MY188351A - Soldering device and method for producing a solder connection, using base and pressure plates and a stop device - Google Patents

Soldering device and method for producing a solder connection, using base and pressure plates and a stop device

Info

Publication number
MY188351A
MY188351A MYPI2019006104A MYPI2019006104A MY188351A MY 188351 A MY188351 A MY 188351A MY PI2019006104 A MYPI2019006104 A MY PI2019006104A MY PI2019006104 A MYPI2019006104 A MY PI2019006104A MY 188351 A MY188351 A MY 188351A
Authority
MY
Malaysia
Prior art keywords
solder
components
producing
group
spacing
Prior art date
Application number
MYPI2019006104A
Inventor
Christoph Oetzel
Aaron Hutzler
Original Assignee
Pink Gmbh Thermosysteme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102017109748.1A external-priority patent/DE102017109748A1/en
Application filed by Pink Gmbh Thermosysteme filed Critical Pink Gmbh Thermosysteme
Publication of MY188351A publication Critical patent/MY188351A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A soldering apparatus (50, 150, 250) is proposed for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected, and/or for coating a component with solder material (16), comprising a base plate (66) and a pressure plate (64), between which a solder group (10) comprising the component(s) (12A, 12B) and the solder material (16) is received, and which are adjustable relative to one another with regard to the spacing thereof for exerting a pressure force on the solder group (10). It is proposed that a stop apparatus is provided which limits the spacing between the base plate (66) and the pressure plate (64) to a minimum spacing such that, once the solder material (16) has melted, the solder group (10) has a predetermined thickness. A secondary aspect proposes a connection method in which, prior to application of a pressure force, the components (12A, 12B) to be connected are initially provisionally connected with a solid or pasty bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position. The most suitable drawing: FIG. 6.
MYPI2019006104A 2017-05-05 2018-05-07 Soldering device and method for producing a solder connection, using base and pressure plates and a stop device MY188351A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017109748.1A DE102017109748A1 (en) 2017-05-05 2017-05-05 Soldering apparatus and method for making a solder joint
DE202017105174 2017-08-28
PCT/EP2018/061728 WO2018202920A1 (en) 2017-05-05 2018-05-07 Soldering device and method for producing a solder connection, using base and pressure plates and a stop device

Publications (1)

Publication Number Publication Date
MY188351A true MY188351A (en) 2021-12-02

Family

ID=62116886

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006104A MY188351A (en) 2017-05-05 2018-05-07 Soldering device and method for producing a solder connection, using base and pressure plates and a stop device

Country Status (7)

Country Link
EP (1) EP3618994B1 (en)
ES (1) ES2890237T3 (en)
HU (1) HUE056579T2 (en)
MY (1) MY188351A (en)
PT (1) PT3618994T (en)
SG (1) SG11201909929UA (en)
WO (1) WO2018202920A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352124A (en) * 2018-12-12 2019-02-19 博耐尔汽车电气系统有限公司 A kind of cooling-water machine brazing jig and its method for welding
CN114192920A (en) * 2021-12-10 2022-03-18 深圳市凯思特信息技术有限公司 Multi-mode spot welding device and spot welding method for circuit board
CN114632995B (en) * 2022-03-02 2022-12-30 浙江亚通新材料股份有限公司 Graphite brazing clamp capable of being used for lap joint and butt joint simultaneously

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801069A (en) 1987-03-30 1989-01-31 Westinghouse Electric Corp. Method and apparatus for solder deposition
US5175410A (en) 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US5881453A (en) * 1994-05-17 1999-03-16 Tandem Computers, Incorporated Method for mounting surface mount devices to a circuit board
US20090085227A1 (en) 2005-05-17 2009-04-02 Matsushita Electric Industrial Co., Ltd. Flip-chip mounting body and flip-chip mounting method
JP5807221B2 (en) * 2010-06-28 2015-11-10 アユミ工業株式会社 Bonded structure manufacturing method, heat-melt treatment method, and system thereof
US8603860B2 (en) * 2011-10-24 2013-12-10 Taiwan Semiconductor Manufacturing Company, L.L.C. Process for forming packages
US9556074B2 (en) * 2011-11-30 2017-01-31 Component Re-Engineering Company, Inc. Method for manufacture of a multi-layer plate device
MY172492A (en) 2014-12-09 2019-11-27 Pink Gmbh Thermosysteme Heat transfer device for producing a soldered connection of electrical components
EP3095544B1 (en) * 2015-05-21 2018-09-19 Airbus Defence and Space GmbH Method of joining parts made of materials that are difficult to solder

Also Published As

Publication number Publication date
SG11201909929UA (en) 2019-11-28
HUE056579T2 (en) 2022-03-28
EP3618994A1 (en) 2020-03-11
PT3618994T (en) 2021-09-21
WO2018202920A1 (en) 2018-11-08
EP3618994B1 (en) 2021-08-11
ES2890237T3 (en) 2022-01-18

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