CN102960077B - 接合构造体制造方法及加热熔融处理方法以及它们的系统 - Google Patents
接合构造体制造方法及加热熔融处理方法以及它们的系统 Download PDFInfo
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- CN102960077B CN102960077B CN201180031174.9A CN201180031174A CN102960077B CN 102960077 B CN102960077 B CN 102960077B CN 201180031174 A CN201180031174 A CN 201180031174A CN 102960077 B CN102960077 B CN 102960077B
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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Abstract
本发明提供一种可省略助熔剂除去的工序但仍可减轻基板间的错位的焊合方法。在多个基板(50a、50b)涂布暂时固定剂(55),在通过暂时固定剂(55)将基板彼此暂时固定的状态下利用加热器(33)进行加热,在焊料(54)熔融之前或焊料(54)熔融中使暂时固定剂(55)蒸发,并且通过熔融的焊料(54)将基板(50a、50b)焊接接合。
Description
技术领域
本发明涉及通过焊料或共晶接合用的嵌入金属等加热熔融材料将多个被接合部件间接合的接合构造体制造方法及加热熔融处理方法以及它们的系统。
背景技术
通过焊料凸起(半田バンプ)或焊料座等焊料或共晶接合用的嵌入金属将多个被接合部件间焊接接合或共晶接合来制造接合构造体的技术在半导体安装工序中被广泛应用。例如,在半导体安装工序中,采用通过焊料凸起将有机基板和半导体基板焊接接合、或通过焊料凸起将半导体基板和半导体芯片焊接接合的技术。
以将半导体基板(半导体芯片)彼此焊接接合的情况为例,为使焊料凸起熔融以将多个基板间焊接接合,必须要除去焊料凸起表面的氧化膜。因此,在基板表面上涂布了被称作“助熔剂(flux)”的松香系的还原性有机剂的状态下将多个基板层叠进行加热。其结果是,在通过助熔剂将焊料凸起表面的氧化膜还原除去的状态进行良好的焊接接合。助熔剂在焊接接合后通过溶液清洗或离子蚀刻等清洗处理而除去。
但是,近年来的焊料凸起构造的微细化难以除去助熔剂。特别是在焊料凸起的直径或相邻的焊料凸起间的间距为数十μm水平以下时,难以充分除去助熔剂。不能除去的助熔剂产生助熔剂残渣。助熔剂残渣通过包含于助熔剂的氯等的作用而可能在相邻的电极构造(焊料凸起)间产生被称作迁移(マイグレ一シヨン)的绝缘不良。另外,最终在基板间充填底部填充树脂的工序中,有时因助熔剂残渣而不能充分充填底部填充树脂,产生被称作空穴的空隙。
另一方面,作为不受助熔剂残渣的影响的方法,实际上使用通过无助熔剂地焊接接合来省略清洗处理的方法(免清洗法)。具体而言,将甲酸等羧酸蒸汽导入腔室内,利用该羧酸将焊料凸起表面的氧化膜还原,由此可不使用助熔剂而进行焊接接合(对比文献1、2)。
但是,在无助熔剂地焊接接合中,存在基板彼此容易产生错位(位置ずれ)的新问题。即,如上述,在使用助熔剂的情况下,因介于多个基板间的助熔剂而产生保持力(堆叠力),通过该保持力防止基板彼此的错位,与之相对,在无助熔剂地焊接接合的情况下,在基板间不存在助熔剂,不能对基板间给予保持力(堆叠力)。因此,在无助熔剂地焊接接合的免清洗法中,容易在基板间产生错位,因此可应用免清洗法的情况有限。特别是在通过基板上的焊料凸起将基板彼此焊接接合的情况下,也有时需要1~2μm左右的定位精度,因此,难以应用容易产生错位的免清洗法。另外,同样的问题在共晶接合的情况下也会产生。
而且,错位不仅在基板接合的情况,在将焊料材料固定于基板上进行焊料凸起等的形成的情况下也成为问题。
现有技术文献
专利文献
专利文献1:日本特开平11-233934号公报
专利文献2:日本特开2001-244618号公报
发明概述
发明所要解决的课题
本发明解决上述现有技术的问题点。即,本发明提供接合构造体制造方法及制造系统,其在将多个被接合部件彼此通过加热熔融材料接合来制造接合构造体时,虽然可省略清洗处理,但仍可以减轻多个被接合部件间的错位。
另外,本发明提供加热熔融处理装置及加热熔融处理系统,其在对焊料材料进行加热熔融处理,以进行焊料凸起等焊料成形的情况下能够减轻焊料形成的错位。
用于解决课题的技术方案
(1)本发明提供一种接合构造体制造方法,其通过加热熔融材料将多个被接合部件间接合以制造接合构造体,所述接合构造体制造方法具有:准备在所述多个被接合部件中的至少一个形成有加热熔融材料的被接合部件的步骤;在所述多个被接合部件彼此对向的面上涂布有机剂,通过该有机剂将多个被接合部件间暂时固定的暂时固定步骤;将所述加热熔融材料熔融,通过该加热熔融材料将多个被接合部件间接合的接合步骤;以及在所述接合步骤之前或之后通过加热使所述有机剂蒸发的蒸发步骤。
(2)本发明提供一种接合构造体制造系统,其通过加热熔融材料将多个被接合部件间接合以制造接合构造体,所述接合构造体制造系统具有:涂布装置,其将非还原性有机剂即暂时固定剂涂布于在所述多个被接合部件中的至少一个形成有加热熔融材料的被接合部件;加热装置,其对通过所述暂时固定剂以层叠的状态暂时固定的所述多个被接合部件进行加热;以及供给装置,其对于所述多个被接合部件供给羧酸蒸汽,其中所述加热装置加热所述被接合部件以用于在所述加热熔融材料熔融之前或所述加热熔融材料熔融中使所述暂时固定剂蒸发,另一方面,在含有所述羧酸蒸汽的气氛中无助熔剂地进行接合。
(3)本发明提供一种加热熔融处理方法,其加热附着有焊料材料的部件,并且对焊料材料进行加热熔融处理以成形焊料,所述加热熔融处理方法具有:在所述部件上附着焊料材料,并且在部件的表面涂布有机剂,通过该有机剂暂时固定所述焊料材料的暂时固定步骤;在所述焊料材料熔融之前或所述焊料材料熔融中使所述有机剂蒸发的蒸发步骤;以及将所述焊料材料熔融以成形焊料的成形步骤。
(4)本发明提供一种加热熔融处理系统,其加热附着有焊料材料的部件,对焊料材料进行加热熔融处理以成形焊料,所述加热熔融处理系统具有:在所述部件上附着焊料材料,并且为将焊料材料暂时固定而在部件的表面涂布有机剂的涂布装置;对通过所述暂时固定剂使焊料材料暂时固定的部件进行加热的加热装置;以及对于所述部件供给羧酸蒸汽的供给装置,其中所述加热装置加热所述部件以用于在所述焊料材料熔融之前或所述焊料材料熔融中使所述暂时固定剂蒸发,另一方面,在含有所述羧酸蒸汽的气氛中无助熔剂地成形焊料。
发明效果
根据本发明,在将多个被接合部件彼此焊接接合以制造接合构造体时,虽然可省略清洗处理,但仍可以减轻多个被接合部件间的错位。另外,在成形焊料时也能够减轻焊料材料的错位。
附图说明
图1是本发明第一实施方式的接合构造体制造系统的概略构成图。
图2是表示本发明第一实施方式的接合构造体制造方法所使用的基板之一例的图。
图3是表示与图2不同的基板的第一例的图。
图4是表示与图2不同的基板的第二例的图。
图5是本发明第一实施方式的对于图2的基板的后续工序的图。
图6是本发明第一实施方式的接着图5的工序的图。
图7是本发明第一实施方式的温度条件及真空度条件的图。
图8是本发明第一实施方式的接着图6的工序的图。
图9是本发明第一实施方式的接着图8的工序的图。
图10是本发明第一实施方式的接着图9的工序的图。
图11是表示本发明第二实施方式的暂时固定剂的涂布例的图。
图12是表示本发明第四实施方式的加热熔融处理的图。
具体实施方式
下面,参照附图说明本发明的实施方式。此外,附图的说明中,对于同一元件标注同一符号,省略重复的说明。另外,附图的尺寸比率为便于说明而夸大图示,存在与实际的比率不同的情况。
本发明的接合构造体制造技术涉及将多个被接合部件间通过加热熔融部件(焊料或嵌入金属等)接合(特别是焊接接合或共晶接合)来制造接合构造体的技术。
<第一实施方式>
本发明第一实施方式的接合构造体制造技术涉及将多个被接合部件间进行焊接接合或共晶接合来制造接合构造体的技术。该接合构造体制造技术也可以用于机械的焊接接合,但优选为将基板彼此、芯片彼此、或基板和芯片焊接接合的技术,且为将一对基板的电极构造彼此、芯片的电极构造彼此、及基板的电极构造和芯片的电极构造通过焊接接合而电连接的技术。
此外,基板可以是印刷基板等有机基板,也可以是硅基板或化合物半导体基板等半导体基板或电介体基板。另外,芯片也可以是半导体芯片或电介体芯片。下面,以通过焊料凸起将半导体基板彼此接合的情况为例进行说明。
在本实施方式的接合构造体制造技术中,在多个半导体基板上形成包含焊料凸起等的电极构造后,在半导体基板上涂布有机剂,通过该有机剂将基板间暂时固定。而且,在腔室内,使该有机剂在焊料熔融前或焊料熔融中蒸发,来进行焊接接合。
特别是,在本实施方式中,虽然采用将羧酸导入腔室内将焊料的氧化膜还原的无助熔剂地焊接接合所形成的免清洗法,但在向腔室内投入基板之前,将不是助熔剂的有机剂、即非还原性的有机剂即暂时固定剂涂布于基板上以将基板间暂时固定。这样,不通过助熔剂而通过用于赋予基板间保持力(堆叠力)的专用的暂时固定剂防止基板的错位,并且可以在借助羧酸进行的氧化膜的还原处理之前或在进行还原处理的同时,使暂时固定剂蒸发,之后将基板彼此接合。
通过以上的构成,本发明尽管可省略清洗处理,但仍减轻了多个被接合部件间的错位。
图1是表示本实施方式的接合构造体制造系统的概略构成的图。
接合构造体制造系统1是将基板彼此等接合的基板焊合系统。制造系统1大体具有暂时固定装置20和焊料熔融装置30。
暂时固定装置20具有分配器21和对准机构22。分配器21是在形成有焊料凸起等焊料的基板面上涂布非还原性的有机剂即暂时固定剂的涂布装置。有机剂的涂布也可以在基板表面的一面上以面状涂布,也可以离散地点状涂布,但本实施方式中以面状进行涂布。对准机构22是以夹入涂布的暂时固定剂的方式使多个基板对向,进行基板间的电极构造彼此的对位,从而将基板彼此暂时固定的定位装置。这样的暂时固定装置20除涂布的有机剂不是助熔剂外,是与被称作是倒装芯片结合器(フリツプチツブボンダ一)的装置共通的,所以省略详细的说明。
另一方面,焊料熔融装置30具有腔室31、羧酸的供给部32、腔室31内的加热器33。向腔室31搬入通过暂时固定装置20暂时固定的状态的基板。供给部32在规定的定时向腔室31供给羧酸蒸汽。但是,根据情况也可以不在腔室31内而在开放环境下进行处理。
供给部32具有羧酸蒸汽的供给系统34和以规定的定时进行开闭的阀35。供给系统34是将氢气、一氧化碳那样的还原性气体、或氮气那样的非氧化性气体等载气与羧酸蒸汽混合并导入腔室31内的系统。供给系统34例如具有容纳羧酸液体的密闭容器36和经由阀37供给载气的载气供给管38。载气供给管38使密闭容器36内产生气泡(冒泡)。但是,供给部32只要可以将羧酸向腔室31内供给即可,也可以设为与本实施方式不同的构成。
对加热器33进行说明。加热器33是设于腔室31内的加热装置。加热器33为了在焊料熔融之前或焊料熔融中使暂时固定剂蒸发,并且在含有羧酸蒸汽的气氛中进行加热处理,以无助熔剂地进行焊接接合而加热作为被接合部件的基板。特别是,加热器33在羧酸进行的焊料氧化膜的还原处理之前、或在进行还原处理的同时,使暂时固定剂蒸发。此外,为防止基板的错位,可以在焊料熔融前不使所有的暂时固定剂蒸发,但在暂时固定剂残留过多时,则不能使焊料表面暴露于羧酸蒸汽,难以进行氧化膜的还原处理。因此,从还原处理的观点考虑,优选在焊料熔融前使暂时固定剂蒸发。
此外,焊料熔融装置30具有用于进行排气的排气泵39、设于或安装于排气泵39的吸气或排气侧且回收汽化的羧酸的羧酸回收部(回收机构)40。羧酸回收部40可以是安装于排气泵39的吸气侧或排气侧的过滤器,也可以是安装于排气侧的洗涤器。另外,焊料熔融装置30经由阀42连接有将内部置换(净化)为氮气气氛的氮气供给管41。
如上构成的焊料熔融装置30将经由暂时固定剂暂时固定的基板搬入腔室。另外,以在焊料熔融之前,特别是羧酸进行的焊料氧化膜的还原处理之前,或在还原处理的同时,使暂时固定剂蒸发的方式,根据暂时固定剂的种类,利用供给部32进行羧酸蒸汽的供给,利用加热器33进行加热。除这些点之外,微细的构成与通常的焊料熔融装置的构成相同,所以省略详细的说明。
此外,为进行暂时固定装置20和焊料熔融装置30之间的基板的交接,也可以设有搬运机器人等。
其次,对利用本实施方式的接合构造体制造系统的接合构造体制造方法、即焊合方法进行说明。
首先,如图2所示,准备在表面形成有焊料凸起的基板50a、50b(以下统称为基板50)。在此,基板50为半导体基板。基板50具有半导体的基板主体51和该基板主体51上的电极构造。具体而言,在半导体的基板主体51上具有铜柱52、铜柱52上的阻挡层53、形成于阻挡层53上的焊料凸起54。铜柱52是可以由铜(Cu)或铜合金形成的第一突起部。阻挡层53是用于防止焊料成分在焊料凸起54熔融时向铜柱52侧扩散的底部阻挡金属。例如,阻挡层53是从基板主体51侧按顺序层叠了镍(Ni)、钯(Pd)、及金(Au)的Ni/Pd/Au层叠层。此外,在图2的情况下,作为电极部设有铜柱52(第一突起部),但电极部不限于突起的方式,另外,材质也不限于铜或铜合金。
焊料凸起54由不含铅(Pb)的Sn-Ag(锡-银)焊料等无铅焊料、Pb-Sn焊料等含铅焊料、或其它焊料形成。此外,焊料凸起54的形成自身与现有的电镀进行的焊料凸起54的形成技术相同,因此,省略详细的说明。此外,与本实施方式不同,代替焊料凸起54也可以使用共晶接合用的嵌入金属。在此,共晶接合是指在处理温度下使2种以上的物质相互扩散而产生物质移动,来进行合金化反应,完成接合。是在接合面间使嵌入金属等暂时熔融、熔化后,利用扩散使其等温凝固而进行接合的液相扩散接合的一种,是相对于液化利用共晶反应的接合方法。
也可以将所准备的一对半导体基板50双方均设为图2所示的构成,但不限于此。例如,对于一个基板50a可以做成具有第一电极部(例如铜柱)52、阻挡层53、及焊料凸起54的基板,对于另一基板50b可以做成如图3、图4所示省略了焊料凸起54的基板(图3)。而且,可以在另一基板50b上省略焊料凸起54和阻挡层53(图4)。特别地,在对于另一基板50b省略焊料凸起54和阻挡层53双方并直接焊接接合于第二电极部(铜柱52)的情况下,减轻基板制造负担。在本实施方式中,通过羧酸可以充分地进行还原处理,因此,即使省略一基板50b中的阻挡层或焊料凸起,也能够直接焊接接合于第二电极部。
此外,本实施方式的接合构造体制造技术优选用于在相邻的焊料凸起间的间距为150μm以下设置有多个直径为100μm以下的焊料凸起的基板50。但是,基板50不限于该情况下。
其次,如图5所示,在基板50上涂布暂时固定剂55。暂时固定剂55被涂布于多个基板50a、50b彼此对向的面(以下称作“接合面”)上。接合面与形成有焊料凸起54等电极构造的侧的面相对应。暂时固定剂也可以涂布于多个基板50a、50b双方的接合面,但也可以仅涂布于一基板50a的接合面。即使仅涂布于一基板50a的接合面,通过与另一基板50b接触,也能够在一对基板50a、50b之间置入暂时固定剂,可以赋予基板50a、50b间保持力(堆叠力)。
在本实施方式中,暂时固定剂55被以面状涂布于被接合部件即基板50上。这样,通过以面状均一地涂布,保持力(堆叠力)提高。在本实施方式中,暂时固定剂55是不为助熔剂的有机剂,即非还原性的有机剂。即,在本实施方式中,尽管通过无助熔剂地进行焊接接合,但代替助熔剂将用于赋予基板间保持力(堆叠力)的暂时固定剂55涂布于基板50的接合面上。优选非还原性的有机剂是为了即使万一残留有机剂的残渣的情况下也能够防止可能产生被称作迁移的绝缘不良。即,作为暂时固定剂55,优选不含对基板带来不利影响的氯等成分的材料。
暂时固定剂55可以含有有机剂和粘度调节剂(稀释液)。这是为了调整粘度。暂时固定剂55的粘度优选在100~100000(30℃mPa·S)的范围,更优选在1600~66000(30℃mPa·S)的范围。这是因为,当粘度过高时,涂布变得困难,另一方面,当粘度过低时,基板间的保持力(堆叠力)降低,不能充分得到暂时固定效果。
另外,作为暂时固定剂55,如后述,选择在腔室31内对基板50进行加热时会在焊料凸起54熔融之前(达到焊料的熔点之前)蒸发的材料。特别是,对于暂时固定剂55选择在借助羧酸蒸汽进行的焊料的氧化膜的还原处理之前、或与该还原处理并行而蒸发的材料。具体而言,暂时固定剂55的沸点基于焊料的氧化膜的还原处理之前及还原处理时的腔室31内的压力和还原处理之际的基板温度设定。就腔室31内的压力而言,在本实施方式中,腔室31内优选在还原处理之前或还原处理时设定为压力1×102~1×105Pa之间的任一压力。优选这样的范围是因为,当压力比1×102Pa低时,例如有时因暂时固定剂55的暴沸而使基板发生错位,当为1×105Pa以上时,成为大气压以上。另外,就基板温度的范围而言,作为还原处理之际的基板温度范围,优选为100℃~350℃。优选这种温度范围是因为,用于还原处理的羧酸即甲酸等在350℃左右时开始分解,因此优选设为350℃以下,但根据焊料的种类,有时通过羧酸蒸汽以100℃左右进行还原处理。考虑如上的压力范围和基板温度范围,作为暂时固定剂55,优选在压力1×102~1×105Pa之间的任一压力下具有100℃~350℃的沸点。此外,通常,根据焊料的材料的种类,可以区分使用在还原处理之前或还原处理时(通常在焊料的熔融之前或焊料的熔融中)蒸发的有机剂的种类。具体而言,Pb-5Sb焊料的熔点为314℃,且将330℃~350℃左右作为焊接接合温度而使用。另外,Sn-3.5Ag焊料的熔点为221℃,且将230℃~250℃左右作为焊接接合温度而使用。另外,相比Sn-3.5Ag焊料,也存在低熔点的焊料。因此,也可以根据这些焊料的材料的种类选择暂时固定剂55。
具体而言,根据实验的结果,暂时固定剂55优选具有选自异冰片基环己醇、松油醇(タ一ピネオ一ル)、及丙二醇苯基醚中的至少一种非还原性的有机剂。异冰片基环己醇(MTPH)在粘度为65500(30℃mPa·S)时,沸点为308℃(5%)313℃(15%)。松油醇(一般名为松油(パインオイル),其成分含有作为主要成分的α-萜品醇(テルピネオ一ル)、异性体β-、γ-萜品醇等萜品醇类97%以上)的粘度比异冰片基环己醇(MTPH)低,沸点为213~223℃。另外,丙二醇苯基醚的粘度为22.7(25℃mPa·S),沸点为243℃(760mmHg)。特别是在Sn-Ag的情况下,优选异冰片基环己醇(MTPH)。
另外,作为粘度调节剂,可以从比上述异冰片基环己醇、松油醇、及丙二醇苯基醚的粘度低的物质中适宜选择。例如,作为粘度调节剂可以使用2,4-二乙基-1,5-戊二醇(C9H20O2)。在有机物的原液中添加粘度调节剂的比例可以适宜选择,但可以设为0~90重量%。
此外,也可以使用含有沸点彼此不同的多种非还原性的有机剂的暂时固定剂55。该情况下,由于至少一部分的暂时固定剂成分比其它暂时固定剂成分较早地蒸发,从而在该蒸发的暂时固定剂成分存在的部分中,焊料凸起的表面在早期露出,开始还原处理,从而早期进行焊接接合。另一方面,由于暂时固定剂不能一次完全蒸发,所以可以在较宽的温度范围维持暂时固定效果,由此,错位的防止效果提高。例如,一部分暂时固定剂成分在焊料熔融前蒸发,其他暂时固定剂成分在焊料熔融中蒸发,可以将混合了这些成分的材料作为暂时固定剂55使用。
其次,在涂布了暂时固定剂55后,通过对准机构22以夹入暂时固定剂55的方式使多个基板50a、50b对向,进行基板50a、50b彼此的对位,使基板50a、50b彼此对接。其结果是,通过暂时固定剂55给予基板50a、50b间保持力(堆叠力),将基板50a、50b彼此暂时固定。
其次,如图6所示,将该暂时固定状态的基板50a、50b搬入腔室31内。在腔室31内,基板50a、50b经由例如托盘(未图示)配置于加热器33上。此外,在图6中表示一对基板50a、50b,但也可以一次将多对基板、多对芯片、多组基板和芯片等作为被接合部件搬入。
其次,以图7所示的温度条件及真空度条件进行工艺处理。首先,如图7所示,通过泵39将腔室31内真空排气到例如10~50Pa左右。此外,真空排气的程度不限于10~50Pa左右,可以适宜调整。而且,接着真空排气处理、或与真空排气处理并行,通过加热器33对基板50a、50b加热,使基板温度升温。
其次,向腔室31内导入羧酸蒸汽。通过羧酸蒸汽的供给,腔室31内变成100~10000Pa左右。羧酸蒸汽优选至少在基板50a、50b的温度达到焊料的熔点之前进行导入。例如在焊料为Sn-3.5Ag(熔点221℃)的情况下,加热至适合焊合的230℃~250℃左右,但在大致200℃以上时,羧酸产生的还原效果变强,开始还原处理。在Pb-5Sn(熔点314℃)的情况下,加热至适合焊合的330℃~350℃左右,但在250℃以上时羧酸产生的还原效果变强,开始还原处理。
而且,在本实施方式中,在借助羧酸蒸汽进行的焊料的氧化膜的还原处理之前或与该还原处理并行地使暂时固定剂55蒸发。即,在焊料为Sn-3.5Ag的情况下,在200℃前后,例如180℃~250℃前后进行还原处理,以230℃~250℃左右进行焊接接合,但在该还原处理之前或与该还原处理并行地使暂时固定剂55蒸发。同样,在焊料为Pb-5Sn的情况下,在250℃前后,例如220℃~350℃前后进行还原处理,以330℃~350℃左右进行焊接接合,但在该还原处理之前或与该还原处理并行地使暂时固定剂55蒸发。在使用其它材料的焊料的情况下,也可以在借助羧酸蒸汽进行的焊料的氧化膜的还原处理之前或与该还原处理并行地使暂时固定剂55蒸发。此外,如图7所示,真空排气到10~50Pa左右容易使暂时固定剂55蒸发。即,以使暂时固定剂55容易蒸发的方式暂时提高腔室31内的真空度是有用的。
如图8所示,随着暂时固定剂55逐渐蒸发,焊料凸起54逐渐暴露于羧酸蒸汽。其结果是将焊料凸起54的表面的氧化膜还原。
此时,作为暂时固定剂55,也可以使用含有沸点彼此不同的多种非还原性的有机剂的物质。该情况下,至少一部分暂时固定剂成分比其它暂时固定剂成分早蒸发。在该早蒸发的暂时固定剂成分存在的部分,早期开始还原处理,另一方面,因沸点的不同,所有的暂时固定剂的成分不能一次蒸发,因此,能够在较宽的温度范围维持暂时固定效果。
而且,如图9所示,通过无助熔剂地进行焊接接合。可以在焊料凸起54熔融前,使暂时固定剂55蒸发一部分或全部,也可以在焊料凸起54熔融中,使暂时固定剂55蒸发。从防止错位的角度出发,优选在焊料凸起54的熔融中使暂时固定剂55开始蒸发,但从以使焊料凸起54的表面早期接触羧酸蒸汽的方式露出并充分地进行还原处理的角度出发,优选在焊料凸起54熔融前,预先使暂时固定剂的一部分或全部蒸发。具体而言,暂时固定剂55的至少一部分蒸发以使焊料凸起54露出,在该露出部分将氧化膜还原而除去。此外,即使在焊料凸起54熔融前,暂时固定剂55完全蒸发,也能够无错位地进行焊接接合。而且,在基板50a、50b的温度为焊接接合温度(例如焊料为Sn-3.5Ag的情况下为230℃~250℃左右)时,在该部分焊料熔融并进行焊合(焊接接合)。暂时固定剂55完全蒸发使焊料凸起54完全露出而进行还原处理并通过使焊料充分熔融由此焊接接合完全结束时,焊合处理(回流)结束。如果通过暂时固定剂55可以防止大的错位,则之后通过焊料的表面张力的作用进行自调整(自己校准),来修正错位。在焊料54熔融中使暂时固定剂55蒸发的情况下,维持暂时固定效果,直至通过焊料54的熔融产生焊合效果。另外,即使在焊料54熔融前使暂时固定剂55蒸发的情况下,由于从暂时固定剂55完全蒸发而没有暂时固定效果到焊合处理结束的期间的时间缩短,所以能够防止或减轻基板50a、50b的错位。
焊合处理(回流)后,开始基板温度的降温,同时通过排气泵39将羧酸蒸汽排气。羧酸回收部(回收机构)40回收汽化的羧酸。然后,利用从氮气供给管41导入的氮气等气体将腔室31内部置换(净化)后,取出完成焊接接合的接合构造体,即焊接接合完的基板50。
其次,如图10所示,在焊接接合阶段后,针对取出的焊接接合完的基板50,在多个基板50a和基板50b之间充填底部填充树脂56。这是为了提高焊接接合完的基板50的贴合强度并且对其进行保护。此时,基板50a和50b之间的有机剂(暂时固定剂)已蒸发且除去。因此,与使用了助熔剂的通常的焊接接合的情况不同,在基板50a和50b之间实质上不存在有机剂,即使清洗也不会残留残渣。其结果是,在基板间充填底部填充树脂的工序中,能够防止底部填充树脂因残渣而不能充分充填所产生的被称作是空穴的空隙的事态。另外,在基板间不残留有机剂(暂时固定剂)即使暂时残留微量的暂时固定剂,由于暂时固定剂不是松香系的还原性有机剂而是非还原性有机剂,所以也能够防止被称作迁移的绝缘不良的产生。
如后述的实施例,通过本实施方式的技术,即使在形成有具有数十μm左右的直径及间隔的焊料凸起的基板的接合中,也能够以2μm以下的错位进行无助熔剂地焊接接合。
如上,对本发明第一实施方式的接合构造体制造技术进行了说明,但本发明不限于该情况,可以适宜变更。
例如,温度条件及真空度条件不限于图7所示的条件。例如,为了缩短工艺时间,如图7所示,期望从基板投入到回流为止使基板温度单纯增加,但不限于此。例如也可以通过在基板温度达到焊接接合温度之前,将基板温度保持在比焊接接合温度低50~80℃左右的温度一定时间的期间来进行还原处理。另外,也可以在将加热器33的温度保持在一定的状态下通过在该加热器33上搬入搬出基板50a、50b来控制基板的温度。
根据本实施方式,得到如下效果。
(1)有机剂55由于在焊料54熔融之前或焊料54熔融中蒸发,所以在进行焊接接合后不需要用于除去有机剂55的清洗。因此,由于不残留有机剂55的残渣,所以特别是在将基板50a的电极构造和基板50b的电极构造焊接接合时,不会产生迁移或其它污染。另外,在将底部填充树脂充填于间隙的工序中,能够防止因有机物的残渣不能充分充填底部填充树脂而产生空穴的情况。
(2)由于不残留有机剂55的残渣,所以特别地,也可以用于具有焊料凸起54的直径及相邻焊料凸起间的间隔为数十μm以下、特别是数μm以下的微细构造的基板的焊接接合。
(3)特别是,作为有机剂,使用非还原性的有机剂即暂时固定剂55以无助熔剂地进行焊接接合。因此,可以在无助熔剂的焊接接合的同时,通过暂时固定剂55对基板赋予保持力(堆叠力),从而可以防止错位。另外,即使万一残存微量的暂时固定剂,也与助熔剂的情况不同,不会产生迁移或其它污染。
(4)特别是,由于在借助羧酸蒸汽进行的焊料54的氧化膜的还原处理之前或与该还原处理并行地使暂时固定剂蒸发,所以随着暂时固定剂55逐渐蒸发,焊料凸起54逐渐暴露于羧酸蒸汽。因此,暂时固定剂55防止基板50a、50b的错位,且不会阻碍借助羧酸蒸汽进行的还原处理。此外,即使在焊料凸起54熔融前暂时固定剂55完全蒸发,也能够无错位地进行焊接接合。即,能够防止基板搬入时的错位,通过焊料凸起54熔融引起的焊料表面张力的作用进行自调整(自己校准),来修正错位。
(5)通过以暂时固定剂55容易蒸发的方式使腔室31内的真空度暂时提高,由此被具有微细构造(52、53、54)的基板50a、50b夹持的暂时固定剂55更容易蒸发。
(6)暂时固定剂55在压力1×102~1×105Pa之间的任一压力下具有100℃~350℃的沸点,因此,直至还原处理的时刻或即将还原处理之前残存暂时固定剂55以给予保持力,但不会阻碍还原处理。
(7)暂时固定剂55是选自异冰片基环己醇、松油醇、及丙二醇苯基醚中的至少一种非还原性的有机剂,因此,在还原处理的时刻或即将还原处理之前,残存暂时固定剂并赋予保持力,但不会阻碍还原处理。另外,不含成为迁移或其它污染的原因的物质。另外,粘度适当,可以给予足够的保持力(堆叠力)。
(8)在暂时固定剂55含有沸点彼此不同的多种非还原性的有机剂的情况下,至少一部分暂时固定剂成分比其它暂时固定剂成分早蒸发,由此,在该蒸发的暂时固定剂成分存在的部分,能够早期开始还原处理。另一方面,由于暂时固定剂不能一次完全蒸发,所以能够在较宽的温度范围维持暂时固定效果,由此,错位的防止效果提高。
(9)暂时固定剂55通过粘度调节剂进行稀释以形成粘度1×102~1×105mPa·s,所以能够防止粘度过高而不能涂布,并且能够防止粘度过低而基板的保持力过小。
(10)特别是直径为100μm以下的焊料凸起54对于相邻凸起间的间距以150μm以下配置的基板的接合是有用的。
(11)在本实施方式中,虽然是使用焊料凸起54的类型,但通过羧酸蒸汽能够充分还原氧化膜,因此,对于一对基板50a、50b中的一片,能够省略阻挡层53及焊料凸起54,仅形成铜柱(由铜形成的第二突起部)52,而直接进行焊接接合。由此,能够减轻基板50b的制造负担。
(12)在本实施方式中,由于暂时固定剂55被面状地涂布于基板50上,所以暂时固定剂55的量增多,保持力(堆叠力)提高。
<第二实施方式>
其次,说明本发明的第二实施方式。在上述的第一实施方式中,对将暂时固定剂面状地涂布于基板上的情况进行了说明。但是,在第二实施方式中,在多个部位点状地涂布暂时固定剂。除该点外,本实施方式的接合构造体制造技术与第一实施方式的情况相同,因此对于与第一实施方式的部件相同的部件在本实施方式中也使用相同的部件编号,并且省略详细的说明。
在本实施方式中,在图1所示的暂时固定装置20中,分配器21在形成有焊料凸起等焊料的基板面上离散且点状地涂布作为非还原性的有机剂的暂时固定剂。
图11表示离散且点状涂布了暂时固定剂55的情况的一例。图11(a)是基板50a的上视图,图11(b)表示暂时固定了基板50a、50b的状态。
在图11所示的情况下,在矩形状的基板(芯片)的4角分别点状地涂布暂时固定剂55。在涂布助熔剂的情况下,在以借助助熔剂进行的焊料表面的氧化膜的还原除去为主要目的的关系上,不得不将助熔剂涂布成与焊料表面相接触。但是,在本实施方式中,由于焊料54表面的氧化膜的还原通过羧酸蒸汽进行,所以暂时固定剂55只要仅在基板间给予保持力(堆叠力)即可。因此,不需要将暂时固定剂55涂布成与焊料54表面相接触。因此,如图11所示,也可以以不与焊料54表面相接触的方式涂布暂时固定剂55。
此外,暂时固定剂55的种类、温度条件、真空度条件、羧酸气体、焊料凸起直径及间距尺寸等与第一实施方式的情况相同。
即使在这种离散且点状地涂布暂时固定剂55的情况下,也能够抑制基板50a、50b的错位并通过无助熔剂地进行焊接接合。而且,由于离散且点状地涂布暂时固定剂55,所以容易使暂时固定剂55蒸发。特别是由于能够以不与焊料表面相接触的方式涂布暂时固定剂55,所以暂时固定剂55不会进入相邻的焊料凸起54间的间隙,容易蒸发除去。
而且,只要能够通过暂时固定的作用防止焊料凸起54的位置从电极构造(铜柱、阻挡层、对方基板的焊料凸起等)的位置脱离,则即使产生小的错位,也能够通过利用焊料凸起54熔融产生的焊料表面张力的作用进行自调整(自己校准),从而修正错位。特别是在暂时固定剂54的量少的本实施方式中,自调整的效果变高。
此外,在上述的说明中,对点(spot)状涂布暂时固定剂55的情况进行了说明,但本实施方式不限于该情况,也可以线(line)状涂布暂时固定剂55。另外,也可以不在多处离散地涂布而以1点的点状或1条线状地涂布暂时固定剂55。
根据本实施方式,在上述第一实施方式的(1)~(12)的效果的基础上,还得到如下效果。
(13)能够将足够的保持力(堆叠力)给予基板,并且离散且点状地涂布暂时固定剂,因此,容易使暂时固定剂蒸发。
(14)特别是在以不与焊料表面相接触的方式涂布暂时固定剂的情况下,暂时固定剂不会进入焊料凸起彼此的间隙,容易蒸发除去。
<第三实施方式>
在上述的第一、第二实施方式中,说明了作为暂时固定剂55,将不是助熔剂的有机剂,即作为非还原性的有机剂的暂时固定剂涂布于基板而将基板间暂时固定的情况。
的确,在所谓即使是微量的暂时固定剂55不能蒸发而残存的情况也不产生迁移或其它污染的意味上,作为暂时固定剂55也不使用助熔剂而优选使用非还原性的有机剂,但本发明不限于该情况。
即,根据本发明,在经由有机剂将多个被接合部件间暂时固定后,会在焊料熔融之前使有机剂蒸发,所以假定使用助熔剂作为有机剂,也不需要在焊接接合后通过溶液清洗或离子蚀刻等清洗处理除去助熔剂的工序。因此,例如即使在焊料凸起54的直径或相邻的焊料凸起间的间距为数十μm水平以下的情况下,也不需要注意所谓助熔剂难以除去的问题。因此,根据本发明,就算使用了助熔剂,但由于在焊接接合后不会产生助熔剂残渣,所以也能够防止被称作迁移的绝缘不良的产生。另外,最终在基板间充填底部填充树脂56的工序中,也能够防止因助熔剂残渣而不能充分充填底部填充树脂56而产生被称作空穴的空隙的情况。
如上,根据本发明,只要是以被夹持于多个基板50a、50b之间的方式涂布有机剂,经由该有机剂将多个基板间暂时固定,并加热暂时固定的多个被接合部件,在焊料熔融之前或焊料熔融中使有机剂蒸发,在腔室31内使焊料熔融并经由该焊料将多个基板间焊接接合,就可以广泛应用。
<第四实施方式>
其次,说明本发明的第四实施方式。
在上述第一~第三实施方式中,说明了基板接合技术,但本发明也可以应用于焊料成形的技术。即,本实施方式涉及在焊料材料54b所附着的部件即基板50a上形成焊料凸起的加热熔融处理方法。
在基板50a(部件)上附着焊料材料54b,同时在基板50a的表面涂布有机剂即暂时固定剂55,经由暂时固定剂(有机剂)55将焊料材料54b的位置暂时固定。而且,在焊料材料54b熔融之前或焊料材料54b熔融中使暂时固定剂55蒸发。而且,将焊料材料54b熔融而成形焊料凸起54。该情况下,也能够防止焊料材料54b的错位。
为进行这样的处理,提供加热熔融处理系统。该系统与图1的系统相同。即,将焊料材料54b所附着的部件加热并对焊料材料54b进行加热熔融处理而成形焊料的加热熔融处理系统。而且,具有:在部件上附着焊料材料54b并且为将焊料材料54b暂时固定而在部件的表面涂布有机剂的暂时固定装置20、加热经由暂时固定剂将焊料材料暂时固定的部件的加热装置(焊料熔融装置30),以及对于上述部件供给羧酸蒸汽的供给装置,其中加热装置为了在上述焊料材料熔融之前或上述焊料材料熔融中使上述暂时固定剂蒸发,另一方面,在含有上述羧酸蒸汽的气氛中无助熔剂地成形焊料,而对上述部件进行加热。
此外,除以上的点外,与第一~第三实施方式的情况相同,所以省略详细的说明。
<实施例>
<第一实施例>
准备在硅基板(5mm方材、25mm方材)上形成有铜制的铜柱52、铜柱52上的阻挡层(Ni/Pd/Au)53、形成于阻挡层53上的Sn-Ag焊料凸起54的基板50a、50b。上述基板50a、50b准备一对。此外,采用了焊料凸起54的直径为100微米,相邻的焊料凸起间的间距(中心间的距离)为250微米的设定。
通过粘度调节剂(2,4-二乙基-1,5-戊二醇)稀释异冰片基环己醇,来制造暂时固定剂。此时,在粘度调节剂的比例为0重量%、30重量%、50重量%、70重量%、90重量%的情况下,分别进行实施。对于一对上述基板50a、50b面状地涂布暂时固定剂55。然后,在图7所示的工艺条件下在甲酸气氛中进行还原处理,通过无助熔剂地进行焊接接合。
其结果是,基板50a、50b不会发生错位,能够良好地进行焊接接合。
另一方面,作为比较例,在氮气气氛中进行处理的情况下,虽然不会发生错位,但不能良好地成形焊料的接合部分。
<第二实施例>
采用了焊料凸起54的直径为20微米,相邻的焊料凸起间的间距(中心间的距离)为40微米的设定。其它条件与上述第一实施例相同。该情况下,基板50a、50b的错位为2μm以下,良好地完成焊接接合。
<第三实施例>
在与上述第一实施例相同的基板中,使用通过粘度调节剂(2,4-二乙基-1,5-戊二醇)稀释松油醇所制成的暂时固定剂进行暂时固定。在粘度调节剂的比例为0重量%、30重量%、50重量%、70重量%、90重量%的情况下分别进行实施。该情况下,与第一实施例相同,错位少,良好地完成焊接接合。但是,收获率相比第一实施例的情况稍低。
<第四实施例>
在与上述第二实施例相同的基板中,使用通过粘度调节剂(2,4-二乙基-1,5-戊二醇)稀释松油醇所制成的暂时固定剂进行暂时固定。该情况下,与第二实施例相同,错位少,良好地完成焊接接合。但是,收获率相比第二实施例的情况差。
<第五实施例>
在与上述第一实施例相同的基板中,使用通过粘度调节剂(2,4-二乙基-1,5-戊二醇)稀释丙二醇苯基醚所制成的暂时固定剂进行暂时固定。在粘度调节剂的比例为0重量%、30重量%、50重量%、70重量%、90重量%的情况下分别进行实施。该情况下,错位也少,良好地完成焊接接合。但是,收获率相比第一实施例及第三实施例的情况变差。
<第六实施例>
在与上述第二实施方式相同的基板中,使用通过粘度调节剂(2,4-二乙基-1,5-戊二醇)稀释丙二醇苯基醚所制成的暂时固定剂进行暂时固定。该情况下,也与第二实施例相同,错位少,良好地完成焊接接合。但是,收获率相比第二实施例及第四实施例的情况变差。
<第七实施例>
在与上述第一实施例相同的基板中,将相同的暂时固定剂在4处(4点)以点状离散地涂布。此时,可以通过暂时固定剂的暂时固定作用减轻错位,以进行焊接接合。此外,在本实施例中,对于在焊接接合前的时刻,基板50a、50b间产生20μm左右的小的错位的样品也尝试进行实验,如果通过暂时固定作用能够防止大的错位的话,则通过焊料凸起54熔融带来的焊料的表面张力的作用进行自调整(自己校准),以消除错位。因此,实用上可知,通过离散地涂布暂时固定剂,尽管在将多个基板彼此焊接接合以制造焊合基板时可省略清洗处理,但仍能够减轻多个基板间的错位。
<第八实施例>
在与上述第二实施方式相同的基板中,将相同的暂时固定剂在4处点状且离散地涂布。该情况下,也能够减轻多个基板间的错位。
<第九实施例>
在与第一实施例相同的基板中,将通过粘度调节剂(2,4-二乙基-1,5-戊二醇)将松油醇稀释为0%~90重量%所制成的暂时固定剂在4处点状且离散地涂布。另外,在与第二实施例相同的基板中,也同样地将暂时固定剂在4处点状且离散地涂布。在这些中,也能够减轻多个基板间的错位,为可以实用的水平。
<第十实施例>
在与第一实施例相同的基板中,将通过粘度调节剂(2,4-二乙基-1,5-戊二醇)将丙二醇苯基醚稀释为0~90重量%所制成的暂时固定剂在4处点状且离散地涂布。另外,在与第二实施例相同的基板中,也同样地将暂时固定剂在4处点状且离散地涂布。在这些中,也能够减轻多个基板间的错位,为可以实用的水平。
以上说明了本发明的最佳的实施方式,但本发明不限于这些情况,在不脱离权利要求范围的范围内可以进行追加、删除、变更等。在上述的说明中,作为接合构造体以一对半导体基板为例进行了说明,但当然在作为本发明对象的接合构造体中包含各种焊接接合完的基板、焊接接合完的芯片(倒装芯片结合完的芯片等)、接合了基板和芯片的部件等。另外,在上述的说明中,主要说明了使用焊料凸起作为焊料的情况,但本发明不限于该情况。
本申请基于2010年6月28日申请的日本专利申请第2010-146337号、2010年7月23日申请的日本专利申请第2010-166448号,其公开内容被参照且以其整体引入。
符号说明
1接合构造体制造系统
20暂时固定装置
21分配器
22对准机构
30焊料熔融装置
31腔室
32羧酸的供给部
33加热器
34供给系统
35阀
36密闭容器
37阀
38载气供给管
39排气泵
40羧酸回收部
41氮气供给管
42阀
50(50a、50b)半导体基板
51半导体基板主体
52铜柱(第一突起部)
53阻挡层(バリア層)
54焊料凸起
55暂时固定剂
56底部填充树脂
Claims (23)
1.一种接合构造体制造方法,其通过加热熔融材料将多个被接合部件之间接合以制造接合构造体,其特征在于,所述接合构造体制造方法包括:
准备在所述多个被接合部件的至少一方形成有加热熔融材料的被接合部件的步骤;
在所述多个被接合部件彼此对向的面上涂布含有沸点彼此不同的多种非还原性的有机剂的预固定剂,并通过该预固定剂将多个被接合部件之间预固定的预固定步骤;
通过在腔室内在含有羧酸蒸汽的气氛中进行加热处理,以无助熔剂的方式使所述加热熔融材料熔融并通过该加热熔融材料将多个被接合部件之间接合的接合步骤;以及
在所述接合步骤之前或在所述接合步骤之后或贯穿所述接合步骤进行的通过加热使所述预固定剂蒸发的蒸发步骤,
其中所述多种非还原性的有机剂含有:具有使得在所述加热熔融材料熔融之前蒸发的沸点的有机剂,以及具有使得在所述加热熔融材料熔融中蒸发的沸点的有机剂,
在所述蒸发步骤中,暂时提高所述腔室内的真空度,以使所述预固定剂容易蒸发。
2.如权利要求1所述的接合构造体制造方法,其通过加热熔融材料将多个被接合部件之间接合以制造接合构造体,所述接合构造体制造方法包括:
准备在所述多个被接合部件的至少一方形成有加热熔融材料的被接合部件的步骤;
在所述多个被接合部件彼此对向的面上涂布预固定剂,并通过该预固定剂将多个被接合部件之间预固定的预固定步骤;
加热被预固定的多个被接合部件,使所述预固定剂在所述加热熔融材料熔融之前或所述加热熔融材料熔融中蒸发的蒸发步骤;以及
将所述加热熔融材料熔融,以通过该加热熔融材料将多个被接合部件之间接合的接合步骤。
3.如权利要求2所述的接合构造体制造方法,其中,
所述加热熔融材料为焊料材料或共晶接合材料,所述接合步骤是将多个被接合部件之间焊接接合或共晶接合。
4.如权利要求2或3所述的接合构造体制造方法,其中,
所述接合步骤,是将设置于所述多个被接合部件中的一方的被接合部件的电极构造和设置于另一方的被接合部件的电极构造进行电连接。
5.如权利要求2所述的接合构造体制造方法,其中,
在使所述预固定剂完全蒸发后,在所述接合步骤中熔融所述加热熔融材料。
6.如权利要求5所述的接合构造体制造方法,其中,
所述预固定步骤是将非还原性有机剂的预固定剂作为所述预固定剂进行涂布的步骤,
所述接合步骤是在含羧酸蒸汽的气氛中进行加热处理且以无助熔剂的方式进行焊接接合或共晶接合的步骤。
7.如权利要求6所述的接合构造体制造方法,其中,
具有向腔室中供给所述羧酸蒸汽的供给步骤。
8.如权利要求5所述的接合构造体制造方法,其中,
在所述接合步骤之前供给所述羧酸蒸汽,
所述蒸发步骤,是在借助所述羧酸蒸汽进行的所述加热熔融材料的氧化膜的还原处理之前或与该还原处理并行地使所述预固定剂蒸发。
9.如权利要求6所述的接合构造体制造方法,其中,
所述蒸发步骤,是在所述加热熔融材料熔融之前使所述预固定剂蒸发。
10.如权利要求5所述的接合构造体制造方法,其中,
在所述接合步骤之后,在无需进行清洗除去所述预固定剂的作业的情况下在所述多个被接合部件之间充填底部填充树脂。
11.如权利要求6所述的接合构造体制造方法,其中,
所述预固定剂在压力1×102~1×105Pa之间的任一压力下具有100℃~350℃的沸点。
12.如权利要求6所述的接合构造体制造方法,其中,
所述预固定剂是选自异冰片基环己醇、松油醇,及丙二醇苯基醚中的至少一种非还原性的有机剂。
13.如权利要求6所述的接合构造体制造方法,其中,
所述预固定剂通过粘度调节剂被稀释为粘度1×102~1×105mPa·s。
14.如权利要求6所述的接合构造体制造方法,其中,
形成于所述多个被接合部件的至少一方的焊料为直径在100μm以下的焊料凸起,相邻的焊料凸起间的间距为150μm以下。
15.如权利要求6所述的接合构造体制造方法,其中,
所述预固定步骤,是在所述被接合部件上点状或线状地涂布所述预固定剂。
16.如权利要求15所述的接合构造体制造方法,其中,
所述预固定步骤,是在所述被接合部件上多处离散地涂布所述预固定剂。
17.如权利要求15所述的接合构造体制造方法,其中,
所述预固定剂是与作为所述加热熔融材料的焊料的表面相隔地被涂布于所述被接合部件上。
18.如权利要求6所述的接合构造体制造方法,其中,
所述预固定步骤,是在所述被接合部件上面状地涂布所述预固定剂。
19.如权利要求6所述的接合构造体制造方法,其中,
所述多个被接合部件的一方所设置的电极构造由第一电极层、形成于所述第一电极部上的阻挡层、形成于所述阻挡层上的焊料凸起构成,
所述多个被接合部件的另一方所设置的电极构造由第二电极层构成,
通过焊接接合将所述焊料凸起和所述第二电极层接合。
20.一种接合构造体制造系统,其通过加热熔融材料将多个被接合部件之间接合以制造接合构造体,其特征在于,所述接合构造体制造系统具有:
涂布装置,其将含有沸点彼此不同的多种非还原性有机剂的预固定剂涂布于在所述多个被接合部件的至少一方形成有加热熔融材料的被接合部件;
加热装置,其对通过所述预固定剂以层叠的状态被预固定的所述多个被接合部件进行加热;以及
供给装置,其向腔室内所述多个被接合部件供给羧酸蒸汽,
其中所述多种非还原性有机剂含有:具有使得在所述加热熔融材料熔融之前蒸发的沸点的有机剂,以及具有使得在所述加热熔融材料熔融中蒸发的沸点的有机剂,
其中所述加热装置,是在所述加热熔融材料熔融之前或所述加热熔融材料熔融中,在以使所述预固定剂容易蒸发的方式暂时提高真空度的所述腔室内使所述预固定剂蒸发,而且加热所述被接合部件使得在含有所述羧酸蒸汽的气氛中以无助熔剂的方式进行接合。
21.一种加热熔融处理方法,其加热附着有焊料材料的部件并且对焊料材料进行加热熔融处理以成形焊料,其特征在于,所述加热熔融处理方法具有:
在所述部件上附着焊料材料,并且在部件的表面涂布含有沸点彼此不同的多种非还原性有机剂的预固定剂,通过该预固定剂预固定所述焊料材料的位置的预固定步骤;
通过在腔室内在含有羧酸蒸汽的气氛中进行加热处理,在以无助熔剂的方式进行的所述焊料材料熔融之前或所述焊料材料熔融中使所述预固定剂蒸发的蒸发步骤;以及
将所述焊料材料熔融以成形焊料的成形步骤,
其中所述多种非还原性有机剂含有:具有使得在所述焊料材料熔融之前蒸发的沸点的有机剂,以及具有使得在所述焊料材料熔融中蒸发的沸点的有机剂,
其中,在所述蒸发步骤中,暂时提高所述腔室内的真空度,以使所述预固定剂容易蒸发。
22.一种加热熔融处理方法,其加热附着有焊料材料的部件并且对焊料材料进行加热熔融处理以成形焊料,其特征在于,所述加热熔融处理方法具有:
在所述部件上附着焊料材料,并且在部件的表面涂布含有沸点彼此不同的多种非还原性有机剂的预固定剂,通过该预固定剂预固定所述焊料材料的预固定步骤;
通过在腔室内在含有羧酸蒸汽的气氛中进行加热处理,在以无助熔剂的方式进行的所述焊料材料熔融之前或所述焊料材料熔融中使所述预固定剂蒸发的蒸发步骤;以及
将所述焊料材料熔融以成形焊料的成形步骤,
其中所述多种非还原性有机剂含有:具有使得在所述焊料材料熔融之前蒸发的沸点的有机剂,以及具有使得在所述焊料材料熔融中蒸发的沸点的有机剂,
在所述蒸发步骤中,暂时提高所述腔室内的真空度,以使所述预固定剂容易蒸发。
23.一种加热熔融处理系统,其加热附着有焊料材料的部件,并且对焊料材料进行加热熔融处理以成形焊料,其特征在于,所述加热熔融处理系统具有:
涂布装置,其在所述部件上附着焊料材料,并且为将焊料材料预固定而在部件的表面涂布含有沸点彼此不同的多种非还原性有机剂的预固定剂;
加热装置,其对通过所述预固定剂使焊料材料被预固定的部件进行加热;以及
供给装置,其向腔室内所述部件供给羧酸蒸汽,
其中所述多种非还原性有机剂含有:具有使得在所述焊料材料熔融之前蒸发的沸点的有机剂,以及具有使得在所述焊料材料熔融中蒸发的沸点的有机剂,
其中所述加热装置,是在所述焊料材料熔融之前或所述焊料材料熔融中,在以使所述预固定剂容易蒸发的方式暂时提高真空度的所述腔室内使所述预固定剂蒸发,而且加热所述部件使得在含有所述羧酸蒸汽的气氛中以无助熔剂的方式成形焊料。
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US8757474B2 (en) | 2014-06-24 |
US20140246481A1 (en) | 2014-09-04 |
EP2587900A1 (en) | 2013-05-01 |
EP2587900B1 (en) | 2019-04-24 |
CN102960077A (zh) | 2013-03-06 |
KR20130087407A (ko) | 2013-08-06 |
EP2587900A4 (en) | 2015-10-28 |
US20130105558A1 (en) | 2013-05-02 |
WO2012002273A1 (ja) | 2012-01-05 |
TW201212762A (en) | 2012-03-16 |
US20150314385A1 (en) | 2015-11-05 |
TWI548317B (zh) | 2016-09-01 |
KR101805147B1 (ko) | 2017-12-05 |
JP2012033518A (ja) | 2012-02-16 |
US9119336B2 (en) | 2015-08-25 |
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