CN101881387A - Led日光灯 - Google Patents

Led日光灯 Download PDF

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Publication number
CN101881387A
CN101881387A CN2010101951631A CN201010195163A CN101881387A CN 101881387 A CN101881387 A CN 101881387A CN 2010101951631 A CN2010101951631 A CN 2010101951631A CN 201010195163 A CN201010195163 A CN 201010195163A CN 101881387 A CN101881387 A CN 101881387A
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Prior art keywords
light
fluorescent lamp
cover
led fluorescent
shade
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CN2010101951631A
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English (en)
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章绍汉
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鸿富锦精密工业(深圳)有限公司
鸿海精密工业股份有限公司
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Priority to CN2010101951631A priority Critical patent/CN101881387A/zh
Publication of CN101881387A publication Critical patent/CN101881387A/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69Details of refractors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/02Refractors for light sources of prismatic shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86Ceramics or glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

一种LED日光灯,包括散热基座、固定于散热基座上的灯罩和光源基板、安装在散热基座与灯罩端部的电源连接器,所述光源基板上安装有多个发光二极管,所述灯罩包括第一罩体和第二罩体,第一罩体包裹在第二罩体内,该第一罩体采用透明材料制成,第一罩体在远离光源基板的表面上设置有凸起部,第二罩体的表面设置一光扩散层。发光二极管发出的光线透过第一罩体,通过凸起部的折射作用使光线的出光角度增大,然后通过第二罩体的散射作用,形成光照明角度较大,均匀柔和的光线。

Description

LED日光灯

技术领域

[0001] 本发明涉及一种日光灯,特别涉及一种LED日光灯。 背景技术

[0002] 和传统光源相比,发光二极管(LED)具有较高之发光效率、低辐射、低耗电、寿命 长、低驱动电压、启动快速、环保、抗震抗压、灯具可小型化等优点,以LED作为日光灯光源 的照明装置目前被广泛应用,用来替代气体荧光式日光灯。

[0003] 现有的LED日光灯通常由圆柱形透明灯管以及安装在灯管内LED光源基板组成。 为了提高LED日光灯的照射度,LED光源基板上安装多列的发光二极管(LED),但所有的发 光二极管都向同一个方向照射,使得LED日光灯的照明角度不足。也有为了增大照射角, 采用增加灯罩的光散射性,通常会在制作灯罩的材料中添加扩散粒子来增加灯罩的光散射 性,此种方式虽然能增加光散射的效果,但是对提升照明角度的作用不明显。

发明内容

[0004] 有鉴于此,本发明提供一种照明角度良好的LED日光灯。

[0005] 一种LED日光灯,包括散热基座、固定于散热基座上的灯罩和光源基板、安装在散 热基座与灯罩端部的电源连接器,所述光源基板上安装有多个发光二极管,所述灯罩包括 第一罩体和第二罩体,第一罩体包裹在第二罩体内,该第一罩体采用透明材料制成,第一罩 体在远离光源基板的表面上设置有凸起部,第二罩体的表面设置一光扩散层。

[0006] 发光二极管发出的光线透过第一罩体,通过凸起部的折射作用使光线的出光角度 增大,然后通过第二罩体的散射作用,形成光照明角度较大,均勻柔和的光线。

附图说明

[0007] 图1是本发明一实施方式中LED日光灯的示意图。

[0008] 图2是图1中的LED日光灯沿着IV-IV方向的截面图。

[0009] 图3是图1中的LED日光灯沿着IV-IV方向的截面的光路示意图。

[0010] 图4是本发明一实施方式中凸起部212的两种常用的结构。

[0011] 图5是图1中的LED日光灯与普通日光灯的配光曲线图。

[0012] 主要元件符号说明

[0013]

LED日光灯 100散热基座 10散热鳍片 11

具体实施方式

[0014] 请参考图1,LED日光灯100包括散热基座10、灯罩20和电源连接器30。灯罩20 固定在散热基座10上,形成大致为细长圆管状结构。电源连接器30设置在散热基座10与 灯罩20形成的圆管状结构的两个端部,电源连接器30用来与电源(未示出)建立电连接。

[0015] 请参考图2,是图1中的LED日光灯沿着IV-IV方向的截面图。LED日光灯100还 包括固定在散热基座10上的光源基板40,光源基板40与电源连接器30电连接。光源基板 40上设置有发光二极管41,根据需要发光二极管41可以选择照射角度较大的草帽型发光二极管、较高功率发光二极管、或者彩色的发光二极管等不同种类。

[0016] 所述散热基座10可以选择采用散热性较好的铝合金基材制造,散热基座10底部 设置有相互间隔一定距离的多个散热鳍片11,散热鳍片11用来增加散热基座10的表面积, 以加快空气流通与散热效率。散热基座10上还形成有一凹部12,所述凹部12与散热鳍片 11相背的设置在散热基座10上。光源基板40设置在所述凹部12内,光源基板40与散热 基座10之间通过高导热性的导热胶带相贴合,导热胶带可以更好的将光源基板40产生的 热量传导至散热基座10,然后通过散热鳍片11与空气进行热交换。光源基板40与也可以 通过螺钉固定或者其他方式与散热基座10相贴合,并在光源基板40与散热基座10之间设 置导热板,用来将光源基板40产生的热量传导至散热基座10。

[0017] 散热基座10还包括卡扣部13,卡扣部13与灯罩20边缘的凸边24相扣合,将灯罩 20固定在散热基座10上。灯罩20对应设置在光源基板40的正上方,光源基板40上的发 光二极管41发出的光透过灯罩20出射到外部。灯罩20包括第一罩体21与第二罩体22, 第一罩体21较第二罩体22更靠近光源基板40,第一罩体21与第二罩体22间隔一定距离 且形成一空腔23。

[0018] 第一罩体21采用透明材料制成,具体可以采用聚甲基丙烯酸甲酯、聚碳酸酯、聚苯乙 烯、苯乙烯-甲基丙烯酸甲酯共聚物中的一种或者几种的混合物。第一罩体21为圆弧形的罩体, 第一罩体21靠近光源基板40的一面为入光面210,与入光面210相对的远离光源基板40的一面 为出光面211。出光面211上设置有棱镜结构的凸起部212。所述凸起部212的尺寸随着远离出 光面211的距离增大而逐渐减小,该凸起部212会对从入光面210入射的光线产生折射作用。

[0019] 请一并结合图3,当发光二极管41发出的光线从入光面210入射,透过第一罩体 21射至凸起部212,并在凸起部212产生折射,在本实施方式中,凸起部212对折射的光线 产生发散作用,从而增大发光二极管41的出光角度。

[0020] 发光二极管41发出的光线可以通过棱镜结构的凸起部212调整出光方向,使出射 光朝向至设定的出光角度,从而来调整LED日光灯100的照明角度。棱镜结构的凸起部212 还可以在第一罩体21上不对称的设计,使发光二极管41发出的光线不对称的透过第一罩 体21,从而可以使LED日光灯100 —侧照明角度大,另一侧的照明角度较小。

[0021] 请参考图4,为本实施例中凸起部212的两种常用的结构。其中,212a为锯齿状的 凸起,212b为圆角化的锯齿状的凸起。

[0022] 第二罩体22以透明材料为基材,透明材料可以采用聚甲基丙烯酸甲酯、聚碳酸 酯、聚苯乙烯、苯乙烯-甲基丙烯酸甲酯共聚物中的一种或者几种的混合物。第二罩体22的 表面设置有一光扩散层50。本实施方式中,光扩散层50为涂覆在第二罩体22的外表面的 光扩散涂层。当发光二极管41发出的光线透过第一罩体21后,通过第二罩体22上光扩散 涂层的散射作用,形成均勻柔和的光线。光扩散涂层也可以涂覆在第二罩体22的内表面。

[0023] 光扩散层50也可以采用在内表面或者外表面以胶粘的方式贴覆光扩散薄膜以增 加光散射效果并使光柔和化。

[0024] 请一并参考图5,第一配光区域71表示本实施例中LED日光灯100的配光曲线,第 二配光区域72表示普通LED日光灯的配光曲线,可以看出本实施例中LED日光灯100的照 明角度明显大于普通LED日光灯。

[0025] 本技术领域的普通技术人员应当认识到,以上的实施方式仅是用来说明本发明,

5而并非用作为对本发明的限定,只要在本发明的实质精神范围之内,对以上实施例所作的 适当改变和变化都落在本发明要求保护的范围之内。

Claims (9)

  1. 一种LED日光灯,包括散热基座、固定于散热基座上的灯罩和光源基板、安装在散热基座与灯罩端部的电源连接器,所述光源基板上安装有多个发光二极管,其特征在于,所述灯罩包括第一罩体和第二罩体,第一罩体包裹在第二罩体内,该第一罩体采用透明材料制成,第一罩体在远离光源基板的表面上设置有凸起部,第二罩体的表面设置有光扩散层。
  2. 2.如权利要求1所述的LED日光灯,其特征在于:所述凸起部为锯齿状凸起。
  3. 3.如权利要求1所述的LED日光灯,其特征在于:所述凸起部为圆角化的锯齿状凸起。
  4. 4.如权利要求1所述的LED日光灯,其特征在于:所述光扩散层为光扩散薄膜,光扩散 薄膜贴附在第二罩体的内表面或者外表面。
  5. 5.如权利要求1所述的LED日光灯,其特征在于:所述光扩散层为光扩散涂层,光扩散 涂层涂覆在第二罩体的内表面或者外表面。
  6. 6.如权利要求1所述的LED日光灯,其特征在于:所述散热基座包括卡扣部,灯罩边缘 设置有凸边,该卡扣部与灯罩边缘的凸边相扣合,将灯罩固定在散热基座上。
  7. 7.如权利要求1所述的LED日光灯,其特征在于:所述散热基座还包括多个间隔设置 的散热鳍片。
  8. 8.如权利要求1所述的LED日光灯,其特征在于:所述散热基座形成有一凹部,光源基 板设置在所述凹部内。
  9. 9.如权利要求1所述的LED日光灯,其特征在于:所述光源基板通过导热的导热胶带 与散热基座相贴合。
CN2010101951631A 2010-06-10 2010-06-10 Led日光灯 CN101881387A (zh)

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US13/091,134 US20110305024A1 (en) 2010-06-10 2011-04-21 Led tube lamp

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102022657A (zh) * 2010-12-28 2011-04-20 鸿富锦精密工业(深圳)有限公司 Led照明灯具
CN102679226A (zh) * 2012-05-31 2012-09-19 东莞市帝信光电科技有限公司 一种大发光面无暗区led灯管
CN102797984A (zh) * 2011-05-24 2012-11-28 旭丽电子(广州)有限公司 灯管
JP2013012453A (ja) * 2011-06-02 2013-01-17 Rohm Co Ltd Ledランプ
CN103411152A (zh) * 2013-08-30 2013-11-27 杭州友旺科技有限公司 发光二极管日光灯
CN103604056A (zh) * 2013-11-22 2014-02-26 林英强 一种led照明灯具
CN104421844A (zh) * 2013-09-03 2015-03-18 深圳市海洋王照明工程有限公司 灯具用的透明件及灯具
CN105339724A (zh) * 2013-06-03 2016-02-17 皇家飞利浦有限公司 管状照明设备
CN105371231A (zh) * 2014-09-01 2016-03-02 鸿富锦精密工业(深圳)有限公司 照明装置
CN105972557A (zh) * 2016-07-25 2016-09-28 安徽众益光电科技有限公司 一种护眼led日光灯
CN106931341A (zh) * 2015-12-31 2017-07-07 赛尔富电子有限公司 一种面光源led条形灯
CN107366837A (zh) * 2017-08-30 2017-11-21 合肥信诺捷科节能服务有限公司 Led灯具
CN107477442A (zh) * 2017-08-30 2017-12-15 合肥信诺捷科节能服务有限公司 一种led灯
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