JP2009111346A - Ledアレイおよびその製造方法 - Google Patents
Ledアレイおよびその製造方法 Download PDFInfo
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- JP2009111346A JP2009111346A JP2008221738A JP2008221738A JP2009111346A JP 2009111346 A JP2009111346 A JP 2009111346A JP 2008221738 A JP2008221738 A JP 2008221738A JP 2008221738 A JP2008221738 A JP 2008221738A JP 2009111346 A JP2009111346 A JP 2009111346A
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/10—Refractors for light sources comprising photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】上面、下面および複数の辺を有し、入力端子と出力端子が上面に配置されたサブマウントを備える発光デバイスすなわち発光アレイ。複数の取り付けパッドおよびトレースも上面に配置され、入力端子と出力端子との間に電気的に接続される。複数のLEDも含まれ、各LEDは取り付けパッドの1つに搭載される。取り付けパッドは、LEDより上面を広く覆い、LEDからの熱をサブマウントの上面に放散する。複数のレンズも含まれ、各レンズは取り付けパッドのそれぞれの1つを覆うように成形され、個々の取り付けパッドに搭載されたLEDを包み込む。
【選択図】図1a
Description
Claims (11)
- 複数の辺を有するサブマウントと、
前記サブマウント上の入力端子および出力端子と、
前記サブマウント上の複数の取り付けパッドと、
複数の固体発光体と、
前記固体発光体および前記取り付けパッドを前記入力端子および前記出力端子に接続する複数の電気接続部と、
複数のレンズと、
を備え、
前記固体発光体の少なくとも1つは前記取り付けパッドの各々に電気的に接続されて搭載され、前記取り付けパッドの少なくとも1つは前記固体発光体より前記サブマウントを広く覆い、前記固体発光体からの熱を前記サブマウントの表面に横方向に放散し、
前記レンズは前記取り付けパッドのそれぞれを覆うように成形され、前記取り付けパッドの前記それぞれに取り付けられた前記固体発光体の前記少なくとも1つを包み込む、
ことを特徴とする発光体アレイ。 - 前記取り付けパッドが、前記固体発光体の端から前記サブマウントの前記表面上に伸びることを特徴とする請求項1に記載の発光体アレイ。
- 前記取り付けパッドが、前記固体発光体の端から前記サブマウントの前記表面上に半径方向に伸びることを特徴とする請求項2に記載の発光体アレイ。
- 前記サブマウントは多角形であることを特徴とする請求項1に記載の発光体アレイ。
- 前記サブマウントは上面と下面を有し、前記入力端子と前記出力端子は前記サブマウントの前記上面または前記下面にあることを特徴とする請求項1に記載の発光体アレイ。
- 前記入力端子は、対応する複数の前記辺の近くに配置された第1のコンタクトパッドのセットをさらに備えることを特徴とする請求項1に記載の発光体アレイ。
- 前記出力端子は、前記第1のコンタクトパッドのセットの向かい側の、対応する複数の前記辺の近くに配置された第2のコンタクトパッドセットをさらに備えることを特徴とする請求項6に記載の発光体アレイ。
- 前記電気接続部は、前記入力端子と前記出力端子との間に前記固体発光体および前記取り付けパッドを直列に接続することを特徴とする請求項1に記載の発光体アレイ。
- 前記サブマウントの前記下面に配置されたヒートスプレッダをさらに備えることを特徴とする請求項1に記載の発光体アレイ。
- 前記複数のレンズの少なくとも一部を覆う副光学素子をさらに備えることを特徴とする請求項1に記載の発光体アレイ。
- 発光体アレイを製造する方法であって、
サブマウントを用意する工程と、
前記サブマウントの1つの表面上に導電部材のセットを形成する工程と、
複数のLEDを、前記複数の導電部材で前記LEDが電気的に接続されるように、前記導電部材に取り付ける工程と、
前記サブマウントの上に複数のレンズを、前記レンズの各々が前記LEDの1つを覆うように成形する工程と
を備え、
前記導電部材は、前記LEDからの熱を前記サブマウントの少なくとも一部に放散するような大きさに作られることを特徴とする方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/982,276 US10295147B2 (en) | 2006-11-09 | 2007-10-31 | LED array and method for fabricating same |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009111346A true JP2009111346A (ja) | 2009-05-21 |
Family
ID=40328464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008221738A Pending JP2009111346A (ja) | 2007-10-31 | 2008-08-29 | Ledアレイおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10295147B2 (ja) |
EP (1) | EP2056014B1 (ja) |
JP (1) | JP2009111346A (ja) |
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JP2011113672A (ja) * | 2009-11-24 | 2011-06-09 | Toshiba Lighting & Technology Corp | 発光装置及びこれを備えた照明器具 |
JP2012042670A (ja) * | 2010-08-18 | 2012-03-01 | Nitto Kogaku Kk | レンズ製造システム、レンズアレイおよびled照明装置 |
WO2012064405A1 (en) * | 2010-11-08 | 2012-05-18 | Bridgelux, Inc. | Led-based light source utilizing asymmetric conductors |
WO2013005561A1 (ja) * | 2011-07-07 | 2013-01-10 | 株式会社マリンコムズ琉球 | 可視光通信方法及び可視光通信装置 |
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EP2056014A3 (en) | 2014-04-02 |
US20080170396A1 (en) | 2008-07-17 |
US10295147B2 (en) | 2019-05-21 |
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