JP6961137B1 - 仮固定用組成物及び接合構造体の製造方法 - Google Patents
仮固定用組成物及び接合構造体の製造方法 Download PDFInfo
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- JP6961137B1 JP6961137B1 JP2021547106A JP2021547106A JP6961137B1 JP 6961137 B1 JP6961137 B1 JP 6961137B1 JP 2021547106 A JP2021547106 A JP 2021547106A JP 2021547106 A JP2021547106 A JP 2021547106A JP 6961137 B1 JP6961137 B1 JP 6961137B1
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Abstract
Description
25℃における粘度が70mPa・s以上であり且つ沸点が210℃以上である第2の有機成分とを含み、
第1の被接合材と第2の被接合材とを接合するのに先立ち両者を仮固定するために用いられる仮固定用組成物を提供するものである。
「仮固定」とは、第1の被接合材と第2の被接合材とが固定されている状態であって且つ大きな外力が加わったときに固定状態が変化するものの小さな外力(例えば第1の被接合材と第2の被接合材との仮固定物を、両被接合材の接合面が鉛直方向を向くように載置したときに、第1又は第2の被接合材のどちらかが自重により落下する程度の力)によっては固定状態に変化がないような固定態様のことである。
ペーストに含まれる金属微粒子は、一種の金属から構成されていてもよく、あるいは二種以上の金属の合金から構成されていてもよい。また、金属微粒子は、異なる二種以上の金属微粒子の混合物から構成されていてもよい。
体積累積粒径DSEM50は、例えば次の方法で測定される。マウンテック社製Mac−Viewを用い、金属微粒子のSEM像を読み込んだ後、SEM像上の金属微粒子を無作為に50個以上選んで、該粒子の粒径(ヘイウッド径)を測定する。次いで、得られたヘイウッド径から、粒子が真球であると仮定したときの体積を算出し、該体積の累積体積50容量%における体積累積粒径DSEM50とする。
固体還元剤としては、25℃で固体の性質を示し、且つ還元作用を示すものが好ましく、例えばビス(2−ヒドロキシエチル)イミノトリス(ヒドロキシメチル)メタン、トリメチロールプロパン、リビトール、グルコース、アスコルビン酸、ヒドロキノンなどが挙げられる。
粘度調整剤としては、前記ペーストの粘度の高低を調整できるものであればよく、例えばケトン類、エステル類、アルコール類、グリコール類、炭化水素、ポリマーなどが挙げられる。
表面張力調整剤としては、前記ペーストの表面張力を調整できるものであればよく、例えばアクリル系界面活性剤、シリコーン系界面活性剤、アルキルポリオキシエチレンエーテル、脂肪酸グリセロールエステルなどのポリマーやアルコール系、炭化水素系、エステル系、グリコール等のモノマーが挙げられる。
本発明においては、前記仮固定用組成物に含まれる第1の有機成分が、25℃において前記ペーストの乾燥体、すなわち前記焼結前駆体の様態を変化させないものであることが好ましく、すべての有機成分が25℃において前記乾燥体の様態を変化させないものであることがより好ましい。このような有機成分が仮固定用組成物中に含まれていることによって、第1の被接合材と第2の被接合材との間に仮固定用組成物を介在させて両者を仮固定するときに、焼結前駆体が変質しづらくなり、両被接合材を確実に仮固定することができる。
本発明でいう「乾燥体の様態を変化させない」とは、乾燥体上に1μlの有機成分を滴下し、110℃以下の条件で乾燥させた場合に顕微鏡で倍率140倍にて観察した際に滴下前後で乾燥体に変化が認められないことを指す。「変化が認められない」とは、滴下前後で乾燥体に変化が全く観察されないことのほか、接合後の超音波探傷像においても滴下の痕跡がみられないことも包含する。
また、本発明でいう「混合液中に析出物が観察される」とは、同様に前記有機溶媒1g、調整剤1g又は前記表面処理剤1gと、前記液状成分9gとを25℃において試験管に入れ、試験管ミキサーで10分混合した後、25℃において5分間静置したときに、両者のうちの一方の析出物が、他方の液相中に観察されることをいう。
第1の有機成分は、25℃における粘度が50mPa・s以下であることが更に好ましく、40mPa・s以下であることが一層好ましい。また、第1の有機成分は、その沸点が195℃以下であることが更に好ましく、190℃以下であることが一層好ましい。
粘度は、レオメーターにより想定される粘度により適用するセンサー(パラレルプレート等)を適宜変更し測定した100/sの値である(以下「粘度」というときにはこの方法で測定された値を意味する。)。
第1の有機成分と第2の有機成分との質量比率は1:99〜70:30であることが好ましく、3:97〜60:40であることがより好ましく、5:95〜50:50であることが更に好ましい。
図1(a)ないし(d)には仮固定用組成物を用いて第1の被接合材と第2の被接合材とを接合する工程が模式的に示されている。まず図1(a)に示すとおり、基板10上に、金属微粒子及び有機溶媒を含むペーストを塗布して塗膜を形成し、この塗膜から有機溶媒を除去して、該ペーストの乾燥体である焼結前駆体、すなわち第2の被接合材11を形成する。図1(a)では、一枚の基板10の表面上に第2の被接合材11としての複数の焼結前駆体が形成されている状態が示されている。基板10としては例えば銅、銀、ニッケル、金、アルミニウムなどの金属、又はアルミナ、炭化ケイ素、窒化ケイ素、窒化アルミニウムなどのセラミックスが挙げられる。また当該金属やセラミックス上に銅、銀、ニッケル、金、アルミニウムなどの金属めっきや金属パターンが片面又は両面に形成されていてもよい。
(1)仮固定用組成物の調製
第1の有機成分としてデカン(25℃における粘度0.7mPa・s、沸点174℃)を用いた。第2の有機成分として2,4,6−トリイソプロピル−1,3,5−トリオキサン(25℃において固体、沸点244℃)を用いた。両者を混合して仮固定用組成物を調製した。仮固定用組成物における第1の有機成分の濃度は70%であり、第2の有機成分の濃度は30%であった。この仮固定用組成物には有機高分子化合物及び無機化合物が含まれていなかった。
仮固定用組成物について、窒素流通下、昇温速度2℃/minで40℃まで昇温し20分間保持後、昇温速度10℃/min、窒素流通下、試料質量30mgの条件で、ブルカー・エイエックスエス社製の示差熱・熱重量同時測定装置TG−DTA2000SAにより熱重量示差熱分析したときの質量95%減少温度は152℃であった。
湿式法で合成された二種類の銅粒子(球状、DSEM50=0.14μm;フレーク状DSEM50=4.7μm)と、有機溶媒としてヘキシレングリコール及びPEG300と、固体還元剤などのその他調整剤を混合して接合用ペーストを調製した。固体還元剤としてはビス(2−ヒドロキシエチル)イミノトリス(ヒドロキシメチル)メタン(以下「BIS−TRIS」ともいう。)を用いた。
接合用ペーストにおける銅粒子の割合は74%であり、ヘキシレングリコールの割合は23.4%であり、PEG300の割合は0.74%であった。また、銅粒子に占める球状粒子の割合は30%であり、フレーク状粒子の割合は70%であった。また、固体還元剤として使用されたBIS−TRISの割合は1.85%であった。
無酸素銅からなる基板上に接合用ペーストをスクリーン印刷により塗布して、1cm×1cmの寸法を有する矩形の塗膜を形成した。この塗膜を110℃、20分乾燥させて有機溶媒を除去することで、乾燥体を形成した。その後、乾燥体に実施例1の第1の有機成分であるデカンを1μl滴下し、そのまま顕微鏡で倍率140倍で状態を確認した結果、デカンの滴下前後で乾燥体の様態変化はみられなかった。
接合用ペーストに含まれる固体還元剤であるBIS−TRIS 1gと、仮固定用組成物における第1の有機成分であるデカン9gとを25℃において混合して静置したところ、両者は相分離して、両者の固−液界面が観察された。
銅板(20mm×20mm、厚み0.5mm)からなる基板上に接合用ペーストをスクリーン印刷により塗布して、0.6cm×0.6cmの寸法を有する矩形の塗膜を形成した。この塗膜を110℃、20分乾燥させて有機溶媒を除去することで、乾燥体である焼結前駆体からなる第2の被接合材を形成した。
半導体パワーデバイスのモデル部材として、Agめっきしたアルミナチップを用意した(0.5cm×0.5cm、厚み0.5mm)。このアルミナチップを第1の被接合材として用いた。(3)で形成した焼結前駆体の全面に数滴の仮固定用組成物を滴下し、引き続き焼結前駆体上にアルミナチップを重ね合わせ、0.8MPa、2秒の荷重をかけた。
アルミナチップを重ね合わせた後、前記の銅板とアルミナチップとの接合面が鉛直方向を向くように接合体を立て、その後、水平に戻す操作を10分おきに計6回実施した。6回の操作のいずれにおいても、アルミナチップは銅板から脱落せず、タック性は確保されていた。
実施例1の(1)仮固定用組成物の調製で用いた第2の有機成分である2,4,6−トリイソプロピル−1,3,5−トリオキサンに代わり4−(1’−アセトキシ―1’−メチルエチル)−シクロヘキサノールアセテート(25℃で液体、25℃での粘度77mPa・s、沸点223℃)を用い、第1の有機成分であるデカンとの質量比を1:99として仮固定用組成物を作製した。それ以外は実施例1の(4)第1の被接合材の重ね合わせまで実施例1と同様にして作製した。
実施例2で作製した基板について上述したタック性の評価をしたところ、アルミナチップが60分後も脱落しなかったことから、タック性が確保されていることが分かった。更に接合評価を行ったところチップの位置にずれは発生しなかった。
仮固定用組成物について、実施例1と同様の条件で熱重量示差熱分析したときの質量95%減少温度は233℃であった。
実施例1の(1)仮固定用組成物の調製で用いた第2の有機成分である2,4,6−トリイソプロピル−1,3,5−トリオキサンを用いずに仮固定用組成物を作製した。それ以外は実施例1の(4)第1の被接合材の重ね合わせまで実施例1と同様にした。作製した基板について上述したタック性の評価をしたところ、20分後にアルミナチップが脱落したことから、タック性が確保されていないことが分かった。
実施例1の(1)仮固定用組成物の調製で用いた第2の有機成分である2,4,6−トリイソプロピル−1,3,5−トリオキサンの代わりにショウノウ(25℃で固体、沸点204℃)を用いて仮固定用組成物を作製した。それ以外は実施例1の(4)第1の被接合材の重ね合わせまで実施例1と同様にした。作製した基板について上述したタック性の評価をしたところ、20分後にアルミナチップが脱落したことから、タック性が確保されていないことが分かった。
Claims (9)
- 25℃における粘度が70mPa・s未満であり且つ沸点が200℃以下である第1の有機成分と、
25℃における粘度が70mPa・s以上であり且つ沸点が210℃以上である第2の有機成分とを含み、
第1の被接合材と第2の被接合材とを接合するのに先立ち両者を仮固定するために用いられる仮固定用組成物。 - 前記第1の有機成分が、25℃において第2の被接合材の様態を変化させないものである、請求項1に記載の仮固定用組成物。
- 第1の被接合材及び第2の被接合材の少なくとも一方が、金属微粒子、有機溶媒及び調整剤を含むペーストの乾燥体であり、
前記有機溶媒1g、前記金属微粒子に付着している表面処理剤1g又は前記調整剤1gと、前記仮固定用組成物中の第1の有機成分9gとを25℃において混合したときに、両者の間に液−液界面が観察されるか、又は混合液中に析出物が観察される、請求項1又は2に記載の仮固定用組成物。 - 第1の有機成分と第2の有機成分との質量比率が1:99〜70:30である、請求項1ないし3のいずれか一項に記載の仮固定用組成物。
- 昇温速度10℃/min、窒素雰囲気、試料質量30mgの条件で熱重量示差熱分析したときの質量95%減少温度が300℃未満である、請求項1ないし4のいずれか一項に記載の仮固定用組成物。
- 有機高分子化合物を実質的に非含有である、請求項1ないし5のいずれか一項に記載の仮固定用組成物。
- 第1の被接合材と、第2の被接合材との間に、仮固定用組成物を介在させて両者を仮固定し、
仮固定された両者に対して焼成を行い両者を接合する工程を含む、接合構造体の製造方法であって、
前記仮固定用組成物として、25℃における粘度が70mPa・s未満であり且つ沸点が200℃以下である第1の有機成分と、
25℃における粘度が70mPa・s以上であり且つ沸点が210℃以上である第2の有機成分とを含むものを用いる、接合構造体の製造方法。 - 第1の被接合材及び第2の被接合材のうちの少なくとも一方が、金属微粒子及び有機溶媒を含むペーストの乾燥体である焼結前駆体からなる、請求項7に記載の製造方法。
- 25℃における粘度が70mPa・s未満であり且つ沸点が200℃以下である第1の有機成分と、
25℃における粘度が70mPa・s以上であり且つ沸点が210℃以上である第2の有機成分と、
を含む組成物の、第1の被接合材と第2の被接合材とを接合するのに先立つ両者の仮固定のための使用。
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JP2020045514A (ja) * | 2018-09-18 | 2020-03-26 | 日立化成株式会社 | 接合体の製造方法、焼結銅ピラー形成用銅ペースト、及び接合用ピラー付部材 |
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KR102487799B1 (ko) | 2023-01-13 |
CN114730715B (zh) | 2023-04-25 |
EP4131347A1 (en) | 2023-02-08 |
CN114730715A (zh) | 2022-07-08 |
US11945974B2 (en) | 2024-04-02 |
JPWO2021193150A1 (ja) | 2021-09-30 |
KR20220065886A (ko) | 2022-05-20 |
WO2021193150A1 (ja) | 2021-09-30 |
EP4131347A4 (en) | 2023-08-30 |
US20220380639A1 (en) | 2022-12-01 |
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