JP2009019225A5 - - Google Patents
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- Publication number
- JP2009019225A5 JP2009019225A5 JP2007181256A JP2007181256A JP2009019225A5 JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5 JP 2007181256 A JP2007181256 A JP 2007181256A JP 2007181256 A JP2007181256 A JP 2007181256A JP 2009019225 A5 JP2009019225 A5 JP 2009019225A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- electroless
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- -1 carboxylic acid compound Chemical class 0.000 claims description 7
- 239000008139 complexing agent Substances 0.000 claims description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- 238000006467 substitution reaction Methods 0.000 claims description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-K 2qpq Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000003638 reducing agent Substances 0.000 claims description 2
- 150000003892 tartrate salts Chemical class 0.000 claims 1
- FEWJPZIEWOKRBE-XIXRPRMCSA-N Mesotartaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-XIXRPRMCSA-N 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
Description
すなわち、本発明は、ニッケル皮膜上にニッケル金属との置換反応によって銅皮膜を形成する無電解銅めっき液であって、前記無電解銅めっき液には、銅の還元剤が非含有であり、前記置換反応を緩和する銅の錯化剤が含有されていると共に、ｐＨが２．０以下であることを特徴とする無電解銅めっき液にある。
また、本発明は、ニッケル皮膜上に銅皮膜を形成する際に、前述した無電解銅めっき液中に前記ニッケル皮膜を浸漬することを特徴とする無電解銅めっき方法でもある。
かかる本発明において、銅の錯化剤として、カルボン酸化合物を好適に用いることができる。特に、カルボン酸化合物として、酒石酸塩を用いるときには、無電解銅めっき液のｐＨを１．５以下とすること、或いはカルボン酸化合物として、クエン酸塩又はグリシンを用いるときには、無電解銅めっき液のｐＨを２．０以下とすることによって、添加したカルボン酸化合物を充分に溶解できる。
更に、ニッケル皮膜としては、無電解ニッケルめっきによって形成したニッケル皮膜である場合、本発明を有効に適用できる。
尚、無電解銅めっき液中の銅としては、硫酸銅から由来していることが好ましい。
That is, the present invention is an electroless copper plating solution that forms a copper film by a substitution reaction with nickel metal on the nickel film, and the electroless copper plating solution does not contain a copper reducing agent , The electroless copper plating solution is characterized in that it contains a copper complexing agent that alleviates the substitution reaction and has a pH of 2.0 or less .
Moreover, this invention is also an electroless copper plating method characterized by immersing the said nickel film in the electroless copper plating solution mentioned above when forming a copper film on a nickel film.
In the present invention, a carboxylic acid compound can be suitably used as the copper complexing agent. In particular, when tartrate is used as the carboxylic acid compound, the pH of the electroless copper plating solution is 1.5 or less, or when citrate or glycine is used as the carboxylic acid compound, the electroless copper plating solution By adjusting the pH to 2.0 or less, the added carboxylic acid compound can be sufficiently dissolved.
Furthermore, when the nickel film is a nickel film formed by electroless nickel plating, the present invention can be effectively applied.
The copper in the electroless copper plating solution is preferably derived from copper sulfate.
Claims (7)
前記無電解銅めっき液には、銅の還元剤が非含有であり、前記置換反応を緩和する銅の錯化剤が含有されていると共に、ｐＨが２．０以下であることを特徴とする無電解銅めっき液。 An electroless copper plating solution for forming a copper film by a substitution reaction with nickel metal on the nickel film,
Wherein the electroless copper plating solution, copper reducing agent is free, along with a complexing agent of the copper to mitigate the substitution reaction is contained, wherein the pH is 2.0 or less Electroless copper plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181256A JP5201897B2 (en) | 2007-07-10 | 2007-07-10 | Electroless copper plating solution and electroless copper plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181256A JP5201897B2 (en) | 2007-07-10 | 2007-07-10 | Electroless copper plating solution and electroless copper plating method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009019225A JP2009019225A (en) | 2009-01-29 |
| JP2009019225A5 true JP2009019225A5 (en) | 2010-06-17 |
| JP5201897B2 JP5201897B2 (en) | 2013-06-05 |
Family
ID=40359126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007181256A Active JP5201897B2 (en) | 2007-07-10 | 2007-07-10 | Electroless copper plating solution and electroless copper plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5201897B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015076549A1 (en) * | 2013-11-22 | 2015-05-28 | 한국생산기술연구원 | Electroless copper plating solution composition and electroless copper plating method using same |
| JP6270681B2 (en) * | 2014-09-29 | 2018-01-31 | 学校法人 関西大学 | Wiring structure manufacturing method, copper displacement plating solution, and wiring structure |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01129977A (en) * | 1987-11-13 | 1989-05-23 | Hitachi Ltd | Copper plating solution |
| JP3052515B2 (en) * | 1991-11-28 | 2000-06-12 | 上村工業株式会社 | Electroless copper plating bath and plating method |
| JP3332668B2 (en) * | 1994-07-14 | 2002-10-07 | 松下電器産業株式会社 | Electroless plating bath used for forming wiring of semiconductor device and method for forming wiring of semiconductor device |
| JP2002180259A (en) * | 2000-12-12 | 2002-06-26 | Shipley Co Llc | Metal deposition acceleration compound in plating liquid and plating liquid containing the same |
| JP2002363762A (en) * | 2001-06-07 | 2002-12-18 | Naoki Toriyama | Electroless plating solution and electroless plating method |
| JP5188683B2 (en) * | 2006-06-12 | 2013-04-24 | パナソニック株式会社 | Contact component or battery component material and battery using the same |
-
2007
- 2007-07-10 JP JP2007181256A patent/JP5201897B2/en active Active
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