JP2010050472A - 発光ダイオード・ランプ及び発光ダイオード交通灯 - Google Patents
発光ダイオード・ランプ及び発光ダイオード交通灯 Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/06—Optical design with parabolic curvature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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- F21Y2115/10—Light-emitting diodes [LED]
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
【解決手段】発光ダイオード・ランプ又は発光ダイオード交通灯は、発光ダイオードを備えている。発光ダイオードは、金属ベース103に取付けられる発光ダイオード・チップ101を備えている。発光ダイオード・チップ101は回路基板106を介して電源に電気的に接続される。前記金属ベースの上表面は光反射面とされている。発光ダイオード・チップの上方には透光媒質が設けられている。金属ベースの上方には回路基板が取付けられている。金属ベースの下表面には、金属ベースと一体になるネジ204或はネジ穴が設けられ、かつ金属ベースはネジ或はネジ穴を通じて直接ヒートシンク113と機械連結されている。
【選択図】図5
Description
上記発光ダイオード・チップの前側には、光反射器がある。
上記透光媒質は、光学接着剤とレンズである。
上記発光ダイオード・チップは、複数の同色の光を発するチップ或は異色の光を発するチップであり、チップ同士は直列、並列、或は直列および並列に接続される。
上記ベースは、金属ベース、超高熱伝導率管または金属ベース下側に設けられた超高熱伝導率管から構成される。
上記光反射器は、光学反射面を有し、その光反射面と発光ダイオード軸間の取付けの角度は10〜70度である。
上記光学接着剤内或は光学接着剤とレンズの間には、光変換素材が設けられる。
上記透光バルブハウジングは、ガラス或はビニールからなる透明の、着色の或は発散のバルブハウジングである。
上記透光バルブハウジングの内壁には光変換素材層がある。
上記ヒートシンクは、フィンを有するヒートシンクである。
上記フィンは、単数或は複数の螺旋を有する螺旋状フィンである。
上記フィンの内表面は、光反射面である。
上記内表面は、円錐形或は放物面をなす。
上記発光ダイオードは、複数の同色の光を発する発光ダイオード或は異色の光を発する発光ダイオードである。
(1)ヒートシンクとベースの直接かつ密接な熱連結は、チップとヒートシンク間の熱抵抗をほとんどゼロにし、それによりチップに生じる熱を有効に発散させる。また、金属ベースとヒートシンクは金属ネジを用いて連結され、熱連結は十分確実であり、長時間作動でも変わらない。これにより、高出力、高効率、長寿命の発光ダイオードを製造することができる。
(2)回路基板は金属ベースの上方或は周囲に設置され、チップとヒートシンク間の熱抵抗を増加させないと共に、チップ間の連結にも便利であり、高密度の取付けにも有利である。
(3)高出力の発光ダイオードと平面光源を製造することができる。
要するに、本発明のダイオードは、従来の発光ダイオードの熱抵抗が大きい及び接着剤が破裂し易いという課題を克服し、またその体積は従来の発光ダイオードよりずっと小さいので、高密度の取付けに好適である。
Claims (19)
- 少なくとも一つの発光ダイオードを備え、
上記発光ダイオードの引出線は、一つの駆動回路と電気的に接続され、
上記駆動回路は、そのハウジングを介して電気コネクターと電気的に接続され、
上記発光ダイオードに一つの透光バルブハウジングを被せた発光ダイオード・ランプにおいて、
上記発光ダイオードは、少なくとも一つの金属ベースに取付けられる発光ダイオード・チップを備え、
上記発光ダイオード・チップは、回路基板を介して電源に電気的に接続され、
上記金属ベースの上表面を光反射面とし、
上記発光ダイオード・チップの上方には透光媒質が設けられ、
上記金属ベースの上方には上記回路基板が取付けられ、
上記金属ベースの下側に少なくとも一つのネジ或はネジ穴を備え、かつ
上記金属ベースは、上記ネジ或はネジ穴を通じて直接上記ヒートシンクと機械連結されることを特徴とする発光ダイオード・ランプ。 - 上記駆動回路は、双脚、多脚直入のランプ・ヘッダ或は螺旋ランプ・ヘッダにより、上記電気コネクターに接続されることを特徴とする請求項1に記載の発光ダイオード・ランプ。
- 上記透光バルブハウジングは、ガラス或はビニールからなる透明の、着色の或は発散のバルブハウジングであることを特徴とする請求項1又は2に記載の発光ダイオード・ランプ。
- 上記透光バルブハウジングの内壁には光変換素材層があることを特徴とする請求項1乃至3のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記ヒートシンクは、フィンを有することを特徴とする請求項1乃至4のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記フィンは、単数或は複数の螺旋を有する螺旋型フィンであることを特徴とする請求項5に記載の発光ダイオード・ランプ。
- 上記ヒートシンクの内表面は、光反射面であることを特徴とする請求項1乃至6のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記ヒートシンクの内表面は、円錐形或は放物面をなすことを特徴とする請求項1乃至7のうちのいずれか一つに記載の発光ダイオード・ランプ。
- さらに、上記発光ダイオード・チップの側方に発する光を、上記発光ダイオード・チップ或は上記光反射面に反射させてから、上記発光ダイオード・チップの前方に出射させる光反射器を有することを特徴とする請求項1乃至8のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記透光媒質は、光学接着剤とレンズであることを特徴とする請求項1乃至9のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記発光ダイオード・チップは、複数の同色の光を発するチップ或は異色の光を発するチップであり、チップ同士は直列、並列、或は直列および並列に接続されることを特徴とする請求項1乃至10のうちのいずれか一つに記載の発光ダイオード・ランプ。
- 上記光反射器の光反射面と発光ダイオード軸間の取付け角度は、10〜70度であることを特徴とする請求項9に記載の発光ダイオード・ランプ。
- さらに、上記光学接着剤内或は光学接着剤とレンズの間には、光変換素材が設けられていることを特徴とする請求項10に記載の発光ダイオード・ランプ。
- 少なくとも一つの発光ダイオードが、交通灯の放物面の光反射器の焦点付近のヒートシンクに取付けられ、
上記発光ダイオードの光発散角は3〜60度であり、
上記発光ダイオードにおける一部分の発光ダイオードが発する光は、上記交通灯の透光窓から直接に出射されるとともに、他の部分の発光ダイオードが発する光は、上記交通灯の放物面の光反射器を介して反射されて出射されて、必要な焦点集中と均一分布の発射光が得られるようにした発光ダイオード交通灯において、
上記発光ダイオードは、少なくとも一つの金属ベースに取付けられる発光ダイオード・チップを備え、
上記発光ダイオード・チップは、回路基板を介して電源に電気的に接続され、
上記金属ベースの上表面を光反射面とし、
上記発光ダイオード・チップの上方には透光媒質が設けられ、
上記金属ベースの上方には上記回路基板が取付けられ、
上記金属ベースの下側に少なくとも一つのネジ或はネジ穴を備え、かつ
上記金属ベースは、上記ネジ或はネジ穴を通じて直接上記ヒートシンクと機械連結されることを特徴とする発光ダイオード交通灯。 - さらに、上記発光ダイオード・チップの側方に発する光を、上記発光ダイオード・チップ或は上記光反射面に反射させてから、上記発光ダイオード・チップの前方に出射させる光反射器を有することを特徴とする請求項14に記載の発光ダイオード交通灯。
- 上記透光媒質は、光学接着剤とレンズであることを特徴とする請求項14又は15に記載の発光ダイオード交通灯。
- 上記発光ダイオード・チップは、複数の同色の光を発するチップ或は異色の光を発するチップであり、チップ同士は直列、並列、或は直列および並列に接続されることを特徴とする請求項14乃至16のうちのいずれか一つに記載の発光ダイオード交通灯。
- 上記光反射器の光反射面と発光ダイオード軸間の取付け角度は、10〜70度であることを特徴とする請求項15に記載の発光ダイオード交通灯。
- さらに、上記光学接着剤内或は光学接着剤とレンズの間には、光変換素材が設けられていることを特徴とする請求項16に記載の発光ダイオード交通灯。
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CNB011457333A CN100468609C (zh) | 2001-12-29 | 2001-12-29 | 超导热管灯 |
CN02203989U CN2517112Y (zh) | 2002-01-24 | 2002-01-24 | 大功率发光二极管 |
CN02207287U CN2526981Y (zh) | 2002-03-09 | 2002-03-09 | 高效率发光二极管 |
CN02236692U CN2540685Y (zh) | 2002-06-03 | 2002-06-03 | 高效率大功率发光二极管 |
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- 2002-12-30 AU AU2002367196A patent/AU2002367196A1/en not_active Abandoned
- 2002-12-30 KR KR1020047010358A patent/KR100991830B1/ko not_active IP Right Cessation
- 2002-12-30 CN CNB028261275A patent/CN100373638C/zh not_active Expired - Fee Related
- 2002-12-30 KR KR1020097019925A patent/KR20090115810A/ko not_active Application Discontinuation
- 2002-12-30 EP EP02790249A patent/EP1467414A4/en not_active Withdrawn
- 2002-12-30 WO PCT/CN2002/000930 patent/WO2003056636A1/zh active Application Filing
- 2002-12-30 US US10/500,315 patent/US7497596B2/en not_active Expired - Fee Related
- 2002-12-30 JP JP2003557050A patent/JP2005513815A/ja active Pending
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2008
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Cited By (10)
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JP4602477B1 (ja) * | 2010-06-16 | 2010-12-22 | 隆泰 佐藤 | 照明装置 |
KR101071665B1 (ko) | 2010-06-16 | 2011-10-11 | 하대봉 | 조명장치 |
WO2011158396A1 (ja) * | 2010-06-16 | 2011-12-22 | Satoh Takayasu | 照明装置 |
JP2012003932A (ja) * | 2010-06-16 | 2012-01-05 | Takayasu Sato | 照明装置 |
JP2012104445A (ja) * | 2010-11-12 | 2012-05-31 | Iina:Kk | Ledランプ構造体 |
WO2012128076A1 (ja) * | 2011-03-18 | 2012-09-27 | シャープ株式会社 | 照明装置、表示装置、及びテレビ受信装置 |
JP2013069444A (ja) * | 2011-09-21 | 2013-04-18 | Hitachi Appliances Inc | 電球型照明装置 |
DE102013010910A1 (de) | 2012-07-13 | 2014-01-16 | Shun-An Liao | LED-Beleuchtungsvorrichtung mit einer niedrigeren Betriebstemperatur |
DE102013010910B4 (de) | 2012-07-13 | 2018-05-03 | Shun-An Liao | LED-Beleuchtungsvorrichtung mit einer niedrigeren Betriebstemperatur sowie Beleuchtungssystem und Handheld-Beleuchtung mit einer derartigen LED-Beleuchtungsvorrichtung |
WO2023042746A1 (ja) * | 2021-09-16 | 2023-03-23 | 旭化成株式会社 | 紫外線照射装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060198147A1 (en) | 2006-09-07 |
US7497596B2 (en) | 2009-03-03 |
AU2002367196A1 (en) | 2003-07-15 |
EP1467414A1 (en) | 2004-10-13 |
WO2003056636A1 (en) | 2003-07-10 |
CN1608326A (zh) | 2005-04-20 |
US20090059595A1 (en) | 2009-03-05 |
KR100991829B1 (ko) | 2010-11-04 |
US20050068776A1 (en) | 2005-03-31 |
JP2005513815A (ja) | 2005-05-12 |
CN100373638C (zh) | 2008-03-05 |
KR20090115878A (ko) | 2009-11-09 |
KR100991830B1 (ko) | 2010-11-04 |
US7736027B2 (en) | 2010-06-15 |
KR20090119916A (ko) | 2009-11-20 |
JP2010050473A (ja) | 2010-03-04 |
KR100991827B1 (ko) | 2010-11-10 |
KR20090115810A (ko) | 2009-11-06 |
KR20040093686A (ko) | 2004-11-08 |
US7347589B2 (en) | 2008-03-25 |
EP1467414A4 (en) | 2007-07-11 |
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