JP2009536987A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009536987A5 JP2009536987A5 JP2009510177A JP2009510177A JP2009536987A5 JP 2009536987 A5 JP2009536987 A5 JP 2009536987A5 JP 2009510177 A JP2009510177 A JP 2009510177A JP 2009510177 A JP2009510177 A JP 2009510177A JP 2009536987 A5 JP2009536987 A5 JP 2009536987A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- salt component
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 6
- 238000007747 plating Methods 0.000 claims 6
- 150000001868 cobalt Chemical class 0.000 claims 2
- 239000008139 complexing agent Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000001879 copper Chemical class 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/382,906 US7306662B2 (en) | 2006-05-11 | 2006-05-11 | Plating solution for electroless deposition of copper |
| US11/382,906 | 2006-05-11 | ||
| PCT/US2007/068691 WO2007134182A1 (en) | 2006-05-11 | 2007-05-10 | Plating solution for electroless deposition of copper |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009536987A JP2009536987A (ja) | 2009-10-22 |
| JP2009536987A5 true JP2009536987A5 (enExample) | 2011-07-07 |
| JP4975099B2 JP4975099B2 (ja) | 2012-07-11 |
Family
ID=38683921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009510177A Expired - Fee Related JP4975099B2 (ja) | 2006-05-11 | 2007-05-10 | 銅の無電解堆積のためのメッキ溶液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7306662B2 (enExample) |
| EP (1) | EP2016207B1 (enExample) |
| JP (1) | JP4975099B2 (enExample) |
| KR (1) | KR101392120B1 (enExample) |
| CN (1) | CN101490308B (enExample) |
| MY (1) | MY144454A (enExample) |
| TW (1) | TWI390079B (enExample) |
| WO (1) | WO2007134182A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7686875B2 (en) * | 2006-05-11 | 2010-03-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| US8298325B2 (en) * | 2006-05-11 | 2012-10-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| US7752996B2 (en) * | 2006-05-11 | 2010-07-13 | Lam Research Corporation | Apparatus for applying a plating solution for electroless deposition |
| JP4755573B2 (ja) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
| US7749893B2 (en) * | 2006-12-18 | 2010-07-06 | Lam Research Corporation | Methods and systems for low interfacial oxide contact between barrier and copper metallization |
| US20080152823A1 (en) * | 2006-12-20 | 2008-06-26 | Lam Research Corporation | Self-limiting plating method |
| US7794530B2 (en) * | 2006-12-22 | 2010-09-14 | Lam Research Corporation | Electroless deposition of cobalt alloys |
| US7521358B2 (en) * | 2006-12-26 | 2009-04-21 | Lam Research Corporation | Process integration scheme to lower overall dielectric constant in BEoL interconnect structures |
| US8058164B2 (en) * | 2007-06-04 | 2011-11-15 | Lam Research Corporation | Methods of fabricating electronic devices using direct copper plating |
| US8323460B2 (en) * | 2007-06-20 | 2012-12-04 | Lam Research Corporation | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal |
| US8673769B2 (en) | 2007-06-20 | 2014-03-18 | Lam Research Corporation | Methods and apparatuses for three dimensional integrated circuits |
| JP4971078B2 (ja) * | 2007-08-30 | 2012-07-11 | 東京応化工業株式会社 | 表面処理装置 |
| US20090162681A1 (en) * | 2007-12-21 | 2009-06-25 | Artur Kolics | Activation solution for electroless plating on dielectric layers |
| WO2014076431A2 (fr) | 2012-11-15 | 2014-05-22 | Alchimer | Dispositif semi-conducteur et son procede de fabrication |
| US9095518B2 (en) | 2013-08-01 | 2015-08-04 | Liqwd, Inc. | Methods for fixing hair and skin |
| US12233289B2 (en) | 2013-08-01 | 2025-02-25 | Olaplex, Inc. | Methods for fixing hair and skin |
| PT3142637T (pt) | 2014-05-16 | 2020-10-15 | Olaplex Inc | Formulações e métodos de tratamento de queratina |
| US9287183B1 (en) * | 2015-03-31 | 2016-03-15 | Lam Research Corporation | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch |
| KR102661331B1 (ko) | 2015-04-24 | 2024-04-30 | 올라플렉스, 인코포레이티드 | 릴렉싱된 헤어의 처리 방법 |
| EP3288520A4 (en) | 2015-05-01 | 2018-12-12 | L'oreal | Use of active agents during chemical treatments |
| CN105470169A (zh) * | 2015-11-20 | 2016-04-06 | 中国科学院微电子研究所 | 面向GaN器件的介质生长系统及其操作方法 |
| WO2017091797A1 (en) | 2015-11-24 | 2017-06-01 | L'oreal | Compositions for treating the hair |
| CN108495613B (zh) | 2015-11-24 | 2021-12-10 | 欧莱雅 | 用于处理头发的组合物 |
| JP6873994B2 (ja) | 2015-11-24 | 2021-05-19 | ロレアル | 毛髪を処置するための組成物 |
| CN106048569A (zh) * | 2016-06-12 | 2016-10-26 | 含山县朝霞铸造有限公司 | 一种铝合金压铸件表面处理方法及其产品 |
| US9872821B1 (en) | 2016-07-12 | 2018-01-23 | Liqwd, Inc. | Methods and formulations for curling hair |
| US9713583B1 (en) | 2016-07-12 | 2017-07-25 | Liqwd, Inc. | Methods and formulations for curling hair |
| KR101734840B1 (ko) * | 2016-11-11 | 2017-05-15 | 일진머티리얼즈 주식회사 | 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법 |
| US11135150B2 (en) | 2016-11-21 | 2021-10-05 | L'oreal | Compositions and methods for improving the quality of chemically treated hair |
| US9974725B1 (en) | 2017-05-24 | 2018-05-22 | L'oreal | Methods for treating chemically relaxed hair |
| WO2019133785A1 (en) | 2017-12-29 | 2019-07-04 | L'oreal | Compositions for altering the color of hair |
| US11090249B2 (en) | 2018-10-31 | 2021-08-17 | L'oreal | Hair treatment compositions, methods, and kits for treating hair |
| JP7441523B2 (ja) * | 2019-02-01 | 2024-03-01 | 国立大学法人大阪大学 | ５’位修飾ヌクレオシドおよびそれを用いたヌクレオチド |
| US11419809B2 (en) | 2019-06-27 | 2022-08-23 | L'oreal | Hair treatment compositions and methods for treating hair |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3935013A (en) * | 1973-11-12 | 1976-01-27 | Eastman Kodak Company | Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei |
| JPS5220339A (en) * | 1975-08-08 | 1977-02-16 | Hitachi Ltd | Chemical copper plating solution |
| US4143186A (en) * | 1976-09-20 | 1979-03-06 | Amp Incorporated | Process for electroless copper deposition from an acidic bath |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
| JPS57501786A (enExample) * | 1980-09-15 | 1982-10-07 | ||
| US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
| JPS6070183A (ja) * | 1983-09-28 | 1985-04-20 | C Uyemura & Co Ltd | 化学銅めっき方法 |
| JP2595319B2 (ja) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
| JP2001164375A (ja) * | 1999-12-03 | 2001-06-19 | Sony Corp | 無電解メッキ浴および導電膜の形成方法 |
| JP2002093747A (ja) * | 2000-09-19 | 2002-03-29 | Sony Corp | 導体構造の形成方法及び導体構造、並びに半導体装置の製造方法及び半導体装置 |
| JP3707394B2 (ja) * | 2001-04-06 | 2005-10-19 | ソニー株式会社 | 無電解メッキ方法 |
| US20040253450A1 (en) * | 2001-05-24 | 2004-12-16 | Shipley Company, L.L.C. | Formaldehyde-free electroless copper plating process and solution for use in the process |
| CN1329972C (zh) * | 2001-08-13 | 2007-08-01 | 株式会社荏原制作所 | 半导体器件及其制造方法 |
| JP2003142427A (ja) * | 2001-11-06 | 2003-05-16 | Ebara Corp | めっき液、半導体装置及びその製造方法 |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US20070048447A1 (en) * | 2005-08-31 | 2007-03-01 | Alan Lee | System and method for forming patterned copper lines through electroless copper plating |
| WO2005038088A1 (ja) * | 2003-10-20 | 2005-04-28 | Kansai Technology Licensing Organization Co., Ltd. | 無電解銅めっき液及びそれを用いた配線基板の製造方法 |
-
2006
- 2006-05-11 US US11/382,906 patent/US7306662B2/en active Active
-
2007
- 2007-05-10 MY MYPI20084533A patent/MY144454A/en unknown
- 2007-05-10 JP JP2009510177A patent/JP4975099B2/ja not_active Expired - Fee Related
- 2007-05-10 CN CN2007800264525A patent/CN101490308B/zh active Active
- 2007-05-10 WO PCT/US2007/068691 patent/WO2007134182A1/en not_active Ceased
- 2007-05-10 EP EP07762101.9A patent/EP2016207B1/en not_active Not-in-force
- 2007-05-11 TW TW096116808A patent/TWI390079B/zh not_active IP Right Cessation
-
2008
- 2008-12-10 KR KR1020087030088A patent/KR101392120B1/ko active Active