方の被接合部材に設けられた電極構造とを電気的に接続することを特徴とする2または3に記載の接合構造体製造方法。
- 前記加熱溶融材を全て蒸発させた後に、前記接合段階において前記加熱溶融材を溶融することを特徴とする請求項2〜4のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め段階は、前記有機剤として非還元性の有機剤である仮止め剤を塗布するものであり、
前記接合段階は、カルボン酸蒸気を含む雰囲気中で加熱処理し、フラックスレスで半田接合または共晶接合するものである、ことを特徴とする請求項5に記載の接合構造体製造方法。 - チャンバ中に前記カルボン酸蒸気を供給する供給段階を有し、
前記接合段階は、前記チャンバ内で行われることを特徴とする請求項6に記載の接合構造体製造方法。 - 前記接合段階に先立って前記カルボン酸蒸気を供給し、
前記蒸発段階は、前記カルボン酸蒸気による前記加熱溶融材の酸化膜の還元処理に先立ってまたは当該還元処理と並行して前記仮止め剤を蒸発させる、ことを特徴とする請求項5または6に記載の接合構造体製造方法。 - 前記蒸発段階は、前記加熱溶融材の溶融する前に前記有機剤を蒸発させることを特徴とする請求項6〜8のいずれか1項に記載の接合構造体製造方法。
- 前記接合段階の後に、前記有機剤を洗浄除去する作業をすることなく前記複数の被接合部材間にアンダーフィル樹脂を充填することを特徴とする請求項5〜9のいずれか1項に記載の接合構造体製造方法。
- 前記蒸発段階では、前記仮止め剤が蒸発しやすいように、前記チャンバ内の真空度を一時的に高めることを特徴とする請求項6〜10のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め剤は、圧力1×102乃至1×105Paのいずれかの圧力において、100℃乃至350℃の沸点を有することを特徴とする請求項6〜11のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め剤は、イソボルニルシクロヘキサノール、ターピネオール、およびプロピレングリコールフェニル・エーテルから選ばれた少なくとも1つの非還元性の有機剤であることを特徴とする請求項6〜12のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め剤は、互いに沸点の異なる複数種類の非還元性の有機剤を含むことを特徴とする請求項6〜13のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め剤は、粘度1×102乃至1×105mPa・sになるように粘度調整剤により希釈されていることを特徴とする請求項6〜14のいずれか1項に記載の接合構造体製造方法。
- 前記複数の被接合部材の少なくとも一方に形成された半田は、直径が100μm以下の半田バンプであり、隣接する半田バンプ間のピッチ間隔が150μm以下であることを特徴とする請求項6〜15のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め段階は、前記被接合部材上にスポット状またはライン状に前記仮止め剤が塗布されることを特徴とする請求項6〜16のいずれか1項に記載の接合構造体製造方法。
- 前記仮止め段階は、前記被接合部材上に、複数の箇所に離散して前記仮止め剤が塗布されることを特徴とする請求項17に記載の接合構造体製造方法。
- 前記仮止め剤は、前記半田の表面から離隔されて前記被接合部材上に塗布されることを特徴とする請求項17または18に記載の接合構造体製造方法。
- 前記仮止め段階は、前記被接合部材上に、面状に前記仮止め剤が塗布されることを特徴とする請求項6〜16のいずれか1項に記載の接合構造体製造方法。
- 前記複数の被接合部材の一方に設けられた電極構造は、第1電極層と、前記第1電極部上に形成されたバリア層と、前記バリア層上に形成された半田バンプとからなり、
前記複数の被接合部材の他方に設けられた電極構造は、第2電極層とからなり、
半田接合によって、前記半田バンプと前記第2電極層とが接合されることを特徴とする請求項6〜20のいずれか1項に記載の接合構造体製造方法。 - 加熱溶融材を介して複数の被接合部材間を接合して接合構造体を製造する接合構造体製造システムにおいて、
前記複数の被接合部材の少なくとも一方に加熱溶融材が形成された被接合部材に非還元性の有機剤である仮止め剤を塗布する塗布手段と、
前記仮止め剤を介して積層された状態で仮止めされた前記複数の被接合部材を加熱する加熱手段と、
前記複数の被接合部材に対してカルボン酸蒸気を供給する供給手段と、を有し、
前記加熱手段は、前記加熱溶融材の溶融する前または前記加熱溶融材の溶融中に前記仮止め剤を蒸発させる一方、前記カルボン酸蒸気を含む雰囲気中においてフラックスレスで接合するために前記被接合部材を加熱することを特徴とする接合構造体製造システム。 - 半田材が付着した部材を加熱して半田材を加熱溶融処理して半田を成形する加熱溶融処理方法であって、
前記部材上に半田材を付着させるとともに、部材の表面に有機剤を塗布して、当該有機剤を介して前記半田材の位置を仮止めする仮止め段階と、
前記加熱溶融材の溶融する前または前記加熱溶融材の溶融中に前記有機剤を蒸発させる蒸発段階と、
前記加熱溶融材を溶融して半田を成形する成形段階と、を有することを特徴とする請求項1に記載の加熱溶融処理方法。 - 半田材が付着した部材を加熱して半田材を加熱溶融処理して半田を成形する加熱溶融処理方法であって、
前記部材上に半田材を付着させるとともに、部材の表面に有機剤を塗布して、当該有機剤を介して前記半田材を仮止めする仮止め段階と、
前記半田材の溶融する前または前記半田材の溶融中に前記有機剤を蒸発させる蒸発段階と、
前記半田材を溶融して半田を成形する成形段階と、を有することを特徴とする加熱溶融処理方法。 - 半田材が付着した部材を加熱して半田材を加熱溶融処理して半田を成形する加熱溶融処理システムにおいて
前記部材上に半田材を付着させるとともに、半田材を仮止めするために部材の表面に有機剤を塗布する塗布手段と、
前記仮止め剤を介して半田材が仮止めされた部材を加熱する加熱手段と、
前記部材に対してカルボン酸蒸気を供給する供給手段と、を有し、
前記加熱手段は、前記半田材の溶融する前または前記半田材の溶融中に前記仮止め剤を蒸発させる一方、前記カルボン酸蒸気を含む雰囲気中においてフラックスレスで半田を成形するために前記部材を加熱することを特徴とする加熱溶融処理システム。
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- 2011-06-24 KR KR1020127033994A patent/KR101805147B1/ko active IP Right Grant
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Also Published As
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JP5807221B2 (ja) | 2015-11-10 |
US8757474B2 (en) | 2014-06-24 |
US20140246481A1 (en) | 2014-09-04 |
EP2587900A1 (en) | 2013-05-01 |
EP2587900B1 (en) | 2019-04-24 |
CN102960077A (zh) | 2013-03-06 |
KR20130087407A (ko) | 2013-08-06 |
EP2587900A4 (en) | 2015-10-28 |
US20130105558A1 (en) | 2013-05-02 |
WO2012002273A1 (ja) | 2012-01-05 |
CN102960077B (zh) | 2017-12-29 |
TW201212762A (en) | 2012-03-16 |
US20150314385A1 (en) | 2015-11-05 |
TWI548317B (zh) | 2016-09-01 |
KR101805147B1 (ko) | 2017-12-05 |
US9119336B2 (en) | 2015-08-25 |
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