JP5287783B2 - Solder deterioration inspection method and apparatus - Google Patents

Description

  The present invention relates to a solder deterioration inspection method and apparatus for accurately and easily inspecting a deterioration state of a solder paste.

  Conventionally, solder made of tin or lead has been used in mounting components such as chips on the surface of a substrate. As an example, there is a method in which solder is printed on the surface of a substrate using a mask in which holes having a required pattern are formed, the component is placed on the printed solder, and the component and the substrate are joined in a reflow furnace. Here, the solder printed on the substrate is a mixture of solder powder and viscous paste-like flux, and is called solder paste or solder paste. This solder paste is easily deteriorated by the influence of heat. For example, a film of a deteriorated solder material is generated on the surface of the solder paste, or the viscosity of the solder paste itself is increased. It is known that the sex decreases. Therefore, the solder paste manufactured by a solder manufacturer is stored in a low-temperature atmosphere of about 0 ° C. to 10 ° C. until the user uses it, thereby suppressing the deterioration of the solder paste.

  By the way, in the automobile industry, for example, the “ELV Directive (End of Life Vehicles Directive)” in Europe, which attempts to reduce the amount of harmful substances used for the purpose of reducing the environmental burden, is related to materials used in automobiles. The movement to regulate materials that have a large environmental impact is becoming active in various countries around the world. Therefore, development of environmental materials that do not contain harmful substances such as lead and can reduce the environmental impact load is demanded for the entire automobile.

  Examples of the environmental material described above include lead-free solder that can reduce the environmental load and has less influence on the human body. When lead-free solder is disposed of as landfill waste, the risk of lead leaking into the surrounding environment and contaminating the natural environment is low, and the danger of workers inhaling harmful lead vapor during soldering This is a material that is being developed and popularized.

  However, lead-free solder has a problem that the solder paste tends to deteriorate because the content of tin with high reactivity is high as compared with the conventional tin-lead solder material. In addition, since the melting point is higher than that of a solder material containing lead, it is hard and has little elongation, wettability is reduced. Therefore, while it is necessary to make the activity of the activator contained in the solder paste flux strong, this causes the problem that the deterioration of the solder paste is promoted this time.

  Development of solder powder for low melting point lead-free solder containing low melting point elements bismuth, zinc, and indium, and development of solder powder with addition of metal elements that suppress solder powder reactivity, Although development of a flux that has no activity near room temperature and can exhibit high activity near the melting point is underway, even when stored in a low temperature atmosphere, it is possible to completely suppress the deterioration of the solder paste caused by them Can not. In addition, lead-free solder is more susceptible to thermal degradation than conventional lead-containing solder, so it is managed under stricter storage conditions when stored in a low-temperature atmosphere. It is difficult to completely suppress the deterioration of the solder paste.

  Therefore, it is possible to inspect the deterioration state of the solder paste before using the solder paste. By this inspection, it is possible to grasp the characteristics such as the viscosity of the solder paste, and to suppress solder printing defects and improve the production efficiency. Development of a method and apparatus is desired.

  By the way, as a conventional published technique related to the solder deterioration inspection method described above, methods disclosed in Patent Documents 1 and 2 can be cited. The solder deterioration inspection method disclosed in Patent Document 1 separates two members in which a solder paste is interposed, emits light to the solder paste positioned between the two members, and passes through the two members, or The light reflected by the solder paste is measured, the viscosity change of the solder paste is evaluated, and the deterioration state of the solder paste is inspected. In addition, the solder deterioration inspection method disclosed in Patent Document 2 detects the temperature of the solder paste contained in the container based on the change in the color and number of the temperature sensing label attached to the inner wall surface of the solder paste transparent container. By doing so, the deterioration state of the solder paste can be inspected.

JP 2006-242927 A JP 2005-271030 A

  In the solder deterioration inspection method disclosed in Patent Document 1, a light projecting unit that emits light and a light receiving unit that receives light are provided, and two members with solder paste interposed are installed in the inspection device. Thus, it is necessary to evaluate the viscosity of the solder paste while separating the two members. For this reason, the inspection apparatus becomes larger and more time is required for measuring the viscosity, which is not preferable as a method for inspecting solder paste that deteriorates with time. Moreover, in the solder deterioration inspection method disclosed in Patent Document 2, the deterioration state of the solder paste is inspected by measuring the temperature of the solder paste only near the side of the solder paste container, which is closest to the outside air and has the largest temperature change. Yes, the exact deterioration state of the solder paste in the entire container cannot be inspected. Therefore, the establishment of a solder deterioration inspection method and apparatus capable of shortening the time required for inspection and precisely inspecting the deterioration state of the entire region of the solder paste in the container has become an urgent solution in the technical field.

  The present invention has been made in view of the above-described problems, and when using a solder paste, the solder paste can be accurately and easily inspected for deterioration, and the solder paste that can be originally used by eliminating the deteriorated solder paste. An object of the present invention is to provide a solder deterioration inspection method and apparatus capable of realizing improvement of product quality and effective use of solder paste by sorting out the above.

  In order to achieve the above object, a solder deterioration inspection method according to the present invention comprises a solder deterioration inspection apparatus comprising a container for containing a solder paste and an inspection material having an oxide film made of a metal oxide on a base material surface. A solder deterioration inspection method for inspecting a deterioration state of a solder paste using a step of immersing at least a part of the oxide film of the inspection material in the solder paste of the container; and Removing the paste and inspecting the discoloration of the oxide film.

  Here, the solder paste is composed of solder powder and flux, and as lead-free solder powder, tin-copper, tin-silver, tin-silver-copper, low melting point elements, etc. Bismuth, zinc, indium, tin-silver-copper-bismuth, tin-silver-bismuth-indium, tin-zinc, tin-bismuth, low melting point lead-free solder powder, gold and Examples thereof include tin-gold-based and tin-antimony-based solder powders containing antimony.

  Further, the flux in the lead-free solder paste is composed of rosin, activator, thixotropic agent, solvent and the like.

  Examples of the rosin include natural rosin (pine resin), polymerized rosin, hydrogenated rosin, maleated rosin, and rosin derivatives.

  In addition, the solvent dissolves the solid components to give excessive viscosity, and many organic solvents can be used. For example, diethylene glycol monoethylene ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol diester Butyl ether or the like can be used.

  Further, the thixotropic agent can be mixed with the paste-like flux and the solder powder and then maintained so that they do not separate and contribute to printability. For example, hydrogenated castor oil, coconut oil, etc. Can be used.

  The activator removes the oxide film of the metal to be joined, and is mainly an organic acid (carboxylic acid). For example, monocarboxylic acid formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid Enthanoic acid, caprylic acid, benzoic acid and the like, dicarboxylic acid oxalic acid, malonic acid, succinic acid, glutamic acid, adipic acid, pimelic acid, suberic acid, maleic acid and the like can be used. In addition, hydrohalic acid, amine / organic acid, etc. of amine to which halogen is added to improve the activity are used. Examples of hydrohalic acid include methylamine hydrochloride, methylamine hydrochloride, ethylamine hydrochloride. , Ethylamine bromide, diethylamine hydrochloride, diethylamine bromide and the like.

  According to the solder deterioration inspection method of the present invention, the inspection material and the solder paste are accommodated in the container so that at least a part of the inspection material having an oxide film made of a metal oxide is immersed in the solder paste. The deterioration state of the solder paste can be inspected by a simple method of removing the inspection material from the solder paste before use and inspecting the discoloration of the oxide film. That is, since the time required for the inspection can be shortened, the deterioration of the solder paste being inspected can be suppressed, so that it is possible to accurately inspect the deterioration state of the solder paste.

  Note that the discoloration of the oxide film in the present invention can be easily confirmed visually, and no additional device for inspection is required. The degree of discoloration and its distribution can be inspected more precisely by taking in the image and analyzing and inspecting with image analysis software.

  Here, the base material used for the inspection material of the present invention is preferably made of a single metal or alloy contained in the composition of the resin or solder paste. Furthermore, the metal oxide used for the oxide film is preferably composed of a single metal or alloy oxide contained in the composition of the solder paste.

  For example, when a solder paste containing tin-silver-copper solder powder is used, a base material or metal made of a metal made of any one of tin, silver, copper, or an alloy containing a plurality of them. By using an oxide, it has affinity with the solder paste, and can suppress the wettability and printability of the solder paste.

  In another embodiment of the solder deterioration inspection method of the present invention, the solder deterioration inspection apparatus includes a plurality of the inspection materials, and a plurality of the inspection materials are immersed in the solder paste at the same time. Are simultaneously removed from the solder paste, and the discoloration of the oxide film at a plurality of positions of the solder paste is simultaneously inspected.

  The solder deterioration inspection device is equipped with a plurality of inspection materials and can simultaneously inspect the deterioration state of a plurality of locations of the solder paste, so that it is not limited to the inspection of the deterioration state of the solder paste in the vertical direction of the inspection material, but is stored in a container. The entire area of the solder paste can be inspected, and the distribution of the three-dimensional deterioration state of the solder paste in the container can be inspected. Therefore, by detecting easily and precisely the distribution of the deterioration state of the solder paste in the container, it is possible to suppress the defective rate such as solder printing, and by identifying and discarding only the deteriorated part, The amount of waste can also be reduced.

  Here, it is preferable that the inspection material has a base material exposed portion that does not cover the oxide film at least at a lower end portion thereof, and the base material exposed portion is immersed in the solder paste.

  By providing a base material exposed part at least at the lower end of the inspection material, there is no need for a reference material such as a color sample to be immersed at the same time as the inspection material, and the degree of discoloration between the previously inspected base material and the deteriorated oxide film From this correlation, the inspection of the deterioration state of the solder paste becomes easier.

  In addition, if the base material exposed part and the oxide film are alternately arranged in the vertical direction of the inspection material or the form alternately arranged in the circumferential direction of the side surface of the inspection material, In various parts, since the base material exposed part which becomes the color reference and the oxide film which changes color can be provided adjacently, the deterioration state of the solder paste can be inspected more precisely.

  By the way, when the base material is made of a single metal or alloy contained in the composition of the solder paste, the exposed portion of the base material that does not cover the oxide film is oxidized and discolored by oxygen in the air. In particular, when the base material exposed portion is not immersed in the solder paste, it reacts with oxygen in the container even during storage of the solder paste, and cannot function as the color reference described above.

  Therefore, a container that accommodates a solder paste including a desiccant and a deoxidizing material has been developed. As the container, for example, a container provided with a desiccant or a deoxidizing material inside the outer lid of the container, an oxygen permeable film is arranged on the inner side of the side or bottom of the container, and the container has a double structure, Examples of the container include a desiccant or a deoxidizing material between the container and the oxygen permeable film.

  However, in the conventional container described above, a space provided with a desiccant or a deoxidizing material is required in the container, and the container is enlarged, and the capacity of the solder paste that can be accommodated in the container is reduced. Moreover, when taking out the solder paste in a container from a container with tools, such as a spatula, an oxygen-permeable film may be damaged.

  Therefore, the inspection material used in the solder deterioration inspection method of the present invention itself is provided with a desiccant or a deoxidizing material, and a part of the desiccant or the deoxidizing material is exposed from the surface of the inspecting material. It is.

  Since the inspection material itself includes a desiccant or a deoxidizing material, a space for the desiccant or the deoxidizing material in the container becomes unnecessary, and the capacity of the solder paste can be assured by suppressing an increase in the size of the container. Moreover, it becomes possible to arrange | position a desiccant and a deoxidation raw material close to a base material exposed part, and it also leads to the increase in an oxidation inhibitory effect.

  In addition, the thickness of the oxide film of the inspection material is uniform, or changes continuously in the vertical direction of the inspection material or in the circumferential direction of the side surface of the inspection material, or of the inspection material Various forms can be used such as changing in a multi-stage shape in the vertical direction or in the circumferential direction of the side surface of the inspection material.

  As described above, the discoloration of the oxide film of the inspection material changes depending on the degree of deterioration of the solder paste, while when the thickness of the oxide film changes, the thickness of the oxide film reduced by the activator of the solder paste and the mother Since the ratio of the thickness of the non-reduced oxide film remaining in the vicinity of the material changes, the color of the inspection material also changes in accordance with the change in the thickness of the oxide film.

  Therefore, the distribution of the deterioration state of the solder paste in the vertical direction of the inspection material can be inspected by changing the thickness of the oxide film continuously or in multiple stages in the vertical direction of the inspection material. In addition, by changing the thickness of the oxide film continuously or in multiple stages in the circumferential direction of the side surface of the inspection material, the degree of deterioration of the solder paste at a desired height in the vertical direction of the inspection material is further refined. Can be inspected.

  Furthermore, the solder deterioration inspection method according to the present invention further includes the steps of manufacturing the solder paste, storing the solder paste in the container, and storing the solder paste stored in the container, The inspecting step is executed between the storing step and the storing step to evaluate an abnormality of the activator of the solder paste.

  The solder deterioration inspection method may further include a step of using the solder paste after storage, and the inspection step is performed between the storage step and the use step to store the solder paste. It is possible to evaluate abnormalities in the state.

  According to the inspection method of the above-described form, it is possible to individually evaluate the abnormality of the active agent and the abnormality of the storage state that may cause the deterioration of the solder paste. In other words, during the period from when the manufactured solder paste is stored in the container to when the container is stored in a low temperature atmosphere, the discoloration of the oxide film is inspected using an inspection material, and the deterioration state of the solder paste is evaluated. By doing so, abnormality of the activator in the solder paste before storage can be evaluated. Also, after storing the container in a low-temperature atmosphere and before using the solder paste in the container, the test material is used to inspect the discoloration of the oxide film and evaluate the abnormality of the deterioration state of the solder paste. Thus, the abnormal storage state of the solder paste can be evaluated.

  The solder deterioration inspection apparatus according to the present invention is a solder deterioration inspection apparatus comprising a container for containing a solder paste, and an inspection material having an oxide film made of a metal oxide on the surface of a base material. The container of the deterioration inspection apparatus includes a container main body that accommodates the solder paste and an outer lid that fits the container main body and seals the container, and at least one of the inspection materials is fixed to the outer cover. When the container is sealed, at least a part of the oxide film of the inspection material is immersed in the solder paste, and when the container is opened, the inspection material is taken out of the solder paste so that the discoloration of the oxide film can be inspected. It is what has become.

  According to the solder deterioration inspection apparatus of the present invention, when the inspection material having an oxide film is fixed to the outer lid of the container, when the outer lid is fitted to the container body and the container is sealed, the oxide film of the inspection material A part of the substrate is immersed in the solder paste of the container body, and at the same time as the container is opened, the inspection material can be taken out of the solder paste and the discoloration of the oxide film can be inspected. Accordingly, it is not necessary to separately take out the inspection material, the time required for the removal is reduced, the deterioration of the solder paste being inspected is suppressed, and a precise inspection of the deterioration state of the solder paste is possible. In addition, a device for taking out the inspection material is not required, contamination of the foreign matter into the solder paste being inspected can be suppressed, and deterioration of the quality of the solder paste due to forgetting to take out the inspection material can be suppressed.

  Further, the container of the solder deterioration inspection apparatus of the present invention includes an inner lid above the solder paste to be accommodated, and the inner lid penetrates the inspection material fixed to the outer lid when the container is sealed and opened. It is preferable to have a through-hole.

  The container body is provided with an inner lid having a through hole, the through hole has a slightly larger diameter than the inspection material, and the inspection material fixed to the outer lid has the through hole when the container is sealed or opened. By being able to penetrate, excess solder paste adhered to the inspection material can be removed from the inspection material surface by the inner lid when the container is opened. Therefore, the time for wiping off the excess solder paste is not required, and the discoloration of the inspection material can be easily inspected.

  In addition, since each of the container body and the outer lid is provided with an index indicating a corresponding position when the container is sealed, even after the container is opened and the inspection material is taken out of the solder paste, The position in the container body can be detected.

  In addition, a surface of the inner surface of the outer lid on which the inspection material is fixed is provided with a rotating plate that can rotate with respect to the outer lid, and the inspection material is fixed to the rotating plate of the outer lid. For example, even in a screw-type outer lid, a solder paste having a viscosity of about 200 Pa · S becomes a resistance, and the rotation of the inspection material in the solder paste when the container is opened can be suppressed. Therefore, the deterioration state of the solder paste can be inspected at a fixed point in the container by the inspection material, and a more precise inspection of the deterioration state can be performed.

  Another embodiment of the solder deterioration inspection apparatus according to the present invention is a solder deterioration inspection apparatus comprising a container for containing a solder paste and an inspection material having an oxide film made of a metal oxide on the surface of the base material. The plurality of inspection materials are removably disposed in the container, and at least two or more compartments are formed inside the container by the plurality of inspection materials, and at least one of the oxide films of the inspection material is formed. A portion is immersed in the solder paste, and each inspection material is individually taken out from the solder paste so that the discoloration of each oxide film can be inspected.

  According to the solder deterioration inspection apparatus described above, at least two or more sections are formed in the container by a plurality of inspection materials, and each inspection material can be individually taken out from the solder paste. It is possible to inspect the discoloration of the corresponding inspection material individually and inspect the distribution of the deterioration state of the solder paste in the container. In addition, because the inside of the container is divided into a plurality of sections by the inspection material, only the solder paste of the section determined to be deteriorated based on the above-described inspection is extracted from the container and partially discarded. This leads to a reduction in the amount of solder paste discarded.

  Here, if the inspection material is arranged so as to be directed from the center of the container toward the outer edge and at least two or more sections are formed inside the container, a fan-shaped section in the container is seen in a plan view. Can be formed uniformly.

  In the solder deterioration inspection method of the present invention, at least a part of an inspection material having an oxide film made of a metal oxide is immersed in the solder paste, and the inspection material is taken out from the solder paste to inspect the discoloration of the oxide film. Thus, since the time required for the inspection can be suppressed and the deterioration state of the solder paste can be inspected, the solder deterioration inspection method becomes precise and simple. Further, the time required for the inspection can be further shortened by the solder deterioration inspection apparatus of the present invention, and the deterioration state of the solder paste in the container can be inspected more precisely.

  As can be understood from the above description, according to the solder deterioration inspection method and apparatus of the present invention, before use of the solder paste, the solder paste relating to the abnormality of the activator and the storage condition which may cause the deterioration of the solder paste. A solder deterioration inspection method that can improve the product quality and effectively use the solder paste by selecting the solder paste that can be used essentially by excluding the deteriorated solder paste The apparatus can be provided.

It is the schematic diagram which showed the solder deterioration test | inspection apparatus of this invention. It is the figure which showed the atmospheric temperature from manufacture of a solder paste to use in time series. (A), (b) is the perspective view which showed other embodiment of the test | inspection material shown in FIG. (A), (b) is each the perspective view which showed the test | inspection material which added the deoxidation raw material to the test | inspection material shown in FIG. (A), (b) is the perspective view which showed the form from which the thickness of the oxide film of an inspection material shown in FIG. 1 changes toward an up-down direction. (A), (b) is a perspective view which showed the form from which the thickness of the oxide film of the test | inspection material shown in FIG. 1 changes in the circumferential direction of the side surface of a test | inspection material. (A), (b) is each the schematic diagram which showed the apparatus for manufacturing the test | inspection material shown in FIG. It is the schematic diagram which showed the form which added the inner cover to the solder deterioration test | inspection apparatus shown in FIG. (A) is the perspective view which showed embodiment of the solder deterioration inspection apparatus which has a some test | inspection material, (b) is a BB arrow line view of (a), (c) is (b). It is a CC arrow line view. It is the figure which added the parameter | index to the container of the solder degradation inspection apparatus shown in FIG. It is the figure which added the rotating plate to the outer cover of the container of the solder degradation inspection apparatus shown in FIG. It is the perspective view which showed other embodiment of the solder deterioration test | inspection apparatus of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a solder deterioration inspection apparatus according to the present invention, FIG. 2 is a view showing the ambient temperature from manufacture to use of solder paste in time series, and FIGS. It is the figure which showed other embodiment of the test | inspection material shown by. The inspection material is not limited to the shape in the illustrated example, and can be changed to a desired shape such as a rectangular parallelepiped, a polygonal column, a cone, or a polygonal pyramid. FIG. 7 is a view showing an apparatus for manufacturing the inspection material shown in FIG. 8 is a view in which an inner lid is added to the solder deterioration inspection apparatus shown in FIG. 1, and FIGS. 9 to 11 are views showing an embodiment of the container of the solder deterioration inspection apparatus having a plurality of inspection materials. FIG. 12 is a view showing another embodiment of the solder deterioration inspection apparatus of the present invention. Here, like the inspection material, the shape of the container is not limited to the illustrated example, and can be changed to a desired shape such as a rectangular parallelepiped or a polygonal column.

  A solder deterioration inspection apparatus 100 shown in FIG. 1 includes a container 10 for containing a solder paste 9 and an inspection material 20. The container 10 includes a container main body 1 and an outer lid 2. The male screw 1 a provided on the side wall of the container main body 1 and the female screw 2 a provided on the side wall of the outer lid 2 are fitted together so that the container 10 is sealed. It has become. Further, the inspection material 20 has an oxide film 12 made of a metal oxide on the side surface and bottom surface of the base material 11, and the upper portion thereof is fixed to the approximate center of the outer lid 2, so that the inspection material 20 is inspected when the container 10 is sealed. A part of the oxide film 12 of the material 20 is immersed in the solder paste 9.

  Here, the deterioration state of the solder paste 9 will be described with reference to the drawings. The solder paste 9 is composed of solder powder 9a and flux 9b, and the metal salt 9c increases in the flux 9b depending on the storage state of the solder paste 9 and the like. In particular, in the flux 9b where the activity of the activator such as lead-free solder is strong, the activator and the solder powder 9a react (arrow K1) and the solder paste 9 deteriorates, while the inspection material 20 has the oxide film 12. Thus, the activator reduces the oxide film 12 of the inspection material 20 (arrow K2), and the deterioration of the solder paste 9 is suppressed compared to the conventional solder paste.

  With reference to FIG. 2, the ambient temperature from manufacture to use of the solder paste will be described in time series. Solder paste is produced by kneading solder powder and flux in a high temperature atmosphere at a solder paste manufacturer (section A), then cooled to room temperature (section B) and stored in a container (section C). In order to suppress the deterioration of the solder paste, it is further cooled to a low temperature state of about 0 ° C. to 10 ° C. (section D). Then, after being stored in the manufacturer's storage room in a low temperature atmosphere until shipment to the user (section E), it is transported to the user in a state where the temperature is controlled in a low temperature atmosphere as necessary (section F). Before use, the user manages in the user's storage room under a low-temperature atmosphere (section G), and then removes the required amount of solder paste from the storage room when using the solder paste, and keeps it in the room temperature atmosphere for about 1 hour. It is returned to room temperature by being left in the plate or stirred for several minutes (section H) and used for printing on a substrate or the like (section I).

  In the solder deterioration inspection apparatus 100 shown in FIG. 1, first, the solder paste 9 after manufacture is accommodated in the container body 1, and the container 10 is sealed by rotating the outer lid 2 clockwise with respect to the container body 1. Then, a part of the oxide film 12 of the inspection material 20 fixed to the outer lid 2 is immersed in the solder paste 9. The sealed container 10 is cooled to a low temperature state of 0 ° C. to 10 ° C., and the inspection material 20 is immersed in the solder paste 9 in a low temperature atmosphere during storage and transportation by the manufacturer or user. When using the solder paste, the user returns the solder paste 9 and its container 10 stored in a low temperature environment to room temperature, and rotates the outer lid 2 counterclockwise with respect to the container body 1 to open the container 10. Is done. Here, since the inspection material 20 is fixed to the outer lid 2, the inspection material 20 can be taken out of the solder paste 9 simultaneously with the opening of the container 10, and the discoloration of the oxide film 12 is inspected, and the solder paste 9 Can be inspected for deterioration.

  In the inspection of discoloration, visual inspection is also possible, but by taking the inspection material after discoloration with a photograph or video, importing it into a computer and analyzing it with image analysis software, the degree of discoloration and its The distribution can be inspected more precisely.

  The thickness of the oxide film 12 can be changed according to the activation power and guarantee period of the solder paste, and is generally preferably in the range of 1 nm to 1000 nm. Considering the vibration at the time, the convenience of visual inspection, etc., it is preferably 10 mm or more.

  Here, the process from solder paste to inspection is performed as described above, for example, when the solder paste is contained in a container, the manufacturer that manufactures the solder paste immerses the inspection material in the solder paste, and uses the solder paste. However, before use, the inspection material may be taken out and the deterioration state of the solder paste may be inspected, or all processes up to the inspection may be performed by the same person.

  Further, by performing the above-described inspection in several steps before use, it is possible to individually evaluate the abnormality of the active agent and the abnormality of the storage state that may cause the deterioration of the solder paste. That is, in the step before storage of the solder paste corresponding to the sections C and D shown in FIG. 2, the inspection material 20 is taken out from the container 10 and inspected for the deterioration state of the solder paste 9 from the discoloration of the oxide film 12. Abnormalities of activator in the solder paste before can be evaluated. Further, in the step after the section E shown in FIG. 2 and before using the solder paste, the inspection material 20 is taken out of the container 10 and the deterioration state of the solder paste 9 is inspected from the discoloration of the oxide film 12. Abnormality of paste storage status can be evaluated.

  Next, another embodiment of the inspection material shown in FIG. 1 will be described with reference to FIGS.

  In the inspection material 30A shown in FIG. 3a, the base material exposed portions 21A and the oxide films 22A are alternately arranged in the circumferential direction of the side surface of the inspection material 30A, and the inspection material 30B shown in FIG. The oxide films 22B are alternately arranged in the vertical direction of the inspection material 30B. When the container is sealed, each of the base material exposed portions 21A and 21B and the oxide films 22A and 22B can be immersed in the solder paste, and the base material exposed portion and the oxide film are adjacent to each other, thereby oxidizing the base material. The relative comparison of the deterioration state of the film is facilitated, and the deterioration state of the solder paste can be easily and precisely inspected using the base material exposed portion as a color standard.

  The base material exposed portion and the number of oxide films and the thickness of each oxide film can be changed as desired, and at least the base material exposed portion is provided at the lower end portion of the inspection material, so that the base material exposed portion serving as a color sample is provided. Is immersed in the solder paste, an additional member that becomes a color reference is not required, and the deterioration of the solder paste can be easily inspected.

  The inspection material shown in FIG. 4 is an inspection material obtained by adding a deoxidizing material to the inspection material shown in FIG. The inspection material 40A shown in FIG. 4A is provided with perforations 33A in the base material exposed portions 31A and the oxide film 32A that are alternately arranged in the circumferential direction on the side thereof, and the deoxidizing material 34A is disposed in the perforations 33A. The deoxidizing material 34A is partly exposed on the surface of the inspection material 40A. Further, the inspection material 40B shown in FIG. 4B is provided with perforations 33B in the base material exposed portions 31B and the oxide film 32B which are alternately arranged in the vertical direction on the side portions, and the perforations 33B are deoxidized. The material 34B is disposed, and a part of the deoxidizing material 34B is exposed on the surface of the inspection material 40B. Therefore, by having a deoxidation raw material itself, the antioxidant effect of a base material exposure part increases, and the oxidation of a base material exposure part can be suppressed efficiently.

  It should be noted that the number and arrangement of the perforations and the base material exposed portion can be changed as desired based on the antioxidant effect of the base material exposed portion. Moreover, the form which provides a through-hole in the desired position of a test | inspection material, distributes a deoxidation raw material and a desiccant in the through-hole, and exposes the part on the surface of a test | inspection material may be sufficient.

  FIG. 5 shows an inspection material of another embodiment of the inspection material shown in FIG. The inspection material 50A shown in FIG. 5a continuously changes so that the thickness of the oxide film 42A disposed on the surface of the base material 41A increases toward the upper side of the inspection material 50A. Further, in the inspection material 50B shown in FIG. 5b, the thickness of the oxide film 42B arranged on the surface of the base material 41B changes so as to increase in a multi-step shape above the inspection material 50B. Here, when the oxide films 42A and 42B are immersed in the solder paste for a certain period of time, the portions where the thicknesses of the oxide films 42A and 42B are thinner than the portions where the thicknesses of the oxide films 42A and 42B are thicker. The discoloration above is large. Further, when the solder paste is deteriorated, the colors of the oxide films 42A and 42B greatly change. Therefore, by previously correlating the thickness of the metal oxide oxide film and the deterioration state of the solder paste, the deterioration of the solder paste The state can be inspected more precisely.

  Note that the thicknesses of the oxide films 41A and 41B included in the inspection materials 50A and 50B shown in FIG. 5 may be continuously changed so as to increase toward the lower side of the inspection material, or below the inspection material. It may be a form that changes in multiple stages so as to increase toward the bottom.

  The inspection material shown in FIG. 6 with respect to the inspection material shown in FIG. 5 is an inspection material in which the thickness of the oxide film changes in the circumferential direction of the side surface of the inspection material. In the inspection material 60A shown in FIG. 6a, the thickness of the oxide film 52A disposed on the surface of the base material 51A continuously changes in the circumferential direction on the side surface of the inspection material 50A. Further, in the inspection material 60B shown in FIG. 6b, the thickness of the oxide film 52B disposed on the surface of the base material 51B changes in a multi-stage shape in the circumferential direction of the side surface of the inspection material 60B. That is, since the inspection materials 60A and 60B have the thick portions 52Aa and 52Ba and the thin portions 52Ab and 52Bb of the oxide films, the oxide films 52A and 52B can be formed at the desired height of the inspection materials 60A and 60B. By inspecting the color change, the deterioration state of the solder paste can be inspected more precisely.

  Next, an apparatus for manufacturing the inspection materials 50A and 50B shown in FIG. 5 will be described with reference to FIG. 7a is an apparatus for manufacturing the inspection material 50A shown in FIG. 5a, and FIG. 7b is an apparatus for manufacturing the inspection material 50B shown in FIG. 5b.

  The heating chamber C1 shown in FIG. 7a has an opening C1a through which the inspection material 70A can penetrate, and an opening C1b for discharging a metal oxide on the side thereof. The heating chamber C1 is connected to the storage chamber S1 for storing the metal oxide by a connecting pipe L1, and the metal oxide can be discharged into the heating chamber C1 through the connecting pipe L1. Note that the amount of the metal oxide discharged can be changed based on the thickness of the oxide film formed on the inspection material, the temperature, oxygen concentration, humidity, and the like of the gas containing the metal oxide.

  The base material 61A of the inspection material 70A is attached to the shaft D11 of the delivery machine D1, and the inspection material 70A can be delivered into the heating chamber C1 through the opening C1a by the driving means D12 of the delivery machine D1. After the formation of the oxide film 62A on the surface of the base material 61A, the inspection material 70A can be taken out from the heating chamber C1.

  Therefore, if the base material 61A of the inspection material 70A is attached to the shaft D11 and the base material 61A is fed into the heating chamber C1 at a constant speed, a certain amount of metal oxide is discharged from the opening C1b to the heating chamber C1. As described with reference to 5a, the inspection material 70A in which the thickness of the oxide film 62A increases toward the upper side of the inspection material 70A is manufactured.

  The heating chamber C2 shown in FIG. 7b has the same configuration as that of the heating chamber C1 shown in FIG. 1, but includes a shielding plate C2c for dividing the heating chamber C2 into four sections. The four compartments inside the heating chamber C2 can be set under different atmospheres. In addition, each shielding plate C2c is provided with an opening C2d through which the inspection material 70B can pass.

  After the base material 61B of the inspection material 70B is attached to the shaft D21 of the delivery machine D2, the inspection material 70B is delivered into the heating chamber C2 through the opening C2a by the driving means D22 of the delivery machine D2, and then heated. A certain amount of metal oxide is discharged from the opening C2b into the chamber C2. By discharging different amounts of metal oxide in each section, the inspection material 70B in which the thickness of the oxide film 62B changes in a multi-step shape in the vertical direction of the inspection material 70B as described in FIG. 5b. The inspection material 70B is taken out from the heating chamber C2 by the delivery machine D2, and the inspection material 70B is manufactured.

  Note that the base material 61B may be delivered to the above-described heating chamber C2 while discharging the metal oxide. In addition, the number of divisions of the heating chamber C2 and the thickness of the oxide film 62A to be formed can be changed as desired, and the thickness of the oxide film can also be changed by the feeding speed of the feeder.

  Further, an inspection material having a uniform thickness in the circumferential direction of the base material can be manufactured by discharging the metal oxide while forming the oxide film while rotating the base material in the heating chamber.

  Next, another embodiment of the solder deterioration inspection apparatus shown in FIG. 1 will be described with reference to FIG. Note that the description of the same configuration in FIG. 8 as in FIG. 1 is omitted.

  In the container main body 1A shown in FIG. 8, an inner lid 3A is arranged above the solder paste 9A to be accommodated, and the outer lid 2A is rotated clockwise relative to the container main body 1A on the inner lid 3A. When the is sealed, a through hole 4A through which the inspection material 20A fixed to the outer lid 2A can pass is arranged at the approximate center of the inner lid 3A. Since the through-hole 4A has a slightly larger diameter than the inspection material 20A, when the container 10A is opened, the excess solder paste 9A attached to the inspection material 20A by the inner lid 3A is removed from the inspection material 20A. This eliminates the need to remove excess solder paste from the surface of the inspection material 20A, and facilitates inspection of the reduced oxide film 12A.

  FIG. 9 shows another embodiment of a solder deterioration inspection apparatus in which a plurality of inspection materials described above are provided simultaneously. 9a is a perspective view of the present embodiment, FIG. 9b is a view taken along the line BB of the embodiment shown in FIG. 9a, and FIG. 9c is a view taken along the line CC of the cross-sectional view of FIG. 9b.

  Referring to FIG. 9a, five inspection materials 20B are fixed to the outer lid 2B at four equally spaced positions that divide the approximate center and the container body 1B into four equal parts, and the container 10B is sealed. Sometimes, these inspection materials 20B are immersed in the solder paste at the same time, and when the container 10B is opened, they can be taken out from the solder paste at the same time. Therefore, by inspecting the inspection material 20B taken out at the same time, the three-dimensional distribution of the deterioration state of the solder paste 9B in the container 10B can be inspected, and the deterioration state of the solder paste 9B can be inspected more precisely. . Moreover, by discarding only the site where degradation has been confirmed, for example, with a spatula or the like, the amount of discarded solder paste can be reduced.

  Referring to FIG. 9b, the container body 1B is provided with an inner lid 3B having a through hole 4B through which the inspection material 20B having the oxide film 12B can pass, and adheres to the inspection material 20B when the container 10B is opened. The excess solder paste 9B is removed by the inner lid 3B. Therefore, when inspecting a plurality of inspection materials 20B taken out at the same time, it is not necessary to wipe off excess solder paste adhering to each inspection material 20B, the inspection time can be shortened, and discoloration of the inspection material 20B can be easily performed. Can be inspected.

  In the present embodiment, since the inner lid 3B is fixed to the container main body 1B and the inspection material 20B is fixed to the outer lid 2B, the container main body 1B and the outer lid 2B are screwed together. The container 10B is hermetically sealed by fitting the convex portion 1Ba disposed on the side wall of the container main body 1B and the concave portion 2Ba disposed on the side wall of the outer lid 2B (see FIG. 9c).

  In addition, the radix and arrangement of the inspection material in the above-described form, the length of the inspection material, and the like can be changed according to the activation power and guarantee period of the solder paste activator, the inspection resolution, etc. The thickness of each can also be different.

  FIG. 10 shows another embodiment of the container used in the solder deterioration inspection apparatus of the present invention. Here, in the illustrated embodiment, as shown in FIG. 9, a solder deterioration inspection device in which a plurality of inspection materials are fixed to the outer lid, or a container that rotates and seals and opens the outer lid with respect to the container body It is effective for a solder deterioration inspection apparatus having

  Each of the container body 1C and the outer lid 2C shown in the figure is provided with indicators 1Ca and 2Ca at corresponding positions P when the container is sealed, and the positions of the container body 1C and the outer lid 2C at the time of sealing are determined after the container is opened. Can also be recognized. Therefore, when inspecting an inspection material (not shown) fixed to the outer lid 2C after opening the container 10C, which position of the solder paste in the container body 1C is inspected is the inspection material. It can be easily recognized, and the distribution of the deterioration state of the solder paste can be inspected precisely.

  In addition, as a form of the above-mentioned index, for example, a form in which the container is colored or a form in which a convex portion is provided at a corresponding position of the container body and the outer lid, the positions of the container body and the outer lid are after the container is opened. Various forms can be applied as long as the form can be recognized.

  FIG. 11 shows another embodiment of the outer lid of the solder deterioration inspection apparatus shown in FIG. Note that the description of the same configuration in FIG. 11 as in FIG. 9 is omitted.

  A rotating plate 5D is arranged on the inner surface 2Db of the outer lid 2D of the container 10D shown in the figure, and a plurality of inspection materials 20D are fixed to the lower surface of the rotating plate 5D. Further, the rotating plate 5D is supported by the convex portion 2Dc disposed on the outer lid 2D at the periphery thereof, so that the rotating plate 5D can rotate with respect to the outer lid 2D. Further, the illustrated container 10D is configured such that a male screw 1Da provided on the side wall of the container main body 1D and a female screw 2Da provided on the side wall of the outer lid 2D are fitted and sealed. Therefore, when the outer lid 2D is rotated with respect to the container body 1D to seal and open the container 10D, the high-viscosity solder paste 9D becomes resistant to the movement of the inspection material 20D, and the inspection material against the solder paste 9D The rotation of 20D and the rotating plate 5D is suppressed, the inspection of the deterioration state of the solder paste 9D at a fixed point by the inspection material 20D becomes possible, and the inspection of the deterioration distribution of the solder paste in the container becomes possible.

  Further, according to the embodiment described above, after the inspection of the deterioration state of the solder paste by the inspection material 20D, the rotating plate 5D to which the reduced inspection material 20D is fixed is removed from the outer lid 2D, and a new inspection material is attached to the outer lid. It becomes possible to reuse the outer lid by attaching a rotating plate having

  Next, another embodiment of the solder deterioration inspection apparatus of the present invention will be described with reference to FIG. The form of the outer lid 2 in the present embodiment can be changed to a form in which the inspection material shown in FIGS. 8 to 11 is fixed to the outer lid.

  The container main body 1E of the container 10E shown in the figure has a gripping means 6E for gripping the inspection material 20E at the center thereof, and six gripping portions 7E are arranged at equal intervals on the inner wall of the side of the container main body 1E. Has been. In addition, six concave portions 6Ea are provided at positions corresponding to the grip portion 7E of the gripping means 6E, and both ends of the inspection material 20E are gripped by the concave portion 6Ea of the grip means 6E and the concave portion 7Ea of the grip portion 7E. 20E is fixed to the container body 1E. Then, six uniform sections are formed inside the container body 1E by the six inspection materials 20E.

  Here, since the inspection materials 20E can be individually slid in the opening direction of the container body 1E, it is possible to individually inspect the discoloration of the oxide film 12E of the inspection material 20E corresponding to each section. The deterioration state of the solder paste in each section of the container body 1E can be individually inspected. Further, since the solder paste inside the container main body 1E is divided for each section, only the solder paste in the section determined to be deteriorated based on the inspection described above is taken out from the container main body 1E. It becomes possible to dispose of the solder paste, and the amount of deteriorated solder paste can be reduced.

  In addition, the cardinal number and arrangement of the sections described above, means for fixing the inspection material, and the like can be changed as desired according to the activation power of the solder paste activator, the resolution of the inspection, the material of the container, and the like.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. They are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 ... Container main body, 2 ... Outer lid, 3 ... Middle lid, 4A, 4B ... Through-hole, 5D ... Rotating plate, 6E ... Holding means, 7E ... Holding part, 9 ... Solder paste, 10 ... Container, 11 ... Base material , 12 ... oxide film, 20 ... inspection material, 100 ... solder deterioration inspection device, C1, C2 ... heating chamber, S1, S2 ... storage room, L1, L2 ... connecting pipe, D1, D2 ... delivery machine, D11, D21 ... Shaft, D12, D22 ... Driving means

Claims (16)

A solder deterioration inspection method for inspecting a deterioration state of a solder paste using a solder deterioration inspection apparatus comprising a container for containing a solder paste and an inspection material having an oxide film made of a metal oxide on a base material surface Because
Immersing at least a part of the oxide film of the inspection material in the solder paste of the container;
A method for inspecting the deterioration of the oxide film by taking out the inspection material from the solder paste and inspecting the discoloration of the oxide film.   The solder deterioration inspection method according to claim 1, wherein the base material is made of a metal contained in a resin or solder paste composition.   The solder deterioration inspection method according to claim 1, wherein the metal oxide is made of a metal oxide included in the composition of the solder paste.   The solder deterioration inspection apparatus includes a plurality of the inspection materials, and a plurality of the inspection materials are immersed in the solder paste at the same time, and the plurality of the inspection materials are simultaneously removed from the solder paste, at a plurality of positions of the solder paste. The solder deterioration inspection method according to claim 1, wherein the discoloration of the oxide film is simultaneously inspected.   The inspection material has a base material exposed portion that does not cover the oxide film at least at a lower end thereof, and the base material exposed portion is immersed in the solder paste. The solder deterioration inspection method according to any one of the above.   The solder deterioration inspection method according to claim 5, wherein the base material exposed portion and the oxide film are alternately arranged in a vertical direction of the inspection material or in a circumferential direction of a side surface of the inspection material. .   The solder deterioration inspection method according to claim 5 or 6, wherein the inspection material includes a desiccant or a deoxidation material, and a part of the desiccant or the deoxidation material is exposed from the surface of the inspection material.   The thickness of the oxide film is uniform, or continuously changing in the vertical direction of the inspection material, or in the circumferential direction of the side surface of the inspection material, or toward the vertical direction of the inspection material The solder deterioration inspection method according to claim 1, wherein the solder deterioration inspection method changes in a multistage shape in a circumferential direction of a side surface of the inspection material. The solder deterioration inspection method is
Producing the solder paste and storing the solder paste in the container;
Storing the solder paste contained in the container; and
The solder deterioration inspection method according to claim 1, wherein the inspecting step is executed between the storing step and the storing step to evaluate an abnormality of the activator of the solder paste. The solder deterioration inspection method is
Further comprising using the solder paste after storage;
The solder deterioration inspection method according to claim 9, wherein the inspecting step is executed between the storing step and the using step to evaluate an abnormality in the storage state of the solder paste. A solder deterioration inspection device comprising a container for containing solder paste and an inspection material having an oxide film made of a metal oxide on the surface of a base material,
The container of the solder deterioration inspection apparatus includes a container main body that contains the solder paste and an outer lid that fits the container main body and seals the container.
At least one inspection material is fixed to the outer lid, and when the container is sealed, at least a part of the oxide film of the inspection material is immersed in the solder paste, and when the container is opened, the inspection material is A solder deterioration inspection apparatus that can be taken out of the solder paste and inspected for discoloration of the oxide film.   The container includes an inner lid above the solder paste to be accommodated, and the inner lid includes a through-hole through which the inspection material fixed to the outer lid passes when the container is sealed and opened. Item 12. The solder deterioration inspection apparatus according to Item 11.   The solder deterioration inspection device according to claim 11 or 12, wherein each of the container body and the outer lid includes an index indicating a corresponding position when the container is sealed.   Of the inner surface of the outer lid, a surface on which the inspection material is fixed is provided with a rotating plate that is rotatable with respect to the outer lid, and the inspection material is fixed to the rotating plate of the outer lid. The solder deterioration test | inspection apparatus in any one of Claims 11-13. A solder deterioration inspection device comprising a container for containing solder paste and an inspection material having an oxide film made of a metal oxide on the surface of a base material,
A plurality of the inspection materials are disposed in the container so as to be removable, and at least two or more sections are formed inside the container by the plurality of the inspection materials, and at least a part of the oxide film of the inspection material is formed. A solder deterioration inspection apparatus configured to be immersed in the solder paste, and to inspect the discoloration of each oxide film by individually taking out each inspection material from the solder paste.   The solder deterioration inspection apparatus according to claim 15, wherein the plurality of inspection materials are respectively arranged so as to go from the center of the container toward the outer edge, and at least two or more sections are formed inside the container.

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