JP5039707B2 - プリント配線板用エポキシ樹脂組成物、樹脂組成物ワニス、プリプレグ、金属張積層体、プリント配線板及び多層プリント配線板 - Google Patents
プリント配線板用エポキシ樹脂組成物、樹脂組成物ワニス、プリプレグ、金属張積層体、プリント配線板及び多層プリント配線板 Download PDFInfo
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- JP5039707B2 JP5039707B2 JP2008534186A JP2008534186A JP5039707B2 JP 5039707 B2 JP5039707 B2 JP 5039707B2 JP 2008534186 A JP2008534186 A JP 2008534186A JP 2008534186 A JP2008534186 A JP 2008534186A JP 5039707 B2 JP5039707 B2 JP 5039707B2
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- epoxy resin
- printed wiring
- wiring board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
・AER4100:旭化成ケミカル(株)製、エポキシ当量320〜380g/eq,臭素原子含有割合16〜17質量%、一分子あたりのエポキシ基の個数 約2個
・AER5200:旭化成ケミカル(株)製、エポキシ当量250〜390g/eq、臭素原子含有割合16〜17質量%、一分子あたりのエポキシ基の個数 約3個
・DER593:ダウケミカル(株)製、エポキシ当量330〜390g/eq、臭素原子含有割合17〜18質量%、一分子あたりのエポキシ基の個数 約2個
・N690:大日本インキ(株)製のクレゾールノボラック型エポキシ樹脂、エポキシ当量190〜240g/eq、臭素原子含有割合0質量%、一分子あたりのエポキシ基の個数 4〜6個、樹脂軟化点 約95℃
・エピクロン1121:大日本インキ(株)製の臭素化ビスフェノールA型エポキシ樹脂、エポキシ当量450〜530g/eq、臭素原子含有割合19〜22質量%、一分子あたりのエポキシ基の個数 約2個、窒素原子は含有しない
・YDB−400:東都化成(株)製の臭素化エポキシ樹脂、エポキシ当量400g/eq、臭素原子含有割合約48質量%、一分子あたりのエポキシ基の個数 約2個、窒素原子は含有しない
・TD2090:大日本インキ(株)製のフェノールノボラック樹脂、水酸基当量105g/eq、樹脂軟化点120℃
・KH6021:大日本インキ(株)製のビスフェノールAノボラック樹脂、水酸基当量118g/eq、樹脂軟化点130℃、2官能ビスフェノールAを13質量%含有する
・VH4170:大日本インキ(株)製のビスフェノールAノボラック樹脂、水酸基当量118g/eq、樹脂軟化点105℃、2官能ビスフェノールAを25質量%含有する
・ジシアンジアミド :試薬級(水酸基当量21g/eq)
・球状シリカ:(株)アドマテックス製「SO−25R」、平均粒径0.5μm
・水酸化アルミニウム:住友化学工業(株)製「C−303」、平均粒径約4mm
・IS1000:日鉱マテリアルズ(株)製の2級水酸基を含有するトリアルコキシシリル型イミダゾールシラン
・IM1000:日鉱マテリアルズ(株)製の2級水酸基を含有しないトリアルコキシシリル型イミダゾールシラン
・2エチル4メチルイミダゾール:試薬級
・メチルエチルケトン:沸点約60℃、試薬級
・メトキシプロパノール:沸点約120℃、試薬級
・シクロヘキサノン:沸点約160℃、試薬級。
樹脂ワニスは以下のようにして調製した。
表1、2に示すような配合組成によりエポキシ樹脂成分及び硬化剤成分を配合し、溶媒に投入した。そしてディスパーで2時間攪拌して均一化した。そして、更に、表1、2に示すような配合組成により硬化促進剤を前記溶媒に投入した。そして、さらにディスパーで2時間攪拌して、樹脂ワニスを得た。なお、無機充填材を配合する場合には、表1、2に示すような配合組成により無機充填材をさらに投入し、さらにディスパーにて2時間攪拌して、樹脂ワニスを得た。
ガラスクロス(日東紡績(株)製「2116タイプクロス」)に調製した樹脂ワニスを室温にて含浸させた。そして、約130〜170℃で加熱することにより、ワニス中の溶媒を乾燥除去し、樹脂組成物を半硬化させてプリプレグを作製した。プリプレグ中の樹脂量は、ガラスクロス100質量部に対し、樹脂100質量部になるように調整した。
そして、得られたプリプレグの特性を以下の評価方法により評価した。
得られたプリプレグ(340mm×510mm)4枚を2枚の銅箔(厚み35μm、JTC箔、日鉱グールドフォイル(株)製)の粗化面の間に挟んで積層してプリプレグ積層体を得た。そして、前記プリプレグ積層体を加熱加圧成形してプリント配線板用銅張り積層体を得た。このときの加熱加圧成形の条件は金型温度170℃、加圧圧力2.94MPa、加圧時間90分間であった。加熱加圧成形においては段内の成形枚数は20枚とした。
内層回路基板として、両表面の銅箔に格子状のパターン(回路幅1mm、回路間2mm)が形成され、且つ、黒化処理が施された厚み0.2mmの内層回路基板(松下電工(株)製「CR1766」:銅箔の厚み35μm)を使用した。この内層回路基板の両表面にそれぞれ、プリプレグ1枚とさらにその外側に銅箔を重ねて多層積層体を得た。そして、前記多層積層体を加熱加圧成形して多層プリント配線板を得た。このときの加熱加圧成形の条件は金型温度170℃、加圧圧力2.94MPa、加圧時間90分間であった。加熱加圧成形においては段内の成形枚数は20枚とした。
上記「成形性1」で得られた銅張り積層体のガラスクロス1枚分を引き剥がし、90度ピールを測定した(JIS C6481)。
上記「成形性1」で得られた銅張り積層体の銅箔を引き剥がし、90度ピールを測定した(JIS C6481)。
上記「成形性1」で銅張り積層体を得たのと同様の方法により、約0.4mmの銅張り積層体を得た。そして、得られた銅張り積層体を種々の温度に設定したオーブンでそれぞれ60分間加熱した。オーブン耐熱温度は加熱後の銅張り積層体に膨れ又は剥離が発生しないときの最高温度とした。
熱重量変化測定装置(TG−DTA)にて、成形された銅張り積層体から樹脂部分を剥離して評価した。昇温速度5℃/分。初期重量に比べて重量が5%減少した温度を熱分解温度とした。
JIS C6481に基づいて、得られた多層プリント配線板について、TMA法(Thermo-mechanical analysis)によりガラス転移温度(Tg)を測定した。
JIS C6481に基づいて、得られた多層プリント配線板について、TMA法(Thermo-mechanical analysis)によりTg以下の温度における板厚方向の熱膨張係数を測定した。
得られた各プリプレグの表面を目視によって観察し、表面の平滑性、樹脂付着むらの有無を調べた。表面の平滑性が良好なものを「良い」、むらの激しいものを「悪い」と判断した。
上記「成形性1」で銅張り積層体を得たのと同様の方法により、約0.4mmの銅張り積層体を得た。得られた銅張り積層体を5枚重ね合わせてドリルで3000hit穴あけ加工し、ドリルの磨耗量を比較した。
成形した積層体をUL法に準じて評価した。
ワニスの透明性を目視で観察した。
透明性が高いものを「良い」、やや不透明なものを「普通」、不透明なものを「悪い」と判定した。
Claims (15)
- (A)同一分子内に窒素原子と臭素原子とを有するエポキシ樹脂(A−1)を含有するエポキシ樹脂成分、(B)フェノール系樹脂(B−1)を含有するフェノール系硬化剤成分、及び(C)イミダゾールシラン系化合物(C−1)を含有する硬化促進剤成分を含有し、
エポキシ樹脂(A−1)が同一分子内にオキサゾリドン環と臭素原子とを有するエポキシ樹脂であることを特徴とするプリント配線板用エポキシ樹脂組成物。 - エポキシ樹脂(A−1)が一分子中に平均1.9〜2.8個のエポキシ基を有する請求項1に記載のプリント配線板用エポキシ樹脂組成物。
- エポキシ樹脂成分(A)、フェノール系硬化剤成分(B)及び硬化促進剤成分(C)の合計量中に、臭素原子を10質量%以上含有する請求項1または2に記載のプリント配線板用エポキシ樹脂組成物。
- エポキシ樹脂成分(A)全量中のエポキシ樹脂(A−1)の含有割合が20〜80質量%である請求項1〜3の何れか1項に記載のプリント配線板用エポキシ樹脂組成物。
- フェノール系樹脂(B−1)がビスフェノールAノボラック樹脂を含有する請求項1〜4の何れか1項に記載のプリント配線板用エポキシ樹脂組成物。
- フェノール系硬化剤成分(B)中にビスフェノールAを含有する請求項1〜5の何れか1項に記載のプリント配線板用エポキシ樹脂組成物。
- エポキシ樹脂成分(A)、フェノール系硬化剤成分(B)及び硬化促進剤成分(C)の全体中に含有されるイミダゾールシラン化合物(C−1)の割合が0.05〜2質量%である請求項1〜6の何れか1項に記載のプリント配線板用エポキシ樹脂組成物。
- さらに、(D)無機充填材を含有する請求項1〜7の何れか1項に記載のプリント配線板用エポキシ樹脂組成物。
- 無機充填材(D)が球状無機充填材を含有する請求項8に記載のプリント配線板用エポキシ樹脂組成物。
- 無機充填材(D)が水酸化アルミニウムを含有する請求項8または9に記載のプリント配線板用エポキシ樹脂組成物。
- シクロヘキサノンを20質量%以上含有する溶媒に、請求項1〜10の何れか1項に記載のプリント配線板用エポキシ樹脂組成物が溶解または分散させていることを特徴とするプリント配線板用エポキシ樹脂組成物ワニス。
- 請求項11に記載のプリント配線板用エポキシ樹脂組成物ワニスをプリプレグ形成用基材に含浸し、乾燥して得られることを特徴とするプリプレグ。
- 請求項12に記載のプリプレグを所定の枚数重ね合わせ、その少なくとも一方の最外層に金属箔を重ねあわせて形成されるプリプレグ積層体を加熱加圧成形して得られることを特徴とするプリント配線板用金属張積層体。
- 請求項13に記載の金属張積層体の表面の金属箔に所定の回路パターンを形成させたことを特徴とするプリント配線板。
- 請求項12に記載のプリプレグ及び/又は請求項14に記載のプリント配線板を含有するプリプレグとプリント配線板との多層積層体を、加熱加圧成形して得られることを特徴とする多層プリント配線板。
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CN101511900A (zh) | 2009-08-19 |
KR101051865B1 (ko) | 2011-07-25 |
US20100025094A1 (en) | 2010-02-04 |
KR20090054436A (ko) | 2009-05-29 |
WO2008032383A1 (fr) | 2008-03-20 |
EP2070963B1 (en) | 2013-04-03 |
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JPWO2008032383A1 (ja) | 2010-01-21 |
CN101511900B (zh) | 2011-11-23 |
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