JP2009021264A - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JP2009021264A JP2009021264A JP2008269038A JP2008269038A JP2009021264A JP 2009021264 A JP2009021264 A JP 2009021264A JP 2008269038 A JP2008269038 A JP 2008269038A JP 2008269038 A JP2008269038 A JP 2008269038A JP 2009021264 A JP2009021264 A JP 2009021264A
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- light emitting
- led chip
- lighting device
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- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 31
- 230000005855 radiation Effects 0.000 abstract description 17
- 238000005286 illumination Methods 0.000 abstract description 14
- 230000017525 heat dissipation Effects 0.000 description 15
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- 239000003570 air Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
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- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- -1 Al and Cu Chemical class 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
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- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
【解決手段】 ベース部1の主面上に複数の絶縁性ヒートシンク2がアレイ状に配置される。各絶縁性ヒートシンク上にLEDチップ3が設けられる。ベース部1上の複数の絶縁性ヒートシンク3および複数の複数のLEDチップ3は蛍光体を含有する樹脂により封止され、蛍光体入り樹脂モールド部4が形成される。蛍光体入り樹脂モールド部4上に半球状樹脂モールド部5が形成される。ベース部1の裏面側には円筒状の支持体6が取り付けられる。支持体6の外周面には複数の放熱フィン7が設けられる。複数の放熱フィン7は支持体6の中心軸を中心として外周面から外方に放射状に延びる。支持体6の他端面には絶縁部60を介して口金9が設けられる。
【選択図】 図1
Description
2 絶縁性ヒートシンク
3 LEDチップ
4 蛍光体入り樹脂モールド部
5 半球状樹脂モールド部
6 支持体
7 放熱フィン
8 交流直流変換回路
9 口金
10 プリント配線基板
11,12 配線部
13,14 ワイヤ
21 ファン用軸受け
22 ファン
23 ベアリング
24 モータ
25 プーリ
26 ファンベルト
31,32 端子
60 絶縁部
91 ねじ部
92 突起部
Claims (5)
- 一面および他面を有する基体と、
前記基体の前記一面上に設けられた複数の発光素子と、
前記基体の前記他面上に設けられた支持体とを備え、
前記支持体は、前記支持体の中心軸を中心として、該支持体の外周面から外方に放射状に延びる複数の放熱フィンを備え、
前記放熱フィンの一端面は前記基体の前記他面に固定されていることを特徴とする照明装置。 - 前記放熱フィンは、板状であり、一辺が前記支持体の中心軸に平行になるように前記支持体の外周面に設けられていることを特徴とする請求項1記載の照明装置。
- 前記複数の発光素子を覆うように前記基体の前記一面側が樹脂で封止されたことを特徴とする請求項1又は2記載の照明装置。
- 前記複数の放熱フィンは、前記基体の端面よりも外方に突出するように設けられたことを特徴とする請求項1〜3のいずれかに記載の照明装置。
- 前記基体と反対側の前記支持体の端部にソケットに接続可能な電極が設けられたことを特徴とする請求項1〜4のいずれかに記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008269038A JP4651701B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008269038A JP4651701B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003320831A Division JP4236544B2 (ja) | 2003-09-12 | 2003-09-12 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009021264A true JP2009021264A (ja) | 2009-01-29 |
JP4651701B2 JP4651701B2 (ja) | 2011-03-16 |
Family
ID=40360690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008269038A Expired - Lifetime JP4651701B2 (ja) | 2008-10-17 | 2008-10-17 | 照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4651701B2 (ja) |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011014306A (ja) * | 2009-06-30 | 2011-01-20 | Toshiba Lighting & Technology Corp | 電球形ランプおよび照明器具 |
WO2011043390A1 (ja) * | 2009-10-09 | 2011-04-14 | Apsジャパン株式会社 | 照明装置 |
JP2011086618A (ja) * | 2009-10-16 | 2011-04-28 | Foxsemicon Integrated Technology Inc | 照明装置 |
CN102072415A (zh) * | 2009-11-20 | 2011-05-25 | 陈凯柏 | 具感测功能之发光装置 |
JP2011108590A (ja) * | 2009-11-20 | 2011-06-02 | Aps Japan Co Ltd | 照明装置 |
EP2407712A2 (en) | 2010-07-12 | 2012-01-18 | Ichikoh Industries, Ltd. | Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device |
EP2413023A2 (en) | 2010-07-30 | 2012-02-01 | Ichikoh Industries, Ltd. | Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device |
JP2012529150A (ja) * | 2009-06-02 | 2012-11-15 | ブリッジラックス インコーポレイテッド | 球放出パターンを生成する光学部品を有する光源 |
WO2013035980A1 (ko) * | 2011-09-09 | 2013-03-14 | 주식회사 포인트엔지니어링 | 기판 일체형 방열 구조를 갖는 광소자 어레이 기판 및 그 제조 방법 |
JP2013521614A (ja) * | 2010-03-03 | 2013-06-10 | クリー インコーポレイテッド | 散乱特性を増強した遠隔リン光体及びディフューザの構成を用いるledランプ又は電球 |
WO2014155765A1 (ja) | 2013-03-28 | 2014-10-02 | 東芝ライテック株式会社 | 照明装置 |
US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US9217544B2 (en) | 2010-03-03 | 2015-12-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
US9847462B2 (en) | 2013-10-29 | 2017-12-19 | Point Engineering Co., Ltd. | Array substrate for mounting chip and method for manufacturing the same |
US10107477B2 (en) | 2010-11-11 | 2018-10-23 | Bridgelux Inc. | LED light using internal reflector |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US10665762B2 (en) | 2010-03-03 | 2020-05-26 | Ideal Industries Lighting Llc | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
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JPH1117228A (ja) * | 1997-06-20 | 1999-01-22 | Ushio Inc | 照明灯 |
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JP2003100974A (ja) * | 2001-09-25 | 2003-04-04 | Tdk Corp | 空冷式半導体ヒートシンク |
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US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US8922106B2 (en) | 2009-06-02 | 2014-12-30 | Bridgelux, Inc. | Light source with optics to produce a spherical emission pattern |
JP2012529150A (ja) * | 2009-06-02 | 2012-11-15 | ブリッジラックス インコーポレイテッド | 球放出パターンを生成する光学部品を有する光源 |
JP2011014306A (ja) * | 2009-06-30 | 2011-01-20 | Toshiba Lighting & Technology Corp | 電球形ランプおよび照明器具 |
WO2011043390A1 (ja) * | 2009-10-09 | 2011-04-14 | Apsジャパン株式会社 | 照明装置 |
CN102575814A (zh) * | 2009-10-09 | 2012-07-11 | 先技精工(日本)有限公司 | 照明装置 |
US9080755B2 (en) | 2009-10-09 | 2015-07-14 | Aps Japan Co., Ltd. | Lighting device |
JP2011086618A (ja) * | 2009-10-16 | 2011-04-28 | Foxsemicon Integrated Technology Inc | 照明装置 |
CN102072415A (zh) * | 2009-11-20 | 2011-05-25 | 陈凯柏 | 具感测功能之发光装置 |
JP2011108590A (ja) * | 2009-11-20 | 2011-06-02 | Aps Japan Co Ltd | 照明装置 |
US9217544B2 (en) | 2010-03-03 | 2015-12-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9062830B2 (en) | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
JP2013521614A (ja) * | 2010-03-03 | 2013-06-10 | クリー インコーポレイテッド | 散乱特性を増強した遠隔リン光体及びディフューザの構成を用いるledランプ又は電球 |
US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US9500325B2 (en) | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
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