TW201016652A - Flux, conductive paste, bonded component, and method for producing bonded component - Google Patents

Abstract

Disclosed is a flux which is capable of bonding a substrate and an electronic component or the like and does not leave residues after bonding (such as soldering). Also disclosed are a conductive paste containing the flux, a bonded component formed by bonding constituent members using the conductive paste and having high bonding reliability, and a method for producing the bonded component. The flux contains an aromatic compound which has two phenolic hydroxy groups in two positions of each aromatic ring, said two positions being next to each other or having one position therebetween. The aromatic compound has a melting point not less than 23 DEG C at 1 atm.

Description

[Technical Field] The present invention relates to a flux used for solder joints and the like of electronic parts and the like, and a conductive paste containing the same, and the use of the joint parts and the joint parts thereof method. ' [Prior Art] ® In the past, flux was used for solder joints of electronic components mounted on a part. This flux contains an organic acid such as rosin or a halogen compound for the purpose of removing an oxide film on a substrate. When the flux residue is adhered by using a paste containing such a flux, if the flux residue remains, the substrate to be welded is slowly corroded due to the corrosive action of the flux residue. Therefore, after the solder bonding is completed, the substrate to be bonded by soldering is cleaned to remove the flux residue. This washing generally uses a fluorocarbon solvent. Recently, however, the concept of environmental pollution has evolved to defluorination of hydrocarbons, and water is washed with water, or low residue with low solids after washing and bonding. ; No cleaning flux. - However, when the water system is washed, the water used in the washing is contaminated by heavy metals due to the use of water during washing. Further, in the case of a semiconductor element having a finer connection pitch structure, since the water-based cleaning method has a problem of poor detergency, a low-residue non-washing flux which is necessary for no cleaning is often used, and it is necessary to In the fluxing device used in the reflowing step -5, 201016652 In the flux used in the manufacture, it is necessary to reduce the joint strength of the weld and maintain the joint strength after a plurality of reflows. As a flux of a low residue, Patent Document 1 discloses a soldering agent which exhibits an activity of reducing the activity of the oxide film of the soldering surface by thermal decomposition at the time of solder joint bonding, which is substantially completely non-evaporated before solder bonding. A flux for bonding. The solvent is a solvent that slowly volatilizes after solder bonding and becomes a low residue flux by using this solvent. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. 8-112692. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] The composition of the paste material in the solder paste is usually composed of a solder powder or a solvent. And solid parts (rosin, active agent, etc.). In the conventional non-cleaning flux described in the patent document, although the solid content is reduced and the halogen compound is not contained, the resin component such as rosin or the residue of the active agent or the like is necessarily produced after the solder joint. concern. — In addition, when it is necessary to manufacture an electronic circuit device in a plurality of reflow steps, if the solder paste used in t is not soldered and has an adhesive solder paste, the number of reflow steps can be reduced. Soldering together without giving excessive thermal stress. Accordingly, it has been demanded to develop a solder paste which does not melt the solder and has an adhesive force. The present invention has been made to solve the above problems, and in particular, the object of the present invention is to provide a flux which has adhesiveness and which does not cause residue after joining (welding together), and contains the aid. The conductive paste of the flux is bonded to each other by bonding members (joined together) formed by joining the constituent members, and a method of manufacturing the joined member. The present invention is as follows: 1. A flux which has two phenolic hydroxyl groups at two positions numbered adjacent to an aromatic ring, or a number of positions in the aromatic ring A flux having an aromatic compound having two phenolic hydroxyl groups at two positions, characterized in that one of the aromatic compounds has a melting point of 23 ° C or higher at atmospheric pressure. 2. The flux according to the above 1, wherein the aromatic compound has a vaporization temperature of 100 ° C or more at atmospheric pressure. 3. The flux according to the above-mentioned item 1 or 2, wherein the aromatic compound having two phenolic hydroxyl groups at two positions adjacent to the aromatic ring is a compound represented by the following formula (1), and ® An aromatic compound having two phenolic hydroxyl groups at two positions in which one of the above aromatic rings is opened is a compound represented by the following formula (2):

OH (1) (2) 201016652 【化2】

OH

[In the above formulae (1) and (2), R represents a yard base, and η represents an integer of 0 to 4]. 4. The flux according to the above 1 or 2, wherein the aromatic ring having two phenolic hydroxyl groups at two positions adjacent to the aromatic ring is in the following formula (3) or The compound represented by the formula (4), and the aromatic compound having two phenolic hydroxyl groups at two positions in which the aromatic ring is skipped at one position is a compound represented by the following formula (5): 3

-8- 201016652 [In the above formulas (3) to (5), R represents an alkyl group, and η represents an integer of 〇~4]. 5. The flux according to any one of the above 1 to 4, wherein the aromatic compound contains two or more kinds of compounds. 6. The flux according to any one of the above 1 to 5, which is solid under an atmosphere of atmospheric pressure at 23 °C. 7. A conductive paste comprising the flux and the conductive metal particles according to any one of the above 1 to 6. A joint component characterized by bonding a constituent member and another constituent member using the conductive paste described in the above 7. A method of producing a joined component, which is a method of producing a joined component obtained by joining a constituent member and another constituent member, characterized in that the conductive member is coated with the conductive paste described in the above seventh embodiment. The step of applying the paste and the step of placing the components on the coated conductive paste on the other constituent members. ❹ [Effect of the Invention] The flux of the present invention has two phenolic hydroxyl groups at two positions numbered adjacent to the aromatic ring, or has two positions at one position of the aromatic ring. The flux of the aromatic compound of the two phenolic hydroxyl groups is such that the melting point of the aromatic compound at 23 ° C or higher at atmospheric pressure makes the flux reductive, and the oxide film generated on the substrate or the like can be removed. Further, the flux has an adhesive property, and the parts can be fixed to each other only by the flux. According to this, it is necessary to carry out a plurality of parts mounting steps and joint parts (electronic circuit devices, etc.) of the -9 - 201016652 reflowing step, and it is also possible to carry out electronic parts and the like without melting the conductive metal particles (solder or the like). Positioning, etc., and joining (welding together, etc.) with fewer reflow times. Further, the flux of the present invention can be used as a flux-free flux by containing the above-mentioned aromatic compound and suppressing the residue of the flux on the substrate after joining of parts such as electronic parts. Further, when the vaporization temperature of the aromatic compound is _ 100 ° C or more at atmospheric pressure, it becomes a flux which is more difficult to remain as a flux residue. Further, the conductive paste of the present invention can suppress the flux residue generated after the electronic component or the like is bonded to the substrate by containing the flux of the present invention, and the cleaning step after bonding can be eliminated. Moreover, the joined component of the present invention can be joined to the other constituent members by using the conductive paste of the present invention, and can be joined with a small number of reflow times, thereby reducing excessive thermal stress on the constituent members and other constituent members. It can provide highly reliable joint parts. [Embodiment] [1] Flux The flux of the present invention is characterized by having two phenolic hydroxyl groups at two positions adjacent to each other in the aromatic ring, or numbering one position in the aromatic ring. A flux of an aromatic compound having two phenolic hydroxyl groups (hereinafter simply referred to as "aromatic compound") at two positions, and one of the aromatic compounds has a melting point of 23 t or more at atmospheric pressure. The above aromatic compound has two phenolic hydroxyl groups at two positions adjacent to the position number of the aromatic ring, and has two phenolic hydroxyl groups at two positions in the position of the aromatic ring. . The flux of the present invention can reduce the oxide film by reducing the oxide film formed on the surface of the metal substrate or the like which is welded together by containing the aromatic compound. Therefore, the so-called weld wettability is improved by this. Further, the flux of the present invention contains the aromatic compound and has an adhesive property in addition to the above-mentioned reducing property. Because of the adhesion, the constituent members can be continued with each other only by the flux (and without using molten solder). Further, the above-described constituent members are, for example, various electronic components such as a component mounting substrate and a wafer mounting substrate, electronic circuit modules, flip chip 1C, and semiconductor wafer (the same applies hereinafter). Further, the flux of the present invention contains the aromatic compound, and in addition to the above-mentioned reducing property and the above-mentioned adhesion, the residue after bonding is extremely difficult to remain, so that the flux cleaning step which has been conventionally required is not required. W The aromatic compound has a melting point of 23 ° C or higher at atmospheric pressure. Usually, the melting point is 25 (TC or less. Since the melting point of the aromatic compound is above 23 ° C, a good adhesion can be maintained at room temperature. The melting point at this atmospheric pressure is preferably 25 to 230 ° C. More preferably, it is from 1 〇〇 to 200 ° C, and more preferably from 120 to 200 ° C. The position of the aromatic ring in the aromatic compound in which the adjacent position number of the aromatic ring has two phenolic hydroxyl groups at two positions Examples of the number are, for example, 1 position and 2 positions, 2 positions and 3 positions, 3 positions and 4 positions, etc. In addition, the aromatic ring in the above aromatic compound is jumped at a position of -11 - 201016652. The position number of the phenolic hydroxyl group is exemplified by, for example, 1 position and 3 position, 2 position, 4 position, etc. The aromatic compound is not particularly limited as long as it has the above characteristics. For example, benzene, naphthalene, anthracene, etc., among these skeletons, benzene and naphthalene are preferred. In particular, compounds represented by the following general formulae (1) to (5) are more preferred:

OH

OH

OH (R) η

(4)

OH -12- (5) 201016652

[Chemical 5] OH

Represents an integer from 0 to 4.].

The carbon number of the alkyl group in R of the above formulae (1) to (5) is preferably from 1 to 1 Torr, more preferably from 1 to 8, more preferably from 1 to 5. The structure of the alkyl group is not particularly limited, and may be linear or branched (branched). The alkyl group is exemplified by, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, t-butyl, pentyl, isopentyl, neopentyl, hexyl. , heptyl, octyl and 2-ethylhexyl, and the like. Further, n in the above formulae (1) to (5) is preferably 0 to 2', more preferably 0 or 1. In the above formulae (1) to (5), when η is ', each R' may be the same or different. That is, as a preferred compound, the compound of the above formula (1) is preferably a compound of the following formula (6) wherein η is 0 or 1 and the compound of the above formula (2) is preferably η or 1. Compound of the formula: [Chemical 6] Rf-

(6) -13- 201016652 【化7】

[In the above formulae (6) to (7), R represents a hydrogen atom or an alkyl group]. Further, as a preferred compound, the compound of the above formula (3) preferably has a η of 0 or 1 and does not have the above phenolic hydroxyl group on the benzene ring.

a compound of the following formula (8) in which R is bonded, wherein the compound of the above formula (4) preferably has η of 0 or 1 and is bonded to the phenyl ring without the above phenolic hydroxyl group. The compound of the following formula: The compound of the above formula (5) is preferably a compound of the following formula (1) in which the above formula (1〇) is bonded to the benzene ring which does not have the above-mentioned hydroxy group. : 【化8 1

[In the above formulae (8) to (10), "R represents a hydrogen atom or an alkyl group]. L -14- 201016652 These aromatic compounds are specifically exemplified by meta-xylenol, 4-methyl phthalic phenol, 4-tert-butyl phthalic phenol, 3-methyl phthalic acid Cresol, 5-methylisoxyl phenol, 5-tert-butyl metaxyl phenol, ·1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, and 2,3-dihydroxynaphthalene . These may be used alone or in combination of two or more. Among these aromatic compounds, 4-methyl phthalic phenol and 4-tert-butyl catechol are preferred. Compared to these other 'aromatic compounds', it is better because of the stronger reduction of metal oxides. Further, when two or more kinds of the above aromatic compounds are used, among the above aromatic compounds, 4-methyl phthalic phenol and 4-tert-butyl phthalyl phenol are preferable. When these are used, it is preferable because it is stronger than the other metal. In addition, the ratio of blending at the time of use is not particularly limited, but when the total of 4-methyl phthalic phenol and 4-tert-butyl phthalic phenol is 1% by mole, so that 4 The ratio of -methyl phthalic phenol is 30 to 80 mol% better than ®. A particularly excellent reducing effect can be obtained within this range. The above range is preferably from 40 to 70 mol%, preferably from 50 to 60 mol%. Further, the vaporization temperature of the above aromatic compound is preferably at most atmospheric pressure - more than 10 °C. When the temperature is 100 ° C or higher and the bonding (welding, etc.) is carried out, the aromatic compound is vaporized, and no residue is formed, and the cleaning agent can be used as a no-clean flux. The gasification temperature at this atmospheric pressure is usually 400 ° C or lower, more preferably 150 ° C or higher, and still more preferably 200 ° C or higher. Further, the so-called gasification temperature at the atmospheric pressure is under the condition of one atmosphere, and the temperature at which the weight is reduced is observed at the time of temperature rise. The gasification temperature -15 - 201016652 degree was measured by the following method. That is, when the temperature inside the system is raised by nitrogen using a differential thermal balance (TG/DTA), the temperature which is initially observed due to vaporization of the flux is reduced (usually, the mass of the sample is 5% by mass or more). As the gasification temperature. The amount of the aromatic compound contained in the flux of the present invention is not particularly limited, and may be contained in one part of the flux or may constitute the entire amount of the flux. In other words, for example, when the entire flux is 1% by mass, the aromatic compound may be contained in an amount of 70 to 100% by mass. When the content of the aromatic compound is within this range, it can be used as a flux having excellent reducibility and low residue. The content is preferably from 80 to 100% by mass, more preferably from 90 to 100% by mass, most preferably from 95 to 100% by mass. The flux of the present invention may be used for the purpose of the present invention, and may contain other components in addition to the above aromatic compound. As other examples, the solvent, the active agent and the thixotropic agent are mentioned. These may be used alone or in combination of two or more. The solvent is exemplified by alcohols, esters, ethers, hydrocarbons, and the like. The solvent hydrazine is exemplified by monovalent alcohols such as isopropyl alcohol and butanol; ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butanediol 'pentane-diol, and Divalent alcohols such as diols; ethylene glycol monomethyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate; propylene glycol monomethyl ether; Propylene glycol monoethyl ether such as propylene glycol monoethyl ether, propylene glycol monopropyl ether or propylene glycol monobutyl ether; propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dipropyl ether, propylene glycol dibutyl ether, etc. Propylene glycol dialkyl ethers; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether-16- 201016652 acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, etc. Monoalkyl ether acetates; cellosolves such as ethyl cellosolve and butyl cellosolve; carbitol such as butyl carbitol; methyl lactate, ethyl lactate, n-propyl lactate, lactic acid Lactic acid esters such as isopropyl ester; ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate , isobutyl acetate, n-amyl acetate, isoamyl acetate, isopropyl propionate, n-butyl propionate, aliphatic carboxylic acid esters such as 'isobutyl propionate; 3-methoxypropionic acid Other esters of methyl ester, ethyl 3-β-methoxypropionate, methyl 3-acetoxypropionate, ethyl 3-ethoxypropionate, methyl pyruvate, ethyl pyruvate; toluene An aromatic hydrocarbon such as xylene; a ketone such as 2-pentanone, 3-pentanone, 4-pentanone or cyclohexanone; Ν-dimethylformamide, Ν-methylacetamide, hydrazine , decylamine such as hydrazine-dimethylacetamide or hydrazine-methylpyrrolidone; lactones such as 7-butyrolactone. These may be used alone or in combination of two or more. The flux of the present invention may contain a solvent. The amount of the solvent is not particularly limited. When the total amount of the aromatic compound is 100 parts by mass, it may be used in an amount of 0.1 to 1,000,000 parts by mass, preferably 1 to 100,000 parts by mass, more preferably 10 to 1 part by mass. 00 0 parts by mass. The viscosity of the flux can be modulated by the amount of the solvent. That is, the appropriate viscosity can be selected according to the method of applying the flux, and the 'viscosity can be modulated by the solvent amount of the above range. As the aforementioned active agents, exemplified are amine salts of hydrochloric acid and hydrobromic acid, and carboxylic acids and amine salts thereof. The active agent is exemplified by a primary amine such as methylamine, ethylamine, n-propylamine, isopropylamine or n-butylamine; dimethylamine, diethylamine, di-n-propylamine, and a secondary amine such as isopropylamine or di-n-butylamine; a tris--17-201016652 amine such as trimethylamine, triethylamine, tri-n-propylamine or triisopropylamine; monoethanolamine, Hydrochloric acid hydrochlorides and hydrobromides of alkanolamines such as diethanolamine and triethanolamine, and oxalic acid, malonic acid, succinic acid, adipic acid, glutaric acid, diethyl glutaric acid, and pimelic acid , azelaic acid, azelaic acid, maleic acid, fumaric acid, diglycolic acid, citric acid, lauric acid, myristic acid, palmitic acid, oleic acid, oleic acid, stearic acid, arachidic acid, hawthorn An aliphatic carboxylic acid such as acid or linolenic acid; an aromatic acid such as benzoic acid; a hydroxy acid such as hydroxypivalic acid, dimethylolpropionic acid, citric acid, malic acid, glyceric acid or lactic acid, and the like Amine salts and the like. These can be used alone or in combination of two or more. The thixotropy imparting agent is exemplified by a polyolefin wax such as castor wax (hardened castor seed oil): a fatty acid guanamine such as m-dimethylphenyl distearate decylamine; N-butyl-Ν'_ste A urea compound such as ruthenium oxide or the like; a polymer compound such as polyethylene glycol, polyethylene oxide, methyl cellulose, ethyl cellulose or hydroxyethyl cellulose; or inorganic particles such as cerium oxide particles and kaolin particles. These may be used alone or in combination of two or more. The flux of the present invention may contain a thixotropic imparting agent. The amount of the thixotropy-imparting agent is not particularly limited, and may be 0.1 to 30 parts by mass, preferably 0.1 to 20 parts by mass, more preferably 0.1 to 1 part by weight based on 100 parts by mass of the total of the aromatic compound. 〇 mass parts. The adhesion of the constituent members to each other can be modulated by the content of the thixotropic imparting agent. Further, the properties of the flux of the present invention are not particularly limited, that is, it may be a solid or a liquid (including a paste, the same applies hereinafter). The solid means a state in which the flow does not flow with or without an external force under an atmosphere of atmospheric pressure and 23 °C. -18- 201016652 In addition, the term "liquid" means a state in which no external force is applied in an atmosphere of one atmosphere and 23 °C. In the case of a liquid flux, for example, the viscosity at an atmospheric pressure and a temperature of 23 ° C is 0.001 〇〇〇 Pa.s. The viscosity may further be 0.01 to 800 Pa·s, and more preferably 0.1 to 700 Pa·s °. The flux of the present invention may be any of the above-described conditions, and may be appropriately selected depending on the use conditions. For example, a solid flux can be used to place the part for ® chipping purposes. Further, the liquid flux can be attached to the target site by screen printing or the like, and can be applied to the target site by coating, and the flux of the present invention can be exhibited by containing the aromatic compound. As described above. This adhesion is usually generated by the flux between the metal and the metal, but the liquid flux tends to exert a subsequent nature in a shorter period of time. On the other hand, the solid flux tends to elongate over a period of time to obtain sufficient adhesion compared to a liquid flux. Therefore, when a solid flux is used, it is preferred to carry out heating. The temperature at which the heating is carried out is preferably carried out below the vaporization temperature, especially at a temperature lower than the gasification temperature by 20 to 100 ° C, and at a temperature higher than the melting point of 10 to 50 ° C to conduct the preferred [2] conductivity. Slurry The conductive paste of the present invention contains the aforementioned flux and conductive metal particles of the present invention. The flux described above can be directly used as the flux of the present invention. The amount of the flux contained in the conductive paste of the present invention is not particularly limited. However, when the content of the flux is 100% by mass of the conductive paste, it is preferably 〇·1 ~3 〇 mass%, more preferably 1 to 20 mass% 'more preferably 5 to 1 〇 mass%. When the content of the flux is within the above range, it can be a conductive paste excellent in substrate wettability. The conductive metal particles are not particularly limited as long as they are metal-bonded metal particles that can be bonded to each other in the electronic circuit or the like, and the like. Powder or metal powder composed of @金, silver, copper 'aluminum and an alloy containing the metals. Among these, it is preferable to use a solder powder when bonding metals to each other at a low temperature. The solder powders can be exemplified by, for example, Sn-Pb, Sn-Pb-Ag, Sn-Pb-Bi, Sn-Pb-In, Sn-Pb-Sb, etc., or lead-free Sn-Sb-based alloys, Sn. -Bi-based alloy, Sn-Ag-based alloy, Sn-Zn-based alloy (addition of Ag, Cu, Bi, In, Ni, P, etc.). These may be used alone or in combination of two or more. 〇 The shape of the conductive metal particles may be either spherical or amorphous. Further, the particle diameter of the conductive metal particles may be a normal one, and the diameter of the spherical metal is preferably 5 to 200 &quot; m, more preferably 5 to 100 #m, and more preferably 5 to 50 / zm. . In addition, when the content of the conductive metal particles is 100% by mass based on the total amount of the conductive paste, it is preferably 70 to 99.9% by mass, more preferably 80 to 90% by mass, and still more preferably 90 to 95% by mass. When the content of the conductive gold ruthenium particles is within the above range, the conductive paste having excellent substrate wettability can be obtained. -20- 201016652 Further, the conductive paste of the present invention may contain other additives in addition to the flux containing the aromatic compound and the conductive metal particles as long as it can achieve the object of the invention. The method for producing the conductive paste of the present invention is exemplified by a method of kneading the above-mentioned flux and the above-mentioned solder powder by a conventional method, and an additive to be added as needed. Examples of the kneading machine are, for example, a vacuum mixer, a kneading device, a planetary mixer, and the like. The temperature and conditions at the time of blending are not particularly limited to ®, but it is usually better at 5 to 2 5 °C. [3] Joining member The joined component of the present invention is obtained by joining the constituent member and other constituent members using the conductive paste of the present invention. The above-described constituent members and other constituent members are not particularly limited as long as they are joined by the members. The members (constituting member and other constituent members) are, for example, various electronic components such as a component mounting substrate and a wafer mounting substrate, various electronic components such as an electric circuit module, a flip chip 1C, and a semiconductor wafer. The joined component of the present invention is obtained by joining the constituent members to each other through a conductive metal derived from the conductive paste of the present invention. The joint component of the present invention is exemplified by, for example, a surface mount type electronic substrate (hereinafter referred to as "mounting body") shown in Fig. 1. An example of the mounting body will be described below. As shown in Fig. 1, in the mounting body, the component-connecting conductors (hereinafter referred to as "conductive land j" 2a, 2b of the substrate 1 for component mounting are passed through the conductive paste of the present invention. Conductive bonding of the slurry - 21,106,652 (materials such as solder) 23a, 23b, and bonding of the external electrodes 5a and 5b of the laminated ceramic capacitor 4. The manufacturing method of the above-mentioned bonding component (when the conductive paste of the present invention is used) The bonding method is not particularly limited as long as the conductive paste of the present invention is used, and the method for producing the above-described constituent members is not particularly limited. For example, the order of the conductive smear application step and the component mounting step is generally included. The manufacturing method of the joined component of the present invention is a method of manufacturing a joined component by joining the constituent member to another constituent member, and is characterized in that the conductive paste of the present invention is applied to the constituent member. The conductive paste application step and the component mounting step of mounting the other component on the coated conductive paste. The method of manufacturing the joint component of the present invention Usually, a reflow step is additionally provided after the component mounting step. Further, a preferred manufacturing method is a method in which a preheating step is provided between the component mounting step and the reflow step. That is, the constituent member is joined to other constituent members. The method for producing a joined component is characterized in that a conductive paste application step of applying the conductive paste of the present invention to a G-forming member is provided, and other constituent members are mounted on the coated conductive paste. The component mounting step and the preheating step of preheating the constituent members on which the other constituent members are mounted without performing the conductivity-melting of the metal particles. Further, the conductive metal particles are meltable particles (for example, solder) as needed. In the case of the powder), a step of reflowing the conductive metal particles contained in the conductive paste is provided. An example of the method for producing the joined member of the present invention will be described below. (1) Conductive paste coating Step: The component connecting conductors (hereinafter referred to as "junctions") 2a, 2b having the -22-201016652 shown in Fig. 2(a) (constituting members) On at junction 2a, the paste printed or coated 2b 3a, 3b [with reference to FIG. 2 (b)]. (2) After the step of the above-described (1), the electric paste (the other constituent members) including the external electrodes 5a and 5b are mounted on the slabs 3a and 3b (see Fig. 2(c)). (3) Preheating step: Preheating is performed by printing or coating the conductive paste 3a on the ® plate 1 (constituting member) of the above step (2), and carrying the electronic component 4 (other constituent members). By the heat, the conductive pastes 13a and 13b are made into a slimy state, and the force is increased [see Fig. 2(d)]. The substrate 1 and the electronic component 4 are brought into a state of being in contact with each other by the guides 13a and 13b having the adhesion force, and are electrically held on the conductive pastes 13a and 13b. Next, when the other electronic component is mounted on the substrate 1, the conductive paste can be brushed again, and the electronic component can be mounted thereon. Since the mounted electronic components are mounted on the conductive paste that has been preheated as described above, the substrate and the electronic components are electrically conductive, and there is no positional shift, and new electronic components can be mounted. - Since the conductive pastes 13a and 13b have an adhesive force, the position of the position between the parts can be easily carried on the substrate 1 under the melting of the electric metal particles. (4) Reflowing step: when the conductive metal particles are in a meltable state, the conductive particles contained in the electrical slags 1 3 a and 1 3 b are melted by a reflow furnace or the like after the preheating. Substrate 1 conductive paste, after the conductive sub-part 4, on the base 3b, the pre-added step is used to display the electrically conductive paste part 4 to coat or print the preheated adhesive paste Pick up. In addition, the conduction of the particles is not carried out and the conduction is carried out -23- 201016652. That is, the member and other constituent members are joined by a conductive metal joint. The heating temperature in the preheating step may be appropriately selected depending on the kind of the conductive metal particles, but is preferably from 80 to 200 ° C, more preferably from 1 to 180 ° C. When the heating temperature in the preheating step is within the above range, the conductive paste exhibits an adhesive force, which can be followed by the substrate and the electronic component. Further, the preheating step can be carried out by a general reflow furnace or the like. The heating temperature in the above-mentioned reflowing step can be appropriately selected depending on the type of the conductive metal particles, but is preferably 200 to 3 50 ° C, more preferably 250 to 300 φ ° C. When the heating temperature in the reflowing step is within the above range, the flux or the like contained in the conductive paste is volatilized, and it is difficult to leave the flux residue. Further, the conductive metal particles contained in the conductive paste are melted to bond the substrate and the electronic component. Since the conductive paste of the present invention has an adhesive force, the substrate can be brought into contact with the electronic component without the conductive metal being melted, and the number of times of reflow in the production of the joined component can be reduced. In other words, for example, when a module substrate (other components 〇) in which electronic components are joined (welded together) are bonded to a mother circuit board (constituting member), etc., first, electronic components are bonded to a module substrate. After that, it is necessary to bond the bonded module-substrate (other constituent members) to the mother circuit substrate (constituting member). In this case, when the module substrate bonded to the mother circuit board is joined to the mother circuit board, the reflow oven can be passed again, and the module substrate can be reflowed a second time. However, when the conductive paste of the present invention is used, first, the electronic component is attached to the module substrate. Next, the module base -24 - 201016652 of the electronic component is then mounted on the mother circuit substrate. Then, the module substrate and the mother substrate can be completely joined by passing the mother circuit board with the module substrate through the reflow furnace. Thereby, the reflow in the manufacture of the joint parts can be performed only once. That is, the method of manufacturing the joined component is a method of producing a joined component by bonding the bonded constituent member to another constituent member using the conductive paste of the present invention, and may have the following steps: applying conductivity to the first constituent member a first first component mounting step of mounting a second constituent member on the coated conductive paste® slurry, and a first constituent member on which the second constituent member is mounted Preheating is performed without melting the conductive metal particles, and the first preheating step is performed between the second constituent member and the first constituent member, and the conductivity of the conductive paste is applied to the third constituent member. a second paste application step, and a second component mounting step of mounting the first constituent member of the second constituent member on the coated conductive paste as needed, and mounting the first constituent member The third constituent member is preheated without melting the conductive metal particles, and the second preheating step of the first constituent member and the third constituent member is performed by the stomach. And optionally in the case where the conductive particles are particles of meltable ', so that the melting of the conductive particles of the conductive metal paste reflow step contained. Excessive thermal stress on the joined component such as an electronic substrate may cause melting of the conductive metal particles bonded to the substrate, or cracking of the substrate or the joint due to expansion or the like. The melting or cracking of the conductive metal particles may cause a short-circuit defect, and the bonding strength between the substrate and the electronic component may be lowered. Therefore, when the conductive paste of the present invention is used, the excessive thermal stress of -25-201016652 may not be imparted. Bonding underneath provides a highly reliable joint part. Since the joined component of the present invention is joined by using the conductive paste of the present invention, it is difficult to leave the flux residue after the joining, and it is not necessary to clean the joined component after joining. Further, since the excessive thermal stress can be alleviated during the joining, it is possible to form a joining component having high bonding reliability. [Examples] - Hereinafter, specific examples of the invention will be described. Further, the present invention is not limited by the implementations. Further, the "parts" in the examples are based on mass unless otherwise specified. Further, the measurement of the viscosity (Pa · s ) in the examples and the comparative examples was carried out in the following manner. [Viscosity] Measured by E-type viscosity agent RE-105H manufactured by Toki Sangyo Co., Ltd. Π] Modulation of solid flux ® &lt;Example 1&gt; The aromatic compound shown in Examples 1 to 4 of Table 1 was used as a solid flux. · -26- 201016652 [Table 1] Table 1 m drying comparison example 1 2 3 4 5 6 1 co-solidification of aromatic meta-xylenol-300 - - - - 100 - melting (300 compounds 2, 3- Hydroxynaphthalene - - 300 - - - Dosage (parts) Methylphthalic acid - 300 - 150 100 - Tert-butyl phthalic phenol • - 300 - 150 100 - Other mm Rosin blending (parts) 300 Solvent Γ Type - Benzyl alcohol blending (parts) 60 in 23. . Liquid solid gasification temperature of solid solid solid liquid liquid (. 〇160 130 140 215 140 145 viscosity (Pa.s) - - - - 570 630 600 [2] Modulation of liquid flux &lt;Example 5 And 6> mixing the aromatic compounds shown in Examples 5 and 6 in Table 1, heating the mixture to 100 ° C, and obtaining a liquid flux by stirring until it became liquid. Further, the liquid aid The flux is liquid at atmospheric pressure and room temperature, and will not recrystallize when cooled to 5 ° C. In addition, the viscosity of the liquid flux under atmospheric pressure and 23 ° C atmosphere (Pa· 〇 - 倂The results are shown in Table 1. <Comparative Example 1 &gt; The compound and the solvent shown in Comparative Example 1 in Table 1 were mixed, and the mixture was heated to 1 ° C and stirred until it became liquid. -27- 201016652 Body flux. In addition, the liquid flux is liquid at atmospheric pressure and room temperature, and will not recrystallize when cooled to 5 ° C. Moreover, the liquid flux is at atmospheric pressure, The viscosity (Pa · s) in an atmosphere of 23 °C is listed in Table 1. [3] Help Evaluation of the flux The fluxes obtained in Examples 1 to 6 and Comparative Example 1 were evaluated, and the results are shown in Table 2. φ (Production of oxide film (copper oxide) substrate) Copper was deposited at a thickness of ΙΟ/zm A copper substrate was fabricated on a wafer (thickness: 1 mm, diameter: 20 cm). Then, the copper substrate was placed on a hot plate at 200 ° C for 1 hour under atmospheric pressure in air to obtain a single-sided fully oxidized oxide film. (Copper oxide) substrate (Production of oxide film (tin oxide) substrate) ® Tin is deposited on a tantalum wafer (thickness: 1 mm, diameter: 20 cm) by a thickness of 10 μm. Then, the tin substrate is formed. Placed in an atmosphere of 20 atmospheres in air (heated on a TC heating plate for 6 hours to obtain a single-sided, fully oxidized oxide film (tin oxide) substrate. (1) Evaluation of solid flux with an oxide film (copper oxide) substrate The adhesion of (Examples 1 to 4) was measured by taking 5 g of a solid flux, which was uniformly spread on the above oxide film (copper oxide) substrate (oxide film formation surface), and heated on a hot plate -28-201016652 The solid flux until it becomes liquid. After melting the flux dispersed on the substrate, another oxide film substrate of the same type is superposed on the oxide film forming surface in contact with the flux in a molten state, and the oxide film forming faces of the two oxide film substrates are fused. The flux was adhered without a gap. The two oxide film substrates after the adhesion were cooled to room temperature, and the oxide film (copper oxide) substrate was visually evaluated for robustness. The case of the adhesion was evaluated as " ", which was not strong. The evaluation was "X". (2) The adhesion of the solid flux (Examples 1 to 4) was evaluated on an oxide film (tin oxide) substrate, and 0.5 g of a solid flux was uniformly dispersed in the above oxide film ( On the substrate of the tin oxide (oxide film formation surface), the solid flux is heated on the hot plate until it becomes liquid. Then, after the co-solvent dispersed on the substrate is melted, another oxide film substrate of the same type is superposed so that the oxide film forming surface is in contact with the flux in a molten state, and the oxide film forming faces of the two oxide film substrates are fused. The flux adheres without gaps. ® The two oxide film substrates after the adhesion were cooled to room temperature to visually evaluate whether or not the oxide film (tin oxide) substrate was firmly adhered. In the case of strengthening, the evaluation was "〇", and when it was not strong, it was evaluated as "xj. (3) The adhesion of the liquid flux (Examples 5 and 6 and Comparative Example 1) was evaluated on an oxide film (copper oxide) substrate. The liquid flux is uniformly applied to the oxide film (copper oxide) substrate (oxide film formation surface), and another oxide film substrate of the same type is overlapped with the oxide film formation surface in contact with the liquid flux. The oxide film forming surface of the two oxide film substrates was adhered through the liquid flux -29-201016652 without gaps. After 24 hours, the oxide film (copper oxide) substrate was visually evaluated to be firmly adhered to. It is "〇", and it is evaluated as "X" when it is not strong. (4) Evaluation of the adhesion of the liquid flux (Examples 5 and 6 and Comparative Example 1) with an oxide film (tin oxide) substrate, and uniformly applying a liquid flux to the oxide film (tin oxide) substrate (Oxide film forming surface), another oxide film of the same type - the substrate is overlapped with the oxide film forming surface in contact with the liquid flux, so that the oxide film forming surface of the two @膜膜膜 substrates passes through the liquid flux without gap Ground attachment. After 24 hours, it was visually evaluated whether or not the oxide film (tin oxide) substrate was firmly adhered. The case of the strongest is evaluated as "〇", and when it is not strong, it is evaluated as ^X". (5) Oxidation film reduction evaluation of flux The respective substrates after the adhesion evaluation were heated by a heating plate. The substrate has two oxide film substrates which are adhered and overlapped by a solid flux or a liquid flux. Next, the temperature at which the reduction was exhibited was measured. This display © The temperature at which the reduction is performed when the oxide film is copper oxide, and the color of the oxide film changes from black to red gold. Further, when the oxide film is tin oxide, the temperature of the oxide film changes from purple black to white. - (6) Evaluation of residue of flux The substrates after the above adhesion evaluation were placed on a hot plate under a nitrogen atmosphere, and heated at 250 ° C for 120 minutes at the same temperature as the melting temperature of the solder. The substrate has two oxide film substrates which are adhered and overlapped by a solid flux or a liquid flux. Next, the surface of the heated oxide film substrate -30-201016652 was evaluated for the presence or absence of residue. The evaluation of the residue was carried out by visually observing the case where the dyed substrate or the blackened black was not observed at the above-mentioned heated oxide film substrate, and it was evaluated as "〇" as no residue. Further, the case of dyeing or burnt black was observed, and it was evaluated as "X" as a residue.

[Table 2] Table 2 Subsequent evaluation Reductive evaluation Residue evaluation Oxide film type Copper oxide Tin oxide Copper oxide Tin oxide Copper oxide Tin oxide Example 1 〇〇180°c 220〇C 〇〇Example 2 〇〇160° C 160 ° C 〇〇 Example 3 〇〇 180 ° C 195 〇 C 〇〇 Example 4 〇〇 160 ° C 180 ° C 〇〇 Example 5 〇〇 150 ° C 170 ° C 〇〇 Example 6 〇〇 160 ° C 200 ° C 〇〇 Comparative Example 1 XX 160 ° C 175 〇 CXX As a result of Table 2, the flux composition of the present invention is excellent not only for the reduction of metal oxides, but also excellent substrate adhesion and no There is a residue which adversely affects the insulation of the circuit, and therefore it has an excellent characteristic which the conventional flux composition does not have. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a joint part of the present invention. Fig. 2 is a partial cross-sectional view showing a method of manufacturing a joined part of -31 - 201016652 using a conductive paste containing the flux of the present invention. [Main component symbol description] 1 : Substrate 2a, 2b: junction 3a, 3b, 13a, 1 3b: conductive paste 4: electronic component ~ 5a, 5b: external electrode _ 23a, 23b: conductive bonding material (solder Wait)

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Claims (1)

201016652 VII. Patent Application No. 1 · A flux which has two divergent radicals at two positions numbered adjacent to an aromatic ring, or two in the aromatic ring A flux having an aromatic compound having two phenolic hydroxyl groups at one position, wherein one of the aromatic compounds has a melting point of 23 ° C or higher at atmospheric pressure. 2. The flux according to claim 1, wherein the aromatic compound compound has a gasification temperature of 100 ° C or more at atmospheric pressure. 3. The flux according to claim 1 or 2, wherein the aromatic compound having two phenolic hydroxyl groups at two positions adjacent to the aromatic ring is a compound represented by the following formula (1) The aromatic compound having two phenolic hydroxyl groups at two positions in which the aromatic ring is opened at one position is a compound represented by the following formula (2): [Chemical 2] [In the above formulae (1) and (2), R represents an alkyl group, and η represents an integer of 〇~4]. 4. The flux according to claim 1 or 2, wherein the aromatic compound having two phenolic hydroxyl groups at two positions adjacent to the adjacent position number of the -33-201016652 aromatic ring is represented by the following formula (3) Or a compound represented by the following formula (4), and an aromatic compound having a phenolic hydroxyl group at two positions in which the aromatic ring is jumped at one position is represented by the following formula (5) Compound: 【化3】 [5 OH (5) Tables are integers from 0 to 4]. 5. The flux according to any one of claims 1 to 4, wherein the aromatic compound contains two or more types of compounds. 6. The flux according to any one of claims 1 to 5, which is solid under an atmosphere of atmospheric pressure at 23 °C. A conductive paste comprising a flux and a conductive metal particle according to any one of claims 1 to 34 to 201016652 to 6. 8. A joint part characterized in that the conductive paste is used to join the constituent member and other constituent members using the conductive paste of the seventh aspect of the patent application. A method of manufacturing a joined component, which is a method of manufacturing a joined component obtained by joining a constituent member and another constituent member, and is characterized in that the conductive paste is coated on the constituent member in the seventh aspect of the patent application. The coating step of the conductive paste and the step of placing the component on the coated conductive paste. -35-