JP2010521587A5 - - Google Patents

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Publication number
JP2010521587A5
JP2010521587A5 JP2009553652A JP2009553652A JP2010521587A5 JP 2010521587 A5 JP2010521587 A5 JP 2010521587A5 JP 2009553652 A JP2009553652 A JP 2009553652A JP 2009553652 A JP2009553652 A JP 2009553652A JP 2010521587 A5 JP2010521587 A5 JP 2010521587A5
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metal layer
etch
microcontact
resistant material
substrate
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JP2009553652A
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JP2010521587A (ja
JP5980468B2 (ja
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Priority claimed from US11/717,587 external-priority patent/US8641913B2/en
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JP2009553652A 2007-03-13 2008-03-13 微細ピッチのマイクロ接点及びその成形方法 Active JP5980468B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/717,587 US8641913B2 (en) 2003-10-06 2007-03-13 Fine pitch microcontacts and method for forming thereof
US11/717,587 2007-03-13
PCT/US2008/003473 WO2008112318A2 (en) 2007-03-13 2008-03-13 Fine pitch microcontacts and method for forming thereof

Publications (3)

Publication Number Publication Date
JP2010521587A JP2010521587A (ja) 2010-06-24
JP2010521587A5 true JP2010521587A5 (enExample) 2016-07-14
JP5980468B2 JP5980468B2 (ja) 2016-08-31

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JP2009553652A Active JP5980468B2 (ja) 2007-03-13 2008-03-13 微細ピッチのマイクロ接点及びその成形方法

Country Status (5)

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US (2) US8641913B2 (enExample)
JP (1) JP5980468B2 (enExample)
KR (1) KR101466252B1 (enExample)
CN (2) CN104681450A (enExample)
WO (1) WO2008112318A2 (enExample)

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