SG11201909929UA - Soldering device and method for producing a solder connection, using base and pressure plates and a stop device - Google Patents
Soldering device and method for producing a solder connection, using base and pressure plates and a stop deviceInfo
- Publication number
- SG11201909929UA SG11201909929UA SG11201909929UA SG11201909929UA SG 11201909929U A SG11201909929U A SG 11201909929UA SG 11201909929U A SG11201909929U A SG 11201909929UA SG 11201909929U A SG11201909929U A SG 11201909929UA
- Authority
- SG
- Singapore
- Prior art keywords
- solder
- components
- producing
- group
- spacing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PNKWO 07.05.2018 A soldering apparatus (50, 150, 250) is proposed for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected, and/or for coating a component with solder material (16), comprising a base plate (66) and a pressure plate (64), between which a solder group (10) comprising the component(s) (12A, 12B) and the solder material (16) is received, and which are adjustable relative to one another with regard to the spacing thereof for exerting a pressure force on the solder group (10). It is proposed that a stop apparatus is provided which limits the spacing between the base plate (66) and the pressure plate (64) to a minimum spacing such that, once the solder material (16) has melted, the solder group (10) has a predetermined thickness. A secondary aspect proposes a connection method in which, prior to applic ation of a pressure force, the components (12A, 12B) to be connected are initially provisionally connected with a solid or pasty bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position. (Fig. 6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017109748.1A DE102017109748A1 (en) | 2017-05-05 | 2017-05-05 | Soldering apparatus and method for making a solder joint |
DE202017105174 | 2017-08-28 | ||
PCT/EP2018/061728 WO2018202920A1 (en) | 2017-05-05 | 2018-05-07 | Soldering device and method for producing a solder connection, using base and pressure plates and a stop device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909929UA true SG11201909929UA (en) | 2019-11-28 |
Family
ID=62116886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909929U SG11201909929UA (en) | 2017-05-05 | 2018-05-07 | Soldering device and method for producing a solder connection, using base and pressure plates and a stop device |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3618994B1 (en) |
ES (1) | ES2890237T3 (en) |
HU (1) | HUE056579T2 (en) |
MY (1) | MY188351A (en) |
PT (1) | PT3618994T (en) |
SG (1) | SG11201909929UA (en) |
WO (1) | WO2018202920A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109352124A (en) * | 2018-12-12 | 2019-02-19 | 博耐尔汽车电气系统有限公司 | A kind of cooling-water machine brazing jig and its method for welding |
CN114192920A (en) * | 2021-12-10 | 2022-03-18 | 深圳市凯思特信息技术有限公司 | Multi-mode spot welding device and spot welding method for circuit board |
CN114632995B (en) * | 2022-03-02 | 2022-12-30 | 浙江亚通新材料股份有限公司 | Graphite brazing clamp capable of being used for lap joint and butt joint simultaneously |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801069A (en) | 1987-03-30 | 1989-01-31 | Westinghouse Electric Corp. | Method and apparatus for solder deposition |
US5175410A (en) | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | IC package hold-down fixture |
US5881453A (en) * | 1994-05-17 | 1999-03-16 | Tandem Computers, Incorporated | Method for mounting surface mount devices to a circuit board |
US20090085227A1 (en) | 2005-05-17 | 2009-04-02 | Matsushita Electric Industrial Co., Ltd. | Flip-chip mounting body and flip-chip mounting method |
JP5807221B2 (en) * | 2010-06-28 | 2015-11-10 | アユミ工業株式会社 | Bonded structure manufacturing method, heat-melt treatment method, and system thereof |
US8603860B2 (en) * | 2011-10-24 | 2013-12-10 | Taiwan Semiconductor Manufacturing Company, L.L.C. | Process for forming packages |
US8684256B2 (en) * | 2011-11-30 | 2014-04-01 | Component Re-Engineering Company, Inc. | Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing |
CA2967727C (en) | 2014-12-09 | 2019-05-28 | Pink Gmbh Thermosysteme | Heat transfer device for producing a soldered connection of electrical components |
EP3095544B1 (en) * | 2015-05-21 | 2018-09-19 | Airbus Defence and Space GmbH | Method of joining parts made of materials that are difficult to solder |
-
2018
- 2018-05-07 HU HUE18722993A patent/HUE056579T2/en unknown
- 2018-05-07 SG SG11201909929U patent/SG11201909929UA/en unknown
- 2018-05-07 WO PCT/EP2018/061728 patent/WO2018202920A1/en active Application Filing
- 2018-05-07 MY MYPI2019006104A patent/MY188351A/en unknown
- 2018-05-07 PT PT187229935T patent/PT3618994T/en unknown
- 2018-05-07 EP EP18722993.5A patent/EP3618994B1/en active Active
- 2018-05-07 ES ES18722993T patent/ES2890237T3/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2018202920A1 (en) | 2018-11-08 |
EP3618994B1 (en) | 2021-08-11 |
ES2890237T3 (en) | 2022-01-18 |
HUE056579T2 (en) | 2022-03-28 |
EP3618994A1 (en) | 2020-03-11 |
PT3618994T (en) | 2021-09-21 |
MY188351A (en) | 2021-12-02 |
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