CN106699801B - 硅基咪唑类环氧树脂固化剂的合成工艺 - Google Patents
硅基咪唑类环氧树脂固化剂的合成工艺 Download PDFInfo
- Publication number
- CN106699801B CN106699801B CN201611045945.0A CN201611045945A CN106699801B CN 106699801 B CN106699801 B CN 106699801B CN 201611045945 A CN201611045945 A CN 201611045945A CN 106699801 B CN106699801 B CN 106699801B
- Authority
- CN
- China
- Prior art keywords
- curing agent
- epoxy resin
- silicon substrate
- imidazoles
- based epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 35
- 238000003786 synthesis reaction Methods 0.000 title claims abstract description 35
- 150000002460 imidazoles Chemical class 0.000 title claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 15
- 238000006243 chemical reaction Methods 0.000 claims abstract description 50
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- -1 chloropropyl siloxanes Chemical class 0.000 claims abstract description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 7
- OOXSLJBUMMHDKW-UHFFFAOYSA-N trichloro(3-chloropropyl)silane Chemical compound ClCCC[Si](Cl)(Cl)Cl OOXSLJBUMMHDKW-UHFFFAOYSA-N 0.000 claims abstract description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 27
- 235000019441 ethanol Nutrition 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 13
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 claims description 10
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 10
- 239000007921 spray Substances 0.000 claims description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 4
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- SLLDUURXGMDOCY-UHFFFAOYSA-N 2-butyl-1h-imidazole Chemical compound CCCCC1=NC=CN1 SLLDUURXGMDOCY-UHFFFAOYSA-N 0.000 claims description 3
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims description 3
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000104 sodium hydride Inorganic materials 0.000 claims description 3
- 239000012312 sodium hydride Substances 0.000 claims description 3
- MKBBSFGKFMQPPC-UHFFFAOYSA-N 2-propyl-1h-imidazole Chemical compound CCCC1=NC=CN1 MKBBSFGKFMQPPC-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000006227 byproduct Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 5
- DTOOTUYZFDDTBD-UHFFFAOYSA-N 3-chloropropylsilane Chemical compound [SiH3]CCCCl DTOOTUYZFDDTBD-UHFFFAOYSA-N 0.000 abstract description 2
- 230000032050 esterification Effects 0.000 abstract description 2
- 238000005886 esterification reaction Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 239000002351 wastewater Substances 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 14
- YKFRUJSEPGHZFJ-UHFFFAOYSA-N N-trimethylsilylimidazole Chemical compound C[Si](C)(C)N1C=CN=C1 YKFRUJSEPGHZFJ-UHFFFAOYSA-N 0.000 description 6
- 238000010792 warming Methods 0.000 description 6
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- ACJJZEUIOAXCJJ-UHFFFAOYSA-N C(CC)[Si](Cl)(Cl)Cl.[Cl] Chemical compound C(CC)[Si](Cl)(Cl)Cl.[Cl] ACJJZEUIOAXCJJ-UHFFFAOYSA-N 0.000 description 1
- LDWWSHYKBUSNGH-UHFFFAOYSA-N C1=CC=CC=C1.C(CCC)C=1NC=CN1 Chemical compound C1=CC=CC=C1.C(CCC)C=1NC=CN1 LDWWSHYKBUSNGH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 235000013409 condiments Nutrition 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
- C07F7/1872—Preparation; Treatments not provided for in C07F7/20
- C07F7/1892—Preparation; Treatments not provided for in C07F7/20 by reactions not provided for in C07F7/1876 - C07F7/1888
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611045945.0A CN106699801B (zh) | 2016-11-22 | 2016-11-22 | 硅基咪唑类环氧树脂固化剂的合成工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611045945.0A CN106699801B (zh) | 2016-11-22 | 2016-11-22 | 硅基咪唑类环氧树脂固化剂的合成工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106699801A CN106699801A (zh) | 2017-05-24 |
CN106699801B true CN106699801B (zh) | 2019-09-20 |
Family
ID=58934758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611045945.0A Active CN106699801B (zh) | 2016-11-22 | 2016-11-22 | 硅基咪唑类环氧树脂固化剂的合成工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106699801B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112724794A (zh) * | 2020-12-28 | 2021-04-30 | 上海瀚岱化学有限公司 | 咪唑基改性环氧树脂漆及其制备方法 |
CN113121796B (zh) * | 2021-05-10 | 2022-04-29 | 华中师范大学 | 一种低介电硅胺-环氧树脂共聚物的制备方法 |
CN114478616B (zh) * | 2022-01-12 | 2024-05-10 | 湖北江瀚新材料股份有限公司 | 一种3-(n-咪唑)丙基三乙氧基硅烷及其合成方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CS195648B1 (en) * | 1978-06-28 | 1980-02-29 | Juraj Forro | N-trialkoxysilylpropylimidazoles |
CN101511900A (zh) * | 2006-09-14 | 2009-08-19 | 松下电工株式会社 | 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板 |
CN201614355U (zh) * | 2009-12-25 | 2010-10-27 | 潍坊中狮化工股份有限公司 | γ-氯丙基三乙氧基硅烷酯化反应装置 |
CN103254224A (zh) * | 2013-03-27 | 2013-08-21 | 青岛晟科材料有限公司 | 一种γ-氯丙基三乙氧基硅烷偶联剂的制备方法 |
-
2016
- 2016-11-22 CN CN201611045945.0A patent/CN106699801B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CS195648B1 (en) * | 1978-06-28 | 1980-02-29 | Juraj Forro | N-trialkoxysilylpropylimidazoles |
CN101511900A (zh) * | 2006-09-14 | 2009-08-19 | 松下电工株式会社 | 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板 |
CN201614355U (zh) * | 2009-12-25 | 2010-10-27 | 潍坊中狮化工股份有限公司 | γ-氯丙基三乙氧基硅烷酯化反应装置 |
CN103254224A (zh) * | 2013-03-27 | 2013-08-21 | 青岛晟科材料有限公司 | 一种γ-氯丙基三乙氧基硅烷偶联剂的制备方法 |
Non-Patent Citations (2)
Title |
---|
Nanoparticles connected through an ionic liquid-like network;Marco Litschauer等;《J. Mater. Chem.》;20071205;第18卷;第640-646页 * |
Zhang-Min Li等.MOR zeolite supported Brønsted acidic ionic liquid:an efficient and recyclable heterogeneous catalyst for ketalization.《RSC Adv.》.2014,第4卷第12160-12167页. * |
Also Published As
Publication number | Publication date |
---|---|
CN106699801A (zh) | 2017-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106699801B (zh) | 硅基咪唑类环氧树脂固化剂的合成工艺 | |
CN104774333B (zh) | 加成型有机硅橡胶增粘剂及其制备方法与应用 | |
CN105289437B (zh) | 一种密胺树脂微胶囊的制备方法及应用 | |
CN101555386B (zh) | 一种(甲基)丙烯酸改性环氧化有机硅紫外光固化涂料及其制备方法 | |
CN104761994B (zh) | 一种光固化有机硅改性环氧树脂漆膜的制备方法 | |
CN104004482A (zh) | 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法 | |
JP7328968B2 (ja) | 硬化剤組成物、及びその硬化剤組成物を含有する樹脂組成物 | |
CN104356894A (zh) | 一种耐高温有机硅改性不饱和聚酯树脂涂料的制备方法 | |
CN106543391A (zh) | 一种双改性硼硅酚醛树脂的制备方法 | |
JP5311380B2 (ja) | 難燃性エポキシ樹脂及びその製造方法 | |
JP2015034281A5 (zh) | ||
CN106554500A (zh) | 一种疏水改性环氧树脂及其制备方法 | |
CN106750329B (zh) | 高抗水性氟硅改性环氧树脂的制备方法 | |
CN111072924A (zh) | 一种改性环氧树脂固化剂 | |
JPS607652B2 (ja) | 陰イオン交換体の製造法 | |
CN102250468A (zh) | 苯并噁嗪树脂/离子液体组合物 | |
CN104250375A (zh) | 歧化松香胺聚氧乙烯聚氧丙烯醚及其制备方法 | |
CN115572235A (zh) | 一种腰果酚醛胺固化剂的制备方法 | |
CN103664834A (zh) | 一种热降解的环氧树脂单体及其制备方法与底部填充料 | |
CN105860081B (zh) | 一种光热双固化有机硅树脂及其制备方法 | |
CN107722242A (zh) | 基于甲基丙烯酸甲酯釜底废料的环氧树脂固化剂及其制备方法和应用 | |
CN104211964A (zh) | 一种利用改性氧化铝制备有机硅树脂耐热材料的方法 | |
CN107090160B (zh) | 一种热固性环氧树脂专用预聚石墨烯母料及制备方法 | |
CN102718733A (zh) | 缩水甘油胺型多官能环氧树脂及其制备方法 | |
JP4674884B2 (ja) | エポキシ樹脂の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Synthetic process of silicon-based imidazole epoxy resin curing agent Effective date of registration: 20191219 Granted publication date: 20190920 Pledgee: Bank of China Limited Jinxiang Branch Pledgor: SHANDONG GUIKE NEW MATERIAL CO., LTD. Registration number: Y2019980001140 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210520 Granted publication date: 20190920 Pledgee: Bank of China Limited Jinxiang Branch Pledgor: SHANDONG GUIKE NEW MATERIAL Co.,Ltd. Registration number: Y2019980001140 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Synthesis of silicon based imidazole curing agent for epoxy resin Effective date of registration: 20210625 Granted publication date: 20190920 Pledgee: Bank of China Limited Jinxiang Branch Pledgor: SHANDONG GUIKE NEW MATERIAL Co.,Ltd. Registration number: Y2021980005307 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211117 Granted publication date: 20190920 Pledgee: Bank of China Limited Jinxiang Branch Pledgor: SHANDONG GUIKE NEW MATERIAL Co.,Ltd. Registration number: Y2021980005307 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |