CN102022656B - Led照明灯具 - Google Patents

Led照明灯具 Download PDF

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Publication number
CN102022656B
CN102022656B CN2010106054011A CN201010605401A CN102022656B CN 102022656 B CN102022656 B CN 102022656B CN 2010106054011 A CN2010106054011 A CN 2010106054011A CN 201010605401 A CN201010605401 A CN 201010605401A CN 102022656 B CN102022656 B CN 102022656B
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heat dissipation
dissipation base
heat
heat radiating
radiating shell
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CN102022656A (zh
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章绍汉
曹青山
蒲小满
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Shanghai State Intellectual Property Services Co ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED照明灯具,包括散热壳体、LED基板、驱动电路板以及电源连接器,所述LED基板上设置有多个发光二极管。LED照明灯具还包括一散热底座,所述LED基板固定在该散热底座顶部,驱动电路板收纳于该散热底座底部。所述散热壳体为两端开口的空心壳体,散热壳体一端与电源连接器连接,另一端与散热底座顶部相固定,散热底座容纳于散热壳体内部。所述散热底座顶部和散热壳体上设有相互连通的导流孔。LED照明灯具工作时,散热底座顶部与散热壳体上开设的导流孔使散热壳体与散热底座之间形成一个内流场,冷空气可以对散热底座底部以及散热壳体内侧壁进行热交换,有效提升散热效率。

Description

LED照明灯具
技术领域
本发明涉及一种LED照明灯具,特别涉及一种具有散热结构的LED照明灯具。
背景技术
和传统光源相比,发光二极管(LED)具有较高之发光效率(光源温度较一般灯泡低)、低辐射、低耗电、寿命长、低电压、启动快速、环保、抗震抗压、灯具可小型化等优点,以LED作为光源的照明装置目前被广泛应用于各种照明,如室内照明、室外照明、可携式照明(如手电筒)、情境照明等应用中。LED在工作时会产生热量,带有这些热量的空气与周围环境中的空气之间的流通进行散热,但此散热方式效果有限,特别在LED长时间工作后,仅用此种散热方式不能使产生的热量及时疏散,使LED温度升高,严重影响LED的发光效率及LED灯具的使用寿命。
为了解决LED灯具的散热问题,现有技术中多采用在灯具壳体上增设散热鳍片,此种方式虽然有效的增加了散热面积,但是会增加LED灯具的体积和重量,另外过小的鳍片间距会引起灰尘杂质等在鳍片间隙内沉积,导致散热能力降低。
发明内容
有鉴于此,本发明提供一种轻便且散热良好的LED照明灯具。
一种LED照明灯具,包括散热壳体、LED基板、驱动电路板以及电源连接器,所述LED基板上设置有多个发光二极管。LED照明灯具还包括一散热底座,所述LED基板固定在该散热底座顶部,驱动电路板收纳于该散热底座底部。所述散热壳体为两端开口的空心壳体,散热壳体一端与电源连接器连接,另一端与散热底座顶部相固定,散热底座容纳于散热壳体内部。所述散热底座顶部和散热壳体上设有相互连通的导流孔。
LED照明灯具工作时,散热底座顶部与散热壳体上开设的导流孔使散热壳体与散热底座之间形成一个内流场,冷空气从散热壳体上开设的导流孔进入,从散热底座上开设的导流孔排出。冷空气可以对散热底座底部以及散热壳体内侧壁进行热交换,有效提升散热效率。由于利用散热壳体和散热底座同时散热,在LED照明灯具的工作过程中,散热壳体表面的温度的较低,用户无意间触摸到LED照明灯具也不会因为散热壳体过热受到伤害。
附图说明
图1是本发明中LED照明灯具的立体图。
图2是本发明中LED照明灯具的爆炸图。
图3是本发明中LED照明灯具的散热底座的结构示意图。
图4是本发明中LED照明灯具的散热壳体的结构示意图。
图5是图1中LED照明灯具的散热方式示意图。
主要元件符号说明
 LED照明灯具   100
  灯罩   10
  散热底座   20
  顶部   21
  底部   22
  凹部   23
  容纳部   24
  后盖   25
  散热鳍片   26
  散热壳体   30
  第一开口部   31
  第二开口部   32
  电源连接器   40
  LED基板   50
  发光二极管   51
  螺丝   52
  驱动电路板   60
  第一导流孔   71
  第二导流孔   72
具体实施方式
请参阅图1,LED照明灯具100包括灯罩10、散热底座20、散热壳体30以及电源连接器40。灯罩10固定在散热底座20上,散热底座20与电源连接器40分别固定在散热壳体30的两端。电源连接器40用来与电源相连接,电源连接器40为通用的电源接口,如螺口电源连接器或者卡口电源连接器。
请参阅图2,LED照明灯具100还包括LED基板50和驱动电路板60。所述LED基板50上还安装有多个发光二极管51。驱动电路板60与电源连接器40和LED基板50电连接,所述驱动电路板60通过电源连接器40从外界获取电能以驱动发光二极管51发光。
灯罩10固定在散热底座20的一端,发光二极管51发出的光线穿过灯罩10射出到LED照明灯具100的外部。灯罩10可以通过螺纹连接、机械卡扣、胶粘等固定方式与散热底座20相固定。在本实施方式中,灯罩10采用透明塑胶为基材,并在其中混合适当比例的光扩散粒子,增加光散射效果并使光柔和化。在其他实施方式中,还可以在所述灯罩10内表面设置粗糙表面来增加灯罩的光漫散射效果。
请一并结合图3,散热底座20的顶部21为圆盘状,该圆盘的上表面形成有一凹部23,所述LED基板50固定在凹部23内。在本实施方式中,LED基板50通过螺丝52固定在凹部23内。优选的,所述LED基板50与散热底座20的顶部21之间还设有导热介质(图未示出),用于将LED基板50工作时散发的热量均匀地传导至散热底座20。在本实施方式中,LED基板50与散热底座20的顶部21之间的导热介质是导热胶带。散热底座20的顶部21的边缘设置有至少一个第一导流孔71。
散热底座20的底部22设有一容纳部24,驱动电路板60收纳于该容纳部24内。在本实施方式中,容纳部24上还扣合了一后盖25,该后盖25将驱动电路板60密封于容纳部24内,提高LED照明灯具100的气密性与水密性。所述后盖25可以采用胶粘的方式扣合在容纳部24上。在散热底座20的底部22还设置有相互间隔一定距离的多个散热鳍片26,所述散热鳍片26与容纳部24相背的设置在散热底座20的底部。散热鳍片26用来增加散热底座20的表面积,从而增加了与空气的接触面积,进而提高了散热效率。
在本实施方式中,散热底座20采用导热性佳的散热材料制成,如铝合金等,所述容纳部24内填充有导热材料,用以将驱动电路板60散发的热量传导至散热鳍片26散发到外部。由LED基板50工作时散发的热量经由导热介质传导至散热底座20,然后传导至散热鳍片26散发。
请一并结合图2和图4,散热壳体30为两端开口的空心壳体,采用导热性佳的散热材料制成,如铝合金等。散热壳体30包括相对设置的第一开口部31与第二开口部32。散热壳体30在第一开口部31与散热底座20顶部通过螺纹结合,散热底座20容纳于散热壳体30内部。散热底座20与散热壳体30通过螺纹的方式固定,可以增大散热底座20与散热壳体30之间的接触面积,加快散热速度。在散热底座20与散热壳体30的螺纹结合处还可以填充导热胶或者其他导热介质,进一步改善间隙间的空气热阻。散热壳体30的第二开口部32与电源连接器40相固定。散热壳体30在所述第二开口部32处设置有至少一个第二导流孔72。该第二导流孔72与第一导流孔71相互连通。
请参考图5,LED照明灯具100工作时,发光二极管51产生的热量经由导热介质传导至散热底座20顶部,再由散热底座20顶部传导至散热壳体30以及散热底座20底部的散热鳍片26。传导至散热壳体30的热量直接与空气进行热交换,从而将热量散发散热。散热底座20顶部的第一导流孔71与散热壳体30第二开口部32的第二导流孔72使散热壳体30与散热底座20之间形成一个内流场,冷空气从远离发光二极管51的第二导流孔72进入,从第一导流孔71排出。从第一导流孔71进入的冷空气可以对散热鳍片26以及散热壳体30内侧壁进行热交换,有效提升散热效率。由于利用散热壳体30和散热底座20同时散热,在LED照明灯具100的工作过程中,散热壳体30表面的温度较低,用户无意间触摸到LED照明灯具100也不会因为散热壳体30过热受到伤害。
本技术领域的普通技术人员应当认识到,以上的实施方式仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围之内,对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。

Claims (7)

1.一种LED照明灯具,包括散热壳体、LED基板、驱动电路板以及电源连接器,所述LED基板上设置有多个发光二极管,其特征在于,还包括一散热底座,所述LED基板固定在该散热底座顶部,散热底座底部设有一容纳部,驱动电路板收纳于该容纳部内,散热底座的顶部的边缘设置有至少一个第一导流孔,所述散热底座底部还设置有相互间隔一定距离的多个散热鳍片,该散热鳍片与容纳部相背的设置在散热底座底部;所述散热壳体为两端开口的空心壳体,散热壳体包括相对设置的第一开口部与第二开口部,散热壳体的第二开口部与电源连接器连接,所述第一开口部与散热底座顶部相固定,散热底座容纳于散热壳体内部,散热壳体在所述第二开口部处设置有至少一个第二导流孔;该第二导流孔与第一导流孔相互连通,使散热壳体与散热底座之间形成一个内流场。
2.如权利要求1所述的LED照明灯具,其特征在于:所述散热底座顶部为圆盘状,该圆盘的上表面形成有一凹部,所述LED基板固定在凹部内。
3.如权利要求2所述的LED照明灯具,其特征在于:所述LED基板与散热底座之间还设置有导热介质,LED基板产生的热量经由导热介质传导至散热底座。
4.如权利要求3所述的LED照明灯具,其特征在于:所述导热介质是石墨导热片、导热胶带或者陶瓷导热板中的一种。
5.如权利要求1所述的LED照明灯具,其特征在于:所述容纳部上还扣合了一后盖,该后盖将驱动电路板密封于容纳部内。
6.如权利要求1所述的LED照明灯具,其特征在于,散热壳体与散热底座顶部通过螺纹结合。
7.如权利要求6所述的LED照明灯具,其特征在于,所述散热底座顶部与散热壳体的螺纹结合处填充有导热介质。
CN2010106054011A 2010-12-25 2010-12-25 Led照明灯具 Expired - Fee Related CN102022656B (zh)

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CN2010106054011A CN102022656B (zh) 2010-12-25 2010-12-25 Led照明灯具
US13/191,475 US20120161627A1 (en) 2010-12-25 2011-07-27 Led illuminating device

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