JP2018523019A5 - - Google Patents
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- Publication number
- JP2018523019A5 JP2018523019A5 JP2018521482A JP2018521482A JP2018523019A5 JP 2018523019 A5 JP2018523019 A5 JP 2018523019A5 JP 2018521482 A JP2018521482 A JP 2018521482A JP 2018521482 A JP2018521482 A JP 2018521482A JP 2018523019 A5 JP2018523019 A5 JP 2018523019A5
- Authority
- JP
- Japan
- Prior art keywords
- bath
- acid
- coated substrate
- zincate
- orthophosphorous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 6
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims 6
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 5
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 4
- 239000008139 complexing agent Substances 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 3
- 239000006227 byproduct Substances 0.000 claims 2
- 239000003638 chemical reducing agent Substances 0.000 claims 2
- 239000004310 lactic acid Substances 0.000 claims 2
- 235000014655 lactic acid Nutrition 0.000 claims 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 239000003513 alkali Substances 0.000 claims 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- 239000002738 chelating agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000013500 data storage Methods 0.000 claims 1
- 229940116298 l- malic acid Drugs 0.000 claims 1
- 239000001630 malic acid Substances 0.000 claims 1
- 229940099690 malic acid Drugs 0.000 claims 1
- 235000011090 malic acid Nutrition 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 239000006174 pH buffer Substances 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
- 235000011044 succinic acid Nutrition 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562193728P | 2015-07-17 | 2015-07-17 | |
| US62/193,728 | 2015-07-17 | ||
| PCT/US2016/042271 WO2017015054A1 (en) | 2015-07-17 | 2016-07-14 | Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018523019A JP2018523019A (ja) | 2018-08-16 |
| JP2018523019A5 true JP2018523019A5 (enExample) | 2019-08-22 |
Family
ID=57834788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018521482A Pending JP2018523019A (ja) | 2015-07-17 | 2016-07-14 | 低減されたイオン濃度を有する無電解ニッケル−リンめっき浴および使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180209047A1 (enExample) |
| EP (1) | EP3325688B1 (enExample) |
| JP (1) | JP2018523019A (enExample) |
| MY (1) | MY185286A (enExample) |
| SG (1) | SG10201913013PA (enExample) |
| WO (1) | WO2017015054A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7560093B2 (ja) * | 2020-06-03 | 2024-10-02 | 奥野製薬工業株式会社 | 無電解ニッケル－リンめっき浴 |
| JP7730667B2 (ja) * | 2021-06-03 | 2025-08-28 | 東洋鋼鈑株式会社 | ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法 |
| WO2023101770A1 (en) * | 2021-11-30 | 2023-06-08 | Coventya, Inc. | Electroless antipathogenic coating |
| CN114438481B (zh) * | 2022-01-24 | 2023-07-07 | 四川轻化工大学 | 非晶态镍磷合金镀层及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU65309A1 (enExample) | 1972-05-08 | 1973-11-23 | ||
| US4511614A (en) * | 1983-10-31 | 1985-04-16 | Ball Corporation | Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same |
| JPH01201484A (ja) * | 1987-10-06 | 1989-08-14 | Hitachi Ltd | 化学ニッケルめっき液及びその使用方法 |
| US6048585A (en) * | 1996-11-14 | 2000-04-11 | Atotech Deutschland Gmbh | Removal of orthophosphite ions from electroless nickel plating baths |
| US6524642B1 (en) * | 2001-04-21 | 2003-02-25 | Omg Fidelity, Inc. | Electroless metal-plating process |
| MY160341A (en) * | 2008-10-16 | 2017-02-28 | Atotech Deutschland Gmbh | Metal plating additive, and method for plating substrates and products therefrom. |
| DE602008005748D1 (de) | 2008-10-17 | 2011-05-05 | Atotech Deutschland Gmbh | Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche |
| WO2014123535A1 (en) | 2013-02-08 | 2014-08-14 | OMG Electronic Chemicals, Inc. | Methods for metallizing an aluminum paste |
| EP3026143A1 (en) * | 2014-11-26 | 2016-06-01 | ATOTECH Deutschland GmbH | Plating bath and method for electroless deposition of nickel layers |
-
2016
- 2016-07-14 JP JP2018521482A patent/JP2018523019A/ja active Pending
- 2016-07-14 WO PCT/US2016/042271 patent/WO2017015054A1/en not_active Ceased
- 2016-07-14 EP EP16828269.7A patent/EP3325688B1/en active Active
- 2016-07-14 US US15/745,600 patent/US20180209047A1/en not_active Abandoned
- 2016-07-14 SG SG10201913013PA patent/SG10201913013PA/en unknown
- 2016-07-14 MY MYPI2018000069A patent/MY185286A/en unknown
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