JP2008508425A5 - - Google Patents

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Publication number
JP2008508425A5
JP2008508425A5 JP2007523536A JP2007523536A JP2008508425A5 JP 2008508425 A5 JP2008508425 A5 JP 2008508425A5 JP 2007523536 A JP2007523536 A JP 2007523536A JP 2007523536 A JP2007523536 A JP 2007523536A JP 2008508425 A5 JP2008508425 A5 JP 2008508425A5
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JP
Japan
Prior art keywords
composition
silver
block copolymer
amino acid
metal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007523536A
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English (en)
Japanese (ja)
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JP2008508425A (ja
JP5283903B2 (ja
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Publication date
Priority claimed from US10/902,398 external-priority patent/US8349393B2/en
Application filed filed Critical
Publication of JP2008508425A publication Critical patent/JP2008508425A/ja
Publication of JP2008508425A5 publication Critical patent/JP2008508425A5/ja
Application granted granted Critical
Publication of JP5283903B2 publication Critical patent/JP5283903B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007523536A 2004-07-29 2005-02-23 電子部品製造における銀めっき Expired - Lifetime JP5283903B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/902,398 2004-07-29
US10/902,398 US8349393B2 (en) 2004-07-29 2004-07-29 Silver plating in electronics manufacture
PCT/US2005/005702 WO2006022835A1 (en) 2004-07-29 2005-02-23 Silver plating in electronics manufacture

Publications (3)

Publication Number Publication Date
JP2008508425A JP2008508425A (ja) 2008-03-21
JP2008508425A5 true JP2008508425A5 (enExample) 2008-05-01
JP5283903B2 JP5283903B2 (ja) 2013-09-04

Family

ID=35732568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523536A Expired - Lifetime JP5283903B2 (ja) 2004-07-29 2005-02-23 電子部品製造における銀めっき

Country Status (10)

Country Link
US (3) US8349393B2 (enExample)
EP (2) EP1781421B1 (enExample)
JP (1) JP5283903B2 (enExample)
KR (1) KR101298780B1 (enExample)
CN (1) CN101031367B (enExample)
ES (2) ES2642094T3 (enExample)
MY (1) MY151333A (enExample)
SG (1) SG139749A1 (enExample)
TW (1) TWI376427B (enExample)
WO (1) WO2006022835A1 (enExample)

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CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
RU2715221C2 (ru) * 2018-06-21 2020-02-26 Федеральный научно-производственный центр акционерное общество "Научно-производственное объединение "Марс" Способ стабилизации слоя паяльной маски, наносимой методом полива
CN109137011A (zh) * 2018-09-20 2019-01-04 吕莉 一种高压隔离开关电接触材料的制备方法
JP7193132B2 (ja) * 2019-03-07 2022-12-20 住友電工プリントサーキット株式会社 配線基板
CN111663124A (zh) * 2020-06-11 2020-09-15 大连理工大学 一种在碳化硅表面镀银的方法
CN115702262A (zh) * 2020-06-23 2023-02-14 同和金属技术有限公司 复合材料、复合材料的制造方法和端子
CN114438557B (zh) * 2022-02-15 2023-04-11 嘉兴学院 一种用于蚀刻引线框架镀银用的电镀液及其制备方法
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