JP2012512967A5 - - Google Patents

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Publication number
JP2012512967A5
JP2012512967A5 JP2011542275A JP2011542275A JP2012512967A5 JP 2012512967 A5 JP2012512967 A5 JP 2012512967A5 JP 2011542275 A JP2011542275 A JP 2011542275A JP 2011542275 A JP2011542275 A JP 2011542275A JP 2012512967 A5 JP2012512967 A5 JP 2012512967A5
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JP
Japan
Prior art keywords
solution
salt component
solution according
copper
anhydrous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011542275A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012512967A (ja
JP5628199B2 (ja
Filing date
Publication date
Priority claimed from US12/338,998 external-priority patent/US7686875B2/en
Application filed filed Critical
Publication of JP2012512967A publication Critical patent/JP2012512967A/ja
Publication of JP2012512967A5 publication Critical patent/JP2012512967A5/ja
Application granted granted Critical
Publication of JP5628199B2 publication Critical patent/JP5628199B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011542275A 2008-12-18 2009-12-10 非水溶液からの無電解析出 Expired - Fee Related JP5628199B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/338,998 US7686875B2 (en) 2006-05-11 2008-12-18 Electroless deposition from non-aqueous solutions
US12/338,998 2008-12-18
PCT/US2009/067594 WO2010080331A2 (en) 2008-12-18 2009-12-10 Electroless depositions from non-aqueous solutions

Publications (3)

Publication Number Publication Date
JP2012512967A JP2012512967A (ja) 2012-06-07
JP2012512967A5 true JP2012512967A5 (enExample) 2014-07-31
JP5628199B2 JP5628199B2 (ja) 2014-11-19

Family

ID=42317054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011542275A Expired - Fee Related JP5628199B2 (ja) 2008-12-18 2009-12-10 非水溶液からの無電解析出

Country Status (7)

Country Link
US (1) US7686875B2 (enExample)
JP (1) JP5628199B2 (enExample)
KR (1) KR101283334B1 (enExample)
CN (1) CN102265384B (enExample)
SG (1) SG171838A1 (enExample)
TW (1) TWI443223B (enExample)
WO (1) WO2010080331A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
JP4755573B2 (ja) * 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
US7794530B2 (en) * 2006-12-22 2010-09-14 Lam Research Corporation Electroless deposition of cobalt alloys
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
JP5571435B2 (ja) * 2010-03-31 2014-08-13 Ｊｘ日鉱日石金属株式会社 銀メッキ銅微粉の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653953A (en) * 1970-01-26 1972-04-04 North American Rockwell Nonaqueous electroless plating
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
DE3148330A1 (de) * 1981-12-07 1983-06-09 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen
JPH03215676A (ja) * 1990-01-20 1991-09-20 Tokin Corp 無電解めっき剤，及びそれを用いた無電解めっき方法
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
JP2001020077A (ja) * 1999-07-07 2001-01-23 Sony Corp 無電解めっき方法及び無電解めっき液
EP1158073A1 (en) * 1999-10-19 2001-11-28 Ebara Corporation Plating method, wiring forming method and devices therefor
KR100475403B1 (ko) * 2002-05-28 2005-03-15 재단법인서울대학교산학협력재단 반도체 배선용 구리 박막 형성방법
US7147767B2 (en) * 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US7306662B2 (en) * 2006-05-11 2007-12-11 Lam Research Corporation Plating solution for electroless deposition of copper
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
US7752996B2 (en) * 2006-05-11 2010-07-13 Lam Research Corporation Apparatus for applying a plating solution for electroless deposition
KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법

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