JP2012512967A5 - - Google Patents
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- Publication number
- JP2012512967A5 JP2012512967A5 JP2011542275A JP2011542275A JP2012512967A5 JP 2012512967 A5 JP2012512967 A5 JP 2012512967A5 JP 2011542275 A JP2011542275 A JP 2011542275A JP 2011542275 A JP2011542275 A JP 2011542275A JP 2012512967 A5 JP2012512967 A5 JP 2012512967A5
- Authority
- JP
- Japan
- Prior art keywords
- solution
- salt component
- solution according
- copper
- anhydrous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008139 complexing agent Substances 0.000 claims description 9
- 150000001879 copper Chemical class 0.000 claims description 9
- 229920000768 polyamine Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 150000001868 cobalt Chemical class 0.000 claims 8
- 239000003125 aqueous solvent Substances 0.000 claims 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 6
- 150000004820 halides Chemical class 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical group [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000012454 non-polar solvent Substances 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 239000002798 polar solvent Substances 0.000 claims 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 229940011182 cobalt acetate Drugs 0.000 claims 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims 1
- UFMZWBIQTDUYBN-UHFFFAOYSA-N cobalt dinitrate Chemical compound [Co+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O UFMZWBIQTDUYBN-UHFFFAOYSA-N 0.000 claims 1
- 229910001981 cobalt nitrate Inorganic materials 0.000 claims 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims 1
- 229940044175 cobalt sulfate Drugs 0.000 claims 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 claims 1
- 229910000365 copper sulfate Inorganic materials 0.000 claims 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims 1
- -1 diamine compound Chemical class 0.000 claims 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical class [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical group [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- OJWUUBGCASMJOR-UHFFFAOYSA-N N'-(2-aminoethyl)ethane-1,2-diamine cobalt(2+) dinitrate Chemical compound [N+](=O)([O-])[O-].[Co+2].NCCNCCN.[N+](=O)([O-])[O-] OJWUUBGCASMJOR-UHFFFAOYSA-N 0.000 description 1
- MKRZOSLIMIMVJX-UHFFFAOYSA-N [N+](=O)([O-])[O-].[Co+2].NCCNCCN.NCCNCCN.[N+](=O)([O-])[O-] Chemical compound [N+](=O)([O-])[O-].[Co+2].NCCNCCN.NCCNCCN.[N+](=O)([O-])[O-] MKRZOSLIMIMVJX-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- UWVVFJRBSCGSCQ-UHFFFAOYSA-L cobalt(2+) ethane-1,2-diamine sulfate Chemical compound S(=O)(=O)([O-])[O-].[Co+2].C(CN)N.C(CN)N UWVVFJRBSCGSCQ-UHFFFAOYSA-L 0.000 description 1
- GJZRSEPNBCRCJW-UHFFFAOYSA-L cobalt(2+);ethane-1,2-diamine;sulfate Chemical compound [Co+2].NCCN.[O-]S([O-])(=O)=O GJZRSEPNBCRCJW-UHFFFAOYSA-L 0.000 description 1
- 229910000001 cobalt(II) carbonate Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/338,998 | 2008-12-18 | ||
| US12/338,998 US7686875B2 (en) | 2006-05-11 | 2008-12-18 | Electroless deposition from non-aqueous solutions |
| PCT/US2009/067594 WO2010080331A2 (en) | 2008-12-18 | 2009-12-10 | Electroless depositions from non-aqueous solutions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012512967A JP2012512967A (ja) | 2012-06-07 |
| JP2012512967A5 true JP2012512967A5 (enExample) | 2014-07-31 |
| JP5628199B2 JP5628199B2 (ja) | 2014-11-19 |
Family
ID=42317054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011542275A Active JP5628199B2 (ja) | 2008-12-18 | 2009-12-10 | 非水溶液からの無電解析出 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7686875B2 (enExample) |
| JP (1) | JP5628199B2 (enExample) |
| KR (1) | KR101283334B1 (enExample) |
| CN (1) | CN102265384B (enExample) |
| SG (1) | SG171838A1 (enExample) |
| TW (1) | TWI443223B (enExample) |
| WO (1) | WO2010080331A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8298325B2 (en) * | 2006-05-11 | 2012-10-30 | Lam Research Corporation | Electroless deposition from non-aqueous solutions |
| JP4755573B2 (ja) * | 2006-11-30 | 2011-08-24 | 東京応化工業株式会社 | 処理装置および処理方法、ならびに表面処理治具 |
| US7794530B2 (en) * | 2006-12-22 | 2010-09-14 | Lam Research Corporation | Electroless deposition of cobalt alloys |
| JP4971078B2 (ja) * | 2007-08-30 | 2012-07-11 | 東京応化工業株式会社 | 表面処理装置 |
| JP5571435B2 (ja) * | 2010-03-31 | 2014-08-13 | Ｊｘ日鉱日石金属株式会社 | 銀メッキ銅微粉の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653953A (en) * | 1970-01-26 | 1972-04-04 | North American Rockwell | Nonaqueous electroless plating |
| US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
| US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| DE3148330A1 (de) * | 1981-12-07 | 1983-06-09 | Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen |
| JPH03215676A (ja) * | 1990-01-20 | 1991-09-20 | Tokin Corp | 無電解めっき剤，及びそれを用いた無電解めっき方法 |
| DE4440299A1 (de) * | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen |
| US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
| JP2001020077A (ja) * | 1999-07-07 | 2001-01-23 | Sony Corp | 無電解めっき方法及び無電解めっき液 |
| EP1158073A1 (en) * | 1999-10-19 | 2001-11-28 | Ebara Corporation | Plating method, wiring forming method and devices therefor |
| KR100475403B1 (ko) * | 2002-05-28 | 2005-03-15 | 재단법인서울대학교산학협력재단 | 반도체 배선용 구리 박막 형성방법 |
| US7147767B2 (en) * | 2002-12-16 | 2006-12-12 | 3M Innovative Properties Company | Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| US7306662B2 (en) * | 2006-05-11 | 2007-12-11 | Lam Research Corporation | Plating solution for electroless deposition of copper |
| US7297190B1 (en) * | 2006-06-28 | 2007-11-20 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
| US7752996B2 (en) * | 2006-05-11 | 2010-07-13 | Lam Research Corporation | Apparatus for applying a plating solution for electroless deposition |
| KR20080083790A (ko) * | 2007-03-13 | 2008-09-19 | 삼성전자주식회사 | 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법 |
-
2008
- 2008-12-18 US US12/338,998 patent/US7686875B2/en active Active
-
2009
- 2009-12-10 KR KR1020117014064A patent/KR101283334B1/ko active Active
- 2009-12-10 CN CN200980150019.1A patent/CN102265384B/zh active Active
- 2009-12-10 WO PCT/US2009/067594 patent/WO2010080331A2/en not_active Ceased
- 2009-12-10 SG SG2011038544A patent/SG171838A1/en unknown
- 2009-12-10 JP JP2011542275A patent/JP5628199B2/ja active Active
- 2009-12-18 TW TW098143687A patent/TWI443223B/zh active
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