CN101846256A - Led光源 - Google Patents

Led光源 Download PDF

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CN101846256A
CN101846256A CN201010172360A CN201010172360A CN101846256A CN 101846256 A CN101846256 A CN 101846256A CN 201010172360 A CN201010172360 A CN 201010172360A CN 201010172360 A CN201010172360 A CN 201010172360A CN 101846256 A CN101846256 A CN 101846256A
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Prior art keywords
fluorescence
fluorophor
wafers
light source
led
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蔡州
邹军
茆学华
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Priority to CN201010172360A priority Critical patent/CN101846256A/zh
Publication of CN101846256A publication Critical patent/CN101846256A/zh
Priority to KR1020127031810A priority patent/KR101621811B1/ko
Priority to AU2011250561A priority patent/AU2011250561B2/en
Priority to PCT/CN2011/000756 priority patent/WO2011137662A1/en
Priority to SG2012080974A priority patent/SG185402A1/en
Priority to JP2013508356A priority patent/JP2013531367A/ja
Priority to RU2012153464/07A priority patent/RU2587999C2/ru
Priority to EP11777083.4A priority patent/EP2567145B1/en
Priority to US13/068,162 priority patent/US8534866B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
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    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
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    • F21V3/00—Globes; Bowls; Cover glasses
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    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2121/00—Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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    • F21—LIGHTING
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Abstract

本发明公开了一种LED光源，所述LED光源包括LED芯片，所述LED芯片包括相背的第一发光面和第二发光面；对应所述第一发光面设置的第一荧光体；对应所述第二发光面设置的第二荧光体。本发明能够大幅提高发光效率、降低散热设计难度和成本。

Description

LED光源
技术领域
本发明涉及一种光源，尤其涉及一种LED光源。
背景技术
现有技术LED灯通常需要采用散热器进行散热，其散热方式主要有：自然对流散热、加装风扇强制散热、热管和回路热管散热等。风扇散热方式系统复杂，可靠性低，经常是风扇的寿命比芯片还短；热管散热的速度不高；而散热片散热，因表面积有限，效果同样不好。
LED灯的核心部件是LED封装结构，现有技术LED封装结构一般包括LED芯片和散热基座，所述LED芯片一面贴附于所述散热基座，另一面发光。现有技术LED封装结构一般还包括覆盖所述LED芯片并将所述LED芯片固定在所述散热基座上的树脂。
目前，LED灯中的散热问题越来越受到重视，散热设计直接决定了LED灯的寿命、性能、成本等；并且由于LED芯片一表面固定在散热基座上，这一面无法发光，导致发光效率底下。
发明内容
本发明主要解决的技术问题是提供一种LED光源，能够大幅提高发光效率、降低散热设计难度和成本。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种LED光源，包括LED芯片，所述LED芯片包括相背的第一发光面和第二发光面；对应所述第一发光面设置的第一荧光体；对应所述第二发光面设置的第二荧光体。
其中，所述第一荧光体是荧光胶体，第二荧光体是荧光胶体；或所述第一荧光体是荧光晶片，第二荧光体是荧光胶体；或所述第二荧光体是荧光晶片，第一荧光体是荧光胶体；或所述第一荧光体是荧光晶片，第二荧光体是荧光晶片。
其中，所述第一荧光体和第二荧光体都是荧光晶片，所述LED芯片数量为单个或多个，其中多个所述LED芯片通过串联或并联连接，水平排列一同位于所述两荧光晶片之间，并且每个LED芯片之间留有空隙。
其中，所述第一荧光体和第二荧光体都是荧光晶片，并且平行设置，所述LED芯片为无反光层的双面出光的正装芯片或倒装芯片。
其中，所述正装芯片架空于所述两块荧光晶片之间，所述倒装芯片无电极一面通过分子键合固定于一所述荧光晶片，或者通过高透光高导热固晶胶固定于一所述荧光晶片表面后进行串并联。
其中，两所述荧光晶片之间设置有多个互相隔开的所述LED芯片，两所述荧光晶片之间通过位于荧光晶片周围的粘结剂粘结，并通过分布于两荧光晶片相对表面设置的多个支撑柱间隔固定，两所述荧光晶片之间充有惰性气体，两所述荧光晶片之间的所述粘结剂设有多个透气孔。
其中，所述粘结剂是光反射粘结硅胶，所述光反射粘结硅胶上设有电极，所述电流扩散层上设置有P型结，所述发光层邻近电流扩散层的一侧设有N型结，所述多个LED芯片之间通过串联或并联的方式采用金线或铜线连接各LED芯片的P型结和N型结，所述金线或铜线连接至所述电极。
其中，包括夹固所述两荧光晶片边侧的夹持机构。
其中，所述LED光源是泡灯，包括灯泡和填充灯泡的惰性气体，所述荧光晶片和LED芯片位于灯泡内，所述两荧光晶片之间的空间通过所述透气孔连通两荧光晶片之外的所述灯泡空间。
其中，包括设置于所述两荧光晶片一边侧的反光杯。
本发明的有益效果是：区别于现有技术LED光源散热设计困难、发光效率低的情况，本发明在LED芯片发光两面都设置荧光体，两面都可以发光，发光效率至少提高30％以上；同时，由于LED芯片不采用散热基座固定的方式，LED芯片这一面可以通过对流、辐射方式散热，散热设计变得非常简单，散热效果也得到保证，成本得以减低。
附图说明
图1是本发明LED光源实施例一的截面示意图；
图2是本发明LED光源实施例二的平面示意图；
图3是图2的A-A线方向截面图；
图4是本发明LED光源实施例中LED芯片的截面示意图；
图5是本发明LED光源实施例中LED芯片及荧光晶片固定结构的立体分解图；
图6是本发明LED光源的实施例三的侧面示意图；
图7是本发明LED光源的实施例四的侧面示意图；
图8是本发明LED光源的实施例五的侧面示意图；
图9是本发明LED光源的实施例六的侧面示意图；
图10是本发明LED光源实施例七的侧面示意图；
图11是本发明LED光源实施例八的侧面示意图；
图12是本发明LED光源实施例九的平面示意图；
图13是本发明LED光源实施例十的平面示意图；
图14是本发明LED光源实施例十一的侧面示意图；
图15是图14的平面示意图；
图16是本发明LED光源实施例十二的侧面示意图；
图17是本发明LED光源实施例十三的侧面示意图；
图18是本发明LED光源实施例十四的侧面示意图；
图19是本发明LED光源实施例十五的侧面示意图；
图20是本发明LED光源实施例十六的侧面示意图。
具体实施方式
为详细说明本发明的技术内容、构造特征、所实现目的及效果，以下结合实施方式并配合附图详予说明。
参阅图1，本发明LED光源实施例一包括：
LED芯片10，包括相背的第一发光面11和第二发光面12；
对应所述第一发光面11设置的第一荧光体20；
对应所述第二发光面12设置的第二荧光体30。
本发明在LED芯片10发光两面都设置荧光体，两面都可以发光，发光效率至少提高30％以上；同时，由于LED芯片10不采用散热基座固定的方式，LED芯片10这一面可以通过对流、辐射方式散热，散热设计变得非常简单，散热效果也得到保证。
在一实施例中，所述第一荧光体20是荧光胶体，第二荧光体30是荧光胶体；或
所述第一荧光体20是荧光晶片，第二荧光体30是荧光胶体；或
所述第二荧光体30是荧光晶片，第一荧光体20是荧光胶体；或
所述第一荧光体20是荧光晶片，第二荧光体30是荧光晶片。
所述荧光晶片可以作为LED芯片10的固定基座，并且可以散热，由于较薄，散热性能可以得以保证。
所述荧光晶片可以是通过量子分割的含有多种稀土元素的钇铝石榴石YAG晶体等。
参阅图2和图3，在另一实施例中，所述第一荧光体20和第二荧光体30都是荧光晶片，所述LED芯片10数量为单个或多个，其中，多个所述LED芯片10通过串联或并联连接，水平排列一同位于所述两荧光晶片之间，并且每个LED芯片10之间留有空隙40。
在上述实施例中，将刚性的荧光晶片作为多个LED芯片10固定的基座，免去散热基座结构，体积、发光效率都得到改善；同时，在每个LED芯片10之间留有空隙40，LED芯片10外无树脂等物质包裹，利于将每个LED芯片10的散发的热量直接通过这些空隙40的气体散发出去，进一步保证热量能够迅速散开，也保证LED芯片10在较低温度下正常工作，提高寿命。
在另一实施例中，所述第一荧光体20和第二荧光体30都是荧光晶片，并且平行设置，所述LED芯片10为无反光层的双面出光的正装芯片或倒装芯片。
一起参阅图2、图3和图4，对于倒装芯片，即P极和N极都位于芯片同一面结构，所述倒装芯片无电极一面通过分子键合固定于一所述荧光晶片，或者通过高透光高导热固晶胶固定于一所述荧光晶片表面后进行串并联。对于正装芯片，即P极和N极分别位于LED芯片10相背两面结构，所述正装芯片采用架空支架架空在所述两块荧光晶片之间(参阅图16或图17)，其中所述架空支架位于两块荧光晶片之间，LED芯片10的两侧边分别接所述架空支架，使得LED芯片10悬于所述两块荧光晶片之间。
对于倒装芯片的结构，可以是倒装结构的六面发光体，包括依次层叠的透明刚性基底13、发光层14以及电流扩散层15，所述透明刚性基底13固定于一所述荧光晶片表面，另一所述荧光晶片对应所述电流扩散层15一侧设置。
本实施例利用倒装结构的LED来实现双面发光，易于实现。
在另一实施例中，所述透明刚性基底13是蓝宝石，所述蓝宝石通过键合方式与所述荧光晶片固定。
由于通过键合方式固定，省略了导热硅胶等导热介质，避免导热介质导热性能低而形成的导热瓶颈，使散热性能进一步提高。当然，所述透明刚性衬底13也可以是其他透明的刚性物体，包括能够以键合方式与所述荧光晶片固定的物体。
所述LED芯片10也可以是两面出光的发光体，没有蓝宝石作为衬底。其中，至少所述第二荧光体30和所述LED芯片10通过键合方式相互固定。比如，材质为荧光晶片的第二荧光体30与所述LED芯片10无电极的一面进行键合。因为LED芯片10是半导体裸片，与第二荧光体30直接键合，大大减少厚度并且节省成本。
一起参阅图3和图5，在另一实施例中，两所述荧光晶片之间设置有多个互相隔开的所述LED芯片10，两所述荧光晶片之间通过位于荧光晶片周围的粘结剂50粘结，并通过分布于两荧光晶片相对表面设置的多个支撑柱60间隔固定，两所述荧光晶片之间充有惰性气体(图未示)，如高导热性能的惰性气体，可以是氦气或氢气的等，两所述荧光晶片之间的所述粘结剂50设有多个透气孔70。
本实施例将两荧光晶片之间的空间作为LED芯片10的容置空间，同时留有此容置空间与外界互通的透气孔70，形成散热通道，利于散热。
所述粘结剂50是光反射粘结硅胶，所述光反射粘结硅胶上设有电极81，所述电流扩散层15上设置有P型结，所述发光层14邻近电流扩散层15的一侧设有N型结，所述多个LED芯片10之间通过串联或并联的方式采用金线80连接各LED芯片10的P型结和N型结，所述金线80连接至所述电极81。当然，也可以采用铜线等导线。
参阅图3，其中，还包括夹固所述两荧光晶片边侧的夹持机构90。
本实施例利用夹持机构90夹持两荧光晶片，使得LED芯片10与荧光晶片之间直接接触，相比于采用粘结剂50连接方式更进一步提高散热效率，并且结构简单实用。
本发明可以应用于各种光源，比如灯泡，比如应急灯、PAR灯、车灯、路灯、隧道灯、室内照明灯等。
参阅图6，在一个实施例中，所述LED光源是泡灯，包括灯泡110和填充灯泡110的惰性气体(图未示)，所述荧光晶片和LED芯片10位于灯泡110内，所述两荧光晶片之间的空间通过所述透气孔70(图5)连通两荧光晶片之外的所述灯泡110空间。
利用灯泡110内的惰性气体作为灯泡110外空间与LED芯片10之间的散热媒介，把整个灯泡110外表面作为散热表面，大幅提高散热表面，提高散热性能；同时惰性气体能保证LED芯片10不会被氧化，保证长期使用性能。
参阅图7和图8，在一个实施例中，所述泡灯可以包括连通所述荧光晶片内空间的气道120。
参阅图9，所述泡灯是PAR灯，包括外壳130和内壳140，所述外壳130具有连通外壳130与内壳140之间空间和外界的通孔150。
参阅图10，在一个实施例中，包括设置于所述两荧光晶片一边侧的反光杯160，使LED芯片10所有表面的发出的光线都被反光杯160朝一个方向反射，适合于限定范围发光的场景。
参阅图11，在一个实施例中，一个泡灯里面设有多个扩散状连接端的支架(未标示)，每个所述连接端连接一个LED芯片10。
参阅图12和图13，所述荧光晶片可以是矩形结构，也可以是圆形等结构。
参阅图14和图15，两片荧光晶片之间可以仅设置一颗LED芯片10，两片荧光晶片的两端采用夹持机构90夹持固定。在仅设置一颗LED芯片10的情况下，也可以不采用LED倒装结构。
参阅图18、19、20，所述泡灯的形状还可以是多节型、尖形或烧杯型等。
与传统光源一样，半导体LED在工作期间也会产生热量，其多少取决于整体的发光效率。现有技术中，在外加电能量作用下，电子和空穴的辐射复合电致发光，在PN结附近辐射出来的光还需经过芯片本身的半导体介质和封装介质才能抵达外界。其综合电流注入效率、辐射发光量子效率、芯片外部光取出效率等，最终大概只有30％～40％的输入电能转化为光能，其余70％的能量转化为热能。需要说明的是热量管理是在LED产品的发光效率不高的现阶段的关键问题，从根本上提高发光效率以减少热能的产生才是釜底抽薪之举。
本发明克服长期以来需要专门的LED散热基座作为承载体的技术偏见，不采用专门的散热基座，利用LED芯片10双面发光的特点，无角度限制地利用了所有方向的光能，可以提升30％以上的光能利用率；同时，彻底解决了散热基座形成的散热瓶颈，全角度发光的同时实现全角度的散热，大幅提高发光效率的同时大幅提高散热性能。在散热性能得以提升的情况下，LED芯片10始终在低温下高效工作，电子和空穴辐射复合电致发光的效率大幅提升，形成提高散热性能-提高发光效率-提高散热性能的良性工作循环。经测试，电能转化为可利用光能的效率可以达到85％以上；
此外，裸露的LED芯片与惰性气体直接接触进行热交换的设计，能进一步降低LED芯片工作温度，在上述85％光能可利用率的基础上进一步提升至90％以上，效果极为明显。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

1.一种LED光源，其特征在于，包括：
LED芯片，包括相背的第一发光面和第二发光面；
对应所述第一发光面设置的第一荧光体；
对应所述第二发光面设置的第二荧光体。
2.根据权利要求1所述的LED光源，其特征在于：
所述第一荧光体是荧光胶体，第二荧光体是荧光胶体；或
所述第一荧光体是荧光晶片，第二荧光体是荧光胶体；或
所述第二荧光体是荧光晶片，第一荧光体是荧光胶体；或
所述第一荧光体是荧光晶片，第二荧光体是荧光晶片。
3.根据权利要求2所述的LED光源，其特征在于：所述第一荧光体和第二荧光体都是荧光晶片，所述LED芯片数量为单个或多个，其中多个所述LED芯片通过串联或并联连接，水平排列一同位于所述两荧光晶片之间，并且每个LED芯片之间留有空隙。
4.根据权利要求1所述的LED光源，其特征在于：所述第一荧光体和第二荧光体都是荧光晶片，并且平行设置，所述LED芯片为无反光层的双面出光的正装芯片或倒装芯片。
5.根据权利要求4所述的LED光源，其特征在于：所述正装芯片架空于所述两块荧光晶片之间，所述倒装芯片无电极一面通过分子键合固定于一所述荧光晶片，或者通过高透光高导热固晶胶固定于一所述荧光晶片表面后进行串并联。
6.根据权利要求5所述的LED光源，其特征在于：两所述荧光晶片之间设置有多个互相隔开的所述LED芯片，两所述荧光晶片之间通过位于荧光晶片周围的粘结剂粘结，并通过分布于两荧光晶片相对表面设置的多个支撑柱间隔固定，两所述荧光晶片之间充有惰性气体，两所述荧光晶片之间的所述粘结剂设有多个透气孔。
7.根据权利要求6所述的LED光源，其特征在于：所述粘结剂是光反射粘结硅胶，所述光反射粘结硅胶上设有电极，所述多个LED芯片之间通过串联或并联的方式采用金线或铜线连接各LED芯片的P型结和N型结，所述金线或铜线线连接至所述电极。
8.根据权利要求6所述的LED光源，其特征在于：包括夹固所述两荧光晶片边侧的夹持机构。
9.根据权利要求7或8所述的LED光源，其特征在于：所述LED光源是泡灯，包括灯泡和填充灯泡的惰性气体，所述荧光晶片和LED芯片位于灯泡内，所述两荧光晶片之间的空间通过所述透气孔连通两荧光晶片之外的所述灯泡空间。
10.根据权利要求9所述的LED光源，其特征在于：包括设置于所述两荧光晶片一边侧的反光杯。
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