US7858403B2
(en)
|
2001-10-31 |
2010-12-28 |
Cree, Inc. |
Methods and systems for fabricating broad spectrum light emitting devices
|
US7009199B2
(en)
*
|
2002-10-22 |
2006-03-07 |
Cree, Inc. |
Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
|
US6885033B2
(en)
*
|
2003-03-10 |
2005-04-26 |
Cree, Inc. |
Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
|
US7714345B2
(en)
|
2003-04-30 |
2010-05-11 |
Cree, Inc. |
Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same
|
US7087936B2
(en)
*
|
2003-04-30 |
2006-08-08 |
Cree, Inc. |
Methods of forming light-emitting devices having an antireflective layer that has a graded index of refraction
|
US7531380B2
(en)
|
2003-04-30 |
2009-05-12 |
Cree, Inc. |
Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof
|
JP3813599B2
(ja)
*
|
2003-06-13 |
2006-08-23 |
ローム株式会社 |
白色発光の発光ダイオード素子を製造する方法
|
US20050104072A1
(en)
|
2003-08-14 |
2005-05-19 |
Slater David B.Jr. |
Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
|
US7183587B2
(en)
*
|
2003-09-09 |
2007-02-27 |
Cree, Inc. |
Solid metal block mounting substrates for semiconductor light emitting devices
|
US7915085B2
(en)
|
2003-09-18 |
2011-03-29 |
Cree, Inc. |
Molded chip fabrication method
|
JP2007511105A
(ja)
*
|
2003-11-12 |
2007-04-26 |
クリー インコーポレイテッド |
発光デバイス(led)をその上に有する半導体ウエハ裏面を加工する方法およびその方法により形成されたled
|
US7518158B2
(en)
*
|
2003-12-09 |
2009-04-14 |
Cree, Inc. |
Semiconductor light emitting devices and submounts
|
US7615689B2
(en)
*
|
2004-02-12 |
2009-11-10 |
Seminis Vegatable Seeds, Inc. |
Methods for coupling resistance alleles in tomato
|
US7202181B2
(en)
*
|
2004-03-26 |
2007-04-10 |
Cres, Inc. |
Etching of substrates of light emitting devices
|
US7355284B2
(en)
|
2004-03-29 |
2008-04-08 |
Cree, Inc. |
Semiconductor light emitting devices including flexible film having therein an optical element
|
US7279346B2
(en)
*
|
2004-03-31 |
2007-10-09 |
Cree, Inc. |
Method for packaging a light emitting device by one dispense then cure step followed by another
|
US7517728B2
(en)
*
|
2004-03-31 |
2009-04-14 |
Cree, Inc. |
Semiconductor light emitting devices including a luminescent conversion element
|
US7326583B2
(en)
*
|
2004-03-31 |
2008-02-05 |
Cree, Inc. |
Methods for packaging of a semiconductor light emitting device
|
US7419912B2
(en)
*
|
2004-04-01 |
2008-09-02 |
Cree, Inc. |
Laser patterning of light emitting devices
|
US7868343B2
(en)
*
|
2004-04-06 |
2011-01-11 |
Cree, Inc. |
Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
|
US7819549B2
(en)
*
|
2004-05-05 |
2010-10-26 |
Rensselaer Polytechnic Institute |
High efficiency light source using solid-state emitter and down-conversion material
|
US7837348B2
(en)
*
|
2004-05-05 |
2010-11-23 |
Rensselaer Polytechnic Institute |
Lighting system using multiple colored light emitting sources and diffuser element
|
US20060002442A1
(en)
*
|
2004-06-30 |
2006-01-05 |
Kevin Haberern |
Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
|
US7795623B2
(en)
|
2004-06-30 |
2010-09-14 |
Cree, Inc. |
Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
|
US7557380B2
(en)
|
2004-07-27 |
2009-07-07 |
Cree, Inc. |
Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
|
US7217583B2
(en)
*
|
2004-09-21 |
2007-05-15 |
Cree, Inc. |
Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
|
US7372198B2
(en)
*
|
2004-09-23 |
2008-05-13 |
Cree, Inc. |
Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
|
DE102004060358A1
(de)
*
|
2004-09-30 |
2006-04-13 |
Osram Opto Semiconductors Gmbh |
Verfahren zum Herstellen von Lumineszenzdiodenchips und Lumineszenzdiodenchip
|
US20060097385A1
(en)
|
2004-10-25 |
2006-05-11 |
Negley Gerald H |
Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
|
US7432536B2
(en)
|
2004-11-04 |
2008-10-07 |
Cree, Inc. |
LED with self aligned bond pad
|
KR100580753B1
(ko)
|
2004-12-17 |
2006-05-15 |
엘지이노텍 주식회사 |
발광소자 패키지
|
US7322732B2
(en)
|
2004-12-23 |
2008-01-29 |
Cree, Inc. |
Light emitting diode arrays for direct backlighting of liquid crystal displays
|
US8288942B2
(en)
*
|
2004-12-28 |
2012-10-16 |
Cree, Inc. |
High efficacy white LED
|
US8125137B2
(en)
|
2005-01-10 |
2012-02-28 |
Cree, Inc. |
Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
|
US7304694B2
(en)
*
|
2005-01-12 |
2007-12-04 |
Cree, Inc. |
Solid colloidal dispersions for backlighting of liquid crystal displays
|
US7335920B2
(en)
*
|
2005-01-24 |
2008-02-26 |
Cree, Inc. |
LED with current confinement structure and surface roughening
|
US7939842B2
(en)
*
|
2005-01-27 |
2011-05-10 |
Cree, Inc. |
Light emitting device packages, light emitting diode (LED) packages and related methods
|
JP2006222288A
(ja)
*
|
2005-02-10 |
2006-08-24 |
Toshiba Corp |
白色led及びその製造方法
|
JP4950557B2
(ja)
*
|
2005-05-31 |
2012-06-13 |
三洋電機株式会社 |
半導体発光装置
|
JP2008544553A
(ja)
*
|
2005-06-23 |
2008-12-04 |
レンセレイアー ポリテクニック インスティテュート |
短波長ledとダウンコンバージョン物質で白色光を生成するパッケージ設計
|
US7365371B2
(en)
*
|
2005-08-04 |
2008-04-29 |
Cree, Inc. |
Packages for semiconductor light emitting devices utilizing dispensed encapsulants
|
US8835952B2
(en)
|
2005-08-04 |
2014-09-16 |
Cree, Inc. |
Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
|
US20070096120A1
(en)
*
|
2005-10-27 |
2007-05-03 |
Gelcore Llc |
Lateral current GaN flip chip LED with shaped transparent substrate
|
JP5614766B2
(ja)
*
|
2005-12-21 |
2014-10-29 |
クリー インコーポレイテッドCree Inc. |
照明装置
|
CN101351891B
(zh)
|
2005-12-22 |
2014-11-19 |
科锐公司 |
照明装置
|
JP2009530798A
(ja)
|
2006-01-05 |
2009-08-27 |
イルミテックス, インコーポレイテッド |
Ledから光を導くための独立した光学デバイス
|
US7442564B2
(en)
*
|
2006-01-19 |
2008-10-28 |
Cree, Inc. |
Dispensed electrical interconnections
|
EP2002488A4
(de)
*
|
2006-01-20 |
2012-05-30 |
Cree Inc |
Verschiebung von spektralen inhalten in festkörperlichtsender mittels räumlicher trennung von lumiphorfilmen
|
US8441179B2
(en)
|
2006-01-20 |
2013-05-14 |
Cree, Inc. |
Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
|
US7521728B2
(en)
*
|
2006-01-20 |
2009-04-21 |
Cree, Inc. |
Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
|
US8969908B2
(en)
|
2006-04-04 |
2015-03-03 |
Cree, Inc. |
Uniform emission LED package
|
US7863639B2
(en)
*
|
2006-04-12 |
2011-01-04 |
Semileds Optoelectronics Co. Ltd. |
Light-emitting diode lamp with low thermal resistance
|
US8373195B2
(en)
|
2006-04-12 |
2013-02-12 |
SemiLEDs Optoelectronics Co., Ltd. |
Light-emitting diode lamp with low thermal resistance
|
US7821194B2
(en)
*
|
2006-04-18 |
2010-10-26 |
Cree, Inc. |
Solid state lighting devices including light mixtures
|
US8998444B2
(en)
*
|
2006-04-18 |
2015-04-07 |
Cree, Inc. |
Solid state lighting devices including light mixtures
|
JP5308618B2
(ja)
*
|
2006-04-26 |
2013-10-09 |
日亜化学工業株式会社 |
半導体発光装置
|
EP2027412B1
(de)
*
|
2006-05-23 |
2018-07-04 |
Cree, Inc. |
Beleuchtungsvorrichtung
|
US7718991B2
(en)
*
|
2006-05-23 |
2010-05-18 |
Cree Led Lighting Solutions, Inc. |
Lighting device and method of making
|
WO2007139894A2
(en)
|
2006-05-26 |
2007-12-06 |
Cree Led Lighting Solutions, Inc. |
Solid state light emitting device and method of making same
|
US8698184B2
(en)
|
2011-01-21 |
2014-04-15 |
Cree, Inc. |
Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
|
US7943952B2
(en)
|
2006-07-31 |
2011-05-17 |
Cree, Inc. |
Method of uniform phosphor chip coating and LED package fabricated using method
|
US7763478B2
(en)
|
2006-08-21 |
2010-07-27 |
Cree, Inc. |
Methods of forming semiconductor light emitting device packages by liquid injection molding
|
KR20090048640A
(ko)
|
2006-08-23 |
2009-05-14 |
크리 엘이디 라이팅 솔루션즈, 인크. |
조명 장치 및 조명 방법
|
US7703942B2
(en)
|
2006-08-31 |
2010-04-27 |
Rensselaer Polytechnic Institute |
High-efficient light engines using light emitting diodes
|
US8087960B2
(en)
*
|
2006-10-02 |
2012-01-03 |
Illumitex, Inc. |
LED system and method
|
US20090275266A1
(en)
*
|
2006-10-02 |
2009-11-05 |
Illumitex, Inc. |
Optical device polishing
|
US20090275157A1
(en)
*
|
2006-10-02 |
2009-11-05 |
Illumitex, Inc. |
Optical device shaping
|
US7808013B2
(en)
*
|
2006-10-31 |
2010-10-05 |
Cree, Inc. |
Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
|
US10295147B2
(en)
|
2006-11-09 |
2019-05-21 |
Cree, Inc. |
LED array and method for fabricating same
|
US7889421B2
(en)
|
2006-11-17 |
2011-02-15 |
Rensselaer Polytechnic Institute |
High-power white LEDs and manufacturing method thereof
|
US20080121911A1
(en)
*
|
2006-11-28 |
2008-05-29 |
Cree, Inc. |
Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
|
US9159888B2
(en)
|
2007-01-22 |
2015-10-13 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US9024349B2
(en)
|
2007-01-22 |
2015-05-05 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US8232564B2
(en)
|
2007-01-22 |
2012-07-31 |
Cree, Inc. |
Wafer level phosphor coating technique for warm light emitting diodes
|
US9061450B2
(en)
|
2007-02-12 |
2015-06-23 |
Cree, Inc. |
Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
|
US7709853B2
(en)
*
|
2007-02-12 |
2010-05-04 |
Cree, Inc. |
Packaged semiconductor light emitting devices having multiple optical elements
|
US20080198572A1
(en)
*
|
2007-02-21 |
2008-08-21 |
Medendorp Nicholas W |
LED lighting systems including luminescent layers on remote reflectors
|
US8409972B2
(en)
*
|
2007-04-11 |
2013-04-02 |
Cree, Inc. |
Light emitting diode having undoped and unintentionally doped nitride transition layer
|
US7910944B2
(en)
*
|
2007-05-04 |
2011-03-22 |
Cree, Inc. |
Side mountable semiconductor light emitting device packages and panels
|
US20080283864A1
(en)
*
|
2007-05-16 |
2008-11-20 |
Letoquin Ronan P |
Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices
|
US8042971B2
(en)
*
|
2007-06-27 |
2011-10-25 |
Cree, Inc. |
Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods
|
US20090002979A1
(en)
*
|
2007-06-27 |
2009-01-01 |
Cree, Inc. |
Light emitting device (led) lighting systems for emitting light in multiple directions and related methods
|
US10505083B2
(en)
|
2007-07-11 |
2019-12-10 |
Cree, Inc. |
Coating method utilizing phosphor containment structure and devices fabricated using same
|
EP2171502B1
(de)
*
|
2007-07-17 |
2016-09-14 |
Cree, Inc. |
Optische elemente mit internen optischen funktionen und herstellungsverfahren dafür
|
US20090039375A1
(en)
*
|
2007-08-07 |
2009-02-12 |
Cree, Inc. |
Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
|
US7863635B2
(en)
*
|
2007-08-07 |
2011-01-04 |
Cree, Inc. |
Semiconductor light emitting devices with applied wavelength conversion materials
|
CN101836297A
(zh)
*
|
2007-10-26 |
2010-09-15 |
科锐Led照明科技公司 |
具有一个或多个发光荧光体的照明装置及其制造方法
|
US9082921B2
(en)
|
2007-10-31 |
2015-07-14 |
Cree, Inc. |
Multi-die LED package
|
US9172012B2
(en)
|
2007-10-31 |
2015-10-27 |
Cree, Inc. |
Multi-chip light emitter packages and related methods
|
US9666762B2
(en)
|
2007-10-31 |
2017-05-30 |
Cree, Inc. |
Multi-chip light emitter packages and related methods
|
US9640737B2
(en)
*
|
2011-01-31 |
2017-05-02 |
Cree, Inc. |
Horizontal light emitting diodes including phosphor particles
|
US8119028B2
(en)
*
|
2007-11-14 |
2012-02-21 |
Cree, Inc. |
Cerium and europium doped single crystal phosphors
|
US9660153B2
(en)
|
2007-11-14 |
2017-05-23 |
Cree, Inc. |
Gap engineering for flip-chip mounted horizontal LEDs
|
US9754926B2
(en)
|
2011-01-31 |
2017-09-05 |
Cree, Inc. |
Light emitting diode (LED) arrays including direct die attach and related assemblies
|
US9041285B2
(en)
|
2007-12-14 |
2015-05-26 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US8167674B2
(en)
|
2007-12-14 |
2012-05-01 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US8878219B2
(en)
|
2008-01-11 |
2014-11-04 |
Cree, Inc. |
Flip-chip phosphor coating method and devices fabricated utilizing method
|
US8940561B2
(en)
*
|
2008-01-15 |
2015-01-27 |
Cree, Inc. |
Systems and methods for application of optical materials to optical elements
|
US8058088B2
(en)
|
2008-01-15 |
2011-11-15 |
Cree, Inc. |
Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
|
US10008637B2
(en)
|
2011-12-06 |
2018-06-26 |
Cree, Inc. |
Light emitter devices and methods with reduced dimensions and improved light output
|
US8178888B2
(en)
*
|
2008-02-01 |
2012-05-15 |
Cree, Inc. |
Semiconductor light emitting devices with high color rendering
|
JP2011512037A
(ja)
*
|
2008-02-08 |
2011-04-14 |
イルミテックス, インコーポレイテッド |
エミッタ層成形のためのシステムおよび方法
|
US8637883B2
(en)
|
2008-03-19 |
2014-01-28 |
Cree, Inc. |
Low index spacer layer in LED devices
|
US9147812B2
(en)
*
|
2008-06-24 |
2015-09-29 |
Cree, Inc. |
Methods of assembly for a semiconductor light emitting device package
|
US20100006873A1
(en)
*
|
2008-06-25 |
2010-01-14 |
Soraa, Inc. |
HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN
|
US8240875B2
(en)
|
2008-06-25 |
2012-08-14 |
Cree, Inc. |
Solid state linear array modules for general illumination
|
US7955875B2
(en)
*
|
2008-09-26 |
2011-06-07 |
Cree, Inc. |
Forming light emitting devices including custom wavelength conversion structures
|
US9052416B2
(en)
|
2008-11-18 |
2015-06-09 |
Cree, Inc. |
Ultra-high efficacy semiconductor light emitting devices
|
US8004172B2
(en)
|
2008-11-18 |
2011-08-23 |
Cree, Inc. |
Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
|
US8853712B2
(en)
|
2008-11-18 |
2014-10-07 |
Cree, Inc. |
High efficacy semiconductor light emitting devices employing remote phosphor configurations
|
TW201034256A
(en)
*
|
2008-12-11 |
2010-09-16 |
Illumitex Inc |
Systems and methods for packaging light-emitting diode devices
|
US8339029B2
(en)
|
2009-02-19 |
2012-12-25 |
Cree, Inc. |
Light emitting devices and systems having tunable chromaticity
|
US8333631B2
(en)
*
|
2009-02-19 |
2012-12-18 |
Cree, Inc. |
Methods for combining light emitting devices in a package and packages including combined light emitting devices
|
US7967652B2
(en)
*
|
2009-02-19 |
2011-06-28 |
Cree, Inc. |
Methods for combining light emitting devices in a package and packages including combined light emitting devices
|
TWI393234B
(zh)
*
|
2009-03-10 |
2013-04-11 |
Chipmos Technologies Inc |
封裝基板以及晶片封裝結構
|
US8921876B2
(en)
*
|
2009-06-02 |
2014-12-30 |
Cree, Inc. |
Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
|
US20110012141A1
(en)
|
2009-07-15 |
2011-01-20 |
Le Toquin Ronan P |
Single-color wavelength-converted light emitting devices
|
US9437785B2
(en)
|
2009-08-10 |
2016-09-06 |
Cree, Inc. |
Light emitting diodes including integrated backside reflector and die attach
|
US8153475B1
(en)
|
2009-08-18 |
2012-04-10 |
Sorra, Inc. |
Back-end processes for substrates re-use
|
US8585253B2
(en)
|
2009-08-20 |
2013-11-19 |
Illumitex, Inc. |
System and method for color mixing lens array
|
US8449128B2
(en)
*
|
2009-08-20 |
2013-05-28 |
Illumitex, Inc. |
System and method for a lens and phosphor layer
|
US9000466B1
(en)
|
2010-08-23 |
2015-04-07 |
Soraa, Inc. |
Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
|
US8207554B2
(en)
*
|
2009-09-11 |
2012-06-26 |
Soraa, Inc. |
System and method for LED packaging
|
US8933644B2
(en)
|
2009-09-18 |
2015-01-13 |
Soraa, Inc. |
LED lamps with improved quality of light
|
US9293667B2
(en)
|
2010-08-19 |
2016-03-22 |
Soraa, Inc. |
System and method for selected pump LEDs with multiple phosphors
|
US9293644B2
(en)
|
2009-09-18 |
2016-03-22 |
Soraa, Inc. |
Power light emitting diode and method with uniform current density operation
|
US9435493B2
(en)
|
2009-10-27 |
2016-09-06 |
Cree, Inc. |
Hybrid reflector system for lighting device
|
US8269245B1
(en)
*
|
2009-10-30 |
2012-09-18 |
Soraa, Inc. |
Optical device with wavelength selective reflector
|
JP5349260B2
(ja)
*
|
2009-11-19 |
2013-11-20 |
株式会社東芝 |
半導体発光装置及びその製造方法
|
US8466611B2
(en)
|
2009-12-14 |
2013-06-18 |
Cree, Inc. |
Lighting device with shaped remote phosphor
|
US8905588B2
(en)
|
2010-02-03 |
2014-12-09 |
Sorra, Inc. |
System and method for providing color light sources in proximity to predetermined wavelength conversion structures
|
US20110186874A1
(en)
*
|
2010-02-03 |
2011-08-04 |
Soraa, Inc. |
White Light Apparatus and Method
|
US10147850B1
(en)
|
2010-02-03 |
2018-12-04 |
Soraa, Inc. |
System and method for providing color light sources in proximity to predetermined wavelength conversion structures
|
US9275979B2
(en)
|
2010-03-03 |
2016-03-01 |
Cree, Inc. |
Enhanced color rendering index emitter through phosphor separation
|
US9991427B2
(en)
*
|
2010-03-08 |
2018-06-05 |
Cree, Inc. |
Photonic crystal phosphor light conversion structures for light emitting devices
|
US20110220920A1
(en)
*
|
2010-03-09 |
2011-09-15 |
Brian Thomas Collins |
Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
|
US8508127B2
(en)
*
|
2010-03-09 |
2013-08-13 |
Cree, Inc. |
High CRI lighting device with added long-wavelength blue color
|
US8684559B2
(en)
|
2010-06-04 |
2014-04-01 |
Cree, Inc. |
Solid state light source emitting warm light with high CRI
|
US10546846B2
(en)
|
2010-07-23 |
2020-01-28 |
Cree, Inc. |
Light transmission control for masking appearance of solid state light sources
|
US8410679B2
(en)
|
2010-09-21 |
2013-04-02 |
Cree, Inc. |
Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface
|
US9515229B2
(en)
|
2010-09-21 |
2016-12-06 |
Cree, Inc. |
Semiconductor light emitting devices with optical coatings and methods of making same
|
US8803452B2
(en)
|
2010-10-08 |
2014-08-12 |
Soraa, Inc. |
High intensity light source
|
US9674938B2
(en)
|
2010-11-03 |
2017-06-06 |
3M Innovative Properties Company |
Flexible LED device for thermal management
|
KR20130143067A
(ko)
|
2010-11-03 |
2013-12-30 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
가요성 led 디바이스 및 제조 방법
|
US8541951B1
(en)
|
2010-11-17 |
2013-09-24 |
Soraa, Inc. |
High temperature LED system using an AC power source
|
US8896235B1
(en)
|
2010-11-17 |
2014-11-25 |
Soraa, Inc. |
High temperature LED system using an AC power source
|
US8556469B2
(en)
|
2010-12-06 |
2013-10-15 |
Cree, Inc. |
High efficiency total internal reflection optic for solid state lighting luminaires
|
US8772817B2
(en)
|
2010-12-22 |
2014-07-08 |
Cree, Inc. |
Electronic device submounts including substrates with thermally conductive vias
|
CN102130253B
(zh)
*
|
2011-01-27 |
2012-12-26 |
广东银雨芯片半导体有限公司 |
一种高出光效率的led晶片及其制造方法
|
US8589120B2
(en)
|
2011-01-28 |
2013-11-19 |
Cree, Inc. |
Methods, systems, and apparatus for determining optical properties of elements of lighting components having similar color points
|
US9166126B2
(en)
|
2011-01-31 |
2015-10-20 |
Cree, Inc. |
Conformally coated light emitting devices and methods for providing the same
|
US9673363B2
(en)
|
2011-01-31 |
2017-06-06 |
Cree, Inc. |
Reflective mounting substrates for flip-chip mounted horizontal LEDs
|
US9831220B2
(en)
|
2011-01-31 |
2017-11-28 |
Cree, Inc. |
Light emitting diode (LED) arrays including direct die attach and related assemblies
|
US9053958B2
(en)
|
2011-01-31 |
2015-06-09 |
Cree, Inc. |
Light emitting diode (LED) arrays including direct die attach and related assemblies
|
US9508904B2
(en)
|
2011-01-31 |
2016-11-29 |
Cree, Inc. |
Structures and substrates for mounting optical elements and methods and devices for providing the same background
|
US8698388B2
(en)
|
2011-02-03 |
2014-04-15 |
Cree, Inc. |
Lighting apparatus providing increased luminous flux while maintaining color point and CRI
|
US9401103B2
(en)
|
2011-02-04 |
2016-07-26 |
Cree, Inc. |
LED-array light source with aspect ratio greater than 1
|
US10036544B1
(en)
|
2011-02-11 |
2018-07-31 |
Soraa, Inc. |
Illumination source with reduced weight
|
US8618742B2
(en)
*
|
2011-02-11 |
2013-12-31 |
Soraa, Inc. |
Illumination source and manufacturing methods
|
US8643257B2
(en)
|
2011-02-11 |
2014-02-04 |
Soraa, Inc. |
Illumination source with reduced inner core size
|
US8324835B2
(en)
*
|
2011-02-11 |
2012-12-04 |
Soraa, Inc. |
Modular LED lamp and manufacturing methods
|
US8525396B2
(en)
*
|
2011-02-11 |
2013-09-03 |
Soraa, Inc. |
Illumination source with direct die placement
|
US10098197B2
(en)
|
2011-06-03 |
2018-10-09 |
Cree, Inc. |
Lighting devices with individually compensating multi-color clusters
|
US11251164B2
(en)
|
2011-02-16 |
2022-02-15 |
Creeled, Inc. |
Multi-layer conversion material for down conversion in solid state lighting
|
KR20140022019A
(ko)
*
|
2011-04-20 |
2014-02-21 |
가부시키가이샤 에루므 |
발광장치 및 그 제조방법
|
JP5746553B2
(ja)
*
|
2011-04-28 |
2015-07-08 |
株式会社東芝 |
基板加工システム、および基板加工プログラム
|
US8921875B2
(en)
|
2011-05-10 |
2014-12-30 |
Cree, Inc. |
Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
|
US8729790B2
(en)
|
2011-06-03 |
2014-05-20 |
Cree, Inc. |
Coated phosphors and light emitting devices including the same
|
US8814621B2
(en)
|
2011-06-03 |
2014-08-26 |
Cree, Inc. |
Methods of determining and making red nitride compositions
|
US8906263B2
(en)
|
2011-06-03 |
2014-12-09 |
Cree, Inc. |
Red nitride phosphors
|
US8747697B2
(en)
|
2011-06-07 |
2014-06-10 |
Cree, Inc. |
Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
|
US8684569B2
(en)
|
2011-07-06 |
2014-04-01 |
Cree, Inc. |
Lens and trim attachment structure for solid state downlights
|
US10686107B2
(en)
|
2011-07-21 |
2020-06-16 |
Cree, Inc. |
Light emitter devices and components with improved chemical resistance and related methods
|
US10211380B2
(en)
|
2011-07-21 |
2019-02-19 |
Cree, Inc. |
Light emitting devices and components having improved chemical resistance and related methods
|
KR20140038553A
(ko)
|
2011-07-21 |
2014-03-28 |
크리,인코포레이티드 |
향상된 화학적 내성을 위한 발광 장치 패키지들, 부품들 및 방법들 그리고 관련된 방법들
|
US9488324B2
(en)
|
2011-09-02 |
2016-11-08 |
Soraa, Inc. |
Accessories for LED lamp systems
|
US8884517B1
(en)
|
2011-10-17 |
2014-11-11 |
Soraa, Inc. |
Illumination sources with thermally-isolated electronics
|
US9496466B2
(en)
|
2011-12-06 |
2016-11-15 |
Cree, Inc. |
Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
|
US9318669B2
(en)
|
2012-01-30 |
2016-04-19 |
Cree, Inc. |
Methods of determining and making red nitride compositions
|
US9343441B2
(en)
|
2012-02-13 |
2016-05-17 |
Cree, Inc. |
Light emitter devices having improved light output and related methods
|
US9240530B2
(en)
|
2012-02-13 |
2016-01-19 |
Cree, Inc. |
Light emitter devices having improved chemical and physical resistance and related methods
|
US9735198B2
(en)
|
2012-03-30 |
2017-08-15 |
Cree, Inc. |
Substrate based light emitter devices, components, and related methods
|
US8985794B1
(en)
|
2012-04-17 |
2015-03-24 |
Soraa, Inc. |
Providing remote blue phosphors in an LED lamp
|
US9978904B2
(en)
|
2012-10-16 |
2018-05-22 |
Soraa, Inc. |
Indium gallium nitride light emitting devices
|
US9761763B2
(en)
|
2012-12-21 |
2017-09-12 |
Soraa, Inc. |
Dense-luminescent-materials-coated violet LEDs
|
KR20140095395A
(ko)
*
|
2013-01-24 |
2014-08-01 |
삼성전자주식회사 |
반도체 발광소자 및 발광장치
|
US9316382B2
(en)
|
2013-01-31 |
2016-04-19 |
Cree, Inc. |
Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
|
US9039746B2
(en)
|
2013-02-08 |
2015-05-26 |
Cree, Inc. |
Solid state light emitting devices including adjustable melatonin suppression effects
|
US9030103B2
(en)
|
2013-02-08 |
2015-05-12 |
Cree, Inc. |
Solid state light emitting devices including adjustable scotopic / photopic ratio
|
US9565782B2
(en)
|
2013-02-15 |
2017-02-07 |
Ecosense Lighting Inc. |
Field replaceable power supply cartridge
|
US9055643B2
(en)
|
2013-03-13 |
2015-06-09 |
Cree, Inc. |
Solid state lighting apparatus and methods of forming
|
US8994033B2
(en)
|
2013-07-09 |
2015-03-31 |
Soraa, Inc. |
Contacts for an n-type gallium and nitrogen substrate for optical devices
|
US9410664B2
(en)
|
2013-08-29 |
2016-08-09 |
Soraa, Inc. |
Circadian friendly LED light source
|
US9240528B2
(en)
|
2013-10-03 |
2016-01-19 |
Cree, Inc. |
Solid state lighting apparatus with high scotopic/photopic (S/P) ratio
|
DE102013111503B4
(de)
*
|
2013-10-18 |
2021-08-05 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Optoelektronischer Halbleiterchip, optoelektronisches Bauelement und Verfahren zur Vereinzelung von Halbleiterchips
|
US9419189B1
(en)
|
2013-11-04 |
2016-08-16 |
Soraa, Inc. |
Small LED source with high brightness and high efficiency
|
US9502614B2
(en)
*
|
2014-06-04 |
2016-11-22 |
Formosa Epitaxy Incorporation |
Light emitting diode chip, light emitting device, and wafer-level structure of light emitting diode
|
KR101647068B1
(ko)
*
|
2014-10-27 |
2016-08-10 |
주식회사 세미콘라이트 |
반도체 발광소자 및 이를 제조하는 방법
|
US10477636B1
(en)
|
2014-10-28 |
2019-11-12 |
Ecosense Lighting Inc. |
Lighting systems having multiple light sources
|
US10431568B2
(en)
|
2014-12-18 |
2019-10-01 |
Cree, Inc. |
Light emitting diodes, components and related methods
|
US11306897B2
(en)
|
2015-02-09 |
2022-04-19 |
Ecosense Lighting Inc. |
Lighting systems generating partially-collimated light emissions
|
US9869450B2
(en)
|
2015-02-09 |
2018-01-16 |
Ecosense Lighting Inc. |
Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
|
US9651216B2
(en)
|
2015-03-03 |
2017-05-16 |
Ecosense Lighting Inc. |
Lighting systems including asymmetric lens modules for selectable light distribution
|
US9568665B2
(en)
|
2015-03-03 |
2017-02-14 |
Ecosense Lighting Inc. |
Lighting systems including lens modules for selectable light distribution
|
US9651227B2
(en)
|
2015-03-03 |
2017-05-16 |
Ecosense Lighting Inc. |
Low-profile lighting system having pivotable lighting enclosure
|
US9746159B1
(en)
|
2015-03-03 |
2017-08-29 |
Ecosense Lighting Inc. |
Lighting system having a sealing system
|
US20160293811A1
(en)
|
2015-03-31 |
2016-10-06 |
Cree, Inc. |
Light emitting diodes and methods with encapsulation
|
WO2016176625A1
(en)
|
2015-04-30 |
2016-11-03 |
Cree, Inc. |
Solid state lighting components
|
USD785218S1
(en)
|
2015-07-06 |
2017-04-25 |
Ecosense Lighting Inc. |
LED luminaire having a mounting system
|
US10074635B2
(en)
|
2015-07-17 |
2018-09-11 |
Cree, Inc. |
Solid state light emitter devices and methods
|
USD782093S1
(en)
|
2015-07-20 |
2017-03-21 |
Ecosense Lighting Inc. |
LED luminaire having a mounting system
|
USD782094S1
(en)
|
2015-07-20 |
2017-03-21 |
Ecosense Lighting Inc. |
LED luminaire having a mounting system
|
US9651232B1
(en)
|
2015-08-03 |
2017-05-16 |
Ecosense Lighting Inc. |
Lighting system having a mounting device
|
US10290777B2
(en)
|
2016-07-26 |
2019-05-14 |
Cree, Inc. |
Light emitting diodes, components and related methods
|
WO2018052902A1
(en)
|
2016-09-13 |
2018-03-22 |
Cree, Inc. |
Light emitting diodes, components and related methods
|
US10804251B2
(en)
|
2016-11-22 |
2020-10-13 |
Cree, Inc. |
Light emitting diode (LED) devices, components and methods
|
US10439114B2
(en)
|
2017-03-08 |
2019-10-08 |
Cree, Inc. |
Substrates for light emitting diodes and related methods
|
US10410997B2
(en)
|
2017-05-11 |
2019-09-10 |
Cree, Inc. |
Tunable integrated optics LED components and methods
|
US10672957B2
(en)
|
2017-07-19 |
2020-06-02 |
Cree, Inc. |
LED apparatuses and methods for high lumen output density
|
US11107857B2
(en)
|
2017-08-18 |
2021-08-31 |
Creeled, Inc. |
Light emitting diodes, components and related methods
|
US11101248B2
(en)
|
2017-08-18 |
2021-08-24 |
Creeled, Inc. |
Light emitting diodes, components and related methods
|
US10361349B2
(en)
|
2017-09-01 |
2019-07-23 |
Cree, Inc. |
Light emitting diodes, components and related methods
|
US10541353B2
(en)
|
2017-11-10 |
2020-01-21 |
Cree, Inc. |
Light emitting devices including narrowband converters for outdoor lighting applications
|
US10734560B2
(en)
|
2017-11-29 |
2020-08-04 |
Cree, Inc. |
Configurable circuit layout for LEDs
|
US10573543B2
(en)
|
2018-04-30 |
2020-02-25 |
Cree, Inc. |
Apparatus and methods for mass transfer of electronic die
|
US11024785B2
(en)
*
|
2018-05-25 |
2021-06-01 |
Creeled, Inc. |
Light-emitting diode packages
|
US11101410B2
(en)
|
2018-05-30 |
2021-08-24 |
Creeled, Inc. |
LED systems, apparatuses, and methods
|
US10453827B1
(en)
|
2018-05-30 |
2019-10-22 |
Cree, Inc. |
LED apparatuses and methods
|
EP3776674B1
(de)
|
2018-06-04 |
2024-07-31 |
CreeLED, Inc. |
Led-geräte und verfahren
|
US10964866B2
(en)
|
2018-08-21 |
2021-03-30 |
Cree, Inc. |
LED device, system, and method with adaptive patterns
|
US11335833B2
(en)
|
2018-08-31 |
2022-05-17 |
Creeled, Inc. |
Light-emitting diodes, light-emitting diode arrays and related devices
|
US11233183B2
(en)
|
2018-08-31 |
2022-01-25 |
Creeled, Inc. |
Light-emitting diodes, light-emitting diode arrays and related devices
|
US11101411B2
(en)
|
2019-06-26 |
2021-08-24 |
Creeled, Inc. |
Solid-state light emitting devices including light emitting diodes in package structures
|
KR102314610B1
(ko)
*
|
2019-12-26 |
2021-10-20 |
경희대학교 산학협력단 |
백색광 구현 발광 패키지 및 이의 제조방법
|