JP2009074036A - エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 - Google Patents
エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 Download PDFInfo
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- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/0313—Organic insulating material
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
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- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
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- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
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Abstract
【解決手段】(A)エポキシ樹脂、(B)フェノール類ノボラック樹脂硬化剤又はアミン系硬化剤からなる硬化剤、(C)水酸化アルミニウム、又は球状シリカ及び水酸化アルミニウムを含む無機充填材、(D)コアシェル構造を有しシェル部分が上記エポキシ樹脂(A)と相溶する樹脂で構成されている微粒子からなる可とう成分を含有する。上記エポキシ樹脂組成物の硬化状態での厚み(Z)方向の熱膨張係数αZが48以下である。
【選択図】なし
Description
(A)エポキシ樹脂、
(B)フェノール類ノボラック樹脂硬化剤又はアミン系硬化剤からなる硬化剤、
(C)水酸化アルミニウム、又は球状シリカ及び水酸化アルミニウムを含む無機充填材、
(D)コアシェル構造を有しシェル部分が上記エポキシ樹脂(A)と相溶する樹脂で構成されている微粒子からなる可とう成分、
を含有するエポキシ樹脂組成物であって、
上記エポキシ樹脂組成物の硬化状態での厚み(Z)方向の熱膨張係数αZが48以下であることを特徴とする。
また、このエポキシ樹脂(A1)が上記のように臭素原子を10〜20質量%の範囲内で含むと、充分な難燃性がエポキシ樹脂組成物の硬化物に付与される。
(1)配合成分
表1に示した配合割合(質量部)の樹脂ワニスを調製した。表1中での成分の略称は次のものを示している。
<エポキシ樹脂>
EXA153:大日本インキ化学工業株式会社製、EPICLONエポキシ樹脂
YDB400:東都化成株式会社製、臭素化ビスフェノールA型エポキシ樹脂
EPON1031:HEXION specialty Chemicals製、エポキシ樹脂
DER593:ダウ・ケミカル株式会社製、エポキシ当量330〜390g/eq、臭素含有率17〜18wt%、分子平均エポキシ基含有量約2個、分子内に窒素と臭素を共に含有するエポキシ樹脂(オキサゾリドン環含有)
N690:エポキシ当量190〜240g/eq、臭素含有率0wt%、分子平均エポキシ基含有量6〜4個、樹脂軟化点約95℃、分子内に窒素も臭素も含有しないエポキシ樹脂。大日本インキ株式会社製のクレゾールノボラックエポキシ樹脂
<硬化剤>
VH4170:水酸基当量118g/eq、樹脂軟化点105℃、2官能ビスフェノールAの含有量が約25%であるビスフェノールAノボラック型硬化剤。大日本インキ化学工業株式会社製のビスフェノールAノボラック樹脂
<無機充填材>
球状シリカ:平均粒径0.4〜0.6μm(球状)、株式会社アドマテックス製『SO−25R』
水酸化アルミニウム:平均粒径約4μm、住友化学工業株式会社製『C−303』
<硬化促進剤>
IM1000:2級水酸基を含有しないトリアルコキシシリルタイプイミダゾールシラン、株式会社日鉱マテリアルズ製
<可とう成分>
AC3816N:コア部分がアクリル樹脂、シェル部分がポリメタクリレート樹脂からなる、コアシェル構造ゴム粒子。ガンツ化成株式会社製。コア部分の架橋が低く、一次粒子間で融着がある構造を有する。
AC3355:コア部分がアクリル樹脂、シェル部分がポリメタクリレート樹脂からなる、コアシェル構造ゴム粒子。ガンツ化成株式会社製。一次粒子間で融着がない構造を有する。
AC3832:コア部分がアクリル樹脂、シェル部分がポリメタクリレート樹脂からなる、コアシェル構造ゴム粒子。ガンツ化成株式会社製。コア部分の架橋が高く、一次粒子間で融着がない構造を有する。
(2)樹脂ワニスの調製方法
表1に示す各成分(無機充填材を除く)、並びに溶媒を、表1に示す配合割合で混合し、ディスパーで攪拌して均一化した。次に、樹脂ワニス中に無機充填材を配合する場合には、更に所定量の無機充填材を加え、更にディスパーにて1時間攪拌した後、ナノミルを用いて分散させた。これにより、溶媒の含有量が25〜40質量%、溶媒以外の固形分の含有量が60〜75質量%となる範囲で樹脂ワニスを調製した。
(3)プリプレグの製造
基材として、ガラスクロス(日東紡績株式会社製「7628タイプクロス」)を使用した。このガラスクロスに樹脂ワニスを室温にて含浸させた後、非接触タイプの加熱ユニットにより、約130〜170℃で加熱した。これにより、樹脂ワニス中の溶媒を乾燥除去すると共にエポキシ樹脂組成物を半硬化させて、プリプレグを作製した。
(4)積層板の成形
上記のようにして作製された8枚のプリプレグ(340mm×510mm)を、2枚の銅箔(厚み35μm、JTC箔、日鉱グールドフォイル株式会社製)の粗化面の間に挟み、180℃、30kgf/cm2(2.9MPa)の条件で90分間、加熱加圧処理を施して、積層板を製造した。
[2] 本発明者らは、上記のように製造された積層板について、次の方法によって、厚み(Z)方向の熱膨張係数αZ、ドリル磨耗、及びメッキ乾燥染み込みについて評価した。その結果は、表1に示される通りである。
(1)熱膨張係数(=CTE)
上記のようにして製造した積層板について、JIS C 6481に基づいて、TMA法(Thermo-mechanical analysis)により、ガラス転移点(Tg)未満の温度での板厚方向の熱膨張係数αZを測定した。
(2)ドリル磨耗率
上記のように製造した厚み約1.6mmの積層板を3枚重ね合わせ、φ0.3mmのドリルにて5000hit穴あけ加工して、貫通孔を形成した。このときの、穴あけ加工後のドリルの磨耗量を測定した。
(3)めっき液染み込み評価
上記のドリル加工後、積層板の貫通孔に厚み25μmのスルーホールメッキを施してスルーホールを形成した。この時の、スルーホールの内壁から積層板中へのメッキ液の染み込み深さを評価した。
Claims (11)
- 次の成分;
(A)エポキシ樹脂
(B)フェノール類ノボラック樹脂硬化剤又はアミン系硬化剤からなる硬化剤、
(C)水酸化アルミニウム、又は球状シリカ及び水酸化アルミニウムを含む無機充填材、
(D)コアシェル構造を有しシェル部分が上記エポキシ樹脂(A)と相溶する樹脂で構成されている微粒子からなる可とう成分、
を含有するエポキシ樹脂組成物であって、
上記エポキシ樹脂組成物の硬化状態での厚み(Z)方向の熱膨張係数αZが48以下であることを特徴とするエポキシ樹脂組成物。 - 上記可とう成分(D)は、上記エポキシ樹脂(A)と硬化剤(B)の合計100質量部に対して、7〜40質量部の範囲内で配合されていることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記可とう成分(D)は、一次粒子間で融着のない構造を有していることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記可とう成分(D)は、一次粒子間で融着している構造を有していることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記硬化剤(B)は、フェノール類ノボラック樹脂硬化剤であり、上記無機充填材(C)は、上記エポキシ樹脂(A)と硬化剤(B)の合計100質量部に対して60質量部以下の範囲内で配合されていることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記硬化剤(B)は、フェノール類ノボラック樹脂硬化剤であり、上記無機充填材(C)中の球状シリカ/水酸化アルミニウムの質量比が1以下であることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記硬化剤(B)は、フェノール類ノボラック樹脂硬化剤であり、上記エポキシ樹脂(A)は、分子構造内にオキサゾリドン環を有し、エポキシ当量が330〜390g/eqの範囲内であり、且つ樹脂中の臭素含有量が10〜20質量%の範囲内にあるエポキシ樹脂(A1)を含有することを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 上記硬化剤(B)は、ジシアンジアミドであることを特徴とする請求項1に記載のエポキシ樹脂組成物。
- 請求項1に記載のエポキシ樹脂組成物を基材に含浸し、加熱乾燥して半硬化させることで製造してなることを特徴とするプリプレグ。
- 請求項9に記載のプリプレグを所定枚数積層し、更に金属箔を積層配置したものを、加熱・加圧して成形してなることを特徴とする積層板。
- 請求項10に記載の積層板の金属箔の表面に導体パターンを形成してなることを特徴とするプリント配線板。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002187937A (ja) * | 2000-12-19 | 2002-07-05 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、プリプレグ及び金属箔張り積層板 |
JP2002249552A (ja) * | 2001-02-23 | 2002-09-06 | Matsushita Electric Works Ltd | リン含有エポキシ樹脂組成物、樹脂シート、樹脂付き金属箔、プリプレグ、積層板、多層板 |
JP2003123539A (ja) * | 2001-10-12 | 2003-04-25 | Hitachi Chem Co Ltd | 高レーザ加工性絶縁樹脂材料、高レーザ加工性プリプレグ及び高レーザ加工性金属張積層板 |
JP2003334886A (ja) * | 2002-05-21 | 2003-11-25 | Matsushita Electric Works Ltd | 積層板 |
JP2005239922A (ja) * | 2004-02-27 | 2005-09-08 | Taoka Chem Co Ltd | 一液型液状エポキシ樹脂組成物 |
JP2005239760A (ja) * | 2004-02-24 | 2005-09-08 | Hitachi Chem Co Ltd | 樹脂組成物、プリプレグおよび金属箔張積層板 |
JP2006143973A (ja) * | 2004-11-24 | 2006-06-08 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、並びにプリプレグ、積層板、プリント配線板 |
JP2007146095A (ja) * | 2005-11-02 | 2007-06-14 | Hitachi Chem Co Ltd | 樹脂組成物、プリプレグならびにそれを用いた積層板およびプリント配線板 |
JP2007254709A (ja) * | 2005-11-29 | 2007-10-04 | Ajinomoto Co Inc | 多層プリント配線板の絶縁層用樹脂組成物 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0848001A (ja) | 1994-08-08 | 1996-02-20 | Matsushita Electric Works Ltd | 銅張積層板 |
JP3288185B2 (ja) * | 1994-10-07 | 2002-06-04 | 日立化成工業株式会社 | 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置 |
JP3173332B2 (ja) | 1995-03-13 | 2001-06-04 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
GB9817799D0 (en) * | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
JP2000158589A (ja) * | 1998-11-30 | 2000-06-13 | Shin Kobe Electric Mach Co Ltd | 金属箔張り積層板の製造法 |
JP2000191746A (ja) * | 1998-12-25 | 2000-07-11 | Mitsubishi Rayon Co Ltd | エポキシ樹脂組成物 |
WO2000039188A1 (fr) * | 1998-12-25 | 2000-07-06 | Mitsubishi Rayon Co., Ltd. | Composition de resine epoxyde, preimpregne, et rouleau a base de resine renforcee avec des fibres de renforcement |
ES2276676T3 (es) * | 1999-03-16 | 2007-07-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Composicion endurecible con combinacion especial de propiedades. |
JP2001123044A (ja) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | プリント配線板用絶縁樹脂組成物 |
JP2002146061A (ja) * | 2000-11-10 | 2002-05-22 | Hitachi Chem Co Ltd | プリプレグ、積層板、金属張り積層板及びプリント配線板 |
TWI228639B (en) * | 2000-11-15 | 2005-03-01 | Vantico Ag | Positive type photosensitive epoxy resin composition and printed circuit board using the same |
JP4474796B2 (ja) | 2001-05-16 | 2010-06-09 | 日立化成工業株式会社 | 電気配線板用積層板及びプリプレグ製造用ワニス組成物の調製方法 |
JP2003213082A (ja) | 2002-01-22 | 2003-07-30 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料 |
JP2003246849A (ja) | 2002-02-26 | 2003-09-05 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物、ならびにそれを用いたプリプレグ、積層板及びプリント配線板 |
JP4576794B2 (ja) * | 2003-02-18 | 2010-11-10 | 日立化成工業株式会社 | 絶縁樹脂組成物及びその使用 |
US7592067B2 (en) * | 2003-09-22 | 2009-09-22 | Hexion Specialty Chemicals, Inc. | Epoxy resin compositions, processes utilizing same and articles made therefrom |
JP2006199565A (ja) * | 2004-05-13 | 2006-08-03 | Showa Denko Kk | 水酸化アルミニウム及びその用途 |
SG119379A1 (en) * | 2004-08-06 | 2006-02-28 | Nippon Catalytic Chem Ind | Resin composition method of its composition and cured formulation |
JP2009508979A (ja) * | 2005-09-15 | 2009-03-05 | ダウ グローバル テクノロジーズ インコーポレイティド | オキサゾリドン基を含む付着、高反応性硬質ポリウレタンフォーム |
TWI457363B (zh) * | 2005-11-29 | 2014-10-21 | Ajinomoto Kk | 供多層印刷電路板之層間絕緣層用之樹脂組成物 |
TWI410442B (zh) * | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
-
2008
- 2008-02-21 EP EP20080720788 patent/EP2113524A4/en not_active Withdrawn
- 2008-02-21 CN CN200880005829.3A patent/CN101616949B/zh active Active
- 2008-02-21 WO PCT/JP2008/052996 patent/WO2008102853A1/ja active Application Filing
- 2008-02-21 US US12/527,853 patent/US20100096173A1/en not_active Abandoned
- 2008-02-22 JP JP2008042196A patent/JP5192259B2/ja active Active
- 2008-02-22 TW TW097106378A patent/TWI365886B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002187937A (ja) * | 2000-12-19 | 2002-07-05 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、プリプレグ及び金属箔張り積層板 |
JP2002249552A (ja) * | 2001-02-23 | 2002-09-06 | Matsushita Electric Works Ltd | リン含有エポキシ樹脂組成物、樹脂シート、樹脂付き金属箔、プリプレグ、積層板、多層板 |
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Also Published As
Publication number | Publication date |
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WO2008102853A1 (ja) | 2008-08-28 |
CN101616949A (zh) | 2009-12-30 |
EP2113524A4 (en) | 2011-03-30 |
TWI365886B (en) | 2012-06-11 |
US20100096173A1 (en) | 2010-04-22 |
EP2113524A1 (en) | 2009-11-04 |
JP5192259B2 (ja) | 2013-05-08 |
CN101616949B (zh) | 2014-01-01 |
TW200906888A (en) | 2009-02-16 |
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