JP2009019225A5 - - Google Patents
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- Publication number
- JP2009019225A5 JP2009019225A5 JP2007181256A JP2007181256A JP2009019225A5 JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5 JP 2007181256 A JP2007181256 A JP 2007181256A JP 2007181256 A JP2007181256 A JP 2007181256A JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- electroless
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- -1 carboxylic acid compound Chemical class 0.000 claims description 7
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 238000006467 substitution reaction Methods 0.000 claims description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 150000003892 tartrate salts Chemical class 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181256A JP5201897B2 (ja) | 2007-07-10 | 2007-07-10 | 無電解銅めっき液及び無電解銅めっき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181256A JP5201897B2 (ja) | 2007-07-10 | 2007-07-10 | 無電解銅めっき液及び無電解銅めっき方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009019225A JP2009019225A (ja) | 2009-01-29 |
| JP2009019225A5 true JP2009019225A5 (enExample) | 2010-06-17 |
| JP5201897B2 JP5201897B2 (ja) | 2013-06-05 |
Family
ID=40359126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007181256A Active JP5201897B2 (ja) | 2007-07-10 | 2007-07-10 | 無電解銅めっき液及び無電解銅めっき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5201897B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015076549A1 (ko) * | 2013-11-22 | 2015-05-28 | 한국생산기술연구원 | 무전해 구리 도금액 조성물 및 이를 이용한 무전해 구리 도금방법 |
| JP6270681B2 (ja) | 2014-09-29 | 2018-01-31 | 学校法人 関西大学 | 配線構造体の製造方法、銅置換めっき液および配線構造体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129977A (ja) * | 1987-11-13 | 1989-05-23 | Hitachi Ltd | 銅めっき液 |
| JP3052515B2 (ja) * | 1991-11-28 | 2000-06-12 | 上村工業株式会社 | 無電解銅めっき浴及びめっき方法 |
| JP3332668B2 (ja) * | 1994-07-14 | 2002-10-07 | 松下電器産業株式会社 | 半導体装置の配線形成に用いる無電解めっき浴及び半導体装置の配線形成方法 |
| JP2002180259A (ja) * | 2000-12-12 | 2002-06-26 | Shipley Co Llc | めっき液における金属析出促進化合物および該化合物を含むめっき液 |
| JP2002363762A (ja) * | 2001-06-07 | 2002-12-18 | Naoki Toriyama | 無電解めっき液及び無電解めっき方法 |
| JP5188683B2 (ja) * | 2006-06-12 | 2013-04-24 | パナソニック株式会社 | 接点部品または電池部品用材料と、それを用いた電池 |
-
2007
- 2007-07-10 JP JP2007181256A patent/JP5201897B2/ja active Active
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